CN115597487B - Measurement method for measuring offset between printed circuit board layers - Google Patents
Measurement method for measuring offset between printed circuit board layers Download PDFInfo
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- CN115597487B CN115597487B CN202211240242.9A CN202211240242A CN115597487B CN 115597487 B CN115597487 B CN 115597487B CN 202211240242 A CN202211240242 A CN 202211240242A CN 115597487 B CN115597487 B CN 115597487B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
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- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a measuring method for measuring offset between printed circuit board layers, which comprises the following steps: and (3) a step of: providing a circuit board to be tested, wherein the circuit board to be tested comprises a first layer to be tested positioned on the surface layer and a second layer to be tested positioned on the inner layer, the first layer to be tested is provided with a first circular pattern, the second layer to be tested is provided with a second circular pattern, and the circle centers of the two circular patterns are positioned on the same vertical line; and II: ablating an observation blind hole on the circuit board to be tested through laser drilling, wherein the observation blind hole covers a part of the edge of the second circular pattern and is used for exposing a section of circular arc; thirdly,: the circuit board to be tested is placed on an optical image measuring instrument, the circle center of the first circular pattern is captured through the measuring instrument, and the circle center of the second circular pattern is fitted by the exposed circular arc of the second circular pattern; fourth, the method comprises the following steps: and measuring the circle center distance A of the circle centers of the two circular patterns on the horizontal plane projection by an optical image measuring instrument, wherein A is the offset value of the first layer to be measured and the second layer to be measured at the group of circular patterns.
Description
Technical Field
The invention relates to a measuring method for measuring offset between printed circuit board layers.
Background
There are two common methods currently used to detect circuit board interlayer offset: the interlayer offset of the circuit board is directly measured after slicing the circuit board, but the measuring method only can measure the offset in a single direction by sampling once, has low efficiency and is difficult to implement in a large scale for destructive test; in another method, metal patterns are arranged at specific positions of each layer of the circuit board in advance, and then the position relation of each preset metal pattern is observed by using X-RAY imaging so as to reversely push out the offset of each layer of the circuit board.
Therefore, how to overcome the above-mentioned drawbacks has become an important issue to be solved by the person skilled in the art.
Disclosure of Invention
The invention overcomes the defects of the technology and provides a measuring method for measuring the offset between the printed circuit board layers.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a measurement method for measuring an offset between printed circuit board layers, comprising the steps of:
step one: providing a circuit board 1 to be tested, wherein the circuit board 1 to be tested comprises a first layer 11 to be tested and a second layer 12 to be tested, the first layer 11 to be tested is positioned on the surface layer of the circuit board 1 to be tested, the second layer 12 to be tested is positioned on the inner layer of the circuit board 1 to be tested, a first circular pattern 2 is arranged on the first layer 11 to be tested, a second circular pattern 3 is arranged on the second layer 12 to be tested, and the circle center positions of the first circular pattern 2 and the second circular pattern 3 are positioned on the same vertical line in the design of the circuit board 1 to be tested;
step two: ablating a substrate of the circuit board 1 to be tested positioned above the second circular pattern 3 by laser drilling at the edge of the preset position of the second circular pattern 3 to form an observation blind hole 4, wherein the observation blind hole 4 covers a part of the edge of the second circular pattern 3 so as to expose a section of circular arc 31;
step three: the circuit board 1 to be tested is placed on an optical image measuring instrument, the circle center of the first circular pattern 2 is captured through the optical image measuring instrument, and the circle center of the second circular pattern 3 is fitted through the optical image measuring instrument by using the exposed arc 31 of the second circular pattern 3;
step four: and measuring the center distance A of the center of the first circular pattern 2 and the center of the second circular pattern 3 on the horizontal plane projection by an optical image measuring instrument, wherein the center distance A is the offset value of the first layer 11 to be measured and the second layer 12 to be measured at the group of circular patterns.
Preferably, in the second step, at least one observation blind hole 4 is ablated corresponding to one second circular pattern 3, and if there are two or more observation blind holes 4, all the circular arcs 31 revealed by the second circular pattern 3 in the third step fit the center of the circle of the second circular pattern 3 together.
Preferably, if the blind holes 4 are observed in two or more ways, the circular arcs 31 respectively revealed are equal in length and uniformly distributed in the circumferential direction of the second circular pattern 3.
