CN112654136B - Reinforcement deviation detection plate and detection method of flexible circuit board - Google Patents
Reinforcement deviation detection plate and detection method of flexible circuit board Download PDFInfo
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- CN112654136B CN112654136B CN202011488119.XA CN202011488119A CN112654136B CN 112654136 B CN112654136 B CN 112654136B CN 202011488119 A CN202011488119 A CN 202011488119A CN 112654136 B CN112654136 B CN 112654136B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Abstract
The application is suitable for the field of flexible circuit boards, and provides a reinforcement deviation detection plate of a flexible circuit board, which comprises a base material, a first copper layer and a second copper layer which are respectively arranged on two sides of the base material, and a reinforcement sheet arranged on one side of the first copper layer, which is far away from the base material; the reinforcement deviation detection plate is divided into an FPC unit area and a waste material area, and the periphery of the reinforcement plate extends to the outer side of the FPC unit area; the distance between the second copper layer and the reinforcing piece in the waste material area and the position control tolerance of the reinforcing piece have a preset relation, and a light transmission area is formed between the second copper layer and the reinforcing piece in the waste material area. The application also provides a reinforcement deviation detection method of the flexible circuit board. The reinforcement deviation detection plate and the reinforcement deviation detection method of the flexible circuit board effectively improve the efficiency of reinforcement deviation detection.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a reinforcement deviation detection board and a detection method of a flexible circuit board.
Background
In recent years, the technology of attaching a steel sheet to the surface of a Flexible circuit board (FPC) is becoming more mature, but the requirement for the accuracy of attaching the steel sheet is becoming higher as the demand for products is increased. Although the accuracy of a sheet metal mounting machine can meet the requirement, a method for monitoring the mounting process is lacked at present. Only when the pasted steel sheet machine is monitored for abnormity in the pasting process and the pasted steel sheet machine is corrected in time, the process of pasting the steel sheet can be monitored in real time, bad production is prevented, and product quality is improved.
For a conventional product, the steel sheet of the product is single-edge abduced by 0.1mm (or 0.2mm) relative to the FPC shape, the inspection standard after mounting is that the offset is controlled to be +/-0.1 mm (or +/-0.2 mm), namely the inspection standard is consistent with the abduced position of the steel sheet, and whether the steel sheet attaching precision meets the requirement can be quickly inspected by observing whether the steel sheet exceeds the FPC shape after attaching the steel sheet.
However, for FPC products where the steel sheet is much larger than the FPC profile (one side > 0.3mm), it is required that the tolerance of the control of the position of the pad from the steel sheet to the back of the FPC is ± 0.1 mm. At the moment, the detection requirements of the FPC abdication and the steel sheet deflection are inconsistent, visual detection cannot be carried out, namely, the size of the attached steel sheet is detected by adopting a detection instrument, so that whether the attached position of the steel sheet meets the requirements can be detected, and time and labor are wasted.
Disclosure of Invention
The application provides a reinforcement deviation detection plate and a detection method of a flexible circuit board, and aims to improve the efficiency of reinforcement deviation detection.
The first aspect of the application provides a reinforcement deviation detection plate of a flexible circuit board, which comprises a base material, a first copper layer and a second copper layer which are respectively arranged on two sides of the base material, and a reinforcement sheet arranged on one side of the first copper layer, which is far away from the base material;
the reinforcement deviation detection plate is divided into an FPC unit area and a waste material area, and the periphery of the reinforcement plate extends to the outer side of the FPC unit area;
the distance between the second copper layer and the reinforcing piece in the waste material area and the position control tolerance of the reinforcing piece have a preset relation, and a light transmission area is formed between the second copper layer and the reinforcing piece in the waste material area.
In one embodiment, the predetermined relationships are equal relationships.
In an embodiment, the second copper layer includes a pad for reference, the predetermined dimension from the edge of the stiffener to the center of the pad for reference is S, the position control tolerance of the stiffener is a, and the control dimension from the edge of the stiffener to the center of the pad for reference is S ± a.
