CN104538138B - The preparation method of precision chip resistor device - Google Patents
The preparation method of precision chip resistor device Download PDFInfo
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- CN104538138B CN104538138B CN201410840100.5A CN201410840100A CN104538138B CN 104538138 B CN104538138 B CN 104538138B CN 201410840100 A CN201410840100 A CN 201410840100A CN 104538138 B CN104538138 B CN 104538138B
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Abstract
The present invention proposes a kind of precision chip resistor device preparation method that resistance trimming is carried out using chemical liquid, including alloy sheet punch forming step, resistance packet step, chemical liquid resistance trimming step, cleaning, dries, encapsulates, curing schedule, cutting and form electrode step.The present invention is finely adjusted by chemical liquids resistant alloy piece, realize accurate resistance trimming, make corrosion process uniform by the relative motion between chemical liquids and alloy sheet in corrosion process, not fully immersed when particularly alloy is put into decoction, oxidation rate can suitably be slowed down, so as to make the lifting process uniform, controllable of resistance, because Integral alloy piece can uniformly be removed effective volume by chemical attack mode, integral thickness slightly changes, larger local damage is not had, can produce more powerful resistor.Present invention process is simple, without purchasing other equipment, has been greatly saved cost, and can be used for making the smaller more accurate resistance of volume.
Description
Technical field
The invention belongs to resistive element Manufacturing Techniques field, is related to a kind of preparation method of precision chip resistor device.
Background technology
Precision resistance, refer to resistance error, the heat endurance of resistance of resistance（Temperature coefficient）, resistor distribution ginseng
Number（Distribution capacity and distributed inductance）Reach the resistor of certain standard Deng item index, its requirement to manufacture craft is higher.
Precision resistor is made frequently with alloy sheet at present, due to the limitation of alloy material smelting technique and related process, is closed
The resistor that golden material punching press makes, its resistance range can not meet that precision resistance resistance accuracy reaches the requirement within ± 1%,
Also need to further adjust the alloy sheet after punching press.Currently available technology mainly carries out Precision trimming with following several ways
Resistance：
（1）Abrasive trimming, progress resistance trimming is used after being applicable band lead resistance cutting, but this kind of mode needs manually
Upper material folding, efficiency are very low and it is necessary to buy special equipment.
（2）Radium-shine mode resistance trimming, this is also a kind of conventional resistance trimming mode, but this method can only adjust thickness in 0.15mm
The resistance of above alloy, cutting laser wires both sides can arch upward, in fact it could happen that the crateriform situation of class, or there is alloy by radium
The phenomenon that merges again after cut-out is penetrated, damages alloy sheet body, therefore can not ensure its precision and for whole piece tablet resistance trimming
Evenness.In addition it is also necessary to purchase special equipment, input cost is big, and professional technique requires higher.
（3）Mechanical resistance trimming, resistance is mainly finely tuned using the mode that drills or polish, but man-to-man can only polished, or
It is one to arrange and polished, low production efficiency, the uniformity is poor, it is necessary to purchase special equipment, and has to alloy sheet body
Certain damage.
The content of the invention
For many disadvantages existing for the resistance trimming mode of precision resistance in the prior art, the present invention breaks through existing thinking, carried
A kind of precision chip resistor device preparation method that resistance trimming is carried out using chemical liquid is gone out, satisfactory precision can be produced
Resistance, technique is simple, improves efficiency.