Preferably, the second step further includes drilling a light-transmitting through hole 5 corresponding to the circular arc 31 and penetrating through the circuit board 1 to be tested by laser drilling on the outer side of the exposed circular arc 31.
Preferably, the first circular pattern 2 has a diameter B, the second circular pattern 3 has a diameter C, and C > B.
Preferably, the diameter of the first circular pattern 2 is B, and 0.3 mm.ltoreq.B.ltoreq.1 mm, and the diameter of the second circular pattern 3 is C, and 1.5 B.ltoreq.C.ltoreq.2B.
Preferably, the first circular pattern 2 and the second circular pattern 3 corresponding to the positions form a group of detection units for measuring the interlayer offset of one position of the circuit board 1 to be tested, at least two detection units are arranged on the circuit board 1 to be tested, and each detection unit is processed in the second to fourth steps.
Preferably, the detecting units are distributed on the edge of the circuit board 1 to be detected.
Preferably, the first circular pattern 2 is a copper region formed by etching or plating, and the second circular pattern 3 is a copper region formed by etching or plating.
Compared with the prior art, the invention has the beneficial effects that:
according to the measuring method, a first circular pattern is arranged on a first layer to be measured on the surface layer of the circuit board to be measured, a second circular pattern is arranged on a second layer to be measured on the inner layer, then an observation blind hole is ablated through laser drilling to expose a section of circular arc of the second circular pattern, and finally the measuring instrument can directly capture the circle center position of the first circular pattern when the circuit board to be measured is placed on the optical image measuring instrument. In addition, the second step of the measuring method can be completed along with the formation of the circuit board to be measured, and the detection can be completed rapidly and accurately by only selecting a circuit board sample and placing the circuit board sample on an optical influence measuring instrument for measurement when the interlayer offset is required to be measured later, so that the accuracy of interlayer detection can be greatly improved through optical measurement on the premise of avoiding destructive test on the circuit board.
Drawings
Fig. 1 is a schematic diagram of a circuit board to be tested in the present case.
Fig. 2 is an enlarged schematic view at 1"E ″ of the present case.
FIG. 3 is a schematic cross-sectional view of "F-F" in FIG. 2 of the present application.
Fig. 4 is a schematic diagram of fig. 2 in a state after interlayer displacement.
Detailed Description
The following examples are provided to illustrate the features of the present invention and other related features in further detail to facilitate understanding by those skilled in the art:
as shown in fig. 1 to 4, a measuring method for measuring an inter-board layer offset of a printed circuit board includes the steps of:
step one: providing a circuit board 1 to be tested, wherein the circuit board 1 to be tested comprises a first layer 11 to be tested and a second layer 12 to be tested, the first layer 11 to be tested is positioned on the surface layer of the circuit board 1 to be tested, the second layer 12 to be tested is positioned on the inner layer of the circuit board 1 to be tested, a first circular pattern 2 is arranged on the first layer 11 to be tested, a second circular pattern 3 is arranged on the second layer 12 to be tested, and the circle center positions of the first circular pattern 2 and the second circular pattern 3 are positioned on the same vertical line in the design of the circuit board 1 to be tested;
step two: ablating a substrate of the circuit board 1 to be tested positioned above the second circular pattern 3 by laser drilling at the edge of the preset position of the second circular pattern 3 to form an observation blind hole 4, wherein the observation blind hole 4 covers a part of the edge of the second circular pattern 3 so as to expose a section of circular arc 31;
step three: the circuit board 1 to be tested is placed on an optical image measuring instrument, the circle center of the first circular pattern 2 is captured through the optical image measuring instrument, and the circle center of the second circular pattern 3 is fitted through the optical image measuring instrument by using the exposed arc 31 of the second circular pattern 3;
step four: and measuring the center distance A of the center of the first circular pattern 2 and the center of the second circular pattern 3 on the horizontal plane projection by an optical image measuring instrument, wherein the center distance A is the offset value of the first layer 11 to be measured and the second layer 12 to be measured at the group of circular patterns.
