CN108998795A - A kind of application method in organic acid etching liquid and its assist side manufacture - Google Patents
A kind of application method in organic acid etching liquid and its assist side manufacture Download PDFInfo
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- CN108998795A CN108998795A CN201811091808.XA CN201811091808A CN108998795A CN 108998795 A CN108998795 A CN 108998795A CN 201811091808 A CN201811091808 A CN 201811091808A CN 108998795 A CN108998795 A CN 108998795A
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- Prior art keywords
- acid
- parts
- organic acid
- wiring board
- etching liquid
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/025—Cleaning or pickling metallic material with solutions or molten salts with acid solutions acidic pickling pastes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
- C23G1/103—Other heavy metals copper or alloys of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a kind of organic acid etching liquid, the raw material including following parts by weight: including following raw material: organic acid, villaumite, carboxylate, surfactant and pure water；Application method in assist side manufacture, comprising the following steps: step 1 enters plate；Step 2, acid clean；Step 3, one-stage water wash；Step 4, organic acid etching；Step 5, second level washing；Step 6, pickling；Step 7, three-level washing；Step 8, drying；Step 9, ejecting plate.Acid etching used in the present invention compared to existing etching for, acid etching detergent can effectively remove the greasy dirt, finger mark and oxide layer of copper face, obtain clean, uniform layers of copper surface, simultaneously, organic acidity etching solution etch-rate is controllable, by control, the layers of copper surface of available difference degree of roughness, to meet the etch effect of different demands.Copper face roughness is uniform, and gloss is consistent.
Description
Technical field
The present invention relates to the acidic etching liquid in a kind of route board manufacturing process, specifically a kind of organic acid etching liquid and its
Application method in assist side manufacture.
Background technique
In the manufacturing process of assist side, in order to improve the adhesiveness of plate, chemical method is generallyd use to layers of copper surface
Greasy dirt, fingerprint and oxide layer be removed, and layers of copper is etched, obtains the layers of copper surface of different degree of roughness.
In existing line plate manufacturing process, in order to obtain metastable micro-etching speed, strong oxidizing property is usually used
Surface treating agent removal surface oxide and form coarse surface.But the prior art is to the finger mark and oil on layers of copper surface
Dirty processing is also unable to reach requirement, is unable to get clean layers of copper surface, in etching, will result in etching unevenness, layers of copper
Excessively, a part of etch quantity is very little, and lustrous surface is inconsistent, and roughness is uneven, is also unable to reach pre- for the etching of surface a part
The etch effect of phase.
Summary of the invention
The purpose of the present invention is to provide the application methods in a kind of organic acid etching liquid and its assist side manufacture, with solution
Certainly the problems mentioned above in the background art.
To achieve the above object, the invention provides the following technical scheme:
A kind of organic acid etching liquid, the raw material including following parts by weight: the raw material including following parts by weight: organic acid 20-
100 parts, 30-200 parts of villaumite, 20-100 parts of carboxylate, 1-5 parts of surfactant and 30-70 parts of pure water.
As a further solution of the present invention: the raw material including following parts by weight: 40-80 parts of organic acid, villaumite 70-
150 parts, 40-80 parts of carboxylate, 2-4 parts of surfactant and 40-60 parts of pure water.
As the present invention further scheme: the raw material including following parts by weight: 60 parts of organic acid, 110 parts of villaumite,
60 parts of carboxylate, 3 parts of surfactant and 50 parts of pure water.
As further scheme of the invention: the organic acid is formic acid, acetic acid, propionic acid, butyric acid, lauric acid, propylene
One of acid, sorbic acid, ethanedioic acid, citric acid, lactic acid, hydroxyacetic acid etc. or the weight ratios such as Multiple components composition.
As further scheme of the invention: the villaumite is sodium chloride, potassium chloride, copper chloride, magnesium chloride, iron chloride
Deng one of or the weight ratios composition such as Multiple components.
As further scheme of the invention: the carboxylate is sodium formate, ammonium formate, sodium acetate, ammonium acetate, propionic acid
Sodium, propionic acid ammonium, sodium butyrate, butyric acid ammonium, sodium citrate, acrylic acid one of receive etc. or the weight ratios compositions such as Multiple components.
