KR101632205B1 - Method for manufacturing antenna for mobile communication device having enhanced galvanic corrosion properties, case frame for mobile communcation device manufactured thereby and mobile communcation device having the case frame - Google Patents

Abstract

A method of manufacturing an antenna for a mobile communication terminal having improved galvanic corrosion resistance according to the present invention includes integrating a conductive metal pin integrally with a dielectric case body for forming a device of a mobile communication terminal to pass through the case body; Forming a conductive pattern layer on one surface of the case body so as to overlap one end surface of the metal pin, the conductive pattern layer having a metal material different from the conductive metal pin; Drying the conductive pattern layer; And forming a conductive hole through a corrosion layer formed on a surface of the conductive metal pin at one side surface of the conductive metal pin to directly connect the conductive pattern layer to the conductive metal pin.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing an antenna for a mobile communication terminal having improved galvanic corrosion resistance, a case for a mobile communication terminal manufactured thereby, and a mobile communication terminal having the same. COMMUNICATION DEVICE MANUFACTURED THEREBY AND MOBILE COMMUNICATION DEVICE HAVING THE CASE FRAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an antenna for a mobile communication terminal having improved galvanic corrosion resistance, a case for the mobile communication terminal manufactured thereby and a mobile communication terminal having the same.

A mobile communication terminal is a portable device having a function of storing information, inputting / outputting information, and data, centering on a call / message transmission / reception function, while being portable. Thanks to the rapid development of information technology and electronic industry, mobile communication terminals are becoming one of the essential personal personal items of modern people equipped with various functions such as cameras, music and video playback, games, and TV.

An external antenna, which is exposed to the outside of the terminal, was developed first, but the internal antenna mounted on the mobile communication terminal has been replaced with an internal antenna having fewer problems of damage while improving the beauty. Various types of built-in antennas have been developed depending on the type of antenna, manufacturing method, material, position, and the like. In accordance with miniaturization of a terminal, an antenna embedded therein must satisfy complicated conditions such as securing a space and a space that can realize communication quality from the viewpoint of design, overcoming influences from other parts becoming closer and becoming higher density, and regulating electromagnetic waves The difficulty also increases.

In recent years, a dielectric carrier or a support for fixing the built-in antenna is separately provided inside the cage of the terminal. In recent years, the antenna is installed directly in a case or a frame of the mobile terminal, thereby reducing the installation space or volume and increasing the component density. In the method of forming the antenna pattern, direct printing or vapor deposition is also used in order to reduce the thickness and simplify the manufacturing process. In order to secure a certain distance from the circuit board, the antenna pattern may be located on the opposite side of the case or the frame. In order to connect the antenna pattern to the circuit board, a conductor that passes through the structure supporting the antenna pattern is required. In order to install the conductor through the case, another metal may be injected into the case and insert, a metal pin may be press-fitted, or printing or plating may be performed on the inner wall of the through hole for conduction.

A slim design of the mobile communication terminal and a design that wraps the frame by using a metallic ring to provide mechanical rigidity or emphasize individuality according to the display conversation has been proposed. However, the metal rim acts as a weak point that imposes restrictions on the mounting area or design of the antenna, which is becoming increasingly narrow.

In such a situation, there is an increasing need to connect between a thin antenna pattern layer or a conductive layer and a metal. In this case, the stability of the electrical connection between them is important, and the risk of disconnection due to impact is also a problem to overcome. In particular, galvanic corrosion due to the potential difference between the surface of conductor metal (eg, aluminum, magnesium) and the dissimilar metal elements (eg, gold, silver) in the electrolyte paste to make the antenna pattern in the manufacturing process degrades the stability of the connection structure It can also act as a factor.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a method of manufacturing an antenna for a mobile communication terminal, which can overcome the galvanic corrosion problem that may occur in the process of manufacturing a mobile communication antenna having a connection portion made of different materials, And a mobile communication terminal having the same.