In order to achieve the above object, the present invention provides following technical scheme：
A kind of preparation method of precision chip resistor, comprises the following steps：
Step（1）, alloy sheet punch forming：Alloy raw material is struck out to required resistance pattern；
Step（2）, resistance packet：Resistance is measured, the alloy pattern piece that resistance is less than to lower limit is grouped, by similar resistance
Alloy pattern piece is divided into one group；
Step（3）, chemical liquid resistance trimming：Alloy pattern piece is carried with carrier, makes alloy pattern piece submerge completely or portion
Point submerge in resistance trimming etching decoction, fluid temperature is 30-50 DEG C, and it is 40-60s to invade the bubble time, resistance trimming alloy figure in immersion process
Relative motion is formed between shape piece and chemical liquid；
Step（4）, step will be passed through（3）The cleaning of resistance alloys pattern piece, dry, encapsulating, solidification after resistance trimming；
Step（5）, step will be passed through（4）Resistor semi after processing cuts into the resistance product of simple grain, and is formed
Electrode.
Further, the step（3）In rock carrier or make chemical liquid formed surge.
Further, the step（3）In, be provided with air supply plant below resistance trimming etching decoction, gas oneself supply gas dress
Put middle submitting, rising makes decoction form surge.
Further, the carrier realizes that self-timing lifts by moving control mechanism.
Further, the step（3）Middle chemical liquid includes following component：Mass ratio 5%-10% etching salt and volume
Strong acid than 1%-5%.
Further, in addition to polyethylene glycol and Hydroxypropylcelliloxe.
Further, the polyethylene glycol volume ratio is 1%-5%, and the Hydroxypropylcelliloxe volume ratio is 5%-
10%。
Further, the chemical liquid is prepared by the following method：
Appropriate running water is added in a reservoir, is heated to 30-50 DEG C, first adds the etching salt that mass ratio is 5%-10%,
Gas pump cycle is opened, after salt to be etched is completely dissolved, adds volume ratio 1%-5% sulfuric acid.
Further, the step（1）In, according to the upper and lower bounds of target resistance values when carrying out punching press, correct center
Value so as to make resistance value all control within the upper limit.
Further, the step（2）In resistance interval between each packet it is identical.
Beneficial effect：
The present invention is finely adjusted by chemical liquids resistant alloy piece, is realized accurate resistance trimming, is passed through chemistry in corrosion process
Relative motion between liquid and alloy sheet makes corrosion process uniform, is not fully immersed when particularly alloy is put into decoction, can be with
Suitably slow down oxidation rate, so as to make the lifting process uniform, controllable of resistance, because chemical attack mode can be by Integral alloy
Piece uniformly removes effective volume, and integral thickness slightly changes, and does not have larger local damage, can produce more powerful
Resistor.Present invention process is simple, without purchasing other equipment, it is not necessary to design etched figure and printing photoresistance region,
Cost has been greatly saved, and can be used for making the smaller more accurate resistance of volume.In addition, by adjust chemical liquids composition,
Concentration, the temperature and time for corroding resistance trimming process, can be by the alloy sheet resistance trimming of different resistances to required scope, using model
Enclose very extensive.
Brief description of the drawings
Fig. 1 is the trough body structure schematic diagram with air duct；
Fig. 2 is surge formula chemical liquids resistance trimming schematic diagram, and arrow is airflow direction in figure；
Fig. 3 is distribution map between the resistor tracks of comparative example and embodiment.
Reference numerals list：
1- chemical liquids, 2- material containing tools, 3- cell bodies, 4- copper-manganese resistance pattern pieces, 5- air ducts, 51- air inlets,
52- plugs, 6- liquid levels.
Embodiment
Technical scheme provided by the invention is described in detail below with reference to specific embodiment, it should be understood that following specific
Embodiment is only illustrative of the invention and is not intended to limit the scope of the invention.
