CN105398143A - Making method of ultrafine line printed circuit board - Google Patents
Making method of ultrafine line printed circuit board Download PDFInfo
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- CN105398143A CN105398143A CN201511005711.9A CN201511005711A CN105398143A CN 105398143 A CN105398143 A CN 105398143A CN 201511005711 A CN201511005711 A CN 201511005711A CN 105398143 A CN105398143 A CN 105398143A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/243—Coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- Laminated Bodies (AREA)
Abstract
The invention discloses a making method of an ultrafine line printed circuit board. The method comprises the following steps: 1, melting a glass raw material, and carrying out wire drawing treatment on the molten glass raw material to form fiberglass; 2, impregnating the fiberglass in a glue solution to carry out impregnation treatment, carrying out drying semi-solidification treatment on the impregnated fiberglass, and braiding the semi-solidified fiberglass to form a glass fiber cloth blank; 3, carrying out baking solidification on the glass fiber cloth blank to form a fixed cloth, wherein the content of resin in the fixed cloth does not exceed 30wt%; 4, coating the rough surface of a copper foil with resin by using a coating machine, and semi-solidifying the copper foil coated with the resin to form a resin-coated copper foil; 5, stitching the fixed cloth and the resin-coated copper foil, and carrying out baking solidification to obtain a copper-clad plate; and 6, processing the copper-clad plate in a present mode to make the ultrafine line printed circuit board. The copper-clad plate with good flatness and no grain exposure is made in the above mode, and the ultrafine line printed circuit board made by using the copper-clad plate has the advantages of no short circuit or broken circuit, ion migration resistance, high performances and qualified rate, and reduced making difficulty and cost.
Description
Technical field
The present invention relates to the production technical field of high density interconnect (HDI) printed circuit board (PCB) and copper-clad plate used thereof, particularly relate to a kind of setting cloth that uses to make the method for ultra fine-line printed circuit board (PCB) and copper-clad plate used thereof.
Background technology
Along with microminaturization, the multifunction of electronic product, especially the microminaturization of consumer electronics product, high performance become visible trend, this just requires to realize densification, high performance, ultra fine-line for the printed circuit board (PrintedCircuitBoard, PCB) of electronic product.Putting before this, ultra fine-line pcb board demonstrates advantage.
Base material for the manufacture of pcb board is copper-clad plate (CopperCladLaminate, CCL).At present, at present, the method for production copper-clad plate is: by conventional glass fibers cloth impregnating resin solution, then baking-curing obtains bonding sheet, and obtains copper-clad plate eventually through lamination; Wherein, the conventional glass fibers cloth of electron level plain weave is the reinforcing material of copper-clad plate, this conventional glass fibers cloth is in impregnating resin solution and baking semi-solid preparation process and lamination process, glass fabric is easily subject to the extruding of impregnating equipment and lamination process resin flows and is out of shape, simultaneously, also be difficult to ensure that thorough impregnation fills up the space between the glass of glass fabric in the resin-dipping process of short time, therefore, conventional glass fibers cloth has following shortcoming according to existing method production copper-clad plate:
(1) due to the braiding structure of conventional glass-fiber-fabric itself, its glass fiber is easy to cause producing in gluing, lamination process skew of weft because being subject to small uneven tension force, make serious, the apparent out-of-flatness of glass-fiber-fabric warpage, poor dimensional stability, make further easily to cause the problems such as bow warping because of crimp in lamination process, make copper-clad plate warpage serious;
(2) glass-fiber-fabric after braiding is due to warp and weft interweaving, make yarn and yarn (namely, warp thread and weft yarn, warp thread and warp thread, weft yarn and weft yarn) between there is space, this space is larger and more by what become when skew of weft, glass-fiber-fabric is caused to flood bad, and then have influence on the quality of copper-clad plate, cause the pcb board using this copper-clad plate to make to occur serious Ion transfer (CAF) problem, cause pcb board defective;
(3) glass fibre to be easily subject in lamination process resin flows extruding under HTHP and to be out of shape, even cause lacking resin bed between glass fibre and Copper Foil and occur phenomenons such as " war proclamation lines ", especially slim copper-clad plate reflection is more outstanding, and this kind of war proclamation line phenomenon, in PCB process, making fine rule or superfine wire PCB are had a negative impact, easily occurs the problem of PCB short circuit or open circuit;
(4) when making slim copper-clad plate, above-mentioned defect can be exaggerated, and has a strong impact on the quality of product, therefore uses existing method to make slim copper-clad plate and ultra fine-line printed circuit board, there is difficulty greatly.
For solving the problem, the applicant, through long-term investigation and production practices, have developed a kind of new method and makes slim copper-clad plate and finally make ultra fine-line printed circuit board by it, to improve quality and the performance of ultra fine-line printed circuit board.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of ultra fine-line printed circuit board, to improve quality and the performance of ultra fine-line printed circuit board.
