CN220292257U - Primary and secondary printed wiring board structure convenient to equipment - Google Patents
Primary and secondary printed wiring board structure convenient to equipment Download PDFInfo
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- CN220292257U CN220292257U CN202321644868.6U CN202321644868U CN220292257U CN 220292257 U CN220292257 U CN 220292257U CN 202321644868 U CN202321644868 U CN 202321644868U CN 220292257 U CN220292257 U CN 220292257U
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 43
- 229910052737 gold Inorganic materials 0.000 claims description 43
- 239000010931 gold Substances 0.000 claims description 43
- 239000002131 composite material Substances 0.000 claims 5
- 238000012423 maintenance Methods 0.000 abstract description 7
- 238000013461 design Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model provides a primary-secondary printed circuit board structure convenient to assemble, relates to the technical field of printed circuit boards, and aims to solve the problem that the existing printed circuit board is difficult to replace and maintain, and comprises a mother board and a daughter board which are the same in thickness; the mother board comprises a first golden finger-medium layer, a first medium-hard board layer and a second golden finger-medium layer which are the same in thickness and are arranged from top to bottom, and the daughter board comprises a second medium-hard board layer, a third golden finger-medium layer and a third medium-hard board layer which are the same in thickness and are arranged from top to bottom; the mother board is of a groove structure, and the concave part of the mother board is positioned on the first medium-hard board layer; the sub-board is of a protruding structure, and the protruding part of the sub-board is positioned on the third golden finger-medium layer; the mother board and the daughter board are detachably connected through the concave part and the convex part. The device has the advantage of convenient disassembly and maintenance.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a primary-secondary printed circuit board structure convenient to assemble.
Background
A printed wiring board is a carrier for electronic components that can be connected together and designed into a circuit. Printed wiring boards are typically constructed of fiberglass or plastic substrates, copper foil, and chemical materials on which circuit patterns are fabricated using chemical etching and printing techniques.
Along with the continuous upgrading and updating of intelligent terminal penetrating products, the demands for printed circuit boards are increasing. However, the conventional printed wiring board has problems that the replacement work is difficult and the replacement process is time-consuming during the maintenance or replacement. Therefore, the conventional circuit board structure design has little maintenance opportunity at present, however, the cost for replacing the whole printed circuit board assembly due to the local fault of the printed circuit board is high, and the purchase period is long.
In order to improve the assembly performance of the printed circuit board and the maintenance and replacement cost of the printed circuit board, and well solve the problems of the traditional printed circuit board structure, a mother-son printed circuit board structure which adopts the combination of a mother-son board and a son board and is convenient to assemble can be adopted.
Disclosure of Invention
The utility model aims to provide a primary-secondary printed circuit board structure convenient to assemble, and aims to solve the problem that the existing printed circuit board is difficult to replace and maintain.
The embodiment of the utility model is realized by the following technical scheme:
a kind of mother-son printed wiring board structure easy to assemble, including mother board and daughter board with the same thickness;
the motherboard comprises a first golden finger-medium layer, a first medium-hard board layer and a second golden finger-medium layer which are the same in thickness and are arranged from top to bottom, and the daughter board comprises a second medium-hard board layer, a third golden finger-medium layer and a third medium-hard board layer which are the same in thickness and are arranged from top to bottom; the mother board is of a groove structure, and a concave part of the mother board is positioned on the first medium-hard board layer; the daughter board is of a protruding structure, and the protruding part of the daughter board is positioned on the third golden finger-medium layer;
the shapes and the sizes of the concave part and the convex part are matched, and the mother board and the daughter board are detachably connected through the concave part and the convex part;
one end of the first golden finger-medium layer is connected with one end of the second medium-hard plate layer, one end of the first medium-hard plate layer is connected with one end of the third golden finger-medium layer, and one end of the second golden finger-medium layer is connected with one end of the third medium-hard plate layer.
Preferably, the first golden finger-medium layer comprises two mother board golden finger layers and a mother board golden finger medium layer; the mother board golden finger medium layer is clamped between the two mother board golden finger layers, and the thicknesses of the two mother board golden finger layers and the mother board golden finger medium layer are the same.
