CN112867264A - Method for riveting and positioning thick copper plate - Google Patents
Method for riveting and positioning thick copper plate Download PDFInfo
- Publication number
- CN112867264A CN112867264A CN202110132627.2A CN202110132627A CN112867264A CN 112867264 A CN112867264 A CN 112867264A CN 202110132627 A CN202110132627 A CN 202110132627A CN 112867264 A CN112867264 A CN 112867264A
- Authority
- CN
- China
- Prior art keywords
- positioning
- film
- riveting
- pcb
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 28
- 239000010949 copper Substances 0.000 title claims abstract description 28
- 238000005530 etching Methods 0.000 claims abstract description 27
- 238000004080 punching Methods 0.000 claims abstract description 23
- 238000005260 corrosion Methods 0.000 claims abstract description 8
- 230000007797 corrosion Effects 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 claims description 5
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 238000011179 visual inspection Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 13
- 238000012797 qualification Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 abstract description 3
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 abstract 2
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a method for riveting and positioning a thick copper plate, which comprises the following steps: s1, designing a film with a special positioning graph, an S surface and a G surface; s2, drawing phenanthrene with a special positioning graph; s3, pasting a corrosion-resistant dry film on the pattern after the film is drawn; s4, exposing the pattern pasted with the anti-corrosion dry film; s5, developing the graph subjected to the exposure process; s6, etching the pattern subjected to the developing process; s7, removing the film of the pattern subjected to the etching process to obtain a complete single-sided copper pattern for positioning; s8, punching the graph after the film stripping process; and S9, positioning the inner-layer core plate subjected to the punching process by using pins. By the method, the service life of the punching pin can be effectively prolonged, the processing strength is improved, the alignment precision is ensured, and the electrical testing qualification rate of products is finally improved.
Description
Technical Field
The invention belongs to the technical field of PCB processing, and particularly relates to a thick copper plate riveting and positioning method.
Background
In the prior art, the copper thickness of an inner core plate of a thick copper PCB is generally designed to be 3-6OZ, positioning holes of 3.175mm need to be punched on all core plates by a punching machine during riveting before lamination, in the prior art, the positioning holes are directly punched on a copper surface, the copper thickness of two surfaces of one core plate reaches 6-12OZ, the abrasion to punching needles is very large, the hole shape is poor, the precision is seriously influenced during riveting alignment, and in the other method, the positioning holes are directly punched on a base material, but the strength of the base material is not enough to be pulled and damaged during riveting alignment, and the alignment precision is also influenced. The short circuit ratio of the final product is very high in electric measurement.
Disclosure of Invention
In view of the above, the invention provides a method for riveting and positioning a thick copper plate, and the invention uses a special positioning pattern design for a 3-6OZ thick copper core plate, thereby reducing the abrasion of a punching pin, prolonging the service life of the punching pin, ensuring the integrity of a hole shape, improving the riveting strength and ensuring the alignment precision of the core plate. Thereby improving the final electrical measurement qualification rate of the product.
The technical scheme of the invention is as follows:
a thick copper plate riveting and positioning method is characterized by comprising the following steps:
s1, designing a film with a special positioning graph, an S surface and a G surface;
s2, drawing a film with a special positioning graph;
s3, pasting a corrosion-resistant dry film on the pattern after the film is drawn;
s4, exposing the pattern pasted with the anti-corrosion dry film;
s5, developing the graph subjected to the exposure process;
s6, etching the pattern subjected to the developing process;
s7, removing the film of the pattern subjected to the etching process to obtain a complete single-sided copper pattern for positioning;
s8, punching the graph after the film stripping process;
and S9, positioning the inner-layer core plate subjected to the punching process by using pins.
Furthermore, the S plane is symmetrically provided with a first positioning area, the G plane is symmetrically provided with a second positioning area, and the first positioning area and the second positioning area are correspondingly arranged.
Furthermore, the second positioning area is provided with a positioning hole.
Further, the aperture of the positioning hole is 3.175 mm.
Furthermore, the first positioning area and the second positioning area are both rectangular positioning areas.
Further, the exposure process comprises: and (4) after a dry film is pasted on the surface of the PCB, a circuit is exposed by using an exposure machine and a film.
Further, the developing process comprises the following steps: and developing the PCB circuit by using a developing machine after exposure.
Further, the etching process comprises: and transferring the PCB with the developed circuit to an etching process through the inserting frame, and etching the PCB through an etching machine.
Further, the film removing process comprises the following steps: after the etching treatment, the unhardened dry film attached to the circuit of the PCB is washed away.