For achieving the above object, technical scheme of the present invention is: the preparation method providing a kind of ultra fine-line printed circuit board, it comprises the steps:
(1) carry out wire drawing process by after frit melting, form glass fiber;
(2) carry out dipping process by described glass fiber immersion glue, carry out the process of oven dry semi-solid preparation after taking-up, then braiding forms glass-fiber-fabric blank;
(3) carry out baking-curing to described glass-fiber-fabric blank, form setting cloth, wherein, in described setting cloth, weight resin content is no more than 30%;
(4) by coating machine coated with resins on the matsurface of Copper Foil, and the Copper Foil semi-solid preparation being coated with resin is formed resin coated copper foil;
(5) by described setting cloth and described resin coated copper foil pressing and baking-curing, copper-clad plate is formed;
(6) described copper-clad plate is made according to existing mode obtain ultra fine-line printed circuit board.
Compared with prior art, in preparation method due to ultra fine-line printed circuit board of the present invention, first dipping process has been carried out to glass fiber, and then the glass fiber after dipping process is carried out the process of oven dry semi-solid preparation, braiding forms glass-fiber-fabric blank again, glass-fiber-fabric blank is carried out baking-curing and forms setting cloth.The setting cloth made in this way, first, because glue has directly carried out surface treatment to glass fiber, the space between glass fibre is filled with in time in setting cloth cloth braiding process, effectively prevent glass fiber simultaneously and occur skew of weft in follow-up braiding processing procedure, ensure that produced setting cloth dimensionally stable; Secondly, due to the dipping process of glass fiber, the setting cloth that last baking-curing is formed there will not be space, apparent smooth, not easily warpage, avoids follow-up glass-fiber-fabric and floods bad problem; Moreover, replaced the starching in the making of traditional glass-fiber-fabric, destarch smoldering by baking-curing, save operation.To sum up, the setting cloth obtained is made by said method, there is dimensionally stable, apparent smooth and void-free feature, therefore this setting cloth is utilized to make in copper-clad plate process, the glass fiber of setting cloth is subject to resin flows and extrudes not yielding, the phenomenon occurring " war proclamation line " between glass fiber and Copper Foil because lacking resin bed can be avoided, the copper-clad plate of making is made to have dimensionally stable, apparent smooth, the not feature of war proclamation line, thus solve the technical barrier causing because of copper-clad plate " war proclamation line " being difficult to make ultra fine-line pcb board, and ultra fine-line pcb board can be avoided to occur the problem of short circuit or open circuit, improve performance and the qualification rate of ultra fine-line pcb board, reduce manufacture difficulty and cost of manufacture, meanwhile, because setting cloth avoids the generation in space, make the resistance to Ion transfer of ultra fine-line pcb board (CAF) made of this, ensure that product quality.
Preferably, in one embodiment, above-mentioned steps (2) comprises the steps: further
(21) at least two described glass fiber are carried out doubling process, form glass filament bundle;
(22) carry out dipping process by described glass filament bundle immersion glue, carry out the process of oven dry semi-solid preparation after dipping process, thus form impregnation organdy; Wherein, described glue is less than 200CPS the viscosity of 25 DEG C, and drying semi-solid preparation treatment temperature is 100-150 DEG C, and drying the semi-solid preparation processing time is 3-5 minute;
(23) twist yarn, warping and braiding process are carried out successively to described impregnation organdy, form described glass-fiber-fabric blank.
In this kind of mode, glass fiber just immerses in glue and carries out dipping process after doubling process, by glue, surface treatment is carried out to glass fiber, therefore in setting cloth braiding process, be filled with the space between glass fiber in time, and can effectively prevent from occurring skew of weft in follow-up braiding processing procedure, ensure that produced setting cloth dimensionally stable; Simultaneously because dipping process just carries out after doubling, the setting cloth that last baking-curing is formed there will not be space and apparent smooth; Therefore, utilize this setting cloth to make the copper-clad plate obtained, there is dimensionally stable, apparent smooth and feature that is not war proclamation line, thus short circuit or open circuit appear in the ultra fine-line pcb board preventing this copper-clad plate from making, improve performance and the qualification rate of ultra fine-line pcb board, reduce manufacture difficulty and cost of manufacture; And setting cloth avoids the generation in space, make the resistance to Ion transfer of pcb board (CAF) made of this, ensure that product quality.
Preferably, in another embodiment, above-mentioned steps (2) comprises the steps: further
(21) at least two described glass fiber are carried out doubling process, form glass filament bundle;
(22) twist yarn and warping process are carried out successively to described glass filament bundle, form warping yarn;
(23) carry out dipping process by described warping yarn immersion glue, carry out the process of oven dry semi-solid preparation after dipping process, thus form impregnation warping yarn; Wherein, described glue is less than 200CPS the viscosity of 25 DEG C, and drying semi-solid preparation treatment temperature is 100-150 DEG C, and drying the semi-solid preparation processing time is 3-5 minute;
(24) braiding process is carried out to described impregnation warping yarn, form described glass-fiber-fabric blank.
