JP2008192788A - Electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance connection strength regarding an electronic part having a plurality of terminal electrodes on the surface of an insulator block. <P>SOLUTION: The electronic part comprises: a plurality of first terminal electrodes 5b provided on the mounting face of an insulator block 2; a second terminal electrode 5a having substantially the same size with the first terminal electrode 5b and having a smaller number of terminals; a first internal electrode 3b which DC-connects all the first terminal electrodes 5b in the insulator block 2; and a second internal electrode 3a which DC-connects all the second terminal electrodes 5a in the insulator block 2 when the second terminal electrode 5a is plural. The first terminal electrode 3b and the second terminal electrode 3a are formed of an underlying layer 6 having electric conductivity and an electrolytic plating layer 7 coating the underlying layer 6, respectively, and the size of the underlying layer 6 of the first terminal electrode 5b is smaller than that of the underlying layer 6 of the second terminal electrode 5a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component having a plurality of terminal electrodes on the surface of an insulator block.

  In an electronic component having a multi-terminal structure, as a technique for making the plating thickness of each terminal constant, conventionally, as shown in FIG. By making it smaller than the difficult inner terminal electrode 1b, the probability of hitting the barrel was adjusted, and the plating thickness was made constant.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2001-358034 A

  With the progress of high-density mounting of electronic components, the use of electronic components in the form of land grid arrays (hereinafter referred to as LGA) has been promoted. When the size of the electrode 1a is set smaller than that of the inner terminal electrode 1b and the electrode thickness is made constant, the terminal electrode 1a on the outer side of the mounting surface to which external stress is easily applied becomes smaller, resulting in insufficient connection strength. It was.

  Accordingly, the present invention aims to solve such problems and increase the connection strength of electronic components.

  In order to solve this problem, the present invention provides two or more first terminal electrodes provided on the mounting surface of the insulator block, and the first terminal electrode is substantially the same size as the first terminal electrode and provided less than the first terminal electrode. The second terminal electrode, the first internal electrode that connects all of the first terminal electrodes in a DC manner inside the insulator block, and the interior of the insulator block when there are a plurality of second terminal electrodes. And a second internal electrode for connecting all of the second terminal electrodes in a DC manner, and the first terminal electrode and the second terminal electrode are each an electrically conductive underlayer and electrolytic plating covering the underlayer. The size of the base layer of the first terminal electrode is made smaller than the size of the base layer of the second terminal electrode.

  According to the present invention, the connection strength of the electronic component can be increased by configuring the electronic component in such a configuration.

  FIG. 1 is a schematic view showing an electronic component according to an embodiment of the present invention. Internal electrodes 3a and 3b and via holes 4 constituting a predetermined circuit are appropriately arranged in an inner layer of an insulator block 2 made of a plurality of ceramic layers. The LGA structure is provided with a terminal electrode 5a for input / output connection of the electronic component and a terminal electrode 5b for ground connection on the upper surface as a mounting surface of the electronic component. The internal electrodes 3a and 3b are DC-connected to the internal electrode 3a for DC connection (hereinafter referred to as DC connection) between the input / output connection terminal electrodes 5a and the ground connection terminal electrode 5b. An internal electrode 3b that ensures the shielding performance of the component is shown.

  The internal electrode 3b is provided on almost the entire inner layer region in the insulator block 2 in order to improve the shielding performance of the electronic component, and the terminal electrode 3b for ground connection stabilizes the ground potential of the internal electrode 3b. Therefore, more terminals are provided than the terminal electrodes 3a for input / output connection.

  As shown in FIG. 2, the terminal electrodes 5a and 5b provided on the mounting surface of the electronic component are formed by first forming an Ag underlayer 6 on the mounting surface of the insulator block 2 by metallization, and then this underlayer. An Ni-Sn electrolytic plating layer 7 is formed on the surface of 6 by electrolytic plating.

  Here, in this electronic component, the size of the electroplating layer 7 is the same as the size of the base layer 6 in comparison with the terminal electrode 5a for input / output connection and the terminal electrode 5b for ground connection. The connection strength of the electronic component is improved by making the difference.

  That is, the terminal electrode 5a for input / output connection is DC-connected by the internal electrode 3a, and the terminal electrode 5b for ground connection is also DC-connected by the internal electrode 3b. That is, by setting the size of the ground layer 6 of the ground connection terminal electrode 5b having a large number of DC-connected terminals to be smaller than that of the ground layer 6 of the input / output connection terminal electrode 5a, the terminal electrode 5a is conventionally provided. The thickness of the electrode formed by electrolytic plating can be made constant without changing the size of 5b.

  This is because even if the barrel in electrolytic plating comes into contact with one terminal electrode 5a, electricity is conducted to the other terminal electrode 5a DC-connected to this terminal electrode, so that a plating layer is simultaneously formed on both terminal electrodes 5a. It is formed. When the number of DC-connected terminals is different like the terminal electrode 5a for input / output connection and the terminal electrode 5b for ground connection, the contact probability of the barrel is proportional to the number of DC connections. By making the size of the base layer 6 of the terminal electrode 5b for a large number of ground connections smaller than the size of the base layer 6 of the terminal electrode 5a for an input / output connection with a small number of DC connections, the final terminal electrode 5a, 5b The thickness of the terminal electrodes 5a and 5b can be made constant without changing the size of the shape, that is, the size of the plating layer 7.

  And when it is LGA structure like the electronic component of this embodiment, in order to make the thickness of the terminal electrodes 5a and 5b constant, conventionally, the shapes of the terminal electrodes 5a and 5b are made different. Although it was difficult to ensure the connection strength of the electronic components, the plating thickness can be made constant without changing the size of the terminal electrodes 5a and 5b as described above. The strength can be increased.

  In this embodiment, the terminal electrodes 5a and 5b have been described by taking the input / output connection and the ground connection as examples. However, the present invention is not limited to this. A similar effect can be obtained by setting the size of the underlayer.

  According to the present invention, the connection strength of the electronic component can be increased by configuring the electronic component in such a configuration.

The disassembled perspective view which showed typically the electronic component of one Embodiment of this invention Diagram showing the mounting surface of the electronic component A perspective view showing a conventional electronic component

Explanation of symbols

2 Insulator block 3a Second internal electrode 3b First internal electrode 5a Second terminal electrode 5b First terminal electrode 6 Underlayer 7 Electrolytic plating layer

Claims (1)

Insulator block, two or more first terminal electrodes provided on the mounting surface of the insulator block, and substantially the same size as the first terminal electrode on the mounting surface and less than the first terminal electrode A plurality of second terminal electrodes, a first internal electrode that is provided inside the insulator block and that connects all of the first terminal electrodes in a DC manner, and a plurality of the second terminal electrodes. A second internal electrode that is provided inside the insulator block and that connects all of the second terminal electrodes in a DC manner independently of the first terminal electrode, and the first terminal Each of the electrode and the second terminal electrode includes a base layer having electrical conductivity and an electrolytic plating layer covering the base layer, and the size of the base layer of the first terminal electrode is set to the size of the second terminal electrode. Characterized by being smaller than the size of the underlayer Electronic parts that.

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