In one embodiment, the first copper layer in the scrap region has a spacing b to the reinforcing sheet, and b is greater than a.
In one embodiment, b is ≧ a +0.2 mm.
In an embodiment, the second copper layer further includes four positioning points, an annular copper-free area is disposed around each positioning point, and white ink is printed on the positioning points and the annular copper-free areas;
the reinforcing sheet is attached by an automatic reinforcing machine through recognizing the positioning of the four positioning points.
In an embodiment, the bonding pad and the four positioning points are made of the same film.
In one embodiment, a gap is formed between the first copper layer of the waste material region and the first copper layer of the FPC unit region, and a gap is formed between the second copper layer of the waste material region and the second copper layer of the FPC unit region.
In one embodiment, the number of the waste material areas is four, and the four waste material areas are respectively located on the periphery of the FPC unit area.
The second aspect of the present application provides a method for detecting reinforcement deviation of a flexible circuit board, including:
providing a reinforcement offset detector plate as described in the first aspect;
and irradiating backlight from one side of the second copper layer to the reinforcement deviation detection plate so as to detect the position accuracy of the reinforcement deviation detection plate through the light-transmitting area.
Above-mentioned flexible circuit board's reinforcement off normal pick-up plate is used for detecting the position precision of reinforcement piece, because the interval between second copper layer in the waste material district and the reinforcement piece has the predetermined relation with the position management and control tolerance of reinforcement piece between, and forms the printing opacity district between second copper layer in the waste material district and the reinforcement piece, whether the actual printing opacity condition through the printing opacity district can detect the position precision of reinforcement piece and meet the requirements, has promoted the efficiency that the reinforcement detected.
According to the reinforcement deviation detection plate and the detection method of the flexible circuit board, the position accuracy of the reinforcement sheet in the flexible circuit board can be detected through the light-transmitting area, the size of a product does not need to be detected completely by using a detection instrument, whether the attaching position of the reinforcement sheet meets the requirement or not can be detected, time and labor are saved, and the detection efficiency is improved. The reinforcement deviation detection plate can be used for detecting the fitting precision of the reinforcement sheet of the flexible circuit board in time, so that the automatic reinforcement machine is corrected in time, poor fitting is prevented, the quality of a product is promoted, and the production cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a reinforcement offset detection plate for a flexible circuit board according to an embodiment of the present application.
Fig. 3 is a flowchart of a reinforcement deviation detecting method for a flexible circuit board according to an embodiment of the present disclosure.
Fig. 4 is a schematic view of a reinforcement deviation detection plate provided in the embodiment of the present application during detection.
The designations in the figures mean:
1. a flexible circuit board; 2. a substrate; 3. a first copper layer; 4. a second copper layer; 5. a first solder mask layer; 6. a second solder mask layer; 7. a reinforcing sheet; 8. a pad; 9. positioning points; A. an FPC unit area; B. a waste zone; C. notching;
100. a reinforcement deviation detecting plate; 10. a substrate; 20. a first copper layer; 30. a second copper layer; 31. a pad; 32. positioning points; 33. an annular copper-free region; 40. a reinforcing sheet; 101. an FPC unit area; 102. a waste zone; 103. a light-transmitting region.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
To illustrate the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application, where the flexible circuit board is a product to be detected for reinforcement deviation. Referring to fig. 1, the flexible circuit board 1 includes a substrate 2, a first copper layer 3 and a second copper layer 4 respectively disposed on two sides of the substrate 2, a first solder mask layer 5 disposed on a side of the first copper layer 3 away from the substrate 2, a second solder mask layer 6 disposed on a side of the second copper layer 4 away from the substrate 2, and a reinforcing sheet 7 disposed on an outer side of the first solder mask layer 5.
