CN210590892U - Low-dielectric double-sided flexible copper-clad plate - Google Patents
Low-dielectric double-sided flexible copper-clad plate Download PDFInfo
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- CN210590892U CN210590892U CN201921327671.3U CN201921327671U CN210590892U CN 210590892 U CN210590892 U CN 210590892U CN 201921327671 U CN201921327671 U CN 201921327671U CN 210590892 U CN210590892 U CN 210590892U
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Abstract
The utility model discloses a two-sided flexible copper-clad plate of low dielectric relates to circuit substrate technical field. The low-dielectric double-sided flexible copper-clad plate adopts a low-dielectric film as a base film in the middle, and polyimide layers, the low-dielectric film layers and conducting layers are symmetrically distributed on two sides of the base film in sequence; the low-dielectric double-sided flexible copper-clad plate has good flexibility, the dielectric constant is low by 2.6-3.0(10GHz), and the dielectric loss is low by 0.005(10 GHz); simultaneously the utility model discloses a heat resistance, wet heat resistance are good, are the two-sided flexible copper-clad plate of low dielectric high frequency that can flexible printed circuit board used under the high frequency condition.
Description
Technical Field
The utility model relates to a circuit substrate technical field specifically is a two-sided flexible copper-clad plate of low dielectric.
Background
The Flexible copper clad laminate material is a processing base material of a Flexible Printed Circuit board (Flexible Printed Circuit board/FPC). The polyimide film (PI film) is bonded with a copper foil by a certain method, and a flexible printed circuit board (FPC) can be formed after subsequent processing procedures.
In recent years, under the sudden and violent promotion of the printed circuit board industry, the copper-clad plate industry in continental China also makes great progress, and the copper-clad plate industry in China is synchronously developed in aspects of capacity, quality, specification, variety and the like. Development and innovation of copper-clad plates in China are developed for 20 years, the copper-clad plates which account for more than 50% of global yield are now used in large countries, and the technical level is in advanced ranks in the world.
According to the research report of the national copper clad plate material industry in 2015-2020 issued authoritatively, the electronic complete machine is shown to be a system, a device and an instrument, such as a signal generator, a program control machine, a transmitter, a mobile phone, a television, a fixed telephone and the like, which are used for aerospace, aviation, automatic control, measurement, industrial equipment control and modern communication signal generation, transmission and reception, and to be a computer, a printer, a copier, a scanner and the like which are not opened at work, and to be an electronic watch, an electronic toy, a lamp and the like of various grades. All electronic machines are composed of many electronic components, devices, circuits and casings, and most of the components are mounted on a printed circuit board by number. Therefore, the important position and the function of the copper-clad plate in all electronic complete machine products and the whole electronic information industry can be easily realized. The copper-clad plate is vividly reputed as the 'foundation' of a building in the electronic information industry by experts and is not exaggerated.
With the arrival of the 5G era, flexible copper clad laminates with low dielectric properties are more and more favored. The nationalization of the basic materials of the high-frequency technology is an important part of the whole electronic material industry chain and is an important material for the development of the 5G industry.
According to studies, signals are transmitted in a high frequency band, loss and distortion of signals mainly occur on a surface of a wiring, that is, a portion where a metal layer is in contact with an insulating layer, and thus materials for high frequency high speed devices mainly solve a dielectric constant of the insulating layer in the portion where the metal layer is in contact with the wiring. The structure of the copper clad plate material generally used for low dielectric constant at present is a copper foil-low dielectric constant epoxy adhesive-base film structure, and the structure needs to use a large amount of low dielectric constant materials to meet the low transmission consumption requirement required by high-frequency materials, and has poor heat resistance and humidity resistance.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a softness can be good, and dielectric constant hangs down 2.6-3.0(10GHz), and dielectric loss is less than 0.005(10GHz), and heat resistance, damp-proof heat ability are good, can be applicable to the two-sided flexible copper-clad plate of low dielectric high frequency that flexible printed circuit board used under the high frequency condition.
In order to achieve the above object, the utility model provides a following technical scheme:
a low-dielectric double-sided flexible copper-clad plate comprises:
a first low dielectric thin film layer;
the second thermoplastic polyimide film layer is positioned above the first low dielectric film layer;
the third thermoplastic polyimide film layer is positioned below the first low dielectric film layer;
the fourth low dielectric film layer is positioned above the second thermoplastic polyimide film layer;
the fifth low dielectric film layer is positioned below the third thermoplastic polyimide film layer;
the sixth conducting layer is positioned above the fourth low dielectric film layer;
and the seventh conducting layer is positioned below the fifth low dielectric film layer.
