CN102296293A - Micro-etchant for printed circuit board - Google Patents
Micro-etchant for printed circuit board Download PDFInfo
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- CN102296293A CN102296293A CN201110173526A CN201110173526A CN102296293A CN 102296293 A CN102296293 A CN 102296293A CN 201110173526 A CN201110173526 A CN 201110173526A CN 201110173526 A CN201110173526 A CN 201110173526A CN 102296293 A CN102296293 A CN 102296293A
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- pwb
- wiring board
- etching agent
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Abstract
The invention relates to a micro-etchant for a printed circuit board, which comprises a potasium bisulfate compound, a stabilizing agent, persulfate and a sulfuric acid system, or comprises the potasium bisulfate compound, a stabilizing agent, persulfate and a phosphoric acid system. the micro-etchant for the printed circuit board of the invention has the following beneficial effects: (1) low usage cost; (2) optimum etching surface, wherein the surface roughness Ra value is between 0.3 - 0.4 micrometers; (3) excellent adhesive force of a dry membrane without residual membrane problem; (4) controllable etching process which has stable speed; (5) the life of the liquid medicine is longer than that of sodium peroxydisulfate SPS.
Description
Technical field
The present invention relates to printed-wiring board (PWB) etching technique field, particularly relate to a kind of printed-wiring board (PWB) micro-etching agent.
Background technology
Make printed-wiring board (PWB), must carry out this processing step of printed-wiring board (PWB) etching, the technology of existing etched circuit board is: iron trichloride is put into plastic tub (annotating: can not use metal basin), join the water of 1500cc-2000cc allocates by the 250g iron trichloride, can accelerate etching speed with hot water, save time.Treat that circuit card that iron trichloride can will develop after fully soluble in water puts into basin and carry out etching, do not stop to rock basin in the middle of the etched process, make etching evenly and can accelerate etching speed.Can finish etching process in about tens minutes, and after etching is finished circuit card be taken out water and wash gently and get final product.
In industry such as printed wiring, electronics and Metal Finishing, extensively adopt iron trichloride etch copper, copper alloy and iron, zinc, aluminium etc.This is because his process stabilizing is easy to operate, low price.But, in the last few years, because its regeneration difficulty is seriously polluted, liquid waste disposal difficulty etc. and being eliminated.
Therefore, the iron trichloride etching solution is applicable to the etching of the press plate of resist layers such as wire mark etchingresistant printing material, liquid photoresists, dry film, gold, but is not suitable for resist layers such as nickel, tin, tin-lead alloy.And utilize iron trichloride etching solution etch-rate instability, difficult its speed of control, etching quality is relatively poor.
Summary of the invention
The objective of the invention is to shortcoming, and a kind of printed-wiring board (PWB) micro-etching agent is provided at prior art.
Technical scheme of the present invention: a kind of printed-wiring board (PWB) micro-etching agent, comprise potassium hydrogen persulfate mixture, stablizer, persulphate and sulfuric acid system, perhaps comprise potassium hydrogen persulfate mixture, stablizer, persulphate and phosphoric acid system.
Among the present invention, described stablizer is an an alkali metal salt.
Among the present invention, described stablizer is the multi-hydroxy carboxy acid.
Among the present invention, described stablizer is an organophosphate.
Among the present invention, the amount that described an alkali metal salt, described multi-hydroxy carboxy acid or described organophosphate add is between 0.1-1%.
Among the present invention, the amount that described an alkali metal salt, described multi-hydroxy carboxy acid or described organophosphate add is 0.1%.
Among the present invention, the amount that described an alkali metal salt, described multi-hydroxy carboxy acid or described organophosphate add is 1%.
Among the present invention, the amount that described an alkali metal salt, described multi-hydroxy carboxy acid or described organophosphate add is 0.5%.
Among the present invention, the amount that described phosphoric acid or sulfuric acid add is calculated between 1-3% according to volume percent.
Among the present invention, the amount that described phosphoric acid or sulfuric acid add is calculated as 1% according to volume percent.