The flexible circuit board 1 is divided into an FPC unit area A and a waste material area B arranged on the periphery of the FPC unit area A, a notching C is arranged between the FPC unit area A and the waste material area B, and the notching C is a through groove and penetrates through the first solder mask layer 5, the first copper layer 3, the base material 2, the second copper layer 4 and the second solder mask layer 6. The notching C is convenient for subsequent plate separation after component mounting. The first and second solder masks 5 and 6 may be coverlays, solder mask inks, or the like.
The second copper layer 4 includes a pad 8, the shape of the reinforcing sheet 7 is larger than that of the FPC unit area a, the preset size from the edge of the reinforcing sheet 7 to the center of the pad 8 is S, the position control tolerance of the reinforcing sheet 7 is a, and the control size from the edge of the reinforcing sheet 7 to the center of the pad 8 is S ± a.
The second copper layer 4 further comprises four positioning points (Mark points) 9, the bonding pad 8 is located in the FPC unit area a, and the four positioning points 9 are located in the waste area B. The automatic reinforcing machine can position the flexible circuit board 1 by identifying the positioning points 9 so as to mount the reinforcing sheet 7.
In order to detect the position precision of reinforcement piece among the flexible circuit board, this application provides a reinforcement off normal pick-up plate of flexible circuit board. Referring to fig. 2, the reinforcement deviation detecting board 100 of the flexible circuit board includes a substrate 10, a first copper layer 20 and a second copper layer 30 respectively disposed on two sides of the substrate 10, and a reinforcement sheet 40 disposed on a side of the first copper layer 20 away from the substrate 10.
The reinforcement deviation detection plate 100 is divided into an FPC unit area 101 and a waste area 102, and the periphery of the reinforcement sheet 40 extends to the outer side of the FPC unit area 101, that is, the shape of the reinforcement sheet 40 is larger than that of the FPC unit area 101.
The distance between the second copper layer 30 and the reinforcing sheet 40 in the scrap region 102 has a predetermined relationship with the position control tolerance of the reinforcing sheet 40, and a light-transmitting region 103 is formed between the second copper layer 30 and the reinforcing sheet 40 in the scrap region 102. The "pitch" described in the present application is the pitch of two elements on the same projection plane, and does not include the perpendicular distance between the two elements.
The reinforcement deviation detecting plate 100 is used to detect the position accuracy of the reinforcement sheet 40. Because the distance between the second copper layer 30 and the reinforcing sheet 40 in the scrap region 102 and the position control tolerance of the reinforcing sheet 40 have a preset relationship, and a light-transmitting region 103 is formed between the second copper layer 30 and the reinforcing sheet 40 in the scrap region 102, whether the position accuracy of the reinforcing sheet 40 meets the requirement can be detected through the actual light-transmitting condition of the light-transmitting region 103. It can be understood that the smaller the width of the light-transmitting area 103, the larger the positional deviation amount of the reinforcing sheet 40 is, and the larger the positional control tolerance is, and the machine adjustment of the automatic reinforcing machine is required.
Above-mentioned reinforcement off normal pick-up plate 100 accessible printing opacity district 103 detects the position precision of reinforcement piece 40 among the flexible circuit board, need not use detecting instrument to survey the product size entirely, can detect whether laminating position of reinforcement piece 40 meets the requirements, and labour saving and time saving has promoted detection efficiency. The reinforcement deviation detection plate 100 can be used for detecting the fitting precision of the reinforcement sheet 40 of the flexible circuit board in time, so that the automatic reinforcement machine can be corrected in time, poor fitting is prevented, the quality of a product is improved, and the production cost is reduced.
In one embodiment, the predetermined relationship is an equal relationship, i.e., the spacing between the second copper layer 30 and the reinforcing sheet 40 in the scrap region 102 and the position control tolerance of the reinforcing sheet 40. When the light-transmitting area 103 is completely opaque, it indicates that the positional deviation of the reinforcing sheet 40 exceeds the positional control tolerance. Therefore, the reinforcement deviation can be detected only by detecting whether the light-transmitting area 103 transmits light or not. The reinforcement deviation detection plate 100 can support visual detection and CCD photographing detection.