In this mode, glass fiber first carries out doubling, twist yarn and warping process and forms warping yarn, then warping yarn is immersed in glue and carry out dipping process, because glue has carried out surface treatment to glass fiber, the space between glass fiber is filled with in time in setting cloth braiding process, and can effectively prevent from occurring skew of weft in follow-up braiding processing procedure, ensure that produced setting cloth dimensionally stable; Simultaneously because dipping process carries out after warping, the setting cloth that last baking-curing is formed there will not be space and apparent smooth, this setting cloth is used to make the copper-clad plate obtained with this, there is dimensionally stable, apparent smooth and feature that is not war proclamation line, thus there is short circuit or open circuit in the ultra fine-line pcb board preventing this copper-clad plate from making, improve performance and the qualification rate of ultra fine-line pcb board, reduce manufacture difficulty and cost of manufacture; And setting cloth avoids the generation in space, make the resistance to Ion transfer of pcb board (CAF) made of this, ensure that product quality.
Preferably, in above-mentioned steps (3), the temperature of baking-curing is 150-200 DEG C, and the time of baking-curing is 1-2 hour.
Preferably, above-mentioned steps (5) comprises the steps: the resin face of described resin coated copper foil and the one or both sides of described setting cloth to carry out roll-in further, after roll-in, baking-curing forms described copper-clad plate, wherein, roll temperature is 80-160 DEG C, rolling pressure is 0.2-2MPa, solidification temperature is 170-200 DEG C, and hardening time is 30-90 minute.
Preferably, above-mentioned steps (5) comprises the steps: that described step (5) comprises the steps: described setting cloth and resin coated copper foil to be cut into measure-alike sheet further further, and the setting cloth being cut into sheet to be folded on the resin face of the resin coated copper foil being cut into sheet and to align, form one deck stock; To at least be positioned in laminating machine and carry out lamination and solidify to form described copper-clad plate by one deck stock, wherein, lamination solidification temperature be 170-200 DEG C, and lamination hardening time is 30-90 minute.
Accompanying drawing explanation
Fig. 1 is the flow chart of preparation method one embodiment of ultra fine-line printed circuit board of the present invention.
Fig. 2 is the flow chart of another embodiment of preparation method of ultra fine-line printed circuit board of the present invention.
Detailed description of the invention
With reference now to accompanying drawing, describe embodiments of the invention, element numbers similar in accompanying drawing represents similar element.
First referring to shown in Fig. 1, in a kind of embodiment of the preparation method of ultra fine-line printed circuit board provided by the present invention, comprise the steps:
Step S11: carry out wire drawing process by after frit melting, forms glass fiber;
Step S12: at least two described glass fiber are carried out doubling process, forms glass filament bundle;
Step S13: described glass filament bundle is immersed in glue and carries out dipping process, carry out the process of oven dry semi-solid preparation after dipping process, thus form impregnation organdy; Wherein, described glue is less than 200CPS the viscosity of 25 DEG C, and drying semi-solid preparation treatment temperature is 100-150 DEG C, and drying the semi-solid preparation processing time is 3-5 minute;
Step S14: carry out twist yarn, warping and braiding process successively to described impregnation organdy, forms glass-fiber-fabric blank;
Step S15: carry out baking-curing to described glass-fiber-fabric blank, forms setting cloth; Wherein, the temperature of baking-curing is 150-200 DEG C, and the time of baking-curing is 1-2 hour, and in described setting cloth, weight resin content is no more than 30%;
Step S16: by coating machine coated with resins on the matsurface of Copper Foil, and the Copper Foil semi-solid preparation being coated with resin is formed resin coated copper foil;
Step S17: by described setting cloth and described resin coated copper foil pressing and baking-curing, forms copper-clad plate;
Step S18: described copper-clad plate is made according to existing mode and obtains ultra fine-line printed circuit board.
In the present embodiment, glass fiber just immerses in glue and carries out dipping process after doubling process, by glue, surface treatment is carried out to glass fiber, therefore in setting cloth cloth braiding process, be filled with the space between glass fibre in time, effectively can prevent from occurring skew of weft in follow-up braiding processing procedure simultaneously, ensure that produced setting cloth dimensionally stable; Simultaneously because dipping process just carries out after doubling, the setting cloth that last baking-curing is formed there will not be space and apparent smooth; Therefore, when utilizing this setting cloth to make copper-clad plate, the glass fiber of setting cloth is subject to resin flows and extrudes not yielding, the phenomenon occurring " war proclamation line " between glass fiber and Copper Foil because lacking resin bed can be avoided, the copper-clad plate of making is made to have dimensionally stable, apparent smooth and feature that is not war proclamation line, thus solve the technical barrier causing because of copper-clad plate " war proclamation line " being difficult to make ultra fine-line pcb board, ultra fine-line pcb board is avoided to occur the problem of short circuit or open circuit, improve performance and the qualification rate of ultra fine-line pcb board, reduce manufacture difficulty and cost of manufacture; And setting cloth avoids the generation in space, make the resistance to Ion transfer of pcb board (CAF) made of this, ensure that product quality.