The present embodiment is using 0.15mm thickness copper-manganese bands as raw material, it is necessary to make the 15m Ω's of package dimension 2512
Precision chip resistor device, it is desirable to which resistor resistance accuracy is that its manufacturing process is as follows within ± 1%：
（1）Alloy sheet punch forming：Copper-manganese band is struck out to required resistance pattern by the way of precision stamping, if
Fixed target resistance values scope is 6.86-6.88m Ω, according to the upper and lower bound of target resistance values, corrects central value to ensure
All within upper specification limit, the whole piece resistance pattern piece resistance after punching press is 6.76-6.88 m Ω to all products for control.Amendment
Central value refers to target's center's value is adjusted to be below into virtual center value intentionally, so may insure the alloy pattern piece stamped out
Resistance value necessarily not super target upper limit, in actual punching course, just measurement actual resistance should be often impacted after a collection of pattern piece, once
Occur just changing the bands of different punching pines or different batches to meet target resistance central value beyond Standard resistance range situation it was found that having
Scope.Copper-manganese band is only a kind of example, and those skilled in that art can also use other suitable alloy raw materials to make
This resistor.
（2）Resistance is grouped：It is according to Sheet Metal Forming Technology level that resistance is small using resistance meter and special fixture measurement resistance
It is divided into N groups in the resistance pattern piece of target lower limit, from 6.86 m Ω, down every 0.01 m Ω are one group to the present embodiment, altogether 10
Group, every group 20.And reservation of the resistance measurement in the range of 6.86-6.88m Ω is without resistance trimming.
（3）Chemical liquid resistance trimming：
, it is necessary to prepare the chemical etching decoction of resistance trimming before resistance trimming：As shown in figure 1, first added in cell body 3 appropriate
Running water, be heated to 30-50 DEG C with heater, the strong acid of the etching salt and volume ratio 1%-5% that add mass ratio 5%-10% is matched somebody with somebody
It is set to as chemical liquid 1.Etching salt can use potassium hydrogen persulfate composite salts（Potassium peroxysulfate salt, Potassium Monopersulfate）Deng.
The potassium peroxymonosulfate that mass ratio is 5% is first added in the present embodiment, opens gas pump cycle, salt to be etched is completely dissolved
Afterwards, the sulfuric acid of volume ratio 5% is added.After chemical liquid composition is uniform, liquid level stabilizing is treated, the chemical liquid 1 prepared can be thrown
Enter production, the volume of chemical liquid 1 accounts for the 80% of total cell body volume in the present embodiment.Foregoing cell body can electroplate PP grooves etc. with general
Acidproof, alkaline-resisting, ageing-resistant, resistant to elevated temperatures cell body, the present embodiment should use acid-fast alkali-proof using in general plating PP grooves, heater
The heater of anti-leakage function, the present embodiment is using the special Teflon heater of plating.
In order to further lift the resistance trimming effect of chemical liquid, 1%-5% can be added in chemical liquid（V/V）Poly- second
Glycol and 5%-10%（V/V）Hydroxypropylcelliloxe（H-HPC）, it is capable of the speed of suitable control corrosion, ensures corrosion
Uniformity, and product surface after corrosion forms one layer of sealing of hole film, avoids that the product hole after corrosion is excessive, and water outlet is followed by
Contact the secondary increase resistance of air oxidation.Above two material can modulate start when or during be slowly added into, temperature during addition
Degree control, should not be too high at 25 DEG C or so.
Because the height of temperature can influence the change of etching speed, therefore our chemical drugs for being stretched into heater in cell body 3
Fluid temperature is kept preferably to be incubated in 30-50 DEG C, the present embodiment at 40 DEG C or so to maintain constant etching speed in liquid 1.
