CN206164971U - Circuit board of fast rechargable battery - Google Patents
Circuit board of fast rechargable battery Download PDFInfo
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- CN206164971U CN206164971U CN201621257100.3U CN201621257100U CN206164971U CN 206164971 U CN206164971 U CN 206164971U CN 201621257100 U CN201621257100 U CN 201621257100U CN 206164971 U CN206164971 U CN 206164971U
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Abstract
The utility model discloses a circuit board of fast rechargable battery, including PCB base plate, first stiffening plate and second stiffening plate, the PCB base plate includes kink, first reinforcement portion and second reinforcement portion, the PCB base plate is from last first cover membrane, first copper plate, first copper foil layer, base film, second copper foil layer and the second copper plate of having set gradually under to, the lower surface of the second copper plate of kink covers has the second to cover the membrane, first copper plate with the thickness sum of first copper foil layer is 38 microns, the second copper plate with the thickness sum of second copper foil layer is 38 microns. The thickness of the copper -clad plate of this embodiment adopts 38 microns, can satisfy circuit board of fast rechargable battery's internal resistance requirement after the inspection, owing to reduced the thickness of copper -clad plate, fixes the intensity of a stiffening plate with the intensifier circuit board respectively at the both ends of circuit board to satisfy the strength requirement of circuit board.
Description
Technical field
This utility model is related to PCB production technical fields, more particularly to a kind of circuit board of quick charging battery.
Background technology
Circuit board is PCB (Printed Circuit Board, printed circuit board), the thickness meeting of the copper-clad plate of its substrate
The internal resistance of circuit board is affected, wherein, copper-clad plate includes copper foil layer and the copper plate electroplated on copper foil layer, and the thickness of copper-clad plate refers to
Copper foil layer and copper plate thickness sum.
The PCB of different application, the requirement of the thickness of its copper-clad plate to substrate differ, and the thickness of existing copper-clad plate is general
At 0.05 millimeter between 3.2 mm of thickness.The thickness of copper-clad plate is excessive, can undoubtedly increase production cost, the thickness of copper-clad plate
Too small, the intensity of circuit board cannot meet requirement.
The internal resistance requirement of the circuit board of quick charging battery is higher, and which requires that the thickness of copper-clad plate is sufficiently small, but existing minimum
The copper-clad plate of thickness, cannot still meet the internal resistance requirement of the circuit board of quick charging battery when as copper-clad plate is 0.05.
Utility model content
The purpose of this utility model is to provide a kind of circuit board of quick charging battery, solves above technical problem.
It is that, up to this purpose, this utility model is employed the following technical solutions：
A kind of circuit board of quick charging battery, including PCB substrate, the first stiffening plate and the second stiffening plate；The PCB substrate bag
Include the kink in the middle of the PCB substrate, and the first reinforcement part positioned at the PCB substrate two ends and the second reinforcement
Portion, the kink, first reinforcement part and second reinforcement part are integrally formed；First stiffening plate is fixed on described
The upper surface of the first reinforcement part；Second stiffening plate is fixed on the upper surface of second reinforcement part；
The PCB substrate be disposed with from top to bottom the first coverlay, the first copper plate, the first copper foil layer, basement membrane,
Two copper foil layers and the second copper plate；The lower surface in the pad pasting area of second copper plate is coated with the second coverlay；Described second
Other regions for not covering second coverlay of the lower surface of copper plate are coated with solder mask；Wherein, second plating
The pad pasting area of layers of copper is the lower surface of second copper plate of the kink；
The thickness sum of first copper plate and first copper foil layer is 38 microns；Second copper plate and described
The thickness sum of the second copper foil layer is 38 microns.
Preferably, the thickness of first copper plate and second copper plate is equal, is 13 microns；
The thickness of first copper foil layer and second copper foil layer is equal, is 25 microns.
Preferably, first copper foil layer and second copper foil layer are electrolytic copper foil；
The upper surface of first copper foil layer is electroplate with first copper plate；The lower surface plating of second copper foil layer
There is second copper plate.