In a preferred embodiment of the present invention, the thickness of the first low dielectric thin film layer is 30 to 50 μm.
In a preferred embodiment of the present invention, the thickness of the second thermoplastic polyimide film layer and the thickness of the third thermoplastic polyimide film layer are both 3 to 7 μm, and more preferably 4 to 6 μm.
In a preferred embodiment of the present invention, the thickness of each of the fourth low dielectric thin film layer and the fifth low dielectric thin film layer is 10 to 30 μm, and more preferably 20 to 30 μm.
In a preferred embodiment of the present invention, the thickness of the sixth conductive layer and the thickness of the seventh conductive layer are both 9 to 70 μm, and more preferably 12 to 70 μm.
As a preferred embodiment of the present invention, the first low dielectric thin film layer includes, but is not limited to, a thin film layer having low dielectric properties such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
As a preferred embodiment of the present invention, the fourth low dielectric thin film layer includes, but is not limited to, a thin film layer having low dielectric properties such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
As a preferred embodiment of the present invention, the fifth low dielectric thin film layer includes, but is not limited to, a thin film layer having low dielectric properties such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
As a preferred embodiment of the present invention, the sixth conductive layer and the seventh conductive layer are metal foils.
As a preferred embodiment of the present invention, the metal foil includes, but is not limited to, a copper foil or an aluminum foil.
As a preferred embodiment of the present invention, the material of the copper foil includes but is not limited to rolled copper or electrolytic copper.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a low dielectric double-sided flexible copper-clad plate, the middle adopts low dielectric film as the base film, and polyimide layer, low dielectric film layer, conducting layer are distributed symmetrically in order on both sides of the base film; the low-dielectric double-sided flexible copper-clad plate has good flexibility, the dielectric constant is low by 2.6-3.0(10GHz), and the dielectric loss is low by 0.005(10 GHz);
2. the utility model discloses a heat resistance, wet heat resistance are good, are the two-sided flexible copper-clad plate of low dielectric high frequency that can flexible printed circuit board used under the high frequency condition.
Drawings
Fig. 1 is the structural schematic diagram of the low dielectric double-sided flexible copper-clad plate of the utility model.
In the figure: 1-a first low dielectric film layer, 2-a second thermoplastic polyimide film layer, 3-a third thermoplastic polyimide film layer, 4-a fourth low dielectric film layer, 5-a fifth low dielectric film layer, 6-a sixth conducting layer and 7-a seventh conducting layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The present invention is directed to the meaning of "up and down" which means that when the reader is facing the drawings, the upper side of the view shown by the reader is up, and the lower side of the reader is down, rather than the specific limitation of the mechanism of the present invention.
In this document, relational terms such as first, second, third, fourth, fifth, sixth, seventh, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
A low-dielectric double-sided flexible copper-clad plate comprises:
a first low dielectric thin film layer;
the second thermoplastic polyimide film layer is positioned above the first low dielectric film layer;
the third thermoplastic polyimide film layer is positioned below the first low dielectric film layer;
the fourth low dielectric film layer is positioned above the second thermoplastic polyimide film layer;
the fifth low dielectric film layer is positioned below the third thermoplastic polyimide film layer;
the sixth conducting layer is positioned above the fourth low dielectric film layer;
and the seventh conducting layer is positioned below the fifth low dielectric film layer.
In one embodiment, the first low dielectric thin film layer has a thickness of 30 to 50 μm.
In one embodiment, the thickness of the second thermoplastic polyimide film layer and the third thermoplastic polyimide film layer are each 3 to 7 μm.
In a preferred embodiment, the thickness of the second thermoplastic polyimide film layer and the third thermoplastic polyimide film layer are both 4 to 6 μm.
In one embodiment, the thickness of each of the fourth and fifth low dielectric thin film layers is 10 to 30 μm.
In a preferred embodiment, the thickness of each of the fourth low dielectric thin film layer and the fifth low dielectric thin film layer is 20 to 30 μm.
In one embodiment, the thickness of the sixth conductive layer and the seventh conductive layer is 9 to 70 μm each.
In a preferred embodiment, the thickness of the sixth conductive layer and the seventh conductive layer is 12 to 70 μm each.
In one embodiment, the first low dielectric thin film layer includes, but is not limited to, a thin film layer having low dielectric properties such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
In one embodiment, the fourth low dielectric thin film layer includes, but is not limited to, a thin film layer having low dielectric properties such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
In one embodiment, the fifth low dielectric thin film layer includes, but is not limited to, a thin film layer having low dielectric properties such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
In one embodiment, the sixth conductive layer and the seventh conductive layer are both metal foils.
