CN115597487A - Measuring method for measuring interlayer offset of printed circuit board - Google Patents
Measuring method for measuring interlayer offset of printed circuit board Download PDFInfo
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- CN115597487A CN115597487A CN202211240242.9A CN202211240242A CN115597487A CN 115597487 A CN115597487 A CN 115597487A CN 202211240242 A CN202211240242 A CN 202211240242A CN 115597487 A CN115597487 A CN 115597487A
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- circular pattern
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
Abstract
The invention discloses a measuring method for measuring interlayer offset of a printed circuit board, which comprises the following steps: firstly, the method comprises the following steps: providing a circuit board to be tested, wherein the circuit board to be tested comprises a first layer to be tested positioned on a surface layer and a second layer to be tested positioned on an inner layer, a first circular pattern is arranged on the first layer to be tested, a second circular pattern is arranged on the second layer to be tested, and the circle centers of the two circular patterns are positioned on the same vertical line; II, secondly: an observation blind hole is ablated on the circuit board to be detected through laser drilling, and the observation blind hole covers the edge of a part of the second circular pattern and is used for exposing a section of circular arc; thirdly, the method comprises the following steps: placing the circuit board to be tested on an optical image measuring instrument, capturing the circle center of the first circular pattern through the measuring instrument, and fitting the circle center of the second circular pattern by using the exposed arc of the second circular pattern; fourthly, the method comprises the following steps: and measuring the circle center distance A of the circle centers of the two circular patterns on the horizontal plane projection through an optical image measuring instrument, wherein the circle center distance A is the deviation value of the first layer to be measured and the second layer to be measured at the group of circular patterns.
Description
Technical Field
The invention relates to a measuring method for measuring the interlayer offset of a printed circuit board.
Background
There are two common methods for detecting the interlayer offset of the circuit board: one method is to slice the circuit board and directly measure the interlayer offset of the circuit board after slicing, but the measurement method can only measure the offset in a single direction by sampling once, has low efficiency and is difficult to implement on a large scale for destructive tests; in the other method, a metal pattern is arranged at a specific position of each layer of the circuit board in advance, and then the position relation of each preset metal pattern is observed by utilizing X-RAY RAY imaging so as to reversely deduce the offset of each layer of the circuit board.
Therefore, how to overcome the above-mentioned drawbacks has become an important issue to be solved by those skilled in the art.
Disclosure of Invention
The invention overcomes the defects of the technology and provides a measuring method for measuring the interlayer offset of the printed circuit board.
In order to realize the purpose, the invention adopts the following technical scheme:
a measuring method for measuring the interlayer offset of a printed circuit board comprises the following steps:
the method comprises the following steps: providing a circuit board 1 to be tested, wherein the circuit board 1 to be tested comprises a first layer 11 to be tested and a second layer 12 to be tested, the first layer 11 to be tested is located on the surface layer of the circuit board 1 to be tested, the second layer 12 to be tested is located on the inner layer of the circuit board 1 to be tested, a first circular pattern 2 is arranged on the first layer 11 to be tested, a second circular pattern 3 is arranged on the second layer 12 to be tested, and the circle centers of the first circular pattern 2 and the second circular pattern 3 are located on the same vertical line in the design of the circuit board 1 to be tested;
step two: burning off the base material of the circuit board 1 to be tested above the second circular pattern 3 at the edge of the preset position of the second circular pattern 3 through laser drilling to form an observation blind hole 4, wherein the observation blind hole 4 covers the edge of a part of the second circular pattern 3 so as to expose a section of circular arc 31;
step three: placing the circuit board 1 to be tested on an optical image measuring instrument, capturing the circle center of the first circular pattern 2 through the optical image measuring instrument, and fitting the circle center of the second circular pattern 3 by using the exposed arc 31 of the second circular pattern 3 through the optical image measuring instrument;
step four: and measuring the circle center distance A of the circle center of the first circular pattern 2 and the circle center of the second circular pattern 3 on the horizontal plane projection by using an optical image measuring instrument, wherein the circle center distance A is the deviation value of the first layer to be measured 11 and the second layer to be measured 12 at the group of circular patterns.
Preferably, in the second step, at least one observation blind hole 4 is correspondingly ablated in one second circular pattern 3, and if there are two or more observation blind holes 4, all arcs 31 exposed through the second circular pattern 3 in the third step are jointly fitted to the circle center of the second circular pattern 3.