Preferably, the second dielectric-hard board layer comprises a hard board layer and two dielectric layers which are sequentially arranged from top to bottom, and the thickness of the hard board layer is the same as that of the two dielectric layers.
Preferably, the second gold finger-medium layer comprises two mother board gold finger layers and a mother board gold finger medium layer; the mother board golden finger medium layer is clamped between the two mother board golden finger layers, and the thicknesses of the two mother board golden finger layers and the mother board golden finger medium layer are the same.
Preferably, the third dielectric-hard board layer is sequentially provided with two sub-board dielectric layers and two sub-board hard board layers from top to bottom, and the thicknesses of the sub-board hard board layers and the two sub-board dielectric layers are the same.
Preferably, the first medium-hard board layer comprises two mother board medium layers and one mother board hard board layer, the mother board hard board layer is sandwiched between the two mother board medium layers, and the thicknesses of the two mother board medium layers and the thickness of the one mother board hard board layer are the same.
Preferably, the third gold finger-medium layer comprises two sub-board gold finger layers and a sub-board gold finger medium layer; the sub-board golden finger medium layer is clamped between the two sub-board golden finger layers, and the thicknesses of the two sub-board golden finger layers and the sub-board golden finger medium layer are the same.
The technical scheme of the embodiment of the utility model has at least the following advantages and beneficial effects:
the utility model sets the printed circuit board as a detachable sub-board and a detachable motherboard, which solves the problems of difficult and long time consumption of the existing printed circuit board replacement and maintenance procedures;
the maintainability of the printed circuit board is improved under the assembly structure, and the defect that the printed circuit board cannot be maintained and replaced in the prior art under the assembly structure can be solved;
according to the assembly structure, the local operation is more convenient during maintenance and replacement, and the maintenance and replacement cost can be reduced;
the design of the daughter board and the mother board can be perfectly spliced, each layer is accurately connected, and the accurate and stable function of the printed circuit board is ensured;
the utility model has simple structure, easy assembly of the daughter board and the mother board, simple assembly operation, low manufacturing cost and easy implementation and popularization.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a daughter board and a mother board of a mother-son printed circuit board structure which are assembled conveniently according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a motherboard structure of a mother-son printed circuit board structure convenient for assembly according to an embodiment of the present utility model;
fig. 3 is a schematic view of a sub-board structure of a mother-son printed circuit board structure for easy assembly according to an embodiment of the present utility model;
icon: 101-motherboard, 101A-first gold finger-dielectric layer, 101B-first dielectric-stiff layer, 101C-second gold finger-dielectric layer, 102-sub-board, 102A-second dielectric-stiff layer, 102B-third gold finger-dielectric layer, 102C-third dielectric-stiff layer.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
In the description of the present utility model, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate an azimuth or a positional relationship based on that shown in the drawings, or an azimuth or a positional relationship in which a product of the application is conventionally put in use, it is merely for convenience of describing the present utility model and simplifying the description, and it is not indicated or implied that the referred device or element must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Example 1
The present embodiment provides a mother-son printed circuit board structure which is convenient to assemble, referring to fig. 1, and includes a mother board 101 and a daughter board 102 with the same thickness;
the motherboard 101 includes a first gold finger-dielectric layer 101A, a first dielectric-hard board layer 101B, and a second gold finger-dielectric layer 101C that are the same in thickness and disposed from top to bottom, and the daughter board 102 includes a second dielectric-hard board layer 102A, a third gold finger-dielectric layer 102B, and a third dielectric-hard board layer 102C that are the same in thickness and disposed from top to bottom; the motherboard 101 has a groove structure, and a concave part of the motherboard 101 is located in the first medium-hard board layer 101B; the daughter board 102 is in a protruding structure, and the protruding part of the daughter board 102 is located on the third gold finger-dielectric layer 102B;
the shapes and the sizes of the concave part and the convex part are matched, and the mother board 101 and the daughter board 102 are detachably connected through the concave part and the convex part;
one end of the first gold finger-dielectric layer 101A is connected with one end of the second dielectric-hard board layer 102A, one end of the first dielectric-hard board layer 101B is connected with one end of the third gold finger-dielectric layer 102B, and one end of the second gold finger-dielectric layer 101C is connected with one end of the third dielectric-hard board layer 102C.