According to another aspect of the present invention, there is provided a method of manufacturing an antenna for a mobile communication terminal having improved galvanic corrosion resistance characteristics according to the present invention. The method includes the steps of: Bonding the metal pin integrally; Forming a conductive pattern layer on one surface of the case body so as to overlap one end surface of the metal pin, the conductive pattern layer having a metal material different from the conductive metal pin; Drying the conductive pattern layer; And forming a conductive hole through a corrosion layer formed on a surface of the conductive metal pin at one side surface of the conductive metal pin to directly connect the conductive pattern layer to the conductive metal pin.

In one embodiment of the present invention, the step of forming the conductive hole through the corrosion layer formed on the surface of the conductive metal pin at one side surface of the conductive metal pin and directly connecting the conductive pattern layer to the conductive metal pin may include: And irradiating the surface of the conductive pattern layer with a laser so as to penetrate a corrosion layer formed on the surface of the conductive pattern layer.

In one embodiment of the present invention, the step of forming the conductive hole through the corrosion layer formed on the surface of the conductive metal pin at one side surface of the conductive metal pin and directly connecting the conductive pattern layer to the conductive metal pin may include: And pressing the punch on the surface of the conductive pattern layer so as to penetrate the corrosion layer formed on the surface.

As an example related to the present invention, the conductive hole may be disposed at a plurality of positions.

As an example related to the present invention, the conductive hole may include either a dot shape or a line shape.

In one embodiment of the present invention, the step of forming the conductive pattern layer on the one side of the case body so as to overlap the one end face of the conductive metal pin includes the step of printing the conductive paste or the conductive ink for forming the conductive pattern layer .

In one embodiment of the present invention, the conductive pattern layer includes silver (Ag) or gold (Au), and the conductive metal pin may include aluminum (Al) or magnesium (Mg).

In one embodiment of the present invention, the step of integrally joining the conductive metal pin to the dielectric case body for forming the device of the mobile communication terminal so as to pass through the case body comprises: Forming a conductive metal rim, the metal rim comprising an inwardly extending elongated protrusion; And inserting the metal rim with a dielectric case, wherein a portion of the elongated protrusion passes through the dielectric case in a thickness direction to form the metal pin.

As a related example of the present invention, a method of manufacturing an antenna for a mobile communication terminal improved in galvanic corrosion resistance characteristic may include a step of, after the step of injecting the metal rim with the dielectric case, And a step of removing the second layer.

As an example related to the present invention, the manufacturing method of an antenna for a mobile communication terminal having improved galvanic corrosion resistance may further include forming a waterproof layer on the surface of the pushing portion and the pattern layer.

In another aspect of the present invention, a method of manufacturing an antenna for a mobile communication terminal having improved galvanic corrosion resistance comprises the steps of: forming a conductive metal pin on a dielectric case body for forming an instrument of the mobile communication terminal, The step of integrally bonding may further include a step of performing a chromate treatment on the conductive metal pin.

A case for a mobile communication terminal according to the present invention includes: a case body made of a dielectric material for forming a structure of a mobile communication terminal; A conductive metal pin disposed to pass through the case body and integrally coupled to the case body; A conductive pattern layer which is attached to one surface of the case body so as to overlap one end surface of the metal pin and has a metal material different from the metal pin; And a conductive hole formed in the conductive pattern layer by pressing or laser at one side surface section of the metal pin so that the conductive pattern layer is in direct contact with the metal pin.

As an example related to the present invention, the case for the mobile communication terminal may further include a waterproof layer formed on the surfaces of the conductive hole and the conductive pattern layer.

A mobile communication terminal according to the present invention comprises: a case body made of a dielectric material; A conductive metal pin disposed to pass through the case body and integrally coupled to the case body; A conductive pattern layer which is attached to one surface of the case body so as to overlap one end surface of the metal pin and has a metal material different from the metal pin; And a conductive hole formed in the conductive pattern layer by a pressing or laser at one side surface section of the metal pin so that the conductive pattern layer is in direct contact with the metal pin.

According to the method for fabricating an antenna for a mobile communication terminal improved in galvanic corrosion resistance according to the present invention, by forming a conductive hole between a metal pin and a pattern part, which are different materials that can cause galvanic corrosion, Since the metal pin and the pattern part are directly connected to each other by physically penetrating the corrosion layer, the resistance can be reduced and the connection quality of the antenna can be improved.