Preferably, if there are two or more blind observation holes 4, the arcs 31 respectively exposed by them are equal in length and are uniformly distributed in the circumferential direction of the second circular pattern 3.
Preferably, the second step further includes drilling a light-transmitting through hole 5 corresponding to the position of the arc 31 and penetrating through the circuit board 1 to be tested, on the outer side of the exposed arc 31 through laser drilling.
Preferably, the first circular pattern 2 has a diameter B, the second circular pattern 3 has a diameter C, and C > B.
Preferably, the first circular patterns 2 have a diameter B of 0.3mm ≦ B ≦ 1mm, and the second circular patterns 3 have a diameter C of 1.5B ≦ C ≦ 2B.
Preferably, a first circular pattern 2 and a second circular pattern 3 corresponding to the positions form a group of detection units for measuring the interlayer offset of one position of the circuit board 1 to be detected, at least two detection units are arranged on the circuit board 1 to be detected, and each detection unit is processed in the second step, the second step and the fourth step.
Preferably, the detection units are distributed at the edge of the circuit board 1 to be detected.
Preferably, the first circular pattern 2 is a copper region formed by etching or plating, and the second circular pattern 3 is a copper region formed by etching or plating.
Compared with the prior art, the invention has the beneficial effects that:
the measuring method comprises the steps of arranging a first circular pattern on a first to-be-measured layer on the surface layer of a circuit board to be measured, arranging a second circular pattern on a second to-be-measured layer on the inner layer, then exposing a section of circular arc of the second circular pattern by ablating an observation blind hole through laser drilling, and finally directly capturing the circle center position of the first circular pattern by a measuring instrument when the circuit board to be measured is placed on an optical image measuring instrument. In addition, the second step of the measuring method can be completed along with the forming of the circuit board to be measured, and the detection can be completed quickly and accurately only by selecting a circuit board sample and placing the circuit board sample on an optical influence measuring instrument to measure when the interlayer deviation needs to be measured subsequently, so that the accuracy of interlayer detection can be greatly improved through optical measurement on the premise of avoiding destructive tests on the circuit board.
Drawings
FIG. 1 is a schematic diagram of a circuit board to be tested according to the present invention.
FIG. 2 is an enlarged schematic view of the site E' of FIG. 1.
FIG. 3 is a schematic sectional view of "F-F" in FIG. 2.
Fig. 4 is a schematic view of the state of fig. 2 after interlayer offset occurs.
Detailed Description
The features of the present invention and other related features are further described in detail below by way of examples to facilitate understanding by those skilled in the art:
as shown in fig. 1 to 4, a measuring method for measuring an interlayer offset of a printed circuit board includes the steps of:
the method comprises the following steps: providing a circuit board 1 to be tested, wherein the circuit board 1 to be tested comprises a first layer 11 to be tested and a second layer 12 to be tested, the first layer 11 to be tested is located on the surface layer of the circuit board 1 to be tested, the second layer 12 to be tested is located on the inner layer of the circuit board 1 to be tested, a first circular pattern 2 is arranged on the first layer 11 to be tested, a second circular pattern 3 is arranged on the second layer 12 to be tested, and the circle centers of the first circular pattern 2 and the second circular pattern 3 are located on the same vertical line in the design of the circuit board 1 to be tested;
step two: burning off the base material of the circuit board 1 to be tested above the second circular pattern 3 at the edge of the preset position of the second circular pattern 3 through laser drilling to form an observation blind hole 4, wherein the observation blind hole 4 covers the edge of a part of the second circular pattern 3 so as to expose a section of circular arc 31;
step three: placing the circuit board 1 to be tested on an optical image measuring instrument, capturing the circle center of the first circular pattern 2 through the optical image measuring instrument, and fitting the circle center of the second circular pattern 3 by using the exposed arc 31 of the second circular pattern 3 through the optical image measuring instrument;
step four: and measuring a circle center distance A of the circle center of the first circular pattern 2 and the circle center of the second circular pattern 3 on a horizontal plane projection through an optical image measuring instrument, wherein the circle center distance A is an offset value of the first layer to be measured 11 and the second layer to be measured 12 at the group of circular patterns.
