CN205171008U - Plating bath liquid level control system - Google Patents
Plating bath liquid level control system Download PDFInfo
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- CN205171008U CN205171008U CN201520776601.1U CN201520776601U CN205171008U CN 205171008 U CN205171008 U CN 205171008U CN 201520776601 U CN201520776601 U CN 201520776601U CN 205171008 U CN205171008 U CN 205171008U
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- liquid level
- liquid
- level sensor
- controlling system
- bath solution
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Abstract
The utility model provides a plating bath liquid level control system. Plating bath liquid level control system includes plating solution circulating device and controlling means. Plating solution circulating device includes feed liquor pipe, feed liquor valve and the plating bath that communicates in proper order through the pipeline, circulating slot and circulating pump, feed liquor pipe with the plating bath intercommunication, the feed liquor valve install in the feed liquor pipe. Controlling means includes level sensor, microprocessor and controller, level sensor with the controller respectively with the microprocessor electricity is connected, the controller respectively with the circulating pump with feed liquor valve electricity is connected. Compared with the prior art, plating bath liquid level control system can realize the automatic plating solution that in time replenishes, guarantees that the plating solution liquid level lies in standard liquid level all the time.
Description
Technical field
The utility model relates to print circuit plates making field, particularly relates to a kind of bath solution level controlling system.
Background technology
Printed circuit board (PCB) is as the necessary carrier of electronic component, and its demand is continuous increase along with electronic product widely uses.Plating is most important processing step during printed circuit board (PCB) is produced, and printed circuit board (PCB) is placed in the plating tank that electroplate liquid is housed and carries out copper facing.In electroplating printed circuit board process, must ensure in the complete immersion plating liquid of printed circuit board (PCB).Therefore, in plating tank electroplate liquid to reach standard liquid level significant for the quality of printed circuit board (PCB).
In correlation technique, electroplate liquid meeting overflow plating groove in electroplating process, in order to ensure the liquid level of electroplate liquid in plating tank, usually after plating tank overflow port, arrange circulation groove, the electroplate liquid of spilling is transmitted back in plating tank by recycling recycle pump.Mainly there is following defect in aforesaid method: first, and because flooding velocity is different, and recycle pump work output is certain, is difficult to ensure that in plating tank, electroplate liquid is positioned at standard liquid level all the time; Secondly, owing to there is electroplate liquid loss in electroplating process, when the total liquid measure of electroplate liquid is not enough, can not supplement in time, need Artificial Control to supplement electroplate liquid, level of automation is low.
Therefore, be necessary to provide a kind of new bath solution level controlling system to solve the problem.
Utility model content
The utility model technical issues that need to address are to provide one can ensure that plating tank liquid level is positioned at standard liquid level all the time, the bath solution level controlling system that level of automation is high.
The utility model provides a kind of bath solution level controlling system.Described bath solution level controlling system comprises electroplating liquid circulation device and control device.Described electroplating liquid circulation device comprises liquid-inlet pipe, liquid feed valve and the plating tank, circulation groove and the recycle pump that are communicated with successively by pipeline, and described liquid-inlet pipe is communicated with described plating tank, and described liquid feed valve is installed in described liquid-inlet pipe.Described control device comprises liquid level sensor, microprocessor and controller, and described liquid level sensor and described controller are electrically connected with described microprocessor respectively, and described controller is electrically connected with described recycle pump and described liquid feed valve respectively.
Preferably, described liquid level sensor comprises the first liquid level sensor and the second liquid level sensor, and described first liquid level sensor is installed in described plating tank, and described second liquid level sensor is installed in described circulation groove.
Preferably, described first liquid level sensor and described second liquid level sensor are float ball liquid level sensor.
Preferably, described controller comprises frequency-variable controller, and described frequency-variable controller is electrically connected with described recycle pump.
Preferably, described controller comprises YE, and described YE is electrically connected with described liquid feed valve.
Preferably, described bath solution level controlling system also comprises display screen, and described display screen is electrically connected with described microprocessor.