Preferably, first coverlay includes the first cover layer and the first adhesive linkage；Second coverlay includes
Second cover layer and the second adhesive linkage；
The thickness of first cover layer and second cover layer is equal, is 12.5 microns；Described first glues
The thickness for connecing layer and second adhesive linkage is equal, is 30 microns.
Preferably, first stiffening plate includes FR4 stiffening plates and the 3rd adhesive linkage；Second stiffening plate includes that PI is mended
Strong plate and the 4th adhesive linkage；
The thickness of the FR4 stiffening plates is 600 microns；The thickness of the PI stiffening plates is 200 microns；
The thickness of the 3rd adhesive linkage and the 4th adhesive linkage is equal, is 25 microns.
Preferably, first adhesive linkage, the thickness of second adhesive linkage are 30 microns.
Preferably, the basement membrane is adopted as PI films, and its thickness is 20 microns.
Preferably, the thickness of the solder mask is 30 microns.
The beneficial effects of the utility model：The thickness of the copper-clad plate of the present embodiment adopts 38 microns, can meet Jing after inspection
The internal resistance requirement of the circuit board of quick charging battery, the thickness due to reducing copper-clad plate, therefore fixed at the both ends of circuit board respectively
One stiffening plate with the intensity of intensifier circuit plate, to meet the intensity requirement of circuit board.
Description of the drawings
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or accompanying drawing to be used is briefly described needed for description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, before creative labor is not paid
Put, can be with according to these other accompanying drawings of accompanying drawings acquisition.
A kind of overlooking structure figure of the circuit board of quick charging battery that Fig. 1 is provided for this utility model embodiment.
A kind of side block diagram of the circuit board of quick charging battery that Fig. 2 is provided for this utility model embodiment.
In figure：
10th, PCB substrate；11st, kink；12nd, the first reinforcement part；13rd, the second reinforcement part；14th, basement membrane；151st, the first Copper Foil
Layer；152nd, the second copper foil layer；161st, the first copper plate；162nd, the second copper plate；1621st, pad pasting area；17th, the first coverlay；
171st, the first cover layer；172nd, the first adhesive linkage；18th, the second coverlay；181st, the second cover layer；182nd, the second bonding
Layer；19th, welding resistance oil；20th, the first stiffening plate；21st, FR4 stiffening plates；22nd, the 3rd adhesive linkage；30th, the second stiffening plate；31st, PI reinforcement
Plate；32nd, the 4th adhesive linkage.
Specific embodiment
To enable utility model purpose of the present utility model, feature, advantage more obvious and understandable, below will knot
The accompanying drawing in this utility model embodiment is closed, the technical scheme in this utility model embodiment is clearly and completely described,
Obviously, the embodiments described below are only a part of embodiment of this utility model, and not all embodiment.Based on this reality
With the embodiment in new, it is all other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of this utility model protection.
The technical solution of the utility model is further illustrated below in conjunction with the accompanying drawings and by specific embodiment.
Refer to Fig. 1, a kind of plan structure of the circuit board of quick charging battery that Fig. 1 is provided for this utility model embodiment
Figure.
The circuit board includes PCB substrate 10, the first stiffening plate 20 and the second stiffening plate 30.
So that I takes charge of the circuit board of a quick charging battery of production as an example, the PCB substrate 10 of the circuit board includes the present embodiment
First reinforcement part 12, kink 11 and the second reinforcement part 13, kink 11, the first reinforcement part 12 and 13 one of the second reinforcement part into
Type.
It should be noted that the circuit board described in this utility model embodiment has a kink 11, the kink 11 is in
Bending, but should not be construed as to restriction of the present utility model, kink 11 can also be other shapes, and which is on circuit board
One without the need for reinforcement part.
Specifically, the first stiffening plate 20 is fixed on the upper surface of the first reinforcement part 12；Second stiffening plate 30 is fixed on second
The upper surface of reinforcement part 13.
A kind of side-looking knot of the circuit board of the quick charging battery provided for this utility model embodiment please continue to refer to Fig. 2, Fig. 2
Composition.
