CN203492264U - Multilayer circuit board for LED display - Google Patents
Multilayer circuit board for LED display Download PDFInfo
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- CN203492264U CN203492264U CN201320545593.0U CN201320545593U CN203492264U CN 203492264 U CN203492264 U CN 203492264U CN 201320545593 U CN201320545593 U CN 201320545593U CN 203492264 U CN203492264 U CN 203492264U
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Abstract
The utility model relates to a multilayer circuit board for LED display, and the circuit board comprises at least one organic-resin insulating layer and at least two metal conducting layers. The organic-resin insulating layer is provided with an electrical-connection hole which contains first conducting metal. Each metal conducting layer is provided with an isolation groove. The metal conducting layers are deposited on the upper and lower surfaces of the organic-resin insulating layer, and are connected with each other through the electrical-connection hole. The metal conducting layers and the first conducting metal are respectively in a metal-layer structure which is formed on the organic-resin insulating layer through sputtering or electroplating depositing. The isolation grooves are respectively in a graphical structure after the photo-etching and etching of the metal conducting layers.
Description
Technical field
The utility model relates to semiconductor applications, relates in particular to a kind of laminated circuit board showing for LED.
Background technology
At traditional LED, show that production development is to today, supporting or the resource of intersection industry has greatly been enriched and is perfect, but adopt FR4 circuit board to be used for doing LED circuit substrate because be limited by traditional product structure, therefore when the resolution of display screen is brought up to a certain degree while being less than 1MM (such as pel spacing), traditional circuit-board is cannot meet small size, high-precision requirement completely.
Utility model content
The purpose of this utility model is to provide a kind of laminated circuit board showing for LED, can overcome the defect in aforementioned conventional structure, can meet small size, high-precision requirement, be particularly useful in the scene of extensive use same class photoelectricity part, applying in same LED display simultaneously.
In first aspect, the utility model provides a kind of laminated circuit board showing for LED, comprising: at least one deck organic resin insulating layer and at least double layer of metal conductive layer;
On described organic resin insulating layer, have electrical connection hole, described electrical connection is filled with the first conducting metal in hole;
On described metal conducting layer, there is isolation channel;
Described in being located at, described at least double layer of metal conductive deposits at least on the upper and lower surface of one deck organic resin insulating layer, by described electrical connection hole, is connected;
Wherein, described metal conducting layer and the first conducting metal are sputter or the metal-layer structure of electroplating deposition on described organic resin insulating layer; Described isolation channel is the patterned structures of described metal conducting layer after photoetching, etching.
Preferably, in the isolation channel of described metal conducting layer, deposit dielectric.
Further preferred, in the isolation channel of described top-level metallic conductive layer, the thickness of the dielectric of deposition is 10%～20% top-level metallic conductive layer thickness.
Further preferred, described top-level metallic conductive layer is separated the LED eutectic pad that forms a plurality of carrying LED wafers by described isolation channel.
Preferably, the bottom of described laminated circuit board has insulating protective layer, and the thickness of described insulating protective layer is 10%～20% underlying metal conductive layer thickness.
Further preferred, on described insulating protective layer, there is pad hole, described pad is filled with the second conducting metal in hole, and described the second conducting metal exposes from described pad hole, forms a plurality of contact electrodes that are electrically connected to external chip or circuit.
Further preferred, described contact electrode is connected with the underlying metal conductive layer of described laminated circuit board, thereby forms being electrically connected between described laminated circuit board and external chip or circuit.
The laminated circuit board showing for LED providing at the utility model, can meet the pel spacing small size of LED display, high-precision requirement, is particularly useful in the scene of extensive use same class photoelectricity part, applying in same LED display simultaneously.
Accompanying drawing explanation
The cross-sectional view of a kind of laminated circuit board showing for LED that Fig. 1 provides for the utility model embodiment.
Embodiment
Below in conjunction with drawings and Examples, the utility model is elaborated.
A kind of laminated circuit board showing for LED of the present utility model, is mainly used in LED display, Ultra fine pitch LED display, super-high density LED display, the just luminous TV of LED, the just luminous monitor of LED, LED video wall, LED indication, LED special lighting etc.
The cross-sectional view of a kind of laminated circuit board showing for LED that Fig. 1 provides for the utility model embodiment.Wherein, the upper surface direction that the top in figure is laminated circuit board, the lower surface direction that the below in figure is laminated circuit board.
As shown in Figure 1, the laminated circuit board showing for LED of the present embodiment, comprising: three layers of organic resin insulating layer 1 and four layers of metal conducting layer 2.
On organic resin insulating layer 1, there is the hole 11 of electrical connection, be electrically connected in hole 11 and be filled with the first conducting metal;
On metal conducting layer 2, there is isolation channel 21, the interior deposition organic resin of isolation channel 21;
Four layers of metal conducting layer 2 are deposited on respectively on the upper and lower surface of three layers of organic resin insulating layer 1, form layer of metal conductive layer 2, one deck organic resin insulating layer 1, the structure of layer of metal conductive layer 2, is realized and being electrically connected to by the first conducting metal in described electrical connection hole 11 between every double layer of metal conductive layer 2 again.