Printed-wiring board (PWB) micro-etching agent of the present invention has following beneficial effect:
1. use cost is low;
2. the surface is lost in excellent stinging, and the surface roughness Ra value is between the 0.3-0.4 micron;
3. outstanding dry film sticking power does not have residual film problem;
4. controlled etching process, velocity-stabilization;
5. the soup life-span is longer than Sodium Persulfate SPS.
Embodiment
Further understand and understanding for making constitutional features of the present invention and the effect reached had, cooperate detailed explanation, be described as follows in order to preferred embodiment:
A kind of printed-wiring board (PWB) micro-etching agent of the present invention comprises potassium hydrogen persulfate mixture, stablizer, persulphate and sulfuric acid system, perhaps comprises potassium hydrogen persulfate mixture, stablizer, persulphate and phosphoric acid system.
In above-mentioned, stablizer is an alkali metal salt, multi-hydroxy carboxy acid or organophosphate.And the amount of the adding of an alkali metal salt, multi-hydroxy carboxy acid or organophosphate is between 0.1-1%.The amount that phosphoric acid, sulfuric acid add is calculated between 1-3% according to volume percent.
In specific embodiment, the amount of the adding of an alkali metal salt, multi-hydroxy carboxy acid or organophosphate can be 0.%, 0.5%, 0.8% or 1%.
In specific embodiment, it can be 1%, 1.5%, 2% or 3% that the amount that phosphoric acid, sulfuric acid add is calculated according to volume percent.
The potassium hydrogen persulfate mixture is a kind of mineral acid oxygenant, have another name called potassium peroxymonosulfate, potassium hydrogen peroxymonosulfate three closes salt peroxidation sulfate mono sylvite, English name Oxone, potassium monopersulfate compound, potassium monopersulfate triple salt or potassium peroxymonopersulfate is called for short " PMPS or KMPS ".It is the basic active principle of common function chemical Oxone, Caroat, ZA200/100, Basolan2448.
Molecular formula: 2KHSO
5KHSO
4K
2SO
4
Molecular weight: 614.7;
CAS?No.70693-62-8。
Using method of the present invention is that an amount of peroxy-monosulfate and persulphate are carried out suitable collocation, adds suitable stabilizers, thereby makes PCB etching rear surface meet the needs of above-mentioned suitable processing procedure.
The present invention is applicable to: (1) inside and outside floor dry film pre-treatment (application of high density interconnect HDI fine rule road);
(2) electroplating ventilating hole PTH microetch pre-treatment; (3) Cu I (copper), Cu II (secondary copper) microetch pre-treatment or the like.
Facts have proved that printed-wiring board (PWB) micro-etching agent of the present invention has the following advantages:
1. use cost is low;
2. the surface is lost in excellent stinging, and the surface roughness Ra value is between the 0.3-0.4 micron;
3. outstanding dry film sticking power does not have residual film problem;
4. controlled etching process, velocity-stabilization;
5. the soup life-span is longer than Sodium Persulfate SPS.
In sum, it only is preferred embodiment of the present invention, be not to be used for limiting scope of the invention process, all equalizations of doing according to the described shape of claim scope of the present invention, structure, feature and spirit change and modify, and all should be included in the claim scope of the present invention.
Claims (10)
1. a printed-wiring board (PWB) micro-etching agent is characterized in that, comprises potassium hydrogen persulfate mixture, stablizer, persulphate and sulfuric acid system, perhaps comprises potassium hydrogen persulfate mixture, stablizer, persulphate and phosphoric acid system.
2. printed-wiring board (PWB) micro-etching agent according to claim 1 is characterized in that described stablizer is an an alkali metal salt.
3. printed-wiring board (PWB) micro-etching agent according to claim 1 is characterized in that described stablizer is the multi-hydroxy carboxy acid.
4. printed-wiring board (PWB) micro-etching agent according to claim 1 is characterized in that described stablizer is an organophosphate.
5. according to each described printed-wiring board (PWB) micro-etching agent of claim 2-4, it is characterized in that the amount that described an alkali metal salt, described multi-hydroxy carboxy acid or described organophosphate add is between 0.1-1%.