PCB substrate 10 be disposed with from top to bottom the first coverlay 17, the first copper plate 161, the first copper foil layer 151,
Basement membrane 14, the second copper foil layer 152 and the second copper plate 162；The lower surface of second copper plate 162 in 11 region of kink, that is, paste
The lower surface in film area 1621 is coated with the second coverlay 18；The lower surface of the second copper plate 162 is not covered with the second coverlay
18 other regions are coated with solder mask 19.
More specifically, the thickness sum of the first copper plate 161 and the first copper foil layer 151 is 38 microns；Second copper plate 162
Thickness sum with the second copper foil layer 152 is 38 microns.After testing, when the thickness of copper-clad plate need to be 38 microns, its internal resistance
The internal resistance demand of quick charging battery can be met, and after stiffening plate carries out reinforcement, not interfere with the intensity of circuit board, therefore copper-clad plate
Thickness be a preferably embodiment from 38 microns, wherein, copper-clad plate refers to copper plate and the copper foil layer two-layer.
Specifically, the thickness of the first copper plate 161 and the second copper plate 162 is equal, is 13 microns；First copper foil layer
151 and second copper foil layer 152 thickness it is equal, be 25 microns.
In the present embodiment, the first copper foil layer 151 and the second copper foil layer 152 are electrolytic copper foil.The upper table of the first copper foil layer 151
Face is electroplate with the first copper plate 161；The lower surface of the second copper foil layer 152 is electroplate with the second copper plate 162.
Using the copper plate and copper foil layer of same shape, processing can be facilitated；The thickness of copper-clad plate is defined as 38 microns
When, after testing, when the thickness of copper plate is between 13-20, the electrical property of PCB substrate 10 is preferable.
Optimum, the thickness of the first copper plate 161 and the second copper plate 162 is 13 microns.Because copper plate is to pass through
It is plated on copper foil layer, therefore thickness of coated copper layer selects excessive, can increase the time of plating, affect production efficiency, Jing tests is right
Than the thickness of the first copper plate 161 and the second copper plate 162 is 13 microns, compares the first copper plate 161 and the second copper plate
162 thickness is 20 microns, and electroplating efficiency improves 30%, and production efficiency is significantly improved.
Specifically, the first coverlay 17 includes the first cover layer 171 and the first adhesive linkage 172；Second coverlay 18 is wrapped
Include the second cover layer 181 and the second adhesive linkage 182.
The thickness of the first cover layer 171 and the second cover layer 181 is equal, is 12.5 microns；First adhesive linkage 172
It is equal with the thickness of the second adhesive linkage 182, it is 30 microns.
First cover layer 171 and the second cover layer 181 adopt PI (polyimide, polyimides) film, using phase
The coverlay of stack pile same size, conveniently can produce, and reduce the wrong probability of patch.
Preferably, the first stiffening plate 20 includes FR4 stiffening plates 21 and the 3rd adhesive linkage 22；Second stiffening plate 30 includes that PI is mended
Strong plate 31 and the 4th adhesive linkage 32.Wherein, the thickness of FR4 stiffening plates 21 is 600 microns；The thickness of PI stiffening plates 31 is 200 micro-
Rice；The thickness of the 3rd adhesive linkage 22 and the 4th adhesive linkage 32 is equal, is 25 microns.
Zones of different on the circuit board of battery needs the stiffening plate of different qualities to carry out reinforcement, and in the present embodiment, FR4 is mended
Strong plate 21 also known as glass mat, its durability is good, curved intensity is good；31 price of PI stiffening plates is high, but its flame resistance is good.FR4 is mended
The thickness of strong plate 21 is 600 microns, and the thickness of PI stiffening plates 31 is 200 microns, is just met for the intensity and size requirements of product.
Preferably, basement membrane 14 is adopted as PI films, and its thickness is 20 microns.
Preferably, the thickness of the solder mask is 30 microns.
In description of the present utility model, it is to be understood that term " on ", the orientation of the instruction such as D score or position relationship be
Based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than indicate
Or the device or element of hint indication with specific orientation, with specific azimuth configuration and operation, therefore must not be understood that
It is to restriction of the present utility model.It should be noted that explanation or description of the present embodiment to orientation are mainly with Fig. 2 as base
It is accurate.