A kind of application method in organic acid etching liquid assist side manufacture, comprising the following steps:
Step 1 enters plate, and wiring board to be processed is placed in etch station and is fixed；
Step 2, acid clean clean PCB surface using acid etching detergent；
Step 3, one-stage water wash clean the wiring board after step 2 cleans using clear water, and way of supplying water is using miniature
Water pump supplies water, and hydraulic pressure control is within 20-40 pa；
Step 4, organic acid etching carry out brushing organic acid to the wiring board after one-stage water wash and drying, have prepared
Machine acid etching liquid is uniformly applied to the surface of wiring board, smears and is brushed using the rotation of acid resistance brush roll；
Step 5, second level are washed, and clear water cleans again on the wiring board after etching, and hydraulic pressure control is within 40-80 pa；
Step 6, pickling are removed wiring board and are placed in the sour pond for fill dilute hydrochloric acid and impregnate, and when immersion is 20-40 minutes a length of；
Step 7, three-level washing, takes out wiring board from sour pond, carries out bath cleaning to it again using water pump；
Step 8, drying, the wiring board after cleaning is placed in dryer, opens dryer power switch, keeps temperature
Degree continues drying out for 75-95 DEG C；
Wiring board after drying is taken out, is deposited at shady and cool ventilation 1 hour by step 9, ejecting plate.
As a further solution of the present invention: the acid etching detergent includes the raw material of following parts by weight: quality
1-10 parts of hydrogen peroxide, 5-30 parts of stabilization agent and the pure water 90-130 that 2-20 parts of the sulfuric acid that score is 50%, mass fraction are 50%
Part.
As further scheme of the invention: the stabilization agent is tertiary sodium phosphate, sodium tripolyphosphate, ethylenediamine tetrem
Acid, malic acid, sodium citrate, tartaric acid, gluconic acid, acrylic acid, poly amic acid, acetanil, cyclohexylamine, second two
The weight ratios such as one or more ingredients form in alcohol, isopropanol, ethylenediamine etc..
Compared with prior art, the beneficial effects of the present invention are: acid etching used in the present invention is compared to existing
Etching for, acid etching detergent can effectively remove the greasy dirt, finger mark and oxide layer of copper face, obtain clean, uniform
Layers of copper surface, meanwhile, organic acidity etching solution etch-rate is controllable, by control, it is available difference degree of roughness copper
Layer surface, to meet the etch effect of different demands.Copper face roughness is uniform, and gloss is consistent.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that retouched
The embodiment stated is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work, belongs to the present invention
The range of protection.
Embodiment 1
A kind of organic acid etching liquid, the raw material including following parts by weight: organic acid 20g, villaumite 30g, carboxylate 20g, surface
Activating agent 1g and pure water 30g, wherein surfactant is neopelex, organic acid be formic acid, acetic acid, propionic acid,
One of butyric acid, lauric acid, acrylic acid, sorbic acid, ethanedioic acid, citric acid, lactic acid, hydroxyacetic acid etc. or the weight such as Multiple components
For amount than composition, villaumite is the weight ratios such as one of sodium chloride, potassium chloride, copper chloride, magnesium chloride, iron chloride etc. or Multiple components
Composition, carboxylate are sodium formate, ammonium formate, sodium acetate, ammonium acetate, sodium propionate, propionic acid ammonium, sodium butyrate, butyric acid ammonium, citric acid
Sodium, acrylic acid one of receive etc. or the weight ratios compositions such as Multiple components.
A kind of application method in organic acid etching liquid assist side manufacture, comprising the following steps:
Step 1 enters plate, and wiring board to be processed is placed in etch station and is fixed；
Step 2, acid clean clean PCB surface using acid etching detergent, wherein acid etching cleaning
Agent includes the raw material of following parts by weight: hydrogen peroxide 1g that sulfuric acid 2g that mass fraction is 50%, mass fraction are 50%, stabilization agent
5g and pure water 90g, further, stabilization agent are tertiary sodium phosphate, sodium tripolyphosphate, ethylenediamine tetra-acetic acid, malic acid, citric acid
Sodium, tartaric acid, gluconic acid, acrylic acid, poly amic acid, acetanil, cyclohexylamine, ethylene glycol, isopropanol, ethylenediamine etc.