The basic working principle of this embodiment is as follows:
firstly, the embodiment realizes rapid and convenient assembly through the detachable assembly design of the design daughter board 102 and the mother board 101; meanwhile, the structure of the first golden finger-medium layer 101A and the second golden finger-medium layer 101C under the design of the motherboard 101 realizes a layered golden finger clamping groove structure, the arrangement of the two layers is further based on the fact that a concave part for butt joint with the daughter board 102 is realized on the first medium-hard board layer 101B, and a golden finger structure with a convex structure is arranged on the third golden finger-medium layer 102B in the middle of the daughter board 102 and is connected with the concave structure in a matching mode.
Under the design of the structure of the mother-son printed circuit board convenient for assembly, the thickness of each layer is equal, so that the contact positions of the mother board 101 and the daughter board 102 are perfectly matched with each other after the connection, and the normal operation of the printed circuit board is ensured.
Example 2
The specific configuration of the motherboard 101 and the daughter board 102 will be further described with reference to fig. 1 to 3 based on the technical solution of embodiment 1.
As a preferred solution of this embodiment, the first gold finger-dielectric layer 101A includes two mother gold finger layers and a mother gold finger dielectric layer; the mother board golden finger medium layer is clamped between the two mother board golden finger layers, and the thicknesses of the two mother board golden finger layers and the mother board golden finger medium layer are the same.
Accordingly, the second dielectric-hard board layer 102A includes a hard board layer and two dielectric layers sequentially disposed from top to bottom, where the thickness of the hard board layer is the same as that of the two dielectric layers.
On the other hand, the second gold finger-dielectric layer 101C includes two mother gold finger layers and a mother gold finger dielectric layer; the mother board golden finger medium layer is clamped between the two mother board golden finger layers, and the thicknesses of the two mother board golden finger layers and the mother board golden finger medium layer are the same.
Correspondingly, the third dielectric-hard board layer 102C is formed by sequentially arranging two sub-board dielectric layers and two sub-board hard board layers from top to bottom, and the thicknesses of the sub-board hard board layers and the two sub-board dielectric layers are the same.
Finally, the first medium-hard board layer 101B includes two mother board medium layers and one mother board hard board layer, where the mother board hard board layer is sandwiched between the two mother board medium layers, and the thicknesses of the two mother board medium layers and the one mother board hard board layer are the same.
Correspondingly, the third gold finger-dielectric layer 102B includes two sub-board gold finger layers and a sub-board gold finger dielectric layer; the sub-board golden finger medium layer is clamped between the two sub-board golden finger layers, and the thicknesses of the two sub-board golden finger layers and the sub-board golden finger medium layer are the same.
Based on this embodiment, the working principle of the secondary-primary printed circuit board structure that is convenient to assemble is further described below:
this embodiment further illustrates the hierarchical structure of the motherboard 101 and the daughter board 102, and it is known that the thickness of all the layers is completely consistent after assembly, and that the following splicing can be achieved from the layer contact:
firstly, the uppermost mother board golden finger layer, the mother board golden finger medium layer and the lowermost mother board golden finger layer of the first golden finger-medium layer 101A are respectively contacted with a hard board layer and two medium layers which are sequentially arranged from top to bottom of the second medium-hard board layer 102A;
next, the uppermost motherboard golden finger layer, the motherboard golden finger dielectric layer and the lowermost motherboard golden finger layer of the second golden finger-dielectric layer 101C are respectively connected with the two dielectric layers and the hard board layer of the third dielectric-hard board layer 102C sequentially from top to bottom.
Finally, the motherboard dielectric layer above the first dielectric-hard board layer 101B, the motherboard hard board layer below the first dielectric-hard board layer 101B, and the motherboard dielectric layer below the first dielectric-hard board layer are respectively in contact with the sub-board gold finger layer, the sub-board gold finger dielectric layer above the third gold finger-dielectric layer 102B, and the sub-board gold finger layer below the third gold finger-dielectric layer.
