CN212910169U

CN212910169U - Anti-electromagnetic interference multilayer circuit board structure

Info

Publication number: CN212910169U
Application number: CN202021124585.5U
Authority: CN
Inventors: 王�锋
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2020-06-17
Filing date: 2020-06-17
Publication date: 2021-04-06
Anticipated expiration: 2030-06-17

Abstract

The utility model provides an anti-electromagnetic interference's multilayer circuit board structure, including top plate, double sided board, lower plywood, first heat conduction insulating layer, second heat conduction insulating layer, the double sided board with lower plywood dislocation set, second heat conduction insulating layer with lower plywood one side forms first breach, top plate, first heat conduction insulating layer, double sided board, second heat conduction insulating layer one side form the second breach, first breach internal fixation has the electromagnetic shield board, be fixed with the inductor on the electromagnetic shield board, be equipped with two electrically conductive feet on the inductor, electrically conductive foot with second inlayer circuit welding. The utility model discloses a multilayer circuit board structure sets up double sided board and lower floor plate dislocation for circuit board one end forms first breach, sets up electromagnetic shield board on first breach, and fixes the inductor on electromagnetic shield board, shields the inductor with electromagnetic shield board, has avoided the influence that the work of magnetic signal to chips etc. caused.

Description

Anti-electromagnetic interference multilayer circuit board structure

Technical Field

The utility model relates to a circuit board technical field, concretely relates to anti-electromagnetic interference's multilayer circuit board structure.

Background

Circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The development of the circuit board has been over 100 years old, the design is mainly a layout design, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of layers of the circuit board. In the circuit board of the speaker, since the speaker has high sensitivity to electrical signals, an inductor is usually used on the circuit board, and the inductor is a component capable of converting electrical energy into magnetic energy and storing the magnetic energy, and the magnetic energy usually affects the electrical signals.

SUMMERY OF THE UTILITY MODEL

To above problem, the utility model provides an anti-electromagnetic interference's multilayer circuit board structure sets up double sided board and lower floor board dislocation for circuit board one end forms first breach, sets up the electromagnetic shield board on first breach, and fixes the inductor on the electromagnetic shield board, shields the inductor with the electromagnetic shield board, has avoided the influence that magnetic signal caused to the work of chip etc..

In order to achieve the above object, the present invention provides the following technical solutions:

an anti-electromagnetic interference multi-layer circuit board structure comprises an upper layer board, a double-sided board and a lower layer board, wherein the upper end of the upper layer board is provided with a first outer layer circuit, the lower end of the lower board is provided with a second outer layer circuit, the upper end and the lower end of the double-sided board are respectively provided with a first inner layer circuit and a second inner layer circuit, a first heat conduction insulating layer is connected between the upper plate and the double-sided board, a second heat conduction insulating layer is connected between the lower plate and the double-sided board, the double-sided board and the lower board are arranged in a staggered way, a first gap is formed between the second heat-conducting insulating layer and one side of the lower board, a second gap is formed on one side of the upper plate, the first heat-conducting insulating layer, the double-sided plate and the second heat-conducting insulating layer, an electromagnetic shielding plate is fixed in the first gap, an inductor is fixed on the electromagnetic shielding plate, and two conductive pins are arranged on the inductor and are welded with the second inner layer circuit.

Specifically, the electromagnetic shield board include with the lower plywood passes through screw fixed connection's installation department, with the installation department is the portion of bearing that 90 are connected, the inductor is fixed the portion of bearing lower extreme, be equipped with the confession in the portion of bearing the through-hole that electrically conductive foot passed, the through-hole inboard is equipped with the insulating ring, the insulating ring cover is established the electrically conductive foot outside.

Specifically, the first outer layer circuit is connected with a chip.

Specifically, a power socket is fixed on the second notch, and the power socket is electrically connected with the second outer layer circuit.

Specifically, a first metalized hole is connected between the first outer layer circuit and the first inner layer circuit, and the inner wall of the first metalized hole is plated with copper.

Specifically, a second metalized hole is connected between the first inner layer circuit and the second inner layer circuit, and the inner wall of the second metalized hole is plated with copper.

Specifically, a third metalized hole is connected between the second inner layer circuit and the second outer layer circuit, and the inner wall of the third metalized hole is plated with copper.

The utility model has the advantages that:

the utility model discloses a multilayer circuit board sets up double sided board and lower floor's board dislocation for the circuit board both ends form first breach and second breach, set up electromagnetic shield board on first breach, and fix the inductor on electromagnetic shield board, shield the inductor with electromagnetic shield board, avoided the influence that magnetic signal caused to the work of chip etc. and set up supply socket on the second breach, can reduce the thickness of circuit board, be favorable to the slim development trend of circuit board.

Drawings

Fig. 1 is a schematic structural diagram of an anti-electromagnetic interference multilayer circuit board structure of the present invention.

Fig. 2 is an enlarged view of a portion a in fig. 1.