It is to be understood that the predetermined relationship may also be a proportional relationship, for example, the distance between the second copper layer 30 and the reinforcing sheet 40 in the scrap region 102 is 1.1 times or 0.9 times the position control tolerance of the reinforcing sheet 40, and the position accuracy of the reinforcing sheet 40 can also be detected by analyzing the actual light transmission width of the light transmission region 103.
In one embodiment, the substrate 10 may be a PI substrate, but is not limited thereto. The PI substrate has certain transmittance, and can meet the requirement of the light transmission area 103. It is understood that the substrate 10 may be made of other materials with certain transmittance and softer material.
In one embodiment, the reinforcing sheet 40 may be a steel sheet, an aluminum sheet, polyimide, or a glass cloth substrate.
In an embodiment, the second copper layer 30 includes a pad 31, a predetermined dimension from an edge of the stiffener 40 to a center of the pad 31 is S, a position control tolerance of the stiffener 40 is a, and a control dimension from the edge of the stiffener 40 to the center of the pad 31 is S ± a. In this embodiment, the product is required to inspect the reinforcing sheet 40 with the pad 31 as a reference, and since the second copper layer 30 and the pad 31 in the scrap region 102 are made of the same film and there is no positional deviation therebetween, the positional accuracy of the reinforcing sheet 40 can be accurately inspected by the reinforcing offset inspection board 100.
The first copper layer 20 in the scrap region 102 is spaced from the reinforcing sheet 40 by a distance b, and b is greater than a. That is, the spacing b between the first copper layer 20 of the scrap region 102 and the reinforcing sheet 40 is greater than the spacing a between the second copper layer 30 of the scrap region 102 and the reinforcing sheet 40. Thus, the first copper layer 20 of the waste region 102 can give way to the transparent region 103, so as to prevent the first copper layer 20 from shielding the transparent region 103.
Preferably, b is more than or equal to a +0.2 mm. Since there may be misalignment between the first copper layer 20 and the second copper layer 30, and the exposure alignment accuracy of the double-sided pattern circuit is usually controlled within ± 0.1mm, the above formula is satisfied to prevent the first copper layer 20 from blocking the transparent region 103 due to the misalignment of the circuit manufacturing.
In one embodiment, the second copper layer 30 further includes four positioning points 32, an annular copper-free region 33 is disposed around each positioning point 32, and the positioning points 32 and the annular copper-free region 33 are printed with white ink; in this manner, the reinforcing sheet 40 is attached by recognizing the positioning of the four positioning points 32 by the automatic reinforcing machine.
Thus, the top circuit layer of the reinforcement deviation detection plate 100 is attached and reinforced, and the four positioning points 32 are arranged on the bottom circuit layer of the reinforcement deviation detection plate 100.
Preferably, the anchor points 32 are circles that retain the copper sheet.
Preferably, the diameter of the positioning point 32 is 0.5mm to 2.0mm, and the radial width of the annular copper-free zone 33 is 0.5mm to 2.0 mm.
The bonding pad 31 and the four positioning points 32 are made of the same film. Therefore, there is no processing deviation among the second copper layer 30, the bonding pad 31, and the four positioning points 32 in the scrap region 102, so as to improve the accuracy of attaching the reinforcing sheet 40 and the accuracy of detection.
It is understood that the first copper layer 20 may be provided with a copper-free region corresponding to the annular copper-free region 33 and the anchor point 32 to avoid the identification of the anchor point.
A gap is formed between the first copper layer 20 of the waste material region 102 and the first copper layer 20 of the FPC unit region 101, and a gap is formed between the second copper layer 30 of the waste material region 102 and the second copper layer 30 of the FPC unit region 101. The FPC unit area 101 and the waste area 102 are partitioned by the above gap.