Multiple copper-manganese resistance pattern pieces 4 are put into chemical liquid 1 simultaneously with material containing tool 2 and soaked, the loading of resistance alloys pattern piece
It is preferred with being paved with the bottom surface of material containing tool, ensures the uniformity of etching.As shown in Figure 1 and Figure 2, cell body bottom is provided with air duct
5, pipeline one end is communicated to outside cell body by the air inlet of air inlet 51, and the other end is placed in the bottom of cell body 3, the pipe positioned at the bottom of cell body 3
Road end has plug 52.Air duct is preferably disposed on the center line of cell body bottom, and both sides are arranged with multiple gas outlets 53, outlet
Direction is parallel with cell body bottom surface.In cell body under the inactive state of liquid level 6, as shown in Fig. 2 chemical liquid did not had carrier surface slightly,
And substantially it is capable of a part for dipped copper-manganese resistance pattern piece 4, but not do not had whole copper-manganese resistance pattern pieces completely.When opening
Begin from air duct supply gas when, gas from the parallel submitting in both sides gas outlet, rising, is formed bottom up from cell body 3 incessantly
The air-flow of ejection（As shown in Figure 2）, so as to make, the chemical liquid 1 in cell body 3 flows, rolling forms surge.Regulation can be passed through
Gas pushing quantity controls surge amplitude, ensures the chemical liquid of rolling and can not have carrier and resistance alloys pattern piece thereon.This
Sample, by the movement of tank liquor come self adjusting resistance piece resistance, and it is more uniform；The tank liquor of rolling can guarantee that each corner temperature,
Concentration uniformity is high；Due to not fully being immersed when copper-manganese resistance pattern piece is put into decoction, it can suitably slow down oxidation speed
Rate, more preferable management and control resistance lifting.Material containing tool 2 is fixed on cell body 3, is not floated with decoction.Resistance alloys pattern piece is in medicine
The bubble time of invading in liquid is 40-60s, with timer timing.According to the packet of picking according to resistance, the lower group product of resistance will soak
The bubble longer time, resistance rises 0.04-0.06m Ω after etching every time.After the completion of each resistance trimming, each layer in material containing tool is extracted
Each 3 of copper-manganese resistance pattern piece confirm actual resistance trimming effect, if resistance is still relatively low, immersion corrosion again will be carried out.
Further, material containing tool 2 can also connect relay by drive cylinder, pass through the different resistances sub-elected
Set lifting time（The relatively low soak time of resistance is longer）, make material containing tool 2 automatically fall into chemical liquid, and arrived in the time
Up to when be lifted off decoction automatically, so as to avoid operator maloperation from causing resistance abnormal, realize the accurate control of resistance regulation.
Certainly, can also be using other moving control mechanisms except cylinder and relay --- realize load such as motor and single-chip microcomputer
Expect the self-timing lifting of tool 2.
Certainly, we can also will use material containing tool 2（Material containing tool 2 can be multilayer, the dress of resistance alloys pattern piece
Load is preferred with being paved with the bottom surface of every layer of material containing tool）Multiple copper-manganese resistance pattern pieces 4 are submerged in chemical liquid simultaneously, and lost
Tool is rocked during quarter makes corrosion evenly.But the resistance trimming effect of this kind of mode is as above-mentioned decoction surge mode uniformly may be used
Control, and resistance trimming homogeneity is poor, but resistance trimming product quantity can be significantly increased in the increase material containing tool number of plies, and more traditional one arranges
Resistance trimming greatly save man-hour, improve efficiency.
It should be lost according to chemical liquid and regularly replace new liquid, the present embodiment herb liquid life-span is about 200/L.
（4）Resistance alloys pattern piece after resistance trimming is cleaned and dried, is encapsulated resistance region using insulating materials
Get up, expose electrode part, then the printing mark outside encapsulated layer, be placed on oven for baking solidification.
（5）Resistor semi after baking-curing cuts into the resistance product of simple grain, finally the electro-coppering of electrode part,
Nickel and tin, complete precision resistance production.
It should be pointed out that the target resistance values scope set in the present embodiment, resistance accuracy can also adjust as needed, and
It is not limited in the number range of this example offer.