In the weight ratios composition such as one or more ingredients；
Step 3, one-stage water wash clean the wiring board after step 2 cleans using clear water, and way of supplying water is using miniature
Water pump supplies water, and hydraulic pressure control is within 20 pas；
Step 4, organic acid etching carry out brushing organic acid to the wiring board after one-stage water wash and drying, have prepared
Machine acid etching liquid is uniformly applied to the surface of wiring board, smears and is brushed using the rotation of acid resistance brush roll, and brush roll revolving speed is 60 revs/min
Clock, bolt back and forth move left and right brushing, and flipflop plate again brushes its back side after having brushed above, keep logical after having brushed
Wind environment is kept for 30 minutes；
Step 5, second level are washed, and clear water cleans again on the wiring board after etching, and hydraulic pressure control is within 40 pas；
Step 6, pickling are removed wiring board and are placed in the sour pond for fill dilute hydrochloric acid and impregnate, and when immersion is 20 minutes a length of, leaching
Constantly overturning swings wiring board during bubble；
Step 7, three-level washing, takes out wiring board from sour pond, carries out bath cleaning to it again using water pump, cleans aqueous
For 10 pas, rinse 30 minutes；
Step 8, drying, the wiring board after cleaning is placed in dryer, opens dryer power switch, keeps temperature
Degree continues drying out 15 minutes for 75 DEG C；
Wiring board after drying is taken out, is deposited at shady and cool ventilation 1 hour by step 9, ejecting plate.
Embodiment 2
A kind of organic acid etching liquid, the raw material including following parts by weight: organic acid 40g, villaumite 70g, carboxylate 40g, surface
Activating agent 2g and pure water 40g, wherein surfactant is neopelex, organic acid be formic acid, acetic acid, propionic acid,
One of butyric acid, lauric acid, acrylic acid, sorbic acid, ethanedioic acid, citric acid, lactic acid, hydroxyacetic acid etc. or the weight such as Multiple components
For amount than composition, villaumite is the weight ratios such as one of sodium chloride, potassium chloride, copper chloride, magnesium chloride, iron chloride etc. or Multiple components
Composition, carboxylate are sodium formate, ammonium formate, sodium acetate, ammonium acetate, sodium propionate, propionic acid ammonium, sodium butyrate, butyric acid ammonium, citric acid
Sodium, acrylic acid one of receive etc. or the weight ratios compositions such as Multiple components.
A kind of application method in organic acid etching liquid assist side manufacture, comprising the following steps:
Step 1 enters plate, and wiring board to be processed is placed in etch station and is fixed；
Step 2, acid clean clean PCB surface using acid etching detergent, wherein acid etching cleaning
Agent includes the raw material of following parts by weight: hydrogen peroxide 3g that sulfuric acid 5g that mass fraction is 50%, mass fraction are 50%, stabilization agent
10g and pure water 100g, further, stabilization agent are tertiary sodium phosphate, sodium tripolyphosphate, ethylenediamine tetra-acetic acid, malic acid, lemon
Sour sodium, tartaric acid, gluconic acid, acrylic acid, poly amic acid, acetanil, cyclohexylamine, ethylene glycol, isopropanol, ethylenediamine
The weight ratios such as one or more ingredients form in；
Step 3, one-stage water wash clean the wiring board after step 2 cleans using clear water, and way of supplying water is using miniature
Water pump supplies water, and hydraulic pressure control is within 25 pas；
Step 4, organic acid etching carry out brushing organic acid to the wiring board after one-stage water wash and drying, have prepared
Machine acid etching liquid is uniformly applied to the surface of wiring board, smears and is brushed using the rotation of acid resistance brush roll, and brush roll revolving speed is 70 revs/min
Clock, bolt back and forth move left and right brushing, and flipflop plate again brushes its back side after having brushed above, keep logical after having brushed
Wind environment is kept for 35 minutes；
Step 5, second level are washed, and clear water cleans again on the wiring board after etching, and hydraulic pressure control is within 50 pas；
Step 6, pickling are removed wiring board and are placed in the sour pond for fill dilute hydrochloric acid and impregnate, and when immersion is 25 minutes a length of, leaching
Constantly overturning swings wiring board during bubble；
Step 7, three-level washing, takes out wiring board from sour pond, carries out bath cleaning to it again using water pump, cleans aqueous
For 15 pas, rinse 33 minutes；
Step 8, drying, the wiring board after cleaning is placed in dryer, opens dryer power switch, keeps temperature
Degree continues drying out 18 minutes for 80 DEG C；
Wiring board after drying is taken out, is deposited at shady and cool ventilation 1 hour by step 9, ejecting plate.