That is, since the motherboard 101 of this embodiment reserves the card slot, that is, the concave portion, the first gold finger-dielectric layer 101A and the second gold finger-dielectric layer 101C of the motherboard can be exposed, and the gold finger layer of the motherboard located below in the first gold finger-dielectric layer 101A of the motherboard 101 contacts the gold finger layer of the motherboard above the third gold finger-dielectric layer 102B of the motherboard 102 to conduct, and meanwhile, the gold finger layer of the motherboard above the second gold finger-dielectric layer 101C of the motherboard 101 contacts the gold finger layer of the motherboard below the third gold finger-dielectric layer 102B of the motherboard 102 to conduct, thereby forming, in combination, a mother-son printed circuit board structure that conducts with each other through the contact of the motherboard 102 and the motherboard 101.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (7)
1. Primary and secondary printed wiring board structure convenient to equipment, its characterized in that: comprises a mother board (101) and a daughter board (102) with the same thickness;
the motherboard (101) comprises a first golden finger-medium layer (101A), a first medium-hard board layer (101B) and a second golden finger-medium layer (101C) which are the same in thickness and are arranged from top to bottom, and the daughter board (102) comprises a second medium-hard board layer (102A), a third golden finger-medium layer (102B) and a third medium-hard board layer (102C) which are the same in thickness and are arranged from top to bottom; the mother board (101) is of a groove structure, and a concave part of the mother board (101) is positioned on the first medium-hard board layer (101B); the daughter board (102) is of a protruding structure, and the protruding part of the daughter board (102) is positioned on the third golden finger-medium layer (102B);
the shapes and the sizes of the concave part and the convex part are matched, and the mother board (101) and the daughter board (102) are detachably connected through the concave part and the convex part;
one end of the first golden finger-medium layer (101A) is connected with one end of the second medium-hard board layer (102A), one end of the first medium-hard board layer (101B) is connected with one end of the third golden finger-medium layer (102B), and one end of the second golden finger-medium layer (101C) is connected with one end of the third medium-hard board layer (102C).
2. The composite printed wiring board structure of claim 1, wherein: the first golden finger-medium layer (101A) comprises two mother board golden finger layers and a mother board golden finger medium layer; the mother board golden finger medium layer is clamped between the two mother board golden finger layers, and the thicknesses of the two mother board golden finger layers and the mother board golden finger medium layer are the same.
3. The composite printed wiring board structure of claim 2, wherein: the second medium-hard board layer (102A) comprises a hard board layer and two medium layers which are sequentially arranged from top to bottom, and the thickness of the hard board layer is the same as that of the two medium layers.
4. The composite printed wiring board structure of claim 1, wherein: the second golden finger-medium layer (101C) comprises two mother board golden finger layers and a mother board golden finger medium layer; the mother board golden finger medium layer is clamped between the two mother board golden finger layers, and the thicknesses of the two mother board golden finger layers and the mother board golden finger medium layer are the same.
5. The composite printed wiring board structure of claim 4, wherein: the third medium-hard board layer (102C) is sequentially provided with two sub-board medium layers and two sub-board hard board layers from top to bottom, and the thicknesses of the sub-board hard board layers and the two sub-board medium layers are the same.
6. The composite printed wiring board structure of claim 1, wherein: the first medium-hard board layer (101B) comprises two mother board medium layers and one mother board hard board layer, the mother board hard board layer is clamped between the two mother board medium layers, and the thicknesses of the two mother board medium layers and the thickness of the one mother board hard board layer are the same.
7. The mother-son printed wiring board structure for easy assembly of claim 6, wherein said third gold finger-dielectric layer (102B) comprises two sub-board gold finger layers and a sub-board gold finger dielectric layer; the sub-board golden finger medium layer is clamped between the two sub-board golden finger layers, and the thicknesses of the two sub-board golden finger layers and the sub-board golden finger medium layer are the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321644868.6U CN220292257U (en) | 2023-06-25 | 2023-06-25 | Primary and secondary printed wiring board structure convenient to equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321644868.6U CN220292257U (en) | 2023-06-25 | 2023-06-25 | Primary and secondary printed wiring board structure convenient to equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220292257U true CN220292257U (en) | 2024-01-02 |
Family
ID=89332632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321644868.6U Active CN220292257U (en) | 2023-06-25 | 2023-06-25 | Primary and secondary printed wiring board structure convenient to equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220292257U (en) |
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2023
- 2023-06-25 CN CN202321644868.6U patent/CN220292257U/en active Active
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