With the precision chip resistor device being finally made in the present embodiment and each 200 of the resistor product without fine setting resistance
Resistance analysis contrast is carried out, comparative example uses step（1）、（2）、（4）、（5）Resistance product is made, embodiment uses step（1）
~（5）Resistance product is made, target resistance central value is 15m Ω, it is desirable to which resistance precision is ± 1%.Table 1 is to be hindered without fine setting
Resistor Value Data --- the i.e. comparative example of making, resistance range 14.14-15.44 m Ω, resistance average value are
15.0357m Ω, standard deviation 0.1406, fraction defective 19%, table 2 are the resistance value number made by step of the present invention
According to --- i.e. embodiment, resistance range 14.16-15.20m Ω, resistance average value is 14.9698m Ω, standard deviation 0.0891,
Fraction defective is 4%, and yield rises 15%.
| 15.15 | 14.81 | 15.08 | 14.14 | 15.14 | 15.00 | 15.11 | 15.04 | 14.93 | 15.07 |
| 15.16 | 14.53 | 15.15 | 15.06 | 15.12 | 14.88 | 15.05 | 15.13 | 15.07 | 15.14 |
| 14.90 | 15.11 | 15.02 | 15.10 | 15.00 | 14.81 | 15.01 | 15.12 | 15.11 | 15.10 |
| 14.88 | 15.19 | 15.16 | 14.99 | 15.08 | 14.98 | 15.12 | 15.13 | 14.96 | 15.08 |
| 15.09 | 14.90 | 15.14 | 15.10 | 15.05 | 15.12 | 15.11 | 15.15 | 15.09 | 14.89 |
| 15.17 | 15.07 | 14.56 | 15.01 | 15.09 | 15.13 | 14.93 | 14.85 | 15.08 | 15.13 |
| 15.06 | 15.17 | 15.18 | 15.04 | 14.90 | 15.19 | 15.07 | 14.89 | 15.19 | 15.23 |
| 15.16 | 15.01 | 15.19 | 15.11 | 15.08 | 15.02 | 15.17 | 15.09 | 14.83 | 15.11 |
| 15.08 | 15.04 | 15.06 | 14.83 | 15.15 | 15.11 | 14.87 | 15.10 | 15.12 | 14.92 |
| 15.14 | 15.08 | 15.14 | 15.07 | 14.82 | 15.13 | 15.12 | 15.03 | 15.16 | 14.59 |
| 15.02 | 15.11 | 14.87 | 15.17 | 15.10 | 14.81 | 15.03 | 15.12 | 15.03 | 15.12 |
| 14.88 | 14.97 | 15.04 | 15.16 | 14.83 | 14.85 | 15.07 | 15.04 | 14.87 | 15.08 |
| 15.00 | 15.06 | 15.11 | 14.85 | 14.93 | 14.99 | 14.51 | 15.16 | 15.07 | 15.06 |
| 15.07 | 15.10 | 15.17 | 15.12 | 15.09 | 14.81 | 14.85 | 15.14 | 14.98 | 14.79 |
| 15.11 | 14.99 | 15.11 | 15.11 | 15.07 | 15.06 | 15.19 | 15.03 | 15.15 | 15.09 |
| 14.96 | 15.44 | 15.19 | 15.06 | 15.03 | 15.03 | 14.90 | 15.04 | 15.01 | 15.00 |
| 14.91 | 15.05 | 15.11 | 15.08 | 15.07 | 14.90 | 15.06 | 15.10 | 15.10 | 15.10 |
| 15.03 | 15.10 | 15.02 | 14.90 | 15.06 | 15.01 | 15.11 | 15.17 | 14.82 | 15.11 |