Embodiment 3
A kind of organic acid etching liquid, the raw material including following parts by weight: organic acid 60g, villaumite 110g, carboxylate 60g, surface
Activating agent 3g and pure water 50g, wherein surfactant is neopelex, organic acid be formic acid, acetic acid, propionic acid,
One of butyric acid, lauric acid, acrylic acid, sorbic acid, ethanedioic acid, citric acid, lactic acid, hydroxyacetic acid etc. or the weight such as Multiple components
For amount than composition, villaumite is the weight ratios such as one of sodium chloride, potassium chloride, copper chloride, magnesium chloride, iron chloride etc. or Multiple components
Composition, carboxylate are sodium formate, ammonium formate, sodium acetate, ammonium acetate, sodium propionate, propionic acid ammonium, sodium butyrate, butyric acid ammonium, citric acid
Sodium, acrylic acid one of receive etc. or the weight ratios compositions such as Multiple components.
A kind of application method in organic acid etching liquid assist side manufacture, comprising the following steps:
Step 1 enters plate, and wiring board to be processed is placed in etch station and is fixed；
Step 2, acid clean clean PCB surface using acid etching detergent, wherein acid etching cleaning
Agent includes the raw material of following parts by weight: hydrogen peroxide 5g that sulfuric acid 10g that mass fraction is 50%, mass fraction are 50%, stable
Agent 15g and pure water 110g, further, stabilization agent are tertiary sodium phosphate, sodium tripolyphosphate, ethylenediamine tetra-acetic acid, malic acid, lemon
Lemon acid sodium, tartaric acid, gluconic acid, acrylic acid, poly amic acid, acetanil, cyclohexylamine, ethylene glycol, isopropanol, second two
The weight ratios such as one or more ingredients form in amine etc.；
Step 3, one-stage water wash clean the wiring board after step 2 cleans using clear water, and way of supplying water is using municipal administration
Water supply tap water, hydraulic pressure control is within 30 pas；
Step 4, organic acid etching carry out brushing organic acid to the wiring board after one-stage water wash and drying, have prepared
Machine acid etching liquid is uniformly applied to the surface of wiring board, smears and is brushed using the rotation of acid resistance brush roll, brush roll revolving speed is
60708090100 revs/min, bolt back and forth moves left and right brushing, and flipflop plate again brushes its back side after having brushed above
It applies, keeps ventilated environment to be kept for 40 minutes after having brushed；
Step 5, second level are washed, and clear water cleans again on the wiring board after etching, and hydraulic pressure control is within 60 pas；
Step 6, pickling are removed wiring board and are placed in the sour pond for fill dilute hydrochloric acid and impregnate, and when immersion is 30 minutes a length of, leaching
Constantly overturning swings wiring board during bubble；
Step 7, three-level washing, takes out wiring board from sour pond, carries out bath cleaning to it again using water pump, cleans aqueous
For 20 pas, rinse 36 minutes；
Step 8, drying, the wiring board after cleaning is placed in dryer, opens dryer power switch, keeps temperature
Degree continues drying out 21 minutes for 85 DEG C；
Wiring board after drying is taken out, is deposited at shady and cool ventilation 1 hour by step 9, ejecting plate.
Embodiment 4
A kind of organic acid etching liquid, the raw material including following parts by weight: organic acid 80g, villaumite 150g, carboxylate 80g, surface
Activating agent 4g and pure water 60g, wherein surfactant is neopelex, organic acid be formic acid, acetic acid, propionic acid,
One of butyric acid, lauric acid, acrylic acid, sorbic acid, ethanedioic acid, citric acid, lactic acid, hydroxyacetic acid etc. or the weight such as Multiple components
For amount than composition, villaumite is the weight ratios such as one of sodium chloride, potassium chloride, copper chloride, magnesium chloride, iron chloride etc. or Multiple components
Composition, carboxylate are sodium formate, ammonium formate, sodium acetate, ammonium acetate, sodium propionate, propionic acid ammonium, sodium butyrate, butyric acid ammonium, citric acid
Sodium, acrylic acid one of receive etc. or the weight ratios compositions such as Multiple components.