In one embodiment, the metal foil includes, but is not limited to, copper foil or aluminum foil.
In one embodiment, the material of the copper foil includes, but is not limited to, rolled copper or electrolytic copper.
The utility model discloses the two-sided flexible copper-clad plate of low dielectric, the compliance is good, and dielectric constant is low 2.6-3.0(10GHz), and dielectric loss is low 0.005(10 GHz). The reason is that the low dielectric film is adopted as the base film in the middle, the polyimide layer, the low dielectric film layer and the conducting layer are symmetrically distributed on the two sides of the base film in sequence, the 7-layer structure adopts films with low dielectric properties such as MPI, LCP and the like with the thicknesses of 20-30 mu m and 30-50 mu m, the thermoplastic polyimide film with the thickness of 3-7 mu m is matched to form three layers of low dielectric films, and the thermoplastic polyimide is used for bonding between the low dielectric films, so that the total thickness of the low dielectric films can be increased, the integral dielectric constant and dielectric loss of the product are reduced, the signal transmission quality of a terminal product is improved, the single-layer thickness of the low dielectric films is reduced, and the manufacturing difficulty of the low dielectric films is reduced; in addition, the loss and the distortion of signal transmission loss signal mainly take place at the circuit surface, the position that conducting layer and insulating layer contacted promptly, the utility model discloses a structure adopts the conducting layer to contact with low dielectric film layer, can improve the quality of signal transmission in high frequency stage, reduces transmission loss.
The utility model discloses two-sided flexible copper-clad plate of low dielectric has better heat resistance, wet heat resistance, is the two-sided flexible copper-clad plate of low dielectric high frequency that can flexible printed circuit board used under the high frequency condition. The reason is that the thermoplastic polyimide film layer with the thickness of 3-7 mu m is used for bonding between the three low dielectric films with the thicknesses of 20-30 mu m and 30-50 mu m, so that the bonding stability is better, and the structure formed by the thermoplastic polyimide film layer has more layers, so that the heat resistance and the damp-heat resistance are better; the gross thickness of low dielectric film is big and the conducting layer contacts with low dielectric film layer and makes the utility model discloses the two-sided flexible copper-clad plate of low dielectric can be flexible printed circuit board use under the high frequency condition.
The present invention will be described in detail with reference to the following examples.
Example 1
A low-dielectric double-sided flexible copper-clad plate is shown in figure 1 and comprises:
a first low dielectric thin film layer 1;
the second thermoplastic polyimide film layer 2 is positioned above the first low dielectric film layer 1;
a third thermoplastic polyimide film layer 3 located below the first low dielectric film layer 1;
a fourth low dielectric thin film layer 4 located above the second thermoplastic polyimide thin film layer 2;
a fifth low dielectric thin film layer 5 located below the third thermoplastic polyimide thin film layer 3;
a sixth conductive layer 6 located above the fourth low dielectric thin film layer 4;
and a seventh conductive layer 7 located below the fifth low dielectric thin film layer 5.
The first low dielectric thin film layer includes, but is not limited to, a thin film layer having a low dielectric property such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
The fourth low dielectric thin film layer includes, but is not limited to, a thin film layer having a low dielectric property such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
The fifth low dielectric thin film layer includes, but is not limited to, a thin film layer having a low dielectric property such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
And the sixth conducting layer and the seventh conducting layer are both metal foils.
The metal foil includes, but is not limited to, copper foil or aluminum foil.
The copper foil is made of, but not limited to, rolled copper or electrolytic copper.
The utility model discloses the two-sided flexible copper-clad plate of low dielectric adopts low dielectric film as the base film in the middle of, the base film both sides are following the orderly symmetrical polyimide layer that distributes, low dielectric film layer, conducting layer, adopt this 7 layer structures, three-layer low dielectric film has, use thermoplasticity polyimide to bond between low dielectric film, can increase low dielectric film's gross thickness, reduce the holistic dielectric constant of product and dielectric loss, improve the signal transmission quality of terminal product, also reduced low dielectric film's individual layer thickness simultaneously, reduced low dielectric film's the preparation degree of difficulty; in addition, the loss and the distortion of signal transmission loss signal mainly take place at the circuit surface, the position that conducting layer and insulating layer contacted promptly, the utility model discloses a structure adopts the conducting layer to contact with low dielectric film layer, can improve the quality of signal transmission in high frequency stage, reduces transmission loss.