According to an embodiment of the present invention, since the through holes are formed by using a laser, the galvanic corrosion layer is locally burned and removed, so that the effect of conduction is excellent, there is an advantage in management of the production process, There is an advantage that the surface state can be obtained.

In addition, according to one embodiment of the present invention, even when an antenna pattern is formed by printing while using some elements of the metal rim as a power supply means such as an antenna, galvanic corrosion is overcome and application effects are advantageous.

1 is a partial cross-sectional view schematically showing an example of a mobile communication terminal having an antenna manufactured in a method related to the present invention;
2 to 6 are views schematically showing a result of a detailed process according to a first embodiment of the present invention in order to illustrate a method of manufacturing an antenna for a mobile communication terminal with improved galvanic corrosion resistance according to the present invention.
7 is a cross-sectional view of a metal pin upper perspective view showing an example in which a conduction hole is formed according to a second embodiment of the present invention.
8 is a cross-sectional view of a metal pin upper perspective view showing an example in which a conduction hole is formed according to the third embodiment of the present invention.
9 is a cross-sectional view of a metal pin upper perspective view showing an example in which a conduction hole is formed according to a fourth embodiment of the present invention.
10 is a cross-sectional view of a metal pin upper perspective view showing an example in which a conduction hole is formed according to a fifth embodiment related to the present invention.
11 is a cross-sectional view of a metal pin upper perspective view showing an example in which a conduction hole is formed according to a sixth embodiment related to the present invention.
FIG. 12 is a partial cross-sectional view schematically showing a mobile communication terminal improved in galvanic corrosion resistance according to a seventh embodiment of the present invention
FIG. 13 is a partial cross-sectional view schematically showing a mobile communication terminal improved in galvanic corrosion resistance according to an eighth embodiment of the present invention
FIG. 14 is a partial cross-sectional view schematically showing a mobile communication terminal improved in galvanic corrosion resistance characteristic according to a ninth embodiment of the present invention
15 is a process sectional view for conceptually illustrating a method of forming a conduction hole according to a tenth embodiment related to the present invention
16 is a photograph of a case for a mobile communication terminal having a through hole manufactured by the method of Fig. 15
18 is a perspective view showing various embodiments in which a conduction hole is formed using a laser,

Hereinafter, a method for fabricating an antenna for a mobile communication terminal with improved galvanic corrosion resistance according to the present invention, a case for a mobile communication terminal manufactured thereby, and a mobile communication terminal having the same will be described in detail with reference to the accompanying drawings.

1 is a partial cross-sectional view schematically showing an example of a mobile communication terminal having an antenna manufactured according to a method related to the present invention.

Referring to FIG. 1, the mobile communication terminal 100 includes a dielectric case body 110 for forming a device, and a substrate 120 is disposed inside the case body 110. The mobile communication terminal 100 is a mobile device having an antenna for a mobile communication in connection with the present invention. Typically, the mobile communication terminal 100 may include a mobile phone, a smart phone, etc. In addition, various portable devices such as a tablet PC, .

A conductive metal pin 130 is integrally coupled to the case body 110. The conductive metal pins 130 pass through the thickness direction of the case body 110 and are arranged such that both surfaces are exposed to the inner and outer surfaces of the case body 110, respectively.

A conductive pattern layer 140 is formed on the surface of the case body 110 and the surface of the conductive metal pin 130. The conductive pattern layer 140 may be formed in a form for securing a necessary length for use as a radiator of the antenna or may be used as a connecting means for connecting one element and another element within the terminal. The material of the conductive pattern layer 140 may be a material different from the conductive metal pin 130. That is, if the conductive metal pin 130 is aluminum (Al) or magnesium (Mg), the conductive pattern layer 140 may include silver (Ag) or gold (Au).

The conductive pattern layer 140 is formed between the conductive metal pin 130 and the conductive pattern layer 140 so that the conductive pattern layer 140 is in direct contact with the conductive metal pin 130. [ The through hole 145 penetrates the galvanic corrosion layer that can be formed on the surface of the conductive metal pin 130 by physical pressing or heat to induce a direct connection between the conductive pattern layer 140 and the conductive metal pin 130.