A kind of application method in organic acid etching liquid assist side manufacture, comprising the following steps:
Step 1 enters plate, and wiring board to be processed is placed in etch station and is fixed；
Step 2, acid clean clean PCB surface using acid etching detergent, wherein acid etching cleaning
Agent includes the raw material of following parts by weight: hydrogen peroxide 7g that sulfuric acid 15g that mass fraction is 50%, mass fraction are 50%, stable
Agent 20g and pure water 120g, further, stabilization agent are tertiary sodium phosphate, sodium tripolyphosphate, ethylenediamine tetra-acetic acid, malic acid, lemon
Lemon acid sodium, tartaric acid, gluconic acid, acrylic acid, poly amic acid, acetanil, cyclohexylamine, ethylene glycol, isopropanol, second two
The weight ratios such as one or more ingredients form in amine etc.；
Step 3, one-stage water wash clean the wiring board after step 2 cleans using clear water, and way of supplying water is using municipal administration
Water supply tap water, hydraulic pressure control is within 35 pas；
Step 4, organic acid etching carry out brushing organic acid to the wiring board after one-stage water wash and drying, have prepared
Machine acid etching liquid is uniformly applied to the surface of wiring board, smears and is brushed using the rotation of acid resistance brush roll, and brush roll revolving speed is 90 revs/min
Clock, bolt back and forth move left and right brushing, and flipflop plate again brushes its back side after having brushed above, keep logical after having brushed
Wind environment is kept for 45 minutes；
Step 5, second level are washed, and clear water cleans again on the wiring board after etching, and hydraulic pressure control is within 70 pas；
Step 6, pickling are removed wiring board and are placed in the sour pond for fill dilute hydrochloric acid and impregnate, and when immersion is 35 minutes a length of, leaching
Constantly overturning swings wiring board during bubble；
Step 7, three-level washing, takes out wiring board from sour pond, carries out bath cleaning to it again using water pump, cleans aqueous
For 25 pas, rinse 38 minutes；
Step 8, drying, the wiring board after cleaning is placed in dryer, opens dryer power switch, keeps temperature
Degree continues drying out 24 minutes for 90 DEG C；
Wiring board after drying is taken out, is deposited at shady and cool ventilation 1 hour by step 9, ejecting plate.
Embodiment 5
A kind of organic acid etching liquid, the raw material including following parts by weight: organic acid 100g, villaumite 200g, carboxylate 100g, table
Face activating agent 5g and pure water 70g, wherein surfactant is neopelex, and organic acid is formic acid, acetic acid, third
One of acid, butyric acid, lauric acid, acrylic acid, sorbic acid, ethanedioic acid, citric acid, lactic acid, hydroxyacetic acid etc. or Multiple components
Etc. weight ratios composition, villaumite be the weight such as one of sodium chloride, potassium chloride, copper chloride, magnesium chloride, iron chloride etc. or Multiple components
For amount than composition, carboxylate is sodium formate, ammonium formate, sodium acetate, ammonium acetate, sodium propionate, propionic acid ammonium, sodium butyrate, butyric acid ammonium, lemon
Sour sodium, acrylic acid one of receive etc. or the weight ratios compositions such as Multiple components.
A kind of application method in organic acid etching liquid assist side manufacture, comprising the following steps:
Step 1 enters plate, and wiring board to be processed is placed in etch station and is fixed；
Step 2, acid clean clean PCB surface using acid etching detergent, wherein acid etching cleaning
Agent includes the raw material of following parts by weight: hydrogen peroxide 10g that sulfuric acid 20g that mass fraction is 50%, mass fraction are 50%, stable
Agent 30g and pure water 130g, further, stabilization agent are tertiary sodium phosphate, sodium tripolyphosphate, ethylenediamine tetra-acetic acid, malic acid, lemon
Lemon acid sodium, tartaric acid, gluconic acid, acrylic acid, poly amic acid, acetanil, cyclohexylamine, ethylene glycol, isopropanol, second two
The weight ratios such as one or more ingredients form in amine etc.；
Step 3, one-stage water wash clean the wiring board after step 2 cleans using clear water, and way of supplying water is using miniature
Water pump supplies water, and hydraulic pressure control is within 40 pas；
Step 4, organic acid etching carry out brushing organic acid to the wiring board after one-stage water wash and drying, have prepared
Machine acid etching liquid is uniformly applied to the surface of wiring board, smears and is brushed using the rotation of acid resistance brush roll, and brush roll revolving speed is 100 turns/
Minute, bolt back and forth moves left and right brushing, and flipflop plate again brushes its back side after having brushed above, holding after having brushed
Ventilated environment is kept for 50 minutes；
Step 5, second level are washed, and clear water cleans again on the wiring board after etching, and hydraulic pressure control is within 80 pas；
Step 6, pickling are removed wiring board and are placed in the sour pond for fill dilute hydrochloric acid and impregnate, and when immersion is 40 minutes a length of, leaching
Constantly overturning swings wiring board during bubble；
Step 7, three-level washing, takes out wiring board from sour pond, carries out bath cleaning to it again using water pump, cleans aqueous
For 30 pas, rinse 40 minutes；
Step 8, drying, the wiring board after cleaning is placed in dryer, opens dryer power switch, keeps temperature
Degree continues drying out 30 minutes for 95 DEG C；
Wiring board after drying is taken out, is deposited at shady and cool ventilation 1 hour by step 9, ejecting plate.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (9)
1. a kind of organic acid etching liquid, which is characterized in that the raw material including following parts by weight: the original including following parts by weight
Material: 20-100 parts of organic acid, 30-200 parts of villaumite, 20-100 parts of carboxylate, 1-5 parts of surfactant and 30-70 parts of pure water.