Below referring to shown in Fig. 2, in the another kind of embodiment of the preparation method of ultra fine-line printed circuit board of the present invention, comprise the steps:
Step S21: carry out wire drawing process by after frit melting, forms glass fiber;
Step S22: at least two described glass fiber are carried out doubling process, forms glass filament bundle;
Step S23: carry out twist yarn and warping process successively to described glass filament bundle, forms warping yarn;
Step S24: described warping yarn is immersed in glue and carries out dipping process, carry out the process of oven dry semi-solid preparation after dipping process, thus form impregnation warping yarn; Wherein, described glue is less than 200CPS the viscosity of 25 DEG C, and drying semi-solid preparation treatment temperature is 100-150 DEG C, and drying the semi-solid preparation processing time is 3-5 minute;
Step S25: braiding process is carried out to described impregnation warping yarn, forms glass-fiber-fabric blank;
Step S26: carry out baking-curing to described glass-fiber-fabric blank, forms setting cloth; Wherein, the temperature of baking-curing is 150-200 DEG C, and the time of baking-curing is 1-2 hour, and in described setting cloth, weight resin content is no more than 30%;
Step S27: by coating machine coated with resins on the matsurface of Copper Foil, and the Copper Foil semi-solid preparation being coated with resin is formed resin coated copper foil;
Step S28: by described setting cloth and described resin coated copper foil pressing and baking-curing, forms copper-clad plate;
Step S29: described copper-clad plate is made according to existing mode and obtains ultra fine-line printed circuit board.
In the present embodiment, glass fiber first carries out doubling, twist yarn and warping process and forms warping yarn, and then carry out dipping process by warping yarn immersion glue, because glue carries out surface treatment to glass fiber, the space between glass fibre is filled with in time in setting cloth cloth braiding process, effectively can prevent from occurring skew of weft in follow-up braiding processing procedure simultaneously, ensure that produced setting cloth dimensionally stable; Simultaneously because dipping process carries out after warping, the setting cloth that last baking-curing is formed there will not be space and apparent smooth; Therefore, when utilizing this setting cloth to make copper-clad plate, the glass fiber of setting cloth is subject to resin flows and extrudes not yielding, the phenomenon occurring " war proclamation line " between glass fiber and Copper Foil because lacking resin bed can be avoided, the copper-clad plate of making is made to have dimensionally stable, apparent smooth and feature that is not war proclamation line, thus solve the technical barrier causing because of copper-clad plate " war proclamation line " being difficult to make ultra fine-line pcb board, ultra fine-line pcb board is avoided to occur the problem of short circuit or open circuit, improve performance and the qualification rate of ultra fine-line pcb board, reduce manufacture difficulty and cost of manufacture; And setting cloth avoids the generation in space, make the resistance to Ion transfer of pcb board (CAF) made of this, ensure that product quality.
Preferably, glue in the present invention can select all kinds of epoxy resin and curing agent solution, also can select non-epoxy, as CE, PI resinoid, liquid crystalline resin etc., the viscosity of glue controls at below 200CPS, and after solidification, the resin content of setting cloth controls in weight ratio less than 30%.
Shown in Fig. 1-2, in the preparation method of above-mentioned two kinds of ultra fine-line printed circuit boards, by described setting cloth and described resin coated copper foil pressing and baking-curing, when forming copper-clad plate, can have with under type:
A kind of is that roll-in is carried out in the resin face of described resin coated copper foil and the one or both sides of described setting cloth, after roll-in, baking-curing forms described copper-clad plate, and wherein, roll temperature is 80-160 DEG C, rolling pressure 0.2-2MPa, solidification temperature is 170-200 DEG C, and hardening time is 30-90 minute.
Another kind of mode is that described setting cloth and resin coated copper foil are cut into measure-alike sheet, and to be folded by the setting cloth being cut into sheet on the resin face of the resin coated copper foil being cut into sheet and to align, and forms one deck stock; To at least be positioned in vacuum laminator and carry out lamination and solidify to form described copper-clad plate by one deck stock, wherein, lamination solidification temperature be 170-200 DEG C, and lamination hardening time is 30-90 minute.
It should be noted that, those skilled in the art it is generally known that: setting cloth is mainly divided into by kind: 7630 setting cloths, 7628 setting cloths, 1500 setting cloths, 2165 setting cloths, 2116 setting cloths, 2113 setting cloths, 2313 setting cloths, 3313 setting cloths, 1080 setting cloths, 106 setting cloths, 1037 setting cloths, 1027 setting cloths etc.Shown in accompanying drawing 1-2, different embodiments use 106 setting cloth being made to ultra fine-line pcb board of the present invention are described respectively.