The conductive pattern layer 140 may be formed by a method of printing directly on the case body 110. A DPA (Direct Printed Antenna) method or a pad printing method can be applied to the conductive pattern layer 140 here. In addition, a pattern may be formed by a method such as vapor deposition, plating or transfer.

The opposite end of the conductive metal pin 130 is in contact with the elastic terminal 150 provided on the substrate 120. The electrical signal of the conductive pattern layer 140 is transmitted to the substrate 120 through the conductive metal pin 130 and the elastic terminal 150. [ The electrical connection state between the conductive pattern layer 140 and the conductive metal pin 130 may be deteriorated due to an impact or an external factor received by the mobile communication terminal 100. The conductive hole 145 may have a resistance to galvanic corrosion The rise can be prevented.

FIGS. 2 to 6 are views schematically showing the result of each sub-process according to the first embodiment in order to explain a method of manufacturing an antenna for a mobile communication terminal with improved galvanic internal characteristics according to the present invention.

First, as shown in FIG. 2, the conductive metal pin 130 is integrated with the dielectric case body 110. The upper surface of the case body 110 and the upper surface of the metal pin 130 may include an undercut 112 to prevent the upper surface of the conductive metal pin 130 from protruding. The conductive metal pin 130 may include aluminum, magnesium, copper, or the like.

Next, as shown in FIG. 3, a conductive paste or conductive ink, which is a material of the conductive pattern layer 140, is printed or adhered to the upper surface of the metal pin 130 and the surface of the case body 110. The conductive paste or conductive ink may comprise silver (Ag) or gold (Au). The conductive paste or conductive ink may be an electrolyte, so that when it contacts the metal pin 130, electron transfer with silver (Ag) or gold (Au) contained in the conductive paste or ink may occur. FIG. 4 is a conceptual representation thereof. That is, the galvanic corrosion layer 135 may be formed on the surface where the conductive metal pin 130 is in contact with the conductive paste or the conductive ink. Since the corrosion layer 135 is nonconductive, the electrical connection between the conductive pattern layer 140 and the conductive metal pin 130 can be cut off or the resistance can be increased.

Next, the conductive pattern layer 140 is dried so that the formation of the corrosion layer 135 can be completed. Such drying may be carried out by using natural air or forced air blowing or heat, and various curing means may be used depending on the material of the conductive paste or the ink. This drying of the pattern layer 140 is meaningful in that it confirms that the corrosion layer 135 is completely formed. If the formation of the through hole 145 thereafter is dry or dry, care must be taken since the corrosion layer 135 may be formed even after the formation of the through hole 145.

When drying of the pattern layer 140 is completed, the pattern layer 140 is depressed locally by a needle punch P or the like (see FIGS. 5 and 6). The mark pressed by the needle punch P forms the through hole 145 and penetrates the corrosion layer 135 as shown in FIG. 6 so that the conductive pattern layer 140 comes into direct contact with the conductive metal pin 130.

FIG. 7 is a top perspective view of a metal pin according to a second embodiment of the present invention. FIG. 8 is a top view of a metal pin shown in FIG. to be.

As shown in these drawings, through holes 245 and 345 are formed in the undercuts 212 and 312 in which the metal pin is disposed at the lower part. In order to ensure a connection state, a plurality of the conduction holes 245 and 345 may be formed, such as two or four.

FIG. 9 is a top perspective view of a metal pin according to a fourth embodiment of the present invention, and FIG. 10 is a top view of a metal pin, showing an example of forming a tapered portion according to a fifth embodiment of the present invention, 11 is a perspective view of a top portion of a metal pin according to a sixth embodiment of the present invention in which a tapered portion is formed.

The shapes of the through holes 445, 545, and 645 may be designed so as to enhance the possibility of direct contact between the conductive pattern layers 440, 540, and 640 and the underlying conductive metal pin through the caustic layer. FIG. 9 shows a dot shape having a complex outline, and FIG. 10 shows a polygonal shape. FIG. 11 shows a through hole 645 formed in a line shape.