As described above, in the measuring method, the first circular pattern 2 is first set on the first layer 11 to be measured on the surface layer of the circuit board 1 to be measured, the second circular pattern 3 is set on the second layer 12 to be measured on the inner layer, then the observation blind hole 4 is ablated by laser drilling to expose a section of circular arc 31 of the second circular pattern 3, and finally the measuring instrument can directly capture the position of the center of the circle of the first circular pattern 2 when the circuit board 1 to be measured is placed on the optical image measuring instrument, in addition, the measuring instrument can also fit the position of the center of the circle of the second circular pattern 3 by capturing the circular arc 31 exposed by the observation blind hole 4, so that the distance between the center of the circle of the first circular pattern 2 and the center of the circle of the second circular pattern 3 on the horizontal plane projection can be measured by the optical image measuring instrument, thereby obtaining the interlayer offset value of the circuit board 1 to be measured at the group of circular patterns. In addition, the second step of the measuring method can be completed along with the formation of the circuit board 1 to be measured, and the detection can be completed rapidly and with high precision only by selecting a circuit board sample and placing the circuit board sample on an optical influence measuring instrument for measurement when the interlayer offset is required to be measured later, so that the accuracy of interlayer detection can be greatly improved through optical measurement on the premise of avoiding destructive test on the circuit board.
As shown in fig. 1 to 4, preferably, in the second step, one second circular pattern 3 is ablated to form at least one observation blind hole 4, and if the observation blind hole 4 has two or more than two circular arcs 31 exposed by the second circular pattern 3 in the third step fit the circle center of the second circular pattern 3 together, so that the fitting accuracy can be improved by using more circular arcs 31 to fit the circle center of the second circular pattern 3, and the accuracy of the circle center position of the second circular pattern 3 is ensured.
As shown in fig. 1 to 4, preferably, if there are two or more observation blind holes 4, the exposed circular arcs 31 are equal in length and uniformly distributed in the circumferential direction of the second circular pattern 3, so that overcrowding between the exposed circular arcs 31 can be avoided, the representativeness of each circular arc 31 is ensured, and the fitting precision is improved.
As shown in fig. 1 to 4, preferably, the second step further includes drilling a light-transmitting through hole 5 corresponding to the position of the circular arc 31 and penetrating through the circuit board 1 to be measured by laser drilling on the outer side of the exposed circular arc 31, so that the backlight at the bottom of the optical image measuring instrument can penetrate through the circuit board 1 to be measured through the light-transmitting through hole 5, thereby improving the imaging accuracy of the optical image measuring instrument.
As shown in fig. 2 to 3, preferably, the diameter of the first circular pattern 2 is B, the diameter of the second circular pattern 3 is C, and C > B, so that the first circular pattern 2 is not damaged when the light-transmitting through hole 5 and the blind observation hole 4 are formed.
As shown in fig. 2 to 3, preferably, the diameter of the first circular pattern 2 is B, and B is 0.3mm less than or equal to 1mm, and the diameter of the second circular pattern 3 is C, and C is 1.5B less than or equal to 2B, so that it is ensured that each circular pattern is large enough to facilitate the optical image measuring instrument to capture the circle center, and meanwhile, the layout of the circuit and the components is not affected by too large encroachment of too many positions.
As shown in fig. 1, preferably, a first circular pattern 2 and a second circular pattern 3 corresponding to the positions form a group of detection units for measuring the interlayer offset of a position of the circuit board 1 to be tested, at least two detection units are disposed on the circuit board 1 to be tested, and each detection unit is processed in the steps two to four, so that the offset condition can be obtained more comprehensively by measuring the offset values of a plurality of positions of the first layer 11 to be tested and the second layer 12 to be tested.
As shown in fig. 1, preferably, the detecting units are distributed on the edge of the circuit board 1 to be detected, so that the arrangement of the circular patterns can be ensured not to cause too much influence on the layout of the circuit board, and as much space as possible is reserved for circuits and components.
As shown in fig. 1 to 4, it is preferable that the first circular pattern 2 is a copper region formed by etching or plating, and the second circular pattern 3 is a copper region formed by etching or plating.
As described above, the present disclosure protects a measurement method for measuring the offset between printed circuit board layers, and all technical solutions identical or similar to the present disclosure should be shown as falling within the scope of the present disclosure.