Further, the PCB after the unhardened dry film is processed is transferred to an outside line inspection process through an inserting frame, and whether the circuit of the PCB is exposed abnormally or deviated abnormally or other abnormal conditions is inspected through visual inspection and a 10-time lens.
And transferring the PCB qualified for inspection to an etching line through the inserting frame, and etching a circuit pattern of the PCB. The PCB circuit is scanned and detected through the AOI scanner, defects on the PCB are detected, and the defects are automatically marked for adjustment of maintenance personnel and subsequent technical improvement.
The innovation points of the invention are as follows:
1. the design of special positioning patterns avoids the direct punching of two layers of thick copper by the punching needle, prolongs the service life of the punching needle and ensures the integrity of the hole shape;
2. avoid dashing the needle through special location graphic design and directly dash the substrate, lifting strength, processing is difficult to damage, guarantees the counterpoint precision.
3. In combination with the above two points, the punching area is designed as a single layer of copper.
By the method, the service life of the punching pin can be effectively prolonged, the processing strength is improved, the alignment precision is ensured, and the electrical testing qualification rate of products is finally improved.
Drawings
FIG. 1 is a schematic structural view of the S-surface of a film according to the present invention;
FIG. 2 is a schematic view of the structure of the G-plane of the film of the present invention;
FIG. 3 is a schematic structural diagram of a processing step S3 according to the present invention;
FIG. 4 is a schematic structural diagram of the processing step S4 according to the present invention;
FIG. 5 is a schematic structural diagram of the processing step S5 according to the present invention;
FIG. 6 is a schematic structural diagram of the processing step S6 according to the present invention;
FIG. 7 is a schematic structural diagram of processing step S7 according to the present invention;
FIG. 8 is a schematic structural view of a processing step S8 according to the present invention;
FIG. 9 is a schematic structural view of a processing step S9 according to the present invention;
wherein, 1 is S face, 11 is first locating area, 2 is G face, 21 is the second locating area, 22 is the locating hole, 3 is the dry film, 4 is the copper face, 5 is the substrate, 6 is the PP layer, 7 is the locating pin.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A thick copper plate riveting and positioning method is characterized by comprising the following steps:
s1, designing a film with a special positioning graph, an S surface and a G surface;
s2, drawing a film with a special positioning graph;
s3, pasting a corrosion-resistant dry film on the pattern after the film is drawn;
s4, exposing the pattern pasted with the anti-corrosion dry film;
s5, developing the graph subjected to the exposure process;
s6, etching the pattern subjected to the developing process;
s7, removing the film of the pattern subjected to the etching process to obtain a complete single-sided copper pattern for positioning;
s8, punching the graph after the film stripping process;
and S9, positioning the inner-layer core plate subjected to the punching process by using pins.
Furthermore, the S plane is symmetrically provided with a first positioning area, the G plane is symmetrically provided with a second positioning area, and the first positioning area and the second positioning area are correspondingly arranged.
Furthermore, the second positioning area is provided with a positioning hole.
Further, the aperture of the positioning hole is 3.175 mm.
Furthermore, the first positioning area and the second positioning area are both rectangular positioning areas.
Further, the exposure process comprises: and (4) after a dry film is pasted on the surface of the PCB, a circuit is exposed by using an exposure machine and a film.
Further, the developing process comprises the following steps: and developing the PCB circuit by using a developing machine after exposure.
Further, the etching process comprises: and transferring the PCB with the developed circuit to an etching process through the inserting frame, and etching the PCB through an etching machine.
Further, the film removing process comprises the following steps: after the etching treatment, the unhardened dry film attached to the circuit of the PCB is washed away.
Further, the PCB after the unhardened dry film is processed is transferred to an outside line inspection process through an inserting frame, and whether the circuit of the PCB is exposed abnormally or deviated abnormally or other abnormal conditions is inspected through visual inspection and a 10-time lens.
And transferring the PCB qualified for inspection to an etching line through the inserting frame, and etching a circuit pattern of the PCB. The PCB circuit is scanned and detected through the AOI scanner, defects on the PCB are detected, and the defects are automatically marked for adjustment of maintenance personnel and subsequent technical improvement.
The innovation points of the invention are as follows:
1. the design of special positioning patterns avoids the direct punching of two layers of thick copper by the punching needle, prolongs the service life of the punching needle and ensures the integrity of the hole shape;
2. avoid dashing the needle through special location graphic design and directly dash the substrate, lifting strength, processing is difficult to damage, guarantees the counterpoint precision.