Wherein, metal conducting layer 2 and the first conducting metal are sputter or the metal-layer structure of electroplating deposition on organic resin insulating layer 1; Isolation channel 21 is that metal conducting layer 2 is in the patterned structures after photoetching, etching.
In the isolation channel 21 of the metal conducting layer 2 of top layer, also deposit the dielectric 3 that thickness is 10%～20% top-level metallic conductive layer thickness.The metal conducting layer 2 of top layer is isolated groove 21 and separates, and forms the LED eutectic pad 22 of a plurality of carrying LED wafers.
The bottom of laminated circuit board also deposits insulating protective layer 4, and the thickness of insulating protective layer 4 is the metallic conduction layer thickness of 10%～20% bottom.On insulating protective layer 4, there is pad hole 41, in pad hole 41, be filled with the second conducting metal, and the second conducting metal exposes from described pad hole 41, form a plurality of contact electrodes 42 that are electrically connected to external chip or circuit.
Contact electrode 42 is connected with the metal conducting layer 2 of the bottom of laminated circuit board, thereby forms being electrically connected between laminated circuit board and external chip or circuit.
In the present embodiment, organic resin insulating layer 1 thickness of central core is 200 μ m, obtains the electrical connection hole 11 on the organic resin insulating layer 1 of central core through patterned via hole processing (Laser Drilling); Whole sheetmetal sputter or electroplating deposition, formation is close to the metal conducting layer 2 of central core organic resin insulating layer 1 both sides and has deposited aforesaid electrical connection hole 11, metal material is preferably copper, thickness 30～35 μ m of this double layer of metal conductive layer 2, the metal thickness of filling electrical connection hole 11 is 200 μ m.Double layer of metal conductive layer 2 is carried out respectively to graphical etching, form a plurality of isolation channels 21; Deposition organic resin, forms two-layer organic resin insulating layer 1 in the outside of double layer of metal conductive layer 2, thickness is 50 μ m, and in isolation channel 21, also fills out deposition organic resin; Above-mentioned two-layer organic resin insulating layer 1 is carried out after patterned via hole processing, same obtains third and fourth layer of metal conducting layer 2 in the sputter of the both sides of laminated circuit board or electroplating deposition again, thickness is 30-35 μ m, and the metal thickness that deposition is electrically connected to hole 11 is 50 μ m; Again the metal conducting layer 2 of integrated circuit plate top surface and bottom surface is carried out to graphical etching, afterwards laminated circuit board is cleaned the dielectric 3 of also graphical sputter or electroplating deposition 5～10 μ m.Finally, the dielectric 3 of bottom surface is carried out to graphical treatment and obtain pad hole 41, then sputter electroplating deposition layer of metal forms a plurality of contact electrodes 42 that are electrically connected to external chip or circuit.
In a preferred example, laminated circuit board has following basic parameter feature:
DIELECTRIC CONSTANT ε 3～4
Live width L and the interval S of metal conducting layer are respectively: 20～50 μ m
LED die pads density: 4000/((200X200) μ m
2)
Aperture and pad footpath are respectively: 30～50 μ m,
Insulation resistance: 1.0e+13 Ω .m
The thermal coefficient of expansion CTE:13-19ppm/ ℃ of laminated circuit board
Integrated circuit plate thickness: 0.7～0.8mm
The organic resin layer thickness 200 μ m of substrate center's layer of laminated circuit board, CTE=6-8ppm/ ℃
The utility model embodiment provides a kind of laminated circuit board showing for LED, preparation technology is simple, can realize without artificial automated production, there is good intensity and high accuracy, can meet the pel spacing small size of LED display, high-precision requirement (while being less than 1MM as pel spacing), be particularly useful in the scene of extensive use same class photoelectricity part, applying in same LED display simultaneously.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only embodiment of the present utility model; and be not used in and limit protection range of the present utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (7)
1. the laminated circuit board showing for LED, is characterized in that, described circuit board comprises: at least one deck organic resin insulating layer and at least double layer of metal conductive layer;
On described organic resin insulating layer, have electrical connection hole, described electrical connection is filled with the first conducting metal in hole;
On described metal conducting layer, there is isolation channel;
Described at least double layer of metal conductive layer deposition, on the upper and lower surface of described at least one deck organic resin insulating layer, is connected by described electrical connection hole;
Wherein, described metal conducting layer and the first conducting metal are sputter or the metal-layer structure of electroplating deposition on described organic resin insulating layer; Described isolation channel is the patterned structures of described metal conducting layer after photoetching, etching.
2. laminated circuit board according to claim 1, is characterized in that, in the isolation channel of described metal conducting layer, deposits dielectric.
3. laminated circuit board according to claim 2, is characterized in that, in the isolation channel of described top-level metallic conductive layer, the thickness of the dielectric of deposition is 10%～20% top-level metallic conductive layer thickness.
4. laminated circuit board according to claim 3, is characterized in that, described top-level metallic conductive layer is separated the LED eutectic pad that forms a plurality of carrying LED wafers by described isolation channel.