As described above, in the measuring method of the present application, the first circular pattern 2 is arranged on the first layer to be measured 11 on the surface layer of the circuit board 1 to be measured, the second circular pattern 3 is arranged on the second layer to be measured 12 on the inner layer, the observation blind hole 4 is ablated by laser drilling to expose a section of circular arc 31 of the second circular pattern 3, and finally, when the circuit board 1 to be measured is placed on the optical image measuring instrument, the measuring instrument can directly capture the circle center position of the first circular pattern 2, and in addition, the measuring instrument can also fit the circle center position of the second circular pattern 3 by capturing the circular arc 31 exposed by the observation blind hole 4, so that the circle center distance of the circle centers of the first circular pattern 2 and the second circular pattern 3 on the horizontal plane projection can be measured by the optical image measuring instrument, and the interlayer offset value of the circuit board 1 to be measured on the group of circular patterns is obtained. In addition, the second step of the measuring method can be completed along with the forming of the circuit board 1 to be measured, and the detection can be completed quickly and accurately only by selecting a circuit board sample and placing the circuit board sample on an optical influence measuring instrument to measure when the interlayer deviation needs to be measured subsequently, so that the accuracy of interlayer detection can be greatly improved through optical measurement on the premise of avoiding destructive tests on the circuit board.
As shown in fig. 1 to 4, preferably, at least one blind observation hole 4 is correspondingly ablated in one second circular pattern 3 in the second step, and if there are two or more blind observation holes 4, all circular arcs 31 exposed through the second circular pattern 3 in the third step are jointly fitted to the center of the second circular pattern 3, so that more circular arcs 31 can be used to fit the center of the second circular pattern 3, thereby improving the fitting accuracy and ensuring the accuracy of the position of the center of the second circular pattern 3.
As shown in fig. 1 to 4, preferably, if there are two or more blind observation holes 4, the exposed arcs 31 are equal in length and are uniformly distributed in the circumferential direction of the second circular pattern 3, so that overcrowding between the exposed arcs 31 can be avoided, each arc 31 is guaranteed to be representative, and the fitting accuracy is improved.
As shown in fig. 1 to 4, preferably, the second step further includes drilling a light-transmitting through hole 5 corresponding to the position of the arc 31 and penetrating through the circuit board 1 to be tested, at the outer side of the exposed arc 31, by laser drilling, so that the backlight at the bottom of the optical image measuring instrument can penetrate through the circuit board 1 to be tested through the light-transmitting through hole 5, thereby improving the imaging accuracy of the optical image measuring instrument.
As shown in fig. 2 to 3, it is preferable that the diameter of the first circular pattern 2 is B, the diameter of the second circular pattern 3 is C, and C > B, so that it is ensured that the first circular pattern 2 is not damaged when the light-transmitting through hole 5 and the blind via hole 4 are formed.
As shown in fig. 2 to fig. 3, preferably, the diameter of the first circular pattern 2 is B, and 0.3mm ≤ B ≤ 1mm, and the diameter of the second circular pattern 3 is C, and 1.5B ≤ C ≤ 2B, so as to ensure that each circular pattern is large enough for the optical image measuring instrument to capture the center of a circle, and at the same time, the circular patterns do not occupy too much positions to affect the layout of the circuit and the components.
As shown in fig. 1, preferably, a first circular pattern 2 and a second circular pattern 3 corresponding to each other in position form a group of detection units for measuring the offset between positions of one position of the circuit board 1 to be measured, the circuit board 1 to be measured is provided with at least two detection units, and step two to step four are respectively performed on each detection unit, so that the offset condition can be obtained more comprehensively by measuring the offset values at multiple positions of the first layer 11 to be measured and the second layer 12 to be measured.
As shown in fig. 1, preferably, the detecting units are distributed at the edge of the circuit board 1 to be detected, so that it can be ensured that the arrangement of the circular patterns does not cause too large influence on the layout of the circuit board, and as much space as possible is reserved for circuits and components.
As shown in fig. 1 to 4, it is preferable that the first circular pattern 2 is a copper region formed by etching or plating, and the second circular pattern 3 is a copper region formed by etching or plating.
As described above, the present disclosure is directed to a method for measuring an interlayer offset of a printed circuit board, and all technical solutions that are the same as or similar to the present disclosure should be considered as falling within the scope of the present disclosure.