3. In combination with the above two points, the punching area is designed as a single layer of copper.
By the method, the service life of the punching pin can be effectively prolonged, the processing strength is improved, the alignment precision is ensured, and the electrical testing qualification rate of products is finally improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A thick copper plate riveting and positioning method is characterized by comprising the following steps:
s1, designing a film with a special positioning graph, an S surface and a G surface;
s2, drawing a film with a special positioning graph;
s3, pasting a corrosion-resistant dry film on the pattern after the film is drawn;
s4, exposing the pattern pasted with the anti-corrosion dry film;
s5, developing the graph subjected to the exposure process;
s6, etching the pattern subjected to the developing process;
s7, removing the film of the pattern subjected to the etching process to obtain a complete single-sided copper pattern for positioning;
s8, punching the graph after the film stripping process;
and S9, positioning the inner-layer core plate subjected to the punching process by using pins.
2. The method for riveting and positioning the thick copper plate according to claim 1, wherein the S plane is symmetrically provided with a first positioning area, the G plane is symmetrically provided with a second positioning area, and the first positioning area and the second positioning area are correspondingly arranged.
3. The method of claim 2, wherein the second positioning region is provided with positioning holes.
4. The method of claim 3, wherein the diameter of the positioning hole is 3.175 mm.
5. The method for riveting and positioning the thick copper plate according to claim 2, wherein the first positioning area and the second positioning area are both rectangular positioning areas.
6. The method for riveting and positioning the thick copper plate according to claim 1, wherein the exposure process comprises the following steps: and (4) after a dry film is pasted on the surface of the PCB, a circuit is exposed by using an exposure machine and a film.
7. The method for riveting and positioning the thick copper plate according to claim 1, wherein the developing process comprises the following steps: and developing the PCB circuit by using a developing machine after exposure.
8. The method for riveting and positioning the thick copper plate according to claim 1, wherein the etching process comprises the following steps: and transferring the PCB with the developed circuit to an etching process through the inserting frame, and etching the PCB through an etching machine.
9. The method for riveting and positioning the thick copper plate according to claim 1, wherein the film stripping process comprises the following steps: after the etching treatment, the unhardened dry film attached to the circuit of the PCB is washed away.
10. The method of thick copper plate staking location of claim 1 further including: and transferring the PCB subjected to the treatment of the unhardened dry film to an outside inspection process through an inserting frame, and inspecting whether the circuit of the PCB is exposed abnormally or deviated abnormally or in other abnormal conditions through visual inspection and a 10-time lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110132627.2A CN112867264B (en) | 2021-01-31 | 2021-01-31 | Method for riveting and positioning thick copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110132627.2A CN112867264B (en) | 2021-01-31 | 2021-01-31 | Method for riveting and positioning thick copper plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112867264A true CN112867264A (en) | 2021-05-28 |
| CN112867264B CN112867264B (en) | 2024-08-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110132627.2A Active CN112867264B (en) | 2021-01-31 | 2021-01-31 | Method for riveting and positioning thick copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112867264B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04299592A (en) * | 1991-03-28 | 1992-10-22 | Toshiba Corp | Printed wiring board |
| KR20030033633A (en) * | 2001-10-24 | 2003-05-01 | 울트라테라 코포레이션 | Manufacturing method of printed circuit board through hole |
| CN1826035A (en) * | 2006-01-12 | 2006-08-30 | 珠海元盛电子科技有限公司 | Method for making single-face hollowed-out board |
| CN104093277A (en) * | 2014-07-11 | 2014-10-08 | 景旺电子科技(龙川)有限公司 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
| CN110149770A (en) * | 2019-06-12 | 2019-08-20 | 重庆方正高密电子有限公司 | The manufacturing method and multilayer printed circuit board of multilayer printed circuit board |
-
2021
- 2021-01-31 CN CN202110132627.2A patent/CN112867264B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04299592A (en) * | 1991-03-28 | 1992-10-22 | Toshiba Corp | Printed wiring board |
| KR20030033633A (en) * | 2001-10-24 | 2003-05-01 | 울트라테라 코포레이션 | Manufacturing method of printed circuit board through hole |
| CN1826035A (en) * | 2006-01-12 | 2006-08-30 | 珠海元盛电子科技有限公司 | Method for making single-face hollowed-out board |
| CN104093277A (en) * | 2014-07-11 | 2014-10-08 | 景旺电子科技(龙川)有限公司 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
| CN110149770A (en) * | 2019-06-12 | 2019-08-20 | 重庆方正高密电子有限公司 | The manufacturing method and multilayer printed circuit board of multilayer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112867264B (en) | 2024-08-02 |
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