The above, above example only to illustrate the technical solution of the utility model, rather than a limitation；Although ginseng
This utility model is described in detail according to previous embodiment, it will be understood by those within the art that：Which is still
Technical scheme described in foregoing embodiments can be modified, or equivalent is carried out to which part technical characteristic and replace
Change；And these modifications or replacement, do not make the essence of appropriate technical solution depart from each embodiment technical scheme of this utility model
Spirit and scope.
Claims (8)
1. a kind of circuit board of quick charging battery, it is characterised in that including PCB substrate, the first stiffening plate and the second stiffening plate；It is described
PCB substrate includes the kink in the middle of the PCB substrate, and the first reinforcement part positioned at the PCB substrate two ends and
Second reinforcement part, the kink, first reinforcement part and second reinforcement part are integrally formed；First stiffening plate is solid
Due to the upper surface of first reinforcement part；Second stiffening plate is fixed on the upper surface of second reinforcement part；
The PCB substrate is disposed with the first coverlay, the first copper plate, the first copper foil layer, basement membrane, the second bronze medal from top to bottom
Layers of foil and the second copper plate；The lower surface in the pad pasting area of second copper plate is coated with the second coverlay；Second copper facing
Other regions for not covering second coverlay of the lower surface of layer are coated with solder mask；Wherein, second copper plate
Pad pasting area be the kink second copper plate lower surface；
The thickness sum of first copper plate and first copper foil layer is 38 microns；Second copper plate and described second
The thickness sum of copper foil layer is 38 microns.
2. circuit board according to claim 1, it is characterised in that the thickness of first copper plate and second copper plate
Degree is equal, is 13 microns；
The thickness of first copper foil layer and second copper foil layer is equal, is 25 microns.
3. circuit board according to claim 2, it is characterised in that first copper foil layer and second copper foil layer are electricity
Solution Copper Foil；
The upper surface of first copper foil layer is electroplate with first copper plate；The lower surface of second copper foil layer is electroplated
State the second copper plate.
4. circuit board according to claim 3, it is characterised in that first coverlay includes the first cover layer and
One adhesive linkage；Second coverlay includes the second cover layer and the second adhesive linkage；
The thickness of first cover layer and second cover layer is equal, is 12.5 microns；First adhesive linkage
It is equal with the thickness of second adhesive linkage, it is 30 microns.
5. circuit board according to claim 4, it is characterised in that first stiffening plate includes FR4 stiffening plates and the 3rd
Adhesive linkage；Second stiffening plate includes PI stiffening plates and the 4th adhesive linkage；
The thickness of the FR4 stiffening plates is 600 microns；The thickness of the PI stiffening plates is 200 microns；
The thickness of the 3rd adhesive linkage and the 4th adhesive linkage is equal, is 25 microns.
6. circuit board according to claim 5, it is characterised in that first adhesive linkage, the thickness of second adhesive linkage
Degree is 30 microns.
7. circuit board according to claim 6, it is characterised in that the basement membrane is adopted as PI films, its thickness are 20 microns.
8. circuit board according to claim 7, it is characterised in that the thickness of the solder mask is 30 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621257100.3U CN206164971U (en) | 2016-11-18 | 2016-11-18 | Circuit board of fast rechargable battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621257100.3U CN206164971U (en) | 2016-11-18 | 2016-11-18 | Circuit board of fast rechargable battery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206164971U true CN206164971U (en) | 2017-05-10 |
Family
ID=58660722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621257100.3U Active CN206164971U (en) | 2016-11-18 | 2016-11-18 | Circuit board of fast rechargable battery |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206164971U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106341942A (en) * | 2016-11-18 | 2017-01-18 | 东莞市五株电子科技有限公司 | Circuit board of quick-charging battery |
-
2016
- 2016-11-18 CN CN201621257100.3U patent/CN206164971U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106341942A (en) * | 2016-11-18 | 2017-01-18 | 东莞市五株电子科技有限公司 | Circuit board of quick-charging battery |
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