Compared with correlation technique, described liquid level sensor is provided with in bath solution level controlling system of the present utility model, described liquid level sensor monitors the real-time level of described plating tank and described circulation groove, and liquid level signal is transferred to described microprocessor, control the switch of described liquid feed valve and the rotating speed of recycle pump by described controller again, realize the supply in time automatically of electroplate liquid and ensure that the liquid level of plating tank is positioned at standard liquid level all the time.
Accompanying drawing explanation
Fig. 1 is the structural representation of the electroplating liquid circulation device of the utility model bath solution level controlling system.
Fig. 2 is the structural representation of the control device of the utility model bath solution level controlling system.
Embodiment
Below in conjunction with drawings and embodiments, the utility model is described in further detail.
It is the structural representation of the electroplating liquid circulation device of the utility model bath solution level controlling system please refer to Fig. 1 and Fig. 2, Fig. 1; Fig. 2 is the structural representation of the control device of the utility model bath solution level controlling system.Described bath solution level controlling system 1 comprises electroplating liquid circulation device 11 and control device 13.
Plating tank 115, circulation groove 117, recycle pump 119 that described electroplating liquid circulation device 11 is comprised liquid-inlet pipe 111, liquid feed valve 113 and is communicated with successively by pipeline, described liquid-inlet pipe 111 is communicated with described plating tank 115, and described liquid feed valve 113 is installed in described liquid-inlet pipe 111.
Described control device 13 comprises liquid level sensor 131, microprocessor 133, controller 135 and display screen 137.Described liquid level sensor 131 and described controller 135 are electrically connected with described microprocessor 133 respectively, and described controller 135 is electrically connected with described recycle pump 113 and described liquid feed valve 111 respectively, and described display screen 137 is electrically connected with described microprocessor 133.
Described liquid level sensor 131 comprises the first liquid level sensor 1311 and the second liquid level sensor 1313, described first liquid level sensor 1311 and described second liquid level sensor 1313 parallel connection access in described microprocessor 133, described first liquid level sensor 1311 detects the liquid level of the electroplate liquid in described plating tank 115, described second liquid level sensor 1313 detects the liquid level of the electroplate liquid of described circulation groove 117, and the liquid level of described plating tank 115 and the level value of described circulation groove 117 is sent in described microprocessor 133 respectively.Optimum, described first liquid level sensor 1311 and described second liquid level sensor 1313 are float ball liquid level sensor, and described first liquid level sensor 1311 and described second liquid level sensor 1313 are separately positioned in described plating tank 115 and in described circulation groove 117.Described first liquid level sensor 1311 and described second liquid level sensor 1313 can also be infrared level sensors, and described first liquid level sensor 1311 and described second liquid level sensor 1313 are separately positioned on outside described plating tank 115 and outside described circulation groove 117.Certainly, described first liquid level sensor 1311 and described second liquid level sensor 1313 can also be other liquid level sensor, and its installation site is according to the type decided of liquid level sensor.This is all feasible, but its principle is the same.
Described microprocessor 133 receives the level value of described plating tank 115 and the level value of described circulation groove 117, and they is compared with default level value respectively, and described microprocessor 133 sends a control signal to described controller 135.
In the present embodiment, described controller 135 comprises frequency-variable controller 1351 and YE 1353.Described frequency-variable controller 1351 is for controlling described recycle pump 119, described frequency-variable controller 1351 controls the rotating speed of described recycle pump 119 according to the control signal that described microprocessor 133 sends, thus regulates described circulation groove 117 to the plating liquid measure of described plating tank 115.Described YE 1353 is for controlling described liquid feed valve 113, when the liquid level of described plating tank 115 and the liquid level of described circulation groove 117 are all lower than described default level value, the total amount loss of the described electroplate liquid namely in described plating tank 115 and described circulation groove 117, described YE 1353 controls described liquid feed valve 113 and opens supplementary described electroplate liquid, when described plating tank 115 and described circulation groove 117 liquid level are recovered, described YE 1353 controls described liquid feed valve 113 and closes, thus realizes automatically supplementing described electroplate liquid in time.By controlling described liquid feed valve 113 and described recycle pump 119, the liquid level of described plating tank 115 is made to be positioned at standard liquid level all the time.