Claims (9)
1. A measuring method for measuring the interlayer offset of a printed circuit board is characterized by comprising the following steps:
the method comprises the following steps: providing a circuit board to be tested (1), wherein the circuit board to be tested (1) comprises a first layer to be tested (11) and a second layer to be tested (12), the offset between the first layer to be tested (11) is required to be measured, the first layer to be tested (11) is positioned on the surface layer of the circuit board to be tested (1), the second layer to be tested (12) is positioned on the inner layer of the circuit board to be tested (1), a first circular pattern (2) is arranged on the first layer to be tested (11), a second circular pattern (3) is arranged on the second layer to be tested (12), and the circle centers of the first circular pattern (2) and the second circular pattern (3) are positioned on the same vertical line in the design of the circuit board to be tested (1);
step two: ablating the base material of the circuit board (1) to be tested, which is positioned above the second circular pattern (3), at the edge of the preset position of the second circular pattern (3) through laser drilling to form an observation blind hole (4), wherein the observation blind hole (4) covers a part of the edge of the second circular pattern (3) so as to expose a section of circular arc (31);
step three: placing the circuit board (1) to be tested on an optical image measuring instrument, capturing the circle center of the first circular pattern (2) through the optical image measuring instrument, and fitting the circle center of the second circular pattern (3) through the optical image measuring instrument by using an exposed arc (31) of the second circular pattern (3);
step four: and measuring a circle center distance A of the circle center of the first circular pattern (2) and the circle center of the second circular pattern (3) on a horizontal plane projection through an optical image measuring instrument, wherein the circle center distance A is an offset value of the first layer to be measured (11) and the second layer to be measured (12) at the group of circular patterns.
2. A method as claimed in claim 1, wherein in step two, at least one blind hole (4) is ablated in a second circular pattern (3), and if there are two or more blind holes (4), all circular arcs (31) exposed through the second circular pattern (3) in step three fit the center of the second circular pattern (3) together.
3. A method for measuring the amount of layer offset of a printed circuit board according to claim 2, characterized in that if there are two or more blind observation holes (4), the arcs (31) respectively emerging therefrom are equally long and evenly distributed in the circumferential direction of the second circular pattern (3).
4. The method for measuring the interlayer offset of the printed circuit board according to any one of claims 1 to 2, wherein the second step further comprises drilling a light-transmitting through hole (5) corresponding to the position of the arc (31) and penetrating the circuit board (1) to be measured outside the exposed arc (31) by laser drilling.
5. A measuring method for measuring an interlayer offset of a printed circuit board according to claim 1, characterized in that the first circular pattern (2) has a diameter of B, the second circular pattern (3) has a diameter of C, and C > B.
6. A measuring method for measuring interlayer offset of printed circuit board according to claim 5, characterized in that the diameter of the first circular pattern (2) is B and 0.3mm ≦ B ≦ 1mm, the diameter of the second circular pattern (3) is C and 1.5B ≦ C ≦ 2B.
7. The method for measuring the interlayer offset of the printed circuit board according to claim 1, wherein a first circular pattern (2) and a second circular pattern (3) corresponding to the positions form a group of detecting units for measuring the interlayer offset of one position of the circuit board (1) to be measured, at least two detecting units are arranged on the circuit board (1) to be measured, and each detecting unit is processed in the steps two to four.
8. A measuring method for measuring the interlayer offset of the printed circuit board according to claim 7, characterized in that the detecting units are distributed at the edge of the circuit board (1) to be measured.
9. A measuring method for measuring an interlayer shift amount of a printed circuit board according to claim 1, wherein said first circular pattern (2) is a copper area formed by etching or plating, and said second circular pattern (3) is a copper area formed by etching or plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211240242.9A CN115597487B (en) | 2022-10-11 | 2022-10-11 | Measurement method for measuring offset between printed circuit board layers |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211240242.9A CN115597487B (en) | 2022-10-11 | 2022-10-11 | Measurement method for measuring offset between printed circuit board layers |
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| CN115597487A true CN115597487A (en) | 2023-01-13 |
| CN115597487B CN115597487B (en) | 2023-09-15 |
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| CN111774741A (en) * | 2020-08-14 | 2020-10-16 | 长春理工大学 | Laser drilling method of composite hole based on tip bright spot guiding |
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| DE4332254C1 (en) * | 1993-09-22 | 1995-02-23 | Siemens Ag | Using a spacing sensor (separation sensor) for computer tomographs |
| TW200730047A (en) * | 2006-01-16 | 2007-08-01 | Advanced Semiconductor Eng | Method for fabricating conductive blind via of circuit substrate |
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