Example 2
A low-dielectric double-sided flexible copper-clad plate is shown in figure 1 and comprises:
a first low dielectric thin film layer 1;
the second thermoplastic polyimide film layer 2 is positioned above the first low dielectric film layer 1;
a third thermoplastic polyimide film layer 3 located below the first low dielectric film layer 1;
a fourth low dielectric thin film layer 4 located above the second thermoplastic polyimide thin film layer 2;
a fifth low dielectric thin film layer 5 located below the third thermoplastic polyimide thin film layer 3;
a sixth conductive layer 6 located above the fourth low dielectric thin film layer 4;
and a seventh conductive layer 7 located below the fifth low dielectric thin film layer 5.
The thickness of the first low dielectric film layer is 30-50 μm.
The thickness of the second thermoplastic polyimide film layer and the thickness of the third thermoplastic polyimide film layer are both 3-7 mu m.
The thickness of the fourth low dielectric film layer and the thickness of the fifth low dielectric film layer are both 10-30 mu m.
The thickness of the sixth conducting layer and the seventh conducting layer is 9-70 mu m.
The first low dielectric thin film layer includes, but is not limited to, a thin film layer having a low dielectric property such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
The fourth low dielectric thin film layer includes, but is not limited to, a thin film layer having a low dielectric property such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
The fifth low dielectric thin film layer includes, but is not limited to, a thin film layer having a low dielectric property such as a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer (MPI), or a liquid crystal polymer Layer (LCP).
And the sixth conducting layer and the seventh conducting layer are both metal foils.
The metal foil includes, but is not limited to, copper foil or aluminum foil.
The copper foil is made of, but not limited to, rolled copper or electrolytic copper.
Example 3
A low-dielectric double-sided flexible copper-clad plate is shown in figure 1 and comprises:
a first low dielectric thin film layer 1;
the second thermoplastic polyimide film layer 2 is positioned above the first low dielectric film layer 1;
a third thermoplastic polyimide film layer 3 located below the first low dielectric film layer 1;
a fourth low dielectric thin film layer 4 located above the second thermoplastic polyimide thin film layer 2;
a fifth low dielectric thin film layer 5 located below the third thermoplastic polyimide thin film layer 3;
a sixth conductive layer 6 located above the fourth low dielectric thin film layer 4;
and a seventh conductive layer 7 located below the fifth low dielectric thin film layer 5.
The thickness of the first low dielectric film layer is 30 μm.
The thickness of the second thermoplastic polyimide film layer and the thickness of the third thermoplastic polyimide film layer are both 3 micrometers. The thickness of the fourth low dielectric thin film layer and the thickness of the fifth low dielectric thin film layer are both 10 micrometers.
The thickness of the sixth conducting layer and the thickness of the seventh conducting layer are both 9 micrometers.
The first low dielectric film layer is a thermosetting polyimide film layer.
The fourth low dielectric film layer is a thermosetting polyimide film layer.
The fifth low dielectric film layer is a thermosetting polyimide film layer.
And the sixth conducting layer and the seventh conducting layer are both copper foils.
The copper foil is made of rolled copper.
Example 4
A low-dielectric double-sided flexible copper-clad plate is shown in figure 1 and comprises:
a first low dielectric thin film layer 1;
the second thermoplastic polyimide film layer 2 is positioned above the first low dielectric film layer 1;
a third thermoplastic polyimide film layer 3 located below the first low dielectric film layer 1;
a fourth low dielectric thin film layer 4 located above the second thermoplastic polyimide thin film layer 2;
a fifth low dielectric thin film layer 5 located below the third thermoplastic polyimide thin film layer 3;
a sixth conductive layer 6 located above the fourth low dielectric thin film layer 4;
and a seventh conductive layer 7 located below the fifth low dielectric thin film layer 5.
The thickness of the first low dielectric film layer is 40 μm.
The thickness of the second thermoplastic polyimide film layer and the thickness of the third thermoplastic polyimide film layer are both 5 micrometers.
The thickness of the fourth low dielectric thin film layer and the thickness of the fifth low dielectric thin film layer are both 20 micrometers.
The thickness of the sixth conducting layer and the thickness of the seventh conducting layer are both 40 mu m.
The first low dielectric film layer is a modified thermosetting polyimide film layer.
The fourth low dielectric film layer is a liquid crystal polymer layer.
The fifth low dielectric film layer is a thermosetting polyimide film layer.
And the sixth conducting layer and the seventh conducting layer are both aluminum foils.