| 14.81 | 15.09 | 15.07 | 15.09 | 15.06 | 15.14 | 15.14 | 15.11 | 14.84 | 15.12 |
| 15.05 | 15.15 | 15.05 | 15.08 | 15.15 | 15.07 | 15.07 | 15.07 | 15.03 | 15.01 |
Table 1 hinders the resistor Value Data made without fine setting（Unit：Milliohm）
| 15.02 | 14.92 | 15.06 | 15.03 | 15.03 | 14.95 | 15.02 | 14.94 | 14.90 | 15.04 |
| 14.91 | 14.97 | 15.07 | 15.00 | 14.95 | 15.01 | 14.98 | 15.07 | 14.92 | 14.94 |
| 14.92 | 14.92 | 14.97 | 14.80 | 15.00 | 14.89 | 14.87 | 14.92 | 14.99 | 14.89 |
| 14.93 | 15.04 | 15.06 | 14.90 | 14.94 | 15.02 | 15.04 | 15.04 | 15.03 | 15.03 |
| 14.99 | 15.03 | 15.04 | 14.96 | 14.84 | 14.81 | 14.92 | 15.02 | 15.00 | 14.89 |
| 14.98 | 14.85 | 14.96 | 15.06 | 14.93 | 14.90 | 14.90 | 15.04 | 15.01 | 15.04 |
| 14.92 | 14.95 | 14.99 | 14.90 | 14.95 | 15.06 | 14.98 | 15.00 | 15.02 | 15.01 |
| 15.04 | 15.08 | 15.03 | 14.89 | 14.99 | 14.95 | 14.90 | 15.03 | 15.04 | 14.88 |
| 15.02 | 15.00 | 15.00 | 15.01 | 15.02 | 14.97 | 14.91 | 15.04 | 14.98 | 14.86 |
| 14.99 | 15.07 | 15.00 | 15.00 | 14.99 | 15.02 | 14.91 | 14.94 | 15.00 | 14.92 |
| 14.98 | 15.00 | 15.04 | 14.84 | 15.12 | 14.89 | 14.95 | 14.97 | 14.91 | 14.98 |
| 15.01 | 14.93 | 14.82 | 14.16 | 14.94 | 14.97 | 15.06 | 14.96 | 15.06 | 14.97 |
| 15.04 | 15.03 | 15.01 | 14.96 | 15.10 | 14.95 | 14.96 | 14.98 | 15.08 | 15.02 |
| 14.89 | 14.97 | 15.06 | 14.92 | 15.07 | 15.07 | 14.86 | 14.92 | 14.75 | 14.92 |
| 14.99 | 14.98 | 14.94 | 15.07 | 15.03 | 14.88 | 14.89 | 15.01 | 14.95 | 15.05 |
| 14.95 | 15.06 | 14.92 | 14.93 | 14.96 | 15.09 | 14.96 | 15.10 | 14.88 | 14.87 |
| 14.91 | 14.89 | 14.90 | 15.04 | 14.88 | 14.99 | 15.00 | 15.02 | 14.89 | 14.96 |
| 14.86 | 15.04 | 14.98 | 15.08 | 14.96 | 14.95 | 14.92 | 15.03 | 15.04 | 14.99 |
| 15.00 | 14.90 | 15.07 | 15.02 | 14.98 | 15.00 | 14.93 | 14.98 | 14.92 | 14.75 |
| 15.01 | 14.91 | 15.08 | 15.01 | 15.01 | 15.09 | 15.00 | 14.90 | 14.94 | 14.90 |
The resistor Value Data that table 2 is made using chemical liquids fine setting resistance（Unit：Milliohm）
For distribution map between resistor tracks as shown in figure 3, wherein curve A is the resistance value distribution of comparative example, curve B is embodiment
Resistance value distribution, as seen from the figure, the resistance value that increase chemical liquid resistance trimming step makes more concentrates on target model
In enclosing.