Embodiment 1:
(as shown in Figure 1) is made by above-mentioned first method, namely, first frit is after wire drawing, doubling, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to glass filament bundle, and toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, and then carry out twist yarn, warping and the specification according to 106 setting cloths carry out braiding process, after toasting solidification in 90 minutes by the baking oven of 170 DEG C after braiding process, obtain 106 setting cloths, in this 106 setting cloth, weight resin content is no more than 30%.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, by the one side of this resin coated copper foil and 106 setting cloths obtained above or two sides roll-in, be cured after roll-in thus obtain dimensionally stable, apparent smooth and void-free copper-clad plate; Wherein, the parameter of roll-in and solidification is as follows: roll temperature 80 DEG C, rolling pressure 2MPa, and after roll-in, baking-curing temperature is 170 DEG C, 90 minutes hardening times.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 2:
(as shown in Figure 1) is made by above-mentioned first method, namely, first frit is after wire drawing, doubling, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to glass filament bundle, and toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, and then carry out twist yarn, warping and the specification according to 106 setting cloths carry out braiding process, after toasting solidification in 90 minutes by the baking oven of 170 DEG C after braiding process, obtain 106 setting cloths, in this 106 setting cloth, weight resin content is no more than 30%.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, by the one side of this resin coated copper foil and 106 setting cloths obtained above or two sides roll-in, be cured after roll-in thus obtain dimensionally stable, apparent smooth and void-free copper-clad plate; Wherein, the parameter of roll-in and solidification is as follows: roll temperature 160 DEG C, rolling pressure 0.2MPa, solidification temperature 200 DEG C, 30 minutes hardening times.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 3:
(as shown in Figure 1) is made by above-mentioned first method, particularly, first frit is after wire drawing, doubling, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to glass filament bundle, then toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, and then carry out twist yarn, warping and the specification according to 106 setting cloths carry out braiding process, after toasting solidification in 90 minutes by the baking oven of 170 DEG C after braiding process, obtain 106 setting cloths, in this 106 setting cloth, weight resin content is no more than 30%.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, by the one side of this resin coated copper foil and 106 setting cloths obtained above or two sides roll-in, be cured after roll-in thus obtain dimensionally stable, apparent smooth and void-free copper-clad plate; Wherein, the parameter of roll-in and solidification is as follows: roll temperature 120 DEG C, rolling pressure 1.5MPa, solidification temperature 185 DEG C, 60 minutes hardening times.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 4:
(as shown in Figure 1) is made by above-mentioned first method, particularly, first frit is after wire drawing, doubling, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to glass filament bundle, then under temperature 100 DEG C of conditions, baking carries out semi-solid preparation process in 5 minutes, and then carry out twist yarn, warping and the specification according to 106 setting cloths carry out braiding process, after toasting solidification in 120 minutes by the baking oven of 150 DEG C after braiding process, obtain 106 setting cloths, in this 106 setting cloth, weight resin content is no more than 30%.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, the setting cloth of above-mentioned making and resin coated copper foil be cut into measure-alike sheet and the two alignd to be stacked in vacuum laminator middle level cured, after lamination solidification, namely obtaining dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of lamination solidification is as follows: lamination solidification temperature 200 DEG C, 30 minutes hardening times of lamination.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 5:
(as shown in Figure 1) is made by above-mentioned first method, namely, frit is after wire drawing, doubling, by the resin adhesive liquid of epoxy resin and curing agent composition, dipping process is carried out to glass filament bundle, and under temperature 120 DEG C of conditions toast 4 minutes, carry out semi-solid preparation process, and then carry out twist yarn, warping and the specification according to 106 setting cloths carry out braiding process, after toasting solidification in 60 minutes by the baking oven of 200 DEG C after braiding process, obtain 106 setting cloths.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, the setting cloth of above-mentioned making and resin coated copper foil be cut into measure-alike sheet and the two alignd to be stacked in vacuum laminator middle level cured, after lamination solidification, namely obtaining dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of lamination solidification is as follows: lamination solidification temperature 170 DEG C, 90 minutes hardening times of lamination.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 6:
(as shown in Figure 1) is made by above-mentioned first method, first, frit is after wire drawing, doubling, by the resin adhesive liquid of epoxy resin and curing agent composition, dipping process is carried out to glass filament bundle, then under temperature 150 DEG C of conditions toast 3 minutes, carry out semi-solid preparation process, and then carry out twist yarn, warping and the specification according to 106 setting cloths carry out braiding process, after toasting solidification in 60 minutes by the baking oven of 200 DEG C after braiding process, obtain 106 setting cloths.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, the setting cloth of above-mentioned making and resin coated copper foil be cut into measure-alike sheet and the two alignd to be stacked in vacuum laminator middle level cured, after lamination solidification, namely obtaining dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of lamination solidification is as follows: lamination solidification temperature 185 DEG C, 60 minutes hardening times of lamination.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 7:
(as shown in Figure 2) is made by above-mentioned second method, first to frit through wire drawing, doubling, twist yarn and warping, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to warping yarn, then toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, and then carry out braiding process according to the specification of 106 setting cloths, after toasting solidification in 60 minutes by the baking oven of 200 DEG C after braiding process, obtain 106 setting cloths.Then, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, by the one side of this resin coated copper foil and 106 setting cloths obtained above or two sides roll-in, be cured after roll-in thus obtain dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of roll-in and solidification is as follows: roll temperature 80 DEG C, rolling pressure 2MPa, solidification temperature 170 DEG C, 90 minutes hardening times.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 8:
(as shown in Figure 2) is made by above-mentioned second method, particularly, first to frit through wire drawing, doubling, twist yarn and warping, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to warping yarn, then toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, and then carry out braiding process according to the specification of 106 setting cloths, after toasting solidification in 60 minutes by the baking oven of 200 DEG C after braiding process, obtain 106 setting cloths.Then, subsequently above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, by the one side of this resin coated copper foil and 106 setting cloths obtained above or two sides roll-in, be cured after roll-in thus obtain dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of roll-in and solidification is as follows: roll temperature 160 DEG C, rolling pressure 0.2MPa, solidification temperature 200 DEG C, 30 minutes hardening times.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 9:
(as shown in Figure 2) is made by above-mentioned second method, namely, frit is after wire drawing, doubling, twist yarn and warping, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to warping yarn, then toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, and then carry out braiding process according to the specification of 106 setting cloths, after toasting solidification in 60 minutes by the baking oven of 200 DEG C after braiding process, obtain 106 setting cloths.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, by the one side of this resin coated copper foil and 106 setting cloths obtained above or two sides roll-in, be cured after roll-in thus obtain dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of roll-in and solidification is as follows: roll temperature 120 DEG C, rolling pressure 1.5MPa, solidification temperature 185 DEG C, 60 minutes hardening times.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 10:
(as shown in Figure 2) is made by above-mentioned second method, particularly, frit is after wire drawing, doubling, twist yarn and warping, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to warping yarn, and toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, and then carry out braiding process according to the specification of 106 setting cloths, after toasting solidification in 90 minutes by the baking oven of 190 DEG C after braiding process, obtain 106 setting cloths.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, the setting cloth of above-mentioned making and resin coated copper foil be cut into measure-alike sheet and the two alignd to be stacked in vacuum laminator middle level cured, after lamination solidification, namely obtaining dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of lamination solidification is as follows: lamination solidification temperature 200 DEG C, 30 minutes hardening times of lamination.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 11:
(as shown in Figure 2) is made by above-mentioned second method, namely, frit is after wire drawing, doubling, twist yarn and warping, by the resin adhesive liquid of the composition such as epoxy resin and curing agent, dipping process is carried out to warping yarn, then toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, then carry out braiding process according to the specification of 106 setting cloths, after toasting solidification in 120 minutes by the baking oven of 150 DEG C after braiding process, obtain 106 setting cloths.Subsequently, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, the setting cloth of above-mentioned making and resin coated copper foil be cut into measure-alike sheet and the two alignd to be stacked in vacuum laminator middle level cured, after lamination solidification, namely obtaining dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of lamination solidification is as follows: lamination solidification temperature 170 DEG C, 90 minutes hardening times of lamination.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Embodiment 12:
(as shown in Figure 2) is made by above-mentioned second method, particularly, first by frit through wire drawing, doubling, twist yarn and warping, by the resin adhesive liquid of epoxy resin and curing agent composition, dipping process is carried out to warping yarn, and toast 3 minutes under temperature 150 DEG C of conditions, carry out semi-solid preparation process, and then carry out braiding process according to the specification of 106 setting cloths, after toasting solidification in 120 minutes by the baking oven of 150 DEG C after braiding process, obtain 106 setting cloths.Then, above-mentioned resin adhesive liquid coating machine is coated on the matsurface of 18 μ electrolytic copper foils, the resin layer thickness formed after Copper Foil coated with resins glue controls within the scope of 10-100 μm, the Copper Foil being coated with resin adhesive liquid being put into temperature is that the baking oven of 150 DEG C-180 DEG C toasts 3-5 minute (that is: semi-solid preparation process), thus forms resin coated copper foil and (be called for short: RCC).Then, the setting cloth of above-mentioned making and resin coated copper foil be cut into measure-alike sheet and the two alignd to be stacked in vacuum laminator middle level cured, after lamination solidification, namely obtaining dimensionally stable, apparent smooth and void-free copper-clad plate; The parameter of lamination solidification is as follows: lamination solidification temperature 185 DEG C, 60 minutes hardening times of lamination.Finally, then by described copper-clad plate according to existing mode make and obtain ultra fine-line printed circuit board.