The reference signs are: the circuit board comprises an upper plate 1, a first outer layer circuit 11, a first metalized hole 12, a double-sided board 2, a first inner layer circuit 21, a second inner layer circuit 22, a second metalized hole 23, a lower plate 3, a second outer layer circuit 31, a first gap 32, a second gap 33, a third metalized hole 34, a first heat conduction insulating layer 4, a second heat conduction insulating layer 5, an electromagnetic shielding plate 6, an inductor 7, a conductive pin 71, a mounting part 61, a bearing part 62, an insulating ring 8, a chip 9 and a power socket 10.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

Referring to FIGS. 1-2:

an anti-electromagnetic interference multi-layer circuit board structure comprises an upper layer board 1, a double-sided board 2 and a lower layer board 3, wherein the upper end of the upper layer board 1 is provided with a first outer layer circuit 11, the lower end of the lower layer board 3 is provided with a second outer layer circuit 31, the upper and lower ends of the double-sided board 2 are respectively provided with a first inner layer circuit 21 and a second inner layer circuit 22, a first heat conduction insulating layer 4 is connected between the upper layer board 1 and the double-sided board 2, a second heat conduction insulating layer 5 is connected between the lower layer board 3 and the double-sided board 2, the double-sided board 2 and the lower layer board 3 are arranged in a staggered manner, a first gap 32 is formed between the second heat conduction insulating layer 5 and one side of the lower layer board 3, a second gap 33 is formed between the upper layer board 1, the first heat conduction insulating layer 4, the double-sided board 2 and one side of the second heat conduction insulating layer 5, an, the conductive pins 71 are welded to the second inner layer circuit 22, the electromagnetic shielding plate 6 has the capability of isolating electromagnetic signals, and can isolate the magnetic signals generated by the inductor 7, so as to avoid the influence of the magnetic signals on the conductivity of electronic components such as other circuits or chips, for example, when the circuit board of the present application is applied to a speaker, the magnetic signals of the inductor 7 can be well shielded, the influence of the magnetic signals on the electrical signal transmission of the speaker is prevented, and thus, the distortion of the speaker is prevented.

Preferably, the electromagnetic shielding plate 6 includes an installation portion 61 fixedly connected to the lower plate 3 by a screw, and a bearing portion 62 connected to the installation portion 61 at 90 °, the inductor 7 is fixed at the lower end of the bearing portion 62, a through hole for passing the conductive pin 71 is provided on the bearing portion 62, an insulating ring 8 is provided inside the through hole, the insulating ring 8 is sleeved outside the conductive pin 71, the electromagnetic shielding plate 6 is usually an aluminum alloy plate, and the purpose of providing the insulating ring 8 is to isolate the two conductive pins 71 and prevent the two conductive pins 71 from conducting.

Preferably, the chip 9 is connected to the first outer layer wire 11.

Preferably, the power socket 10 is fixed on the second notch 33, the power socket 10 is electrically connected with the second outer layer circuit 31, and the power socket 10 is usually large in size, so that the circuit board can be made thinner by mounting the power socket 10 on the second notch 33.

Preferably, a first metalized hole 12 is connected between the first outer layer circuit 11 and the first inner layer circuit 21, the inner wall of the first metalized hole 12 is plated with copper, and the first outer layer circuit 11 and the first inner layer circuit 21 are electrically connected through the first metalized hole 12.

Preferably, a second metalized hole 23 is connected between the first inner layer circuit 21 and the second inner layer circuit 22, the inner wall of the second metalized hole 23 is plated with copper, and the first inner layer circuit 21 and the second inner layer circuit 22 are electrically connected through the second metalized hole 23.

Preferably, a third metalized hole 34 is connected between the second inner layer circuit 22 and the second outer layer circuit 31, an inner wall of the third metalized hole 34 is plated with copper, and the second inner layer circuit 22 and the second outer layer circuit 31 are electrically connected through the third metalized hole 34.

The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides an anti-electromagnetic interference's multilayer circuit board structure, its characterized in that, includes top plate (1), double sided board (2), lower floor's board (3), top plate (1) upper end is equipped with first outer circuit (11), lower floor's board (3) lower extreme is equipped with second outer circuit (31), both ends are equipped with first inlayer circuit (21), second inlayer circuit (22) respectively about double sided board (2), top plate (1) with be connected with first heat conduction insulating layer (4) between double sided board (2), lower floor's board (3) with be connected with second heat conduction insulating layer (5) between double sided board (2), double sided board (2) with plywood (3) dislocation set down, second heat conduction insulating layer (5) with plywood (3) one side forms first breach (32) down, top plate (1), First thermal insulation layer (4), double sided board (2), second thermal insulation layer (5) one side form second breach (33), first breach (32) internal fixation has electromagnetic shield board (6), be fixed with inductor (7) on electromagnetic shield board (6), be equipped with two electrically conductive feet (71) on inductor (7), electrically conductive foot (71) with second inlayer circuit (22) welding.

2. The anti-electromagnetic interference multilayer circuit board structure of claim 1, wherein the electromagnetic shielding plate (6) comprises an installation part (61) fixedly connected with the lower board (3) through a screw, and a bearing part (62) connected with the installation part (61) at 90 degrees, the inductor (7) is fixed at the lower end of the bearing part (62), a through hole for the conductive pin (71) to pass through is arranged on the bearing part (62), an insulating ring (8) is arranged on the inner side of the through hole, and the insulating ring (8) is sleeved outside the conductive pin (71).

3. An anti-electromagnetic interference multilayer circuit board structure according to claim 1, characterized in that a chip (9) is connected to said first outer layer of lines (11).

4. An anti-electromagnetic interference multi-layer circuit board structure according to claim 1, wherein a power socket (10) is fixed on the second notch (33), and the power socket (10) is electrically connected to the second outer layer circuit (31).

5. An anti-electromagnetic interference multilayer circuit board structure according to claim 1, characterized in that a first metalized hole (12) is connected between the first outer layer circuit (11) and the first inner layer circuit (21), and the inner wall of the first metalized hole (12) is plated with copper.

6. An anti-electromagnetic interference multilayer circuit board structure according to claim 1, characterized in that a second metallized hole (23) is connected between the first inner layer circuit (21) and the second inner layer circuit (22), and the inner wall of the second metallized hole (23) is plated with copper.

7. An anti-electromagnetic interference multilayer circuit board structure according to claim 1, characterized in that a third metallized hole (34) is connected between the second inner layer circuit (22) and the second outer layer circuit (31), and the inner wall of the third metallized hole (34) is plated with copper.