6. printed-wiring board (PWB) micro-etching agent according to claim 5 is characterized in that, the amount that described an alkali metal salt, described multi-hydroxy carboxy acid or described organophosphate add is 0.1%.
7. printed-wiring board (PWB) micro-etching agent according to claim 5 is characterized in that, the amount that described an alkali metal salt, described multi-hydroxy carboxy acid or described organophosphate add is 1%.
8. printed-wiring board (PWB) micro-etching agent according to claim 5 is characterized in that, the amount that described an alkali metal salt, described multi-hydroxy carboxy acid or described organophosphate add is 0.5%.
9. printed-wiring board (PWB) micro-etching agent according to claim 5 is characterized in that, the amount that described phosphoric acid or sulfuric acid add is calculated between 1-3% according to volume percent.
10. printed-wiring board (PWB) micro-etching agent according to claim 9 is characterized in that, the amount that described phosphoric acid or sulfuric acid add is calculated as 1% according to volume percent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110173526.6A CN102296293B (en) | 2011-06-24 | 2011-06-24 | Micro-etchant for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110173526.6A CN102296293B (en) | 2011-06-24 | 2011-06-24 | Micro-etchant for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102296293A true CN102296293A (en) | 2011-12-28 |
| CN102296293B CN102296293B (en) | 2015-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110173526.6A Active CN102296293B (en) | 2011-06-24 | 2011-06-24 | Micro-etchant for printed circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103361690A (en) * | 2012-03-31 | 2013-10-23 | 北大方正集团有限公司 | Blind hole cleaning method of PCB (printed circuit board) |
| CN104538138A (en) * | 2014-12-30 | 2015-04-22 | 南京萨特科技发展有限公司 | Manufacturing method of precise SMD resistor |
| TWI640622B (en) * | 2013-09-25 | 2018-11-11 | 德國艾托特克公司 | Method for treatment of recessed structures in dielectric materials for smear removal |
| CN108950558A (en) * | 2018-08-27 | 2018-12-07 | 深圳市星扬高新科技有限公司 | A kind of copper fitting surface coarsening agent |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101245462A (en) * | 2007-02-13 | 2008-08-20 | 峻科技有限公司 | Etching liquid composition and etching method |
| CN101460397A (en) * | 2006-06-02 | 2009-06-17 | 纳幕尔杜邦公司 | Potassium monopersulfate solutions |
| CN102102206A (en) * | 2009-12-18 | 2011-06-22 | 鑫林科技股份有限公司 | Metal etching liquid composition and etching method |
-
2011
- 2011-06-24 CN CN201110173526.6A patent/CN102296293B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101460397A (en) * | 2006-06-02 | 2009-06-17 | 纳幕尔杜邦公司 | Potassium monopersulfate solutions |
| CN101245462A (en) * | 2007-02-13 | 2008-08-20 | 峻科技有限公司 | Etching liquid composition and etching method |
| CN102102206A (en) * | 2009-12-18 | 2011-06-22 | 鑫林科技股份有限公司 | Metal etching liquid composition and etching method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103361690A (en) * | 2012-03-31 | 2013-10-23 | 北大方正集团有限公司 | Blind hole cleaning method of PCB (printed circuit board) |
| CN103361690B (en) * | 2012-03-31 | 2016-08-24 | 北大方正集团有限公司 | The blind hole cleaning method of PCB |
| TWI640622B (en) * | 2013-09-25 | 2018-11-11 | 德國艾托特克公司 | Method for treatment of recessed structures in dielectric materials for smear removal |
| CN104538138A (en) * | 2014-12-30 | 2015-04-22 | 南京萨特科技发展有限公司 | Manufacturing method of precise SMD resistor |
| CN104538138B (en) * | 2014-12-30 | 2017-12-29 | 南京萨特科技发展有限公司 | The preparation method of precision chip resistor device |
| CN108950558A (en) * | 2018-08-27 | 2018-12-07 | 深圳市星扬高新科技有限公司 | A kind of copper fitting surface coarsening agent |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102296293B (en) | 2015-01-07 |
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