By described display screen 137 described plating tank 115 level value of display and described circulation groove 117 level value in real time, thus judge the operation conditions of described bath solution level controlling system 1.
Compared with correlation technique, liquid level sensor 131 is provided with in described bath solution level controlling system 1 of the present utility model, described liquid level sensor 131 monitors the real-time level of described plating tank 115 and described circulation groove 117, and liquid level signal is transferred to described microprocessor 133, control the switch of described liquid feed valve 113 and the rotating speed of described recycle pump 119 by described controller 135 again, realize the supply in time automatically of electroplate liquid and ensure that the liquid level of described plating tank 115 is positioned at standard liquid level all the time.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification sheets and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (6)
1. a bath solution level controlling system, comprise electroplating liquid circulation device, described electroplating liquid circulation device comprises liquid-inlet pipe, liquid feed valve and the plating tank be communicated with successively by pipeline, circulation groove and recycle pump, described liquid-inlet pipe is communicated with described plating tank, described liquid feed valve is installed in described liquid-inlet pipe, it is characterized in that: described bath solution level controlling system also comprises control device, described control device comprises liquid level sensor, microprocessor and controller, described liquid level sensor and described controller are electrically connected with described microprocessor respectively, described controller is electrically connected with described recycle pump and described liquid feed valve respectively.
2. bath solution level controlling system according to claim 1, it is characterized in that: described liquid level sensor comprises the first liquid level sensor and the second liquid level sensor, described first liquid level sensor is installed in described plating tank, and described second liquid level sensor is installed in described circulation groove.
3. bath solution level controlling system according to claim 2, is characterized in that: described first liquid level sensor and described second liquid level sensor are float ball liquid level sensor.
4. bath solution level controlling system according to claim 1, it is characterized in that: described controller comprises frequency-variable controller, described frequency-variable controller is electrically connected with described recycle pump.
5. bath solution level controlling system according to claim 1, it is characterized in that: described controller comprises YE, described YE is electrically connected with described liquid feed valve.
6. bath solution level controlling system according to any one of claim 1 to 5, is characterized in that: described bath solution level controlling system also comprises display screen, and described display screen is electrically connected with described microprocessor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520776601.1U CN205171008U (en) | 2015-09-30 | 2015-09-30 | Plating bath liquid level control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520776601.1U CN205171008U (en) | 2015-09-30 | 2015-09-30 | Plating bath liquid level control system |
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| CN205171008U true CN205171008U (en) | 2016-04-20 |
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| CN201520776601.1U Active CN205171008U (en) | 2015-09-30 | 2015-09-30 | Plating bath liquid level control system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222732A (en) * | 2016-08-30 | 2016-12-14 | 昆山东威电镀设备技术有限公司 | A kind of liquid level maintaining device in electroplating bath |
| CN109306476A (en) * | 2017-07-27 | 2019-02-05 | 塞姆西斯科有限责任公司 | For chemistry and/or the system of electrolytic surface processing |
-
2015
- 2015-09-30 CN CN201520776601.1U patent/CN205171008U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106222732A (en) * | 2016-08-30 | 2016-12-14 | 昆山东威电镀设备技术有限公司 | A kind of liquid level maintaining device in electroplating bath |
| CN106222732B (en) * | 2016-08-30 | 2018-05-15 | 昆山东威电镀设备技术有限公司 | A kind of liquid level maintaining device in electroplating bath |
| CN109306476A (en) * | 2017-07-27 | 2019-02-05 | 塞姆西斯科有限责任公司 | For chemistry and/or the system of electrolytic surface processing |
| JP2019052370A (en) * | 2017-07-27 | 2019-04-04 | セムシスコ ゲーエムベーハーＳｅｍｓｙｓｃｏ ＧｍｂＨ | System for at least one of chemical and electrolytic surface treatments |
| JP7229690B2 (en) | 2017-07-27 | 2023-02-28 | セムシスコ ゲーエムベーハー | System for chemical and/or electrolytic surface treatment |
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