FIG. 12 is a partial cross-sectional view schematically showing a mobile communication terminal improved in galvanic corrosion resistance according to a seventh embodiment of the present invention.

Referring to FIG. 12, the mobile communication terminal 700 includes a main body and is surrounded by a conductive metal frame 701 at the edges of the main body. And a case body 710 formed integrally with the metal frame 701 is disposed inside or outside the main body.

The metal frame 701 forms an outer appearance of the mobile communication terminal 700 and can be utilized as an antenna by its conductivity. A conductive pattern layer 740 is formed on the case body 710 and the conductive pattern layer 740 is also electrically connected to the extending protrusions 730 extending from the metal frame 701. Specifically, the extending protrusion 730 extends inward of the metal rim 701 and includes a connecting arm portion 731 extending from the metal rim 701 and a connecting arm portion 731 extending from the end of the connecting arm portion 731 to the case body 710 And a through-hole fin portion 732 penetrating through the through-hole 732. One end of the through-hole fin 732 faces toward the circuit board 720 and the other end faces away from the circuit board 720. The through-hole fin portion 732 contacts an elastic terminal 750 provided on the circuit board 720 to supply an electrical signal to be received or transmitted in the pattern layer 740 or the metal frame 701.

The case body 710 having the metal rim 701 can be manufactured through the following procedure.

First, to form the metal rim 701, a conductive metal material is cast to obtain a primary shape. The primary shape includes a rim body and an extending projection extending inward of the rim body. As the conductive metal material, aluminum having excellent workability and electrical conductivity can be used, and a primary shape can be formed by the die casting method. In addition, it is also possible to use magnesium as a conductive metal material. The extension protrusions 730 can have a number of positions or numbers depending on the part where it is needed.

Next, the primary shape is mechanically processed through a machine such as CNC to obtain a secondary shape. Whereby the frame body and the extending protrusion 730 form an accurate shape to be provided.

When the shape of the rim body and the shape processing of the extending projections 730 are completed, the secondary shape can be subjected to the corrosion treatment so as to reduce the deterioration of the electric conductivity. A chromate treatment can be applied as such a corrosion-resistant treatment. Even if the extended protrusion 730 subjected to the chromate treatment, partial corrosion may occur between the aluminum and the chromate, so that a stable conductive property can be ensured by forming the pressing portion 745 to be described later.

When the shape of the metal rim and the protrusion is completed, the metal rim 701 and the extending protrusion 730 are integrated with the dielectric case 710. As such a method, a process of molding the metal rim 701 and the extending projection 730 by insert injection with a resin material for forming the dielectric case 710 may be included. At this time, the extending protrusion 730 passes through the dielectric case 710, and one end thereof faces toward the circuit board to be mounted forward, and the other end faces away from the circuit board.

Next, after the insert injection, the metal rim and the dielectric case can be machined. At this stage, the metal rim 701 can be divided into several pieces by cutting gap. Further, the extending protrusion 730 can be separated from the metal rim 701 through machining. For this purpose, a portion connecting the extension protrusion 730 and the metal rim 701 may be removed. The extension protrusion 730 may be used independently of the metal rim 701.

In this way, the antenna for a mobile communication terminal having a metal rim is formed with an antenna pattern or a contact pin to which a metal rim is to be fed together (that is, an extending projection) in the process of integrating the metal rim and the dielectric case together, It can reduce the manufacturing process and is excellent in cost and management.

The conductive pattern layer 740 may be formed by a method of direct printing on the case body 710, as described above. The conductive pattern layer 740 is connected to the circuit board 720 through an extension protrusion 730 extending from the metal rim 701. Therefore, the metal frame 701 and the case body 710 can be integrated with each other without having a press-fit pin or a through-hole structure for connecting an antenna.

The conductive pattern layer 740 and the through-hole fin portions 732 are formed with the conduction holes 745 as described above. The through holes 745 penetrate the corrosion layer to be formed in the through-hole fin portions 732 of the extending protrusions 730 and allow the pattern layer 740 to directly contact and connect the through-fin portions 732. Since the rim 701 and the penetrating fin portion 732 are made of aluminum or magnesium and the pattern layer 740 includes silver or the like, a galvanic corrosion layer problem may occur. The through hole 745 effectively solves this problem.