The reinforcement deviation detection plate 100 is mainly used for detection, and does not need to be manufactured into a finished product, so that punching of the reinforcement deviation detection plate 100 is not needed, and the gap can be formed through an etching step when the first copper layer 20 and the second copper layer 30 are manufactured, so that the manufacturing process of the reinforcement deviation detection plate 100 is simple, and the production efficiency is high. It can be understood that compared with the conventional flexible circuit board product, the manufacturing process of the reinforcement deviation detection plate 100 does not need pressing, solder mask, gold immersion, electrical measurement and other processes.
In one embodiment, the number of the waste material areas 102 is four, and four waste material areas 102 are respectively located at the periphery of the FPC unit area 101. Thus, the second copper layer 30 of the four waste areas 102 and the FPC unit area 101 form four light-transmitting areas 103, and the positional accuracy in four directions, i.e., up, down, left, and right, of the reinforcing plate can be detected by the four light-transmitting areas 103.
Referring to fig. 3 and 4, an embodiment of the present application further provides a reinforcement deviation detecting method for a flexible circuit board, including the following steps.
In step S110, a reinforcement deviation detecting board 100 is provided.
The reinforcement deviation detection plate 100 is the reinforcement deviation detection plate 100 provided in any of the above embodiments.
It can be understood that the reinforcement deviation detection plate 100 and the conventional flexible circuit board product are manufactured by using the same parameters, and the consistency of key data such as size, expansion and contraction and the like between the reinforcement deviation detection plate 100 and the conventional product is ensured. The flexible circuit board products of the same model correspond to one reinforcing deviation detection plate 100, and the flexible circuit board products of different models cannot share the reinforcing deviation detection plate 100.
In one embodiment, the reinforcement deviation detection plate 100 is manufactured as follows.
First, a substrate 10 is provided.
Next, a first copper layer 20 and a second copper layer 30 are respectively formed on both sides of the substrate 10. The reinforcement deviation detecting board 100 is divided into an FPC unit area 101 and a waste area 102. In the design stage, the first copper layer 20 and the second copper layer 30 may be modified on the basis of the flexible circuit board 1, so that the distance between the second copper layer 30 of the waste material region 102 and the preset shape of the reinforcing sheet 40 and the position control tolerance satisfy the preset relationship, and the distance between the first copper layer 20 of the waste material region 102 and the preset shape of the reinforcing sheet 40 is greater than or equal to the position control tolerance. Preferably, the distance between the second copper layer 30 of the scrap region 102 and the predetermined outline of the reinforcing sheet 40 is equal to the position control tolerance a, so that the distance between the first copper layer 20 of the scrap region 102 and the predetermined outline of the reinforcing sheet 40 is greater than or equal to a +0.2 mm.
The method of forming the first copper layer 20 or the second copper layer 30 may include exposing, developing, etching, and the like.
Then, the reinforcing sheet 40 is attached on the first copper layer 20 using an automatic reinforcing machine. The reinforcing sheet 40 is located in the FPC unit region 101 and the periphery of the reinforcing sheet 40 extends to the outside of the FPC unit region 101, that is, the outer shape of the reinforcing sheet 40 is larger than the outer shape of the FPC unit region 101. The parameters of the automatic reinforcing machine are consistent with those of a normally produced product, and the positioning mode is also consistent, so that the reliability of reinforcing deviation detection is ensured.
In step S120, a backlight is irradiated from one side of the second copper layer 30 to the reinforcement deviation detecting plate 100 to detect the position accuracy of the reinforcing sheet 40 through the light-transmitting area 103.
The reinforcement deviation detection plate 100 may be placed corresponding to the backlight, and whether the light-transmitting region 103 transmits light may be detected visually. Meanwhile, whether the light transmission regions around the reinforcing sheet 40 are equal or not can be visually detected.
Alternatively, after the stiffening offset detection plate 100 is illuminated with backlight, the stiffening offset detection plate 100 may be photographed by using a CCD camera to acquire an image, and whether the light-transmitting region 103 transmits light or the light-transmitting width of the light-transmitting region 103 is analyzed by analyzing the image.