Comparative example 1: the copper-clad plate that the prepreg produced according to existing conventional fiber glass cloth and conventional method and resin coated copper foil are produced by the mode that roll-in is solidified, then this copper-clad plate is made by existing mode obtain ultra fine-line pcb board.
Comparative example 2: according to the existing common technological process of production, the resin composition solution be made up of epoxy resin, curing agent, flexibilizer etc. be impregnated on 106 model glass fabrics, after in 155 DEG C of baking ovens toast 5 minutes remove solvent obtain prepreg, use individual prepreg, respectively cover 18 μ electrolytic copper foils up and down, lamination in vacuum press, lamination is 190 DEG C, 90 minutes, make copper-clad plate, then this copper-clad plate is made ultra fine-line pcb board by existing mode.
The various performance datas of embodiment of the present invention 1-12 and comparative example 1-2 contrast as shown in table 1 below:
| Embodiment 1-12 | Comparative example 1 | Comparative example 2 | |
| Apparent | Well | Well | Local war proclamation line |
| Flatness | OK | NG | NG |
| Depth of camber (mm) | ＜1.0 | ＞3.0 | ＞3.0 |
| Live width | 25-50 micron | > 50 microns | > 50 microns |
| Line-spacing | 25-50 micron | > 50 microns | > 50 microns |
| CAF (hour) | ＞1000 | 500 | 500 |
Table 1
Known from above-mentioned table 1, make the ultra fine-line pcb board obtained according to method of the present invention, relative to existing pcb board, the performance in apparent flatness, dimensional stability, live width, line-spacing, Ion transfer (CAF) etc. is all obviously better.
In summary, in preparation method due to ultra fine-line printed circuit board of the present invention, first dipping process is carried out to glass fiber, and then the glass fiber after dipping process is carried out the process of oven dry semi-solid preparation, braiding forms glass-fiber-fabric blank again, and glass-fiber-fabric blank is carried out baking-curing and forms setting cloth.The setting cloth made in this way, first, because glue directly carries out surface treatment to glass fiber, the space between glass fibre is filled with in time in setting cloth cloth braiding process, effectively prevent glass fiber simultaneously and occur skew of weft in follow-up braiding processing procedure, ensure that produced setting cloth dimensionally stable; Secondly, due to the dipping process of glass fiber, the setting cloth that last baking-curing is formed there will not be space, apparent smooth, not easily warpage, avoids setting cloth and floods bad problem; Moreover, replaced the starching in the making of traditional glass-fiber-fabric, destarch smoldering by baking-curing, save operation.To sum up, the setting cloth obtained is made by said method, there is dimensionally stable, apparent smooth and void-free feature, therefore this setting cloth is utilized to make in copper-clad plate process, the glass fiber of setting cloth is subject to resin flows and extrudes not yielding, the phenomenon occurring " war proclamation line " between glass fiber and Copper Foil because lacking resin bed can be avoided, the copper-clad plate of making is made to have dimensionally stable, apparent smooth, the not feature of war proclamation line, thus solve the technical barrier causing because of copper-clad plate " war proclamation line " being difficult to make ultra fine-line pcb board, and ultra fine-line pcb board can be avoided to occur the problem of short circuit or open circuit, improve performance and the qualification rate of ultra fine-line pcb board, reduce manufacture difficulty and cost of manufacture, meanwhile, because setting cloth avoids the generation in space, make the resistance to Ion transfer of ultra fine-line pcb board (CAF) made of this, ensure that product quality.
Above disclosedly be only the preferred embodiments of the present invention, certainly can not limit the interest field of the present invention with this, therefore according to the equivalent variations that the present patent application the scope of the claims is done, still belong to the scope that the present invention is contained.
Claims (6)
1. a preparation method for ultra fine-line printed circuit board, is characterized in that, comprises the steps:
(1) carry out wire drawing process by after frit melting, form glass fiber;
(2) carry out dipping process by described glass fiber immersion glue, carry out the process of oven dry semi-solid preparation after taking-up, then braiding forms glass-fiber-fabric blank;
(3) carry out baking-curing to described glass-fiber-fabric blank, form setting cloth, wherein, in described setting cloth, weight resin content is no more than 30%;
(4) by coating machine coated with resins on the matsurface of Copper Foil, and the Copper Foil semi-solid preparation being coated with resin is formed resin coated copper foil;
(5) by described setting cloth and described resin coated copper foil pressing and baking-curing, copper-clad plate is formed;
(6) described copper-clad plate is made according to existing mode obtain ultra fine-line printed circuit board.