Example 5
A low-dielectric double-sided flexible copper-clad plate is shown in figure 1 and comprises:
a first low dielectric thin film layer 1;
the second thermoplastic polyimide film layer 2 is positioned above the first low dielectric film layer 1;
a third thermoplastic polyimide film layer 3 located below the first low dielectric film layer 1;
a fourth low dielectric thin film layer 4 located above the second thermoplastic polyimide thin film layer 2;
a fifth low dielectric thin film layer 5 located below the third thermoplastic polyimide thin film layer 3;
a sixth conductive layer 6 located above the fourth low dielectric thin film layer 4;
and a seventh conductive layer 7 located below the fifth low dielectric thin film layer 5.
The thickness of the first low dielectric film layer is 50 μm.
The thickness of the second thermoplastic polyimide film layer and the thickness of the third thermoplastic polyimide film layer are both 7 micrometers.
The thickness of the fourth low dielectric thin film layer and the thickness of the fifth low dielectric thin film layer are both 30 micrometers.
The thickness of the sixth conducting layer and the thickness of the seventh conducting layer are both 70 mu m.
The first low dielectric thin film layer is a liquid crystal polymer Layer (LCP).
The fourth low dielectric film layer is a modified thermosetting polyimide film layer.
The fifth low dielectric thin film layer is a liquid crystal polymer Layer (LCP).
And the sixth conducting layer and the seventh conducting layer are both copper foils.
The copper foil is made of electrolytic copper.
The utility model discloses a low dielectric double-sided flexible copper-clad plate, the middle adopts low dielectric film as the base film, and polyimide layer, low dielectric film layer, conducting layer are distributed symmetrically in order on both sides of the base film; the low-dielectric double-sided flexible copper-clad plate has good flexibility, the dielectric constant is low by 2.6-3.0(10GHz), and the dielectric loss is low by 0.005(10 GHz); simultaneously the utility model discloses a heat resistance, wet heat resistance are good, are the two-sided flexible copper-clad plate of low dielectric high frequency that can flexible printed circuit board used under the high frequency condition.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a low dielectric two-sided flexible copper-clad plate which characterized in that includes:
a first low dielectric thin film layer;
the second thermoplastic polyimide film layer is positioned above the first low dielectric film layer;
the third thermoplastic polyimide film layer is positioned below the first low dielectric film layer;
the fourth low dielectric film layer is positioned above the second thermoplastic polyimide film layer;
the fifth low dielectric film layer is positioned below the third thermoplastic polyimide film layer;
the sixth conducting layer is positioned above the fourth low dielectric film layer;
and the seventh conducting layer is positioned below the fifth low dielectric film layer.
2. The low-dielectric double-sided flexible copper-clad plate according to claim 1, wherein the thickness of the first low-dielectric thin film layer is 30 to 50 μm.
3. The low-dielectric double-sided flexible copper-clad plate according to claim 1, wherein the thickness of the second thermoplastic polyimide film layer and the thickness of the third thermoplastic polyimide film layer are both 3 to 7 μm.
4. The low-dielectric double-sided flexible copper-clad plate according to claim 1, wherein the thickness of the fourth low-dielectric thin film layer and the thickness of the fifth low-dielectric thin film layer are both 10 to 30 μm.
5. The low-dielectric double-sided flexible copper-clad plate according to claim 1, wherein the thickness of the sixth conductive layer and the thickness of the seventh conductive layer are both 9 to 70 μm.
6. The low-dielectric double-sided flexible copper-clad plate according to claim 1, wherein the first low-dielectric thin film layer comprises but is not limited to a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer or a liquid crystal high polymer layer.
7. The low-dielectric double-sided flexible copper-clad plate according to claim 1, wherein the fourth low-dielectric thin film layer comprises but is not limited to a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer or a liquid crystal high polymer layer.
8. The low-dielectric double-sided flexible copper-clad plate according to claim 1, wherein the fifth low-dielectric thin film layer comprises but is not limited to a thermosetting polyimide thin film layer, a modified thermosetting polyimide thin film layer or a liquid crystal high polymer layer.
9. The low-dielectric double-sided flexible copper-clad plate according to claim 1, wherein the sixth conductive layer and the seventh conductive layer are both metal foils.
10. The low-dielectric double-sided flexible copper-clad plate according to claim 9, wherein the metal foil includes but is not limited to copper foil or aluminum foil.
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| CN201921327671.3U CN210590892U (en) | 2019-08-16 | 2019-08-16 | Low-dielectric double-sided flexible copper-clad plate |
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