After step S110, the reinforcement deviation detecting method further includes: the reinforcement offset sensing board 100 is placed on the test table such that the first copper layer 20 is located on the side of the reinforcement offset sensing board 100 that is close to the test table. Thus, backlight can be irradiated through a lateral reinforcement deviation detection plate 100 of the detection table, so that detection is facilitated.
If the detection is qualified, the automatic reinforcing machine can be continuously used for sticking the reinforcing sheet 40 to the subsequent product; if the detection is not qualified, the parameters of the automatic reinforcing machine need to be adjusted, and the steps S110 and S120 are repeated until the detection is qualified.
The reinforcement deviation detection method of the flexible circuit board can quickly and conveniently detect the position precision of the reinforcement sheet 40, so that whether the reinforcement sheet 40 deviates or not is judged, an automatic reinforcement machine can be adjusted and calibrated in time, and the quality and the yield of products are improved. The reinforcement deviation detection method does not need to measure the size completely, and has high efficiency and reliability.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. A reinforcement deviation detecting plate of a flexible circuit board is characterized in that,
the reinforcement deviation detection plate comprises a base material, a first copper layer and a second copper layer which are respectively arranged on two sides of the base material, and a reinforcement sheet arranged on one side of the first copper layer, which is far away from the base material;
the reinforcement deviation detection plate is divided into an FPC unit area and a waste material area, and the periphery of the reinforcement plate extends to the outer side of the FPC unit area;
the distance between the second copper layer and the reinforcing piece in the waste material area and the position control tolerance of the reinforcing piece have a preset relation, and a light transmission area is formed between the second copper layer and the reinforcing piece in the waste material area.
2. The reinforcement deflection test panel of claim 1, wherein said predetermined relationship is an equal relationship.
3. The reinforcement deflection test board of claim 2, wherein the second copper layer includes a reference pad, the predetermined dimension from the edge of the stiffener to the center of the reference pad is S, the position control tolerance of the stiffener is a, and the control dimension from the edge of the stiffener to the center of the reference pad is S ± a.
4. The reinforcement deflection test panel of claim 3, wherein the first copper layer in the scrap region is spaced from the reinforcement tab by a distance b, and b is greater than a.
5. The reinforcement deflection test plate of claim 4, wherein b is ≧ a +0.2 mm.
6. The reinforcement offset sensing plate of claim 3, wherein said second copper layer further comprises four positioning points, an annular copper-free area is disposed around each of said positioning points, and said positioning points and said annular copper-free areas are printed with white ink; the reinforcing sheet is attached by an automatic reinforcing machine through recognizing the positioning of the four positioning points.
7. The reinforcement deviation detecting plate as claimed in claim 6, wherein said bonding pad and said four positioning points are made of the same film.
8. The reinforcement deflection test board of claim 1, wherein a gap is provided between the first copper layer of the waste area and the first copper layer of the FPC unit area, and a gap is provided between the second copper layer of the waste area and the second copper layer of the FPC unit area.
9. The reinforcement deflection detector plate of any one of claims 1-8, wherein the number of said waste areas is four, four of said waste areas being located around each of said FPC unit areas.
10. A reinforcement deviation detection method of a flexible circuit board is characterized by comprising the following steps:
providing a reinforcement offset test panel according to any one of claims 1-9;
and irradiating backlight from one side of the second copper layer to the reinforcement deviation detection plate so as to detect the position accuracy of the reinforcement sheet through the light transmission area.
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| CN202011488119.XA CN112654136B (en) | 2020-12-16 | 2020-12-16 | Reinforcement deviation detection plate and detection method of flexible circuit board |
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| JP2005310584A (en) * | 2004-04-22 | 2005-11-04 | Koito Mfg Co Ltd | Lamp for vehicle |
| JP4403049B2 (en) * | 2004-10-13 | 2010-01-20 | 日東電工株式会社 | Method for manufacturing printed circuit board |
| CN103338596A (en) * | 2013-06-18 | 2013-10-02 | 华南理工大学 | Manufacturing method of whole addition circuit board without photoresist |
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