5. laminated circuit board according to claim 1, is characterized in that, the bottom of described laminated circuit board has insulating protective layer, and the thickness of described insulating protective layer is 10%～20% underlying metal conductive layer thickness.
6. laminated circuit board according to claim 5; it is characterized in that; on described insulating protective layer, there is pad hole; described pad is filled with the second conducting metal in hole; and described the second conducting metal exposes from described pad hole, form a plurality of contact electrodes that are electrically connected to external chip or circuit.
7. laminated circuit board according to claim 6, is characterized in that, described contact electrode is connected with the underlying metal conductive layer of described laminated circuit board, thereby forms being electrically connected between described laminated circuit board and external chip or circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320545593.0U CN203492264U (en) | 2013-09-03 | 2013-09-03 | Multilayer circuit board for LED display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320545593.0U CN203492264U (en) | 2013-09-03 | 2013-09-03 | Multilayer circuit board for LED display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203492264U true CN203492264U (en) | 2014-03-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320545593.0U Expired - Lifetime CN203492264U (en) | 2013-09-03 | 2013-09-03 | Multilayer circuit board for LED display |
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| CN (1) | CN203492264U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023990A (en) * | 2014-04-30 | 2015-11-04 | 严敏 | Method of manufacturing LED laminated circuit board based on inorganic substances |
| CN105023991A (en) * | 2014-04-30 | 2015-11-04 | 程君 | Method of manufacturing LED laminated circuit board based on inorganic substance |
| CN105101682A (en) * | 2014-05-22 | 2015-11-25 | 严敏 | Method for preparing composite LED build-up inorganic circuit board through physical vapor deposition |
| CN105374925A (en) * | 2014-08-22 | 2016-03-02 | 严敏 | Inorganic substance-based LED epitaxy lamination circuit board and preparation method thereof |
| CN105449089A (en) * | 2014-08-07 | 2016-03-30 | 严敏 | Inorganic epitaxy LED display module and manufacturing method thereof |
| CN110364614A (en) * | 2019-06-25 | 2019-10-22 | 东莞阿尔泰显示技术有限公司 | A kind of LED display wiring board and preparation method thereof based on sputtering technology |
| CN113204291A (en) * | 2021-05-18 | 2021-08-03 | 业成科技（成都）有限公司 | Touch control display |
-
2013
- 2013-09-03 CN CN201320545593.0U patent/CN203492264U/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023991A (en) * | 2014-04-30 | 2015-11-04 | 程君 | Method of manufacturing LED laminated circuit board based on inorganic substance |
| CN105023990A (en) * | 2014-04-30 | 2015-11-04 | 严敏 | Method of manufacturing LED laminated circuit board based on inorganic substances |
| CN105023990B (en) * | 2014-04-30 | 2018-03-23 | 环视先进数字显示无锡有限公司 | A kind of manufacture method of the composite LED laminated circuit board based on inorganic matter |
| CN105023991B (en) * | 2014-04-30 | 2018-02-23 | 环视先进数字显示无锡有限公司 | A kind of manufacture method of the LED laminated circuit boards based on inorganic matter |
| CN105101682B (en) * | 2014-05-22 | 2018-02-23 | 环视先进数字显示无锡有限公司 | A kind of method that physical vapor deposition prepares composite LED lamination inorganic circuit plate |
| CN105101682A (en) * | 2014-05-22 | 2015-11-25 | 严敏 | Method for preparing composite LED build-up inorganic circuit board through physical vapor deposition |
| CN105449089B (en) * | 2014-08-07 | 2019-04-05 | 无锡极目科技有限公司 | A kind of inorganic epitaxy LED display module and its manufacturing method |
| CN105449089A (en) * | 2014-08-07 | 2016-03-30 | 严敏 | Inorganic epitaxy LED display module and manufacturing method thereof |
| CN105374925B (en) * | 2014-08-22 | 2018-07-13 | 无锡极目科技有限公司 | A kind of LED epitaxial growth laminated circuit board and preparation method thereof based on inorganic matter |
| CN105374925A (en) * | 2014-08-22 | 2016-03-02 | 严敏 | Inorganic substance-based LED epitaxy lamination circuit board and preparation method thereof |
| CN110364614A (en) * | 2019-06-25 | 2019-10-22 | 东莞阿尔泰显示技术有限公司 | A kind of LED display wiring board and preparation method thereof based on sputtering technology |
| CN113204291A (en) * | 2021-05-18 | 2021-08-03 | 业成科技（成都）有限公司 | Touch control display |
| CN113204291B (en) * | 2021-05-18 | 2022-05-13 | 业成科技（成都）有限公司 | Touch control display |
| TWI784536B (en) * | 2021-05-18 | 2022-11-21 | 大陸商業成科技（成都）有限公司 | Touch display |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161212 Address after: 214100, Jiangsu, Wuxi Province, high road, Binhu District No. 999 (software R & D building) Patentee after: HUANSHI ADVANCED DIGITAL DISPLAY WUXI CO.,LTD. Address before: 100097 room B1F, unit four, building No. three, Far East Road, Haidian District, Beijing Patentee before: Yan Min Patentee before: Cheng Jun Patentee before: Zhou Mingbo |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140319 |