FIG. 13 is a partial cross-sectional view schematically showing a mobile communication terminal according to an eighth embodiment of the present invention. FIG.

In this example, a portion C connecting the metal frame 801 and the through-hole fin 832 is removed in a state where the metal frame 801 and the through-hole fin 832 are connected. Accordingly, the through-fin portion 832 can be connected to the circuit board 820 independently of the metal frame 801. [ The through-hole fin portion 832 may have a length protruding from the inner surface of the case body 810 in consideration of the distance between the circuit board 820 and the conductive elastic terminal 850. [

In this example as well, the through hole 845 is formed in the pattern layer 840 and the through-fin portion 832 as described above.

FIG. 14 is a partial cross-sectional view schematically illustrating a mobile communication terminal improved in galvanic corrosion resistance according to a ninth embodiment of the present invention.

In this example, after the conductive hole 945 is formed, the waterproof layer 970 is formed to prevent further corrosion due to moisture or electrolytic substances in the air. The waterproof layer 970 can be formed by a method such as screen printing or painting after the provision of the through hole 945. [

15 is a process sectional view conceptually illustrating a method of forming a conductive hole according to a tenth embodiment of the present invention, FIG. 16 is a cross-sectional view of a case for a mobile communication terminal having a conductive hole manufactured by the method of FIG. 15 And FIG. 18 is a perspective view showing various embodiments in which conduction holes are formed by using a laser.

In this embodiment, as a method of forming the through hole 1045, the surface of the conductive pattern layer 1040 is irradiated with a laser L to pierce the etching layer 1035, and the conductive pattern layer 1040 is electrically connected to the conductive metal pin 1030 ). ≪ / RTI > The laser L irradiates and locally forms spot-shaped conduction holes 1045 by locally irradiating the surface of the conductive pattern layer 1040 so as to irradiate and transport the laser to form conduction holes 1145, 1245, 1345 and 1445 on the lines. See Fig. 17).

As a result, as shown in FIG. 16, the galvanic corrosion layer 1035 is locally removed by the laser L, and the surface of the conductive pattern layer 1040 and the conductive metal pin 1030 1045 are formed. The parameter of the laser L to be irradiated and the punching position can be corrected according to the thickness, material, etc. of the conductive pattern layer 1040 to be corrected. The present method can further improve the production process and the screen printing surface condition as compared with the case of Fig. 5 using the needle punch (P).

The method for fabricating the antenna for a mobile communication terminal improved in galvanic corrosion resistance as described above, the case for the mobile communication terminal manufactured by the method, and the mobile communication terminal having the same are not limited to the configuration and method of the embodiments described above. The above embodiments may be constructed by selectively combining all or a part of each embodiment so that various modifications can be made.

100, 700, 800: mobile communication terminal
110, 710, 810, 910, 1010: dielectric case body
112, 212, 312: undercuts 120, 720, 820:
130, 730, 830, 930, 1030: Conductive metal pin 135,935: Corrosion layer
140, 240, 340, 440, 540, 640, 740, 840, 940, 1040:
145, 245, 345, 445, 545, 645, 745, 845, 945, 1045, 1145, 1245, 1345, 1445:
150, 750, 850: conductive elastic terminal 970: waterproof layer

Claims (15)