2. a kind of organic acid etching liquid according to claim 1, which is characterized in that the raw material including following parts by weight:
40-80 parts of organic acid, 70-150 parts of villaumite, 40-80 parts of carboxylate, 2-4 parts of surfactant and 40-60 parts of pure water.
3. a kind of organic acid etching liquid according to claim 1, which is characterized in that the raw material including following parts by weight:
60 parts of organic acid, 110 parts of villaumite, 60 parts of carboxylate, 3 parts of surfactant and 50 parts of pure water.
4. a kind of organic acid etching liquid according to claim 1 to 3, which is characterized in that the organic acid be formic acid,
One of acetic acid, propionic acid, butyric acid, lauric acid, acrylic acid, sorbic acid, ethanedioic acid, citric acid, lactic acid, hydroxyacetic acid etc. are more
The weight ratios composition such as kind ingredient.
5. a kind of organic acid etching liquid according to claim 1 to 3, which is characterized in that the villaumite be sodium chloride,
One of potassium chloride, copper chloride, magnesium chloride, iron chloride etc. or the weight ratios such as Multiple components composition.
6. a kind of organic acid etching liquid according to claim 1 to 3, which is characterized in that the carboxylate is formic acid
Sodium, ammonium formate, sodium acetate, ammonium acetate, sodium propionate, propionic acid ammonium, sodium butyrate, butyric acid ammonium, sodium citrate, acrylic acid receive etc. in one
The weight ratios composition such as kind or Multiple components.
7. the application method in a kind of organic acid etching liquid assist side manufacture, which comprises the following steps:
Step 1 enters plate, and wiring board to be processed is placed in etch station and is fixed；
Step 2, acid clean clean PCB surface using acid etching detergent；
Step 3, one-stage water wash clean the wiring board after step 2 cleans using clear water, and way of supplying water is using miniature
Water pump supplies water, and hydraulic pressure control is within 20-40 pa；
Step 4, organic acid etching carry out brushing organic acid to the wiring board after one-stage water wash and drying, have prepared
Machine acid etching liquid is uniformly applied to the surface of wiring board, smears and is brushed using the rotation of acid resistance brush roll；
Step 5, second level are washed, and clear water cleans again on the wiring board after etching, and hydraulic pressure control is within 40-80 pa；
Step 6, pickling are removed wiring board and are placed in the sour pond for fill dilute hydrochloric acid and impregnate, and when immersion is 20-40 minutes a length of；
Step 7, three-level washing, takes out wiring board from sour pond, carries out bath cleaning to it again using water pump；
Step 8, drying, the wiring board after cleaning is placed in dryer, opens dryer power switch, keeps temperature
Degree continues drying out for 75-95 DEG C；
Wiring board after drying is taken out, is deposited at shady and cool ventilation 1 hour by step 9, ejecting plate.
8. the application method in a kind of organic acid etching liquid assist side manufacture according to claim 7, which is characterized in that
The acid etching detergent includes the raw material of following parts by weight: 2-20 parts of the sulfuric acid that mass fraction is 50%, mass fraction are
50% 1-10 parts of hydrogen peroxide, 5-30 parts of stabilization agent and 90-130 parts of pure water.
9. the application method in a kind of organic acid etching liquid assist side manufacture according to claim 8, which is characterized in that
The stabilization agent be tertiary sodium phosphate, sodium tripolyphosphate, ethylenediamine tetra-acetic acid, malic acid, sodium citrate, tartaric acid, gluconic acid,
One or more ingredients etc. in acrylic acid, poly amic acid, acetanil, cyclohexylamine, ethylene glycol, isopropanol, ethylenediamine etc.
Weight ratio composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811091808.XA CN108998795A (en) | 2018-09-19 | 2018-09-19 | A kind of application method in organic acid etching liquid and its assist side manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN116121754A (en) * | 2022-12-30 | 2023-05-16 | 浙江奥首材料科技有限公司 | Organic system Al/Mo etching solution, and preparation method and application thereof |
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Application publication date: 20181214 |