Technological means disclosed in the present invention program is not limited only to the technological means disclosed in above-mentioned embodiment, in addition to
Formed technical scheme is combined by above technical characteristic.It should be pointed out that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (8)
1. a kind of preparation method of precision chip resistor, it is characterised in that comprise the following steps：
Step（1）, alloy sheet punch forming：Alloy raw material is struck out to required resistance pattern；
Step（2）, resistance packet：Resistance is measured, the alloy pattern piece that resistance is less than to lower limit is grouped, by the alloy of similar resistance
Pattern piece is divided into one group；
Step（3）, chemical liquid resistance trimming：
Alloy pattern piece is carried with carrier, makes alloy pattern piece part submerge in resistance trimming etching decoction, fluid temperature 30-50
DEG C, it is 40-60s to invade the bubble time, forms relative motion, the shape in immersion process between resistance trimming alloy pattern piece and chemical liquid
Pass through any one realization in following two modes into relative motion：
Rock carrier
Or
Air supply plant is set below resistance trimming etching decoction, and gas parallel submitting, rising from air supply plant make liquid medicine flow, turned over
Rolling forms surge；
Or
Alloy pattern piece is carried with carrier, makes alloy pattern piece all submerge in resistance trimming etching decoction, fluid temperature 30-50
DEG C, it is 40-60s to invade the bubble time, forms relative motion, the shape in immersion process between resistance trimming alloy pattern piece and chemical liquid
It is accomplished by the following way into relative motion：
Air supply plant is set below resistance trimming etching decoction, and gas parallel submitting, rising from air supply plant make liquid medicine flow, turned over
Rolling forms surge；
Step（4）, step will be passed through（3）The cleaning of resistance alloys pattern piece, dry, encapsulating, solidification after resistance trimming；
Step（5）, step will be passed through（4）Resistor semi after processing cuts into the resistance product of simple grain, and forms electrode.
2. the preparation method of precision chip resistor according to claim 1, it is characterised in that：The carrier is controlled by mobile
Mechanism processed realizes that self-timing lifts.
3. the preparation method of precision chip resistor according to claim 1, it is characterised in that：The step（3）Middle chemistry
Decoction includes following component：Mass ratio 5%-10% etching salt and volume ratio 1%-5% strong acid.
4. the preparation method of precision chip resistor according to claim 3, it is characterised in that：Also include polyethylene glycol and height
Substitute hydroxypropyl cellulose.
5. the preparation method of precision chip resistor according to claim 4, it is characterised in that：The polyethylene glycol volume ratio
For 1%-5%, the Hydroxypropylcelliloxe volume ratio is 5%-10%.
6. the preparation method of precision chip resistor according to claim 3, it is characterised in that：The chemical liquid passes through such as
Lower method is prepared：
Appropriate running water is added in a reservoir, is heated to 30-50 DEG C, is first added the etching salt that mass ratio is 5%-10%, is opened
Gas pump cycle, after salt to be etched is completely dissolved, add volume ratio 1%-5% sulfuric acid.
7. the preparation method of precision chip resistor according to claim 1, it is characterised in that：The step（1）In, carry out
According to the upper and lower bound of target resistance values during punching press, central value is corrected so as to make resistance value all control within the upper limit.
8. the preparation method of precision chip resistor according to claim 1, it is characterised in that：The step（2）In each point
Resistance interval between group is identical.
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| CN109494037A (en) * | 2018-11-19 | 2019-03-19 | 深圳市业展电子有限公司 | A kind of efficient resistance trimming technique of high-precision low resistance alloy Chip-R |
| CN113035478A (en) * | 2021-02-23 | 2021-06-25 | 深圳市业展电子有限公司 | Method for processing chip resistor |
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| JP6128847B2 (en) * | 2009-06-25 | 2017-05-17 | スリーエム イノベイティブ プロパティズ カンパニー | Wet etching method for self-assembled monolayer patterned substrate and metal patterned article |
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|---|---|---|---|---|
| CN101587766A (en) * | 2009-03-23 | 2009-11-25 | 贝迪斯电子有限公司 | Method for manufacturing precise metal strip resistor |
| CN102296293A (en) * | 2011-06-24 | 2011-12-28 | 李沛泓 | Micro-etchant for printed circuit board |
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| Title |
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| 新型微蚀刻剂——单过硫酸氢钾复合物在PCB 行业中的应用研究;杨万秀等;《印刷电路信息》;20061231;38页第2段至40页第1段 * |
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