2. the preparation method of ultra fine-line printed circuit board as claimed in claim 1, it is characterized in that, described step (2) comprises the steps:
(21) at least two described glass fiber are carried out doubling process, form glass filament bundle;
(22) carry out dipping process by described glass filament bundle immersion glue, carry out the process of oven dry semi-solid preparation after dipping process, thus form impregnation organdy; Wherein, described glue is less than 200CPS the viscosity of 25 DEG C, and drying semi-solid preparation treatment temperature is 100-150 DEG C, and drying the semi-solid preparation processing time is 3-5 minute;
(23) twist yarn, warping and braiding process are carried out successively to described impregnation organdy, form described glass-fiber-fabric blank.
3. the preparation method of ultra fine-line printed circuit board as claimed in claim 1, it is characterized in that, described step (2) comprises the steps:
(21) at least two described glass fiber are carried out doubling process, form glass filament bundle;
(22) twist yarn and warping process are carried out successively to described glass filament bundle, form warping yarn;
(23) carry out dipping process by described warping yarn immersion glue, carry out the process of oven dry semi-solid preparation after dipping process, thus form impregnation warping yarn; Wherein, described glue is less than 200CPS the viscosity of 25 DEG C, and drying semi-solid preparation treatment temperature is 100-150 DEG C, and drying the semi-solid preparation processing time is 3-5 minute;
(24) braiding process is carried out to described impregnation warping yarn, form described glass-fiber-fabric blank.
4. the preparation method of ultra fine-line printed circuit board as claimed in claim 1, it is characterized in that, in described step (3), the temperature of baking-curing is 150-200 DEG C, and the time of baking-curing is 1-2 hour.
5. the preparation method of ultra fine-line printed circuit board as claimed in claim 1, it is characterized in that, described step (5) comprises the steps: the resin face of described resin coated copper foil and the one or both sides of described setting cloth to carry out roll-in further, after roll-in, baking-curing forms described copper-clad plate, wherein, roll temperature is 80-160 DEG C, rolling pressure is 0.2-2MPa, and solidification temperature is 170-200 DEG C, and hardening time is 30-90 minute.
6. the preparation method of ultra fine-line printed circuit board as claimed in claim 1, it is characterized in that, described step (5) comprises the steps: described setting cloth and resin coated copper foil to be cut into measure-alike sheet further, and the setting cloth being cut into sheet to be folded on the resin face of the resin coated copper foil being cut into sheet and to align, form one deck stock; To at least be positioned in laminating machine and carry out lamination and solidify to form described copper-clad plate by one deck stock, wherein, lamination solidification temperature be 170-200 DEG C, and lamination hardening time is 30-90 minute.
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| CN201511005711.9A CN105398143A (en) | 2015-12-25 | 2015-12-25 | Making method of ultrafine line printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856341A (en) * | 2019-11-21 | 2020-02-28 | 颀谱电子科技(南通)有限公司 | Manufacturing process of integrated circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1082125A (en) * | 1992-07-31 | 1994-02-16 | 佐治亚科技研究公司 | Soft multiply predipped yarn, with its product of making and preparation method |
| CN1392758A (en) * | 2001-06-19 | 2003-01-22 | 华通电脑股份有限公司 | Method for forming high density super fine circuiton fibrous substrate |
| CN1747629A (en) * | 2004-09-07 | 2006-03-15 | 南亚电路板股份有限公司 | Production of duoble-face printing circuit board |
| CN101491959A (en) * | 2009-03-04 | 2009-07-29 | 腾辉电子（苏州）有限公司 | Glass fiber fabric base clad copper foil basal plate and production method thereof |
| CN104973791A (en) * | 2015-04-28 | 2015-10-14 | 安徽丹凤集团桐城玻璃纤维有限公司 | Alkali-free glass fiber yarn production process |
-
2015
- 2015-12-25 CN CN201511005711.9A patent/CN105398143A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1082125A (en) * | 1992-07-31 | 1994-02-16 | 佐治亚科技研究公司 | Soft multiply predipped yarn, with its product of making and preparation method |
| CN1392758A (en) * | 2001-06-19 | 2003-01-22 | 华通电脑股份有限公司 | Method for forming high density super fine circuiton fibrous substrate |
| CN1747629A (en) * | 2004-09-07 | 2006-03-15 | 南亚电路板股份有限公司 | Production of duoble-face printing circuit board |
| CN101491959A (en) * | 2009-03-04 | 2009-07-29 | 腾辉电子（苏州）有限公司 | Glass fiber fabric base clad copper foil basal plate and production method thereof |
| CN104973791A (en) * | 2015-04-28 | 2015-10-14 | 安徽丹凤集团桐城玻璃纤维有限公司 | Alkali-free glass fiber yarn production process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856341A (en) * | 2019-11-21 | 2020-02-28 | 颀谱电子科技(南通)有限公司 | Manufacturing process of integrated circuit board |
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Application publication date: 20160316 |