Integrally coupling a conductive metal pin to the dielectric case body for forming a device of the mobile communication terminal so as to pass through the case body;
Forming a conductive pattern layer on one surface of the case body so as to overlap one end surface of the metal pin, the conductive pattern layer having a metal material different from the conductive metal pin;
Drying the conductive pattern layer; And
Forming a conduction hole through a corrosion layer formed on a surface of the conductive metal pin at one end surface of the conductive metal pin and directly connecting the conductive pattern layer to the conductive metal pin,
The step of integrally joining the conductive metal pin to the dielectric case body for forming the device of the mobile communication terminal,
Forming a conductive metal rim for forming an edge portion of the mobile communication terminal, the metal rim including an extending projection extending inward; And
And a step of inserting the metal rim with a dielectric case, wherein a part of the extending protrusion passes through the dielectric case in the thickness direction to form the metal pin. How to make an antenna.
The method according to claim 1,
Forming a conductive hole through a corrosion layer formed on a surface of the conductive metal pin at one side surface of the conductive metal pin and directly connecting the conductive pattern layer to the conductive metal pin,
And irradiating a laser on the surface of the conductive pattern layer so as to penetrate the corrosion layer formed on the surface of the conductive metal pin.
The method according to claim 1,
Forming a conductive hole through a corrosion layer formed on a surface of the conductive metal pin at one side surface of the conductive metal pin and directly connecting the conductive pattern layer to the conductive metal pin,
And pressing a punch on the surface of the conductive pattern layer so as to penetrate the corrosion layer formed on the surface of the conductive metal pin.
Claim 4 has been abandoned due to the setting registration fee. The method according to claim 1,
Wherein the conductive hole is disposed at a plurality of positions, wherein the galvanic internal property is improved.
Claim 5 has been abandoned due to the setting registration fee. The method according to claim 1,
Wherein the conductive hole includes either a dot shape or a line shape, wherein the conductive hole has improved galvanic corrosion resistance.
The method according to claim 1,
Forming a conductive pattern layer on one surface of the case body so as to overlap with one side surface of the conductive metal pin,
And printing a conductive paste or a conductive ink for forming the conductive pattern layer on the surface of the conductive pattern layer.
Claim 7 has been abandoned due to the setting registration fee. The method according to claim 1,
Wherein the conductive pattern layer comprises silver (Ag) or gold (Au)
Wherein the conductive metal pin comprises aluminum (Al) or magnesium (Mg).
delete The method according to claim 1,
After the step of inserting the metal rim with the dielectric case,
Further comprising the step of removing a portion connecting the extension protrusion and the metal rim.
Claim 10 has been abandoned due to the setting registration fee. The method according to claim 1,
And forming a waterproof layer on a surface of the pattern layer, wherein the waterproof layer is formed on the surface of the pattern layer.
Claim 11 has been abandoned due to the set registration fee. The method according to claim 1,
The step of integrally joining the conductive metal pin to the dielectric case body for forming the device of the mobile communication terminal,
The method of claim 1, further comprising the step of chromating the conductive metal pin.
A case body made of a dielectric material for forming a device of the mobile communication terminal;
A conductive metal pin disposed to pass through the case body and integrally coupled to the case body;
A conductive pattern layer which is attached to one surface of the case body so as to overlap one end surface of the metal pin and has a metal material different from the metal pin; And
And a conductive hole formed in the conductive pattern layer by press-fitting or laser at one side surface section of the metal pin so that the conductive pattern layer is in direct contact with the metal pin,
A conductive metal rim is formed at an edge portion of the case body,
Wherein the metal rim includes an inwardly extending extension protrusion,
The metal rim is fixed to the case body by insert injection,
And a part of the extending protrusion passes through the case body in the thickness direction to form the metal pin.

Claim 13 has been abandoned due to the set registration fee. 13. The method of claim 12,
Wherein the conductive pattern layer comprises silver (Ag) or gold (Au)
Wherein the conductive metal pin comprises aluminum (Al) or magnesium (Mg), wherein the conductive metal pin has improved galvanic corrosion resistance.
Claim 14 has been abandoned due to the setting registration fee. 13. The method of claim 12,
And a waterproof layer formed on the conductive hole layer and the conductive pattern layer.
A case body made of a dielectric material;
A conductive metal pin disposed to pass through the case body and integrally coupled to the case body;
A conductive pattern layer which is attached to one surface of the case body so as to overlap one end surface of the metal pin and has a metal material different from the metal pin; And
And a conductive hole formed in the conductive pattern layer by press-fitting or laser at one side surface section of the metal pin so that the conductive pattern layer is in direct contact with the metal pin,
A conductive metal rim is formed at an edge portion of the case body,
Wherein the metal rim includes an inwardly extending extension protrusion,
The metal rim is fixed to the case body by insert injection,
And a part of the extending protrusion passes through the case body in the thickness direction to form the metal pin.

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