Claims (8)
1. A measurement method for measuring an offset between printed circuit board layers, comprising the steps of:
step one: providing a circuit board (1) to be tested, wherein the circuit board (1) to be tested comprises a first layer (11) to be tested and a second layer (12) to be tested, the offset between the first layer (11) to be tested and the second layer (12) to be tested are required to be measured, the first layer (11) to be tested is positioned on the surface layer of the circuit board (1) to be tested, the second layer (12) to be tested is positioned on the inner layer of the circuit board (1) to be tested, a first circular pattern (2) is arranged on the first layer (11) to be tested, a second circular pattern (3) is arranged on the second layer (12) to be tested, and the circle center positions of the first circular pattern (2) and the second circular pattern (3) are positioned on the same vertical line in the design of the circuit board (1) to be tested;
the first circular pattern (2) is a copper region formed by etching or plating, and the second circular pattern (3) is a copper region formed by etching or plating;
step two: ablating a substrate of the circuit board (1) to be tested positioned above the second circular pattern (3) at the edge of the preset position of the second circular pattern (3) through laser drilling to form an observation blind hole (4), wherein the observation blind hole (4) covers a part of the edge of the second circular pattern (3) so as to expose a section of circular arc (31);
step three: the circuit board (1) to be tested is arranged on an optical image measuring instrument, the circle center of the first circular pattern (2) is captured through the optical image measuring instrument, and the circle center of the second circular pattern (3) is fitted through the optical image measuring instrument by using an arc (31) exposed out of the second circular pattern (3);
step four: and measuring a circle center distance A of the circle centers of the first circular pattern (2) and the second circular pattern (3) on the horizontal plane projection by an optical image measuring instrument, wherein the circle center distance A is an offset value of the first layer (11) to be measured and the second layer (12) to be measured at the group of circular patterns.
2. The method according to claim 1, wherein in the second step, at least one blind observation hole (4) is ablated in correspondence with one second circular pattern (3), and if there are two or more blind observation holes (4), all the circular arcs (31) revealed by the second circular pattern (3) in the third step fit the center of the circle of the second circular pattern (3) together.
3. A measuring method for the offset between printed circuit board layers according to claim 2, characterized in that if there are two or more blind observation holes (4), the arcs (31) that they reveal respectively are equal in length and uniformly distributed in the circumferential direction of the second circular pattern (3).
4. A method for measuring offset between printed circuit boards according to any of claims 1 to 2, characterized in that step two further comprises drilling a light-transmitting through hole (5) corresponding to the position of the circular arc (31) and penetrating the circuit board (1) to be measured by laser drilling outside the exposed circular arc (31).
5. A measuring method for measuring an offset between printed circuit board layers according to claim 1, characterized in that the first circular pattern (2) has a diameter B, the second circular pattern (3) has a diameter C, and C > B.
6. A measuring method for measuring an offset between printed circuit board layers according to claim 5, characterized in that the diameter of the first circular pattern (2) is B and 0.3 mm.ltoreq.b.ltoreq.1 mm, the diameter of the second circular pattern (3) is C and 1.5 b.ltoreq.c.ltoreq.2b.
7. The method for measuring the inter-layer offset of the printed circuit board according to claim 1, wherein the first circular pattern (2) and the second circular pattern (3) corresponding to the positions form a group of detection units for measuring the inter-layer offset of the circuit board (1) to be measured, the circuit board (1) to be measured is provided with at least two detection units, and each detection unit is processed in the steps two to four.
8. A measuring method for measuring an offset between printed circuit board layers according to claim 7, characterized in that the detecting units are distributed at the edges of the circuit board (1) to be measured.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211240242.9A CN115597487B (en) | 2022-10-11 | 2022-10-11 | Measurement method for measuring offset between printed circuit board layers |
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| CN202211240242.9A CN115597487B (en) | 2022-10-11 | 2022-10-11 | Measurement method for measuring offset between printed circuit board layers |
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| CN115597487B true CN115597487B (en) | 2023-09-15 |
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| CN112304215A (en) * | 2019-07-31 | 2021-02-02 | 由田新技股份有限公司 | Method and equipment for detecting hole site information of printed circuit board |
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| TW200730047A (en) * | 2006-01-16 | 2007-08-01 | Advanced Semiconductor Eng | Method for fabricating conductive blind via of circuit substrate |
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