CN105636333A - Flexible printed circuit board and mobile terminal - Google Patents
Flexible printed circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105636333A CN105636333A CN201511025696.4A CN201511025696A CN105636333A CN 105636333 A CN105636333 A CN 105636333A CN 201511025696 A CN201511025696 A CN 201511025696A CN 105636333 A CN105636333 A CN 105636333A
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- China
- Prior art keywords
- edge
- layer
- copper foil
- stiffening plate
- tectum
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a flexible printed circuit. The flexible printed circuit comprises a dielectric layer. Copper foil layers, sticking layers and covering layers are successively arranged on two sides of the dielectric layer from inside to outside. A reinforcing plate is arranged on the covering layer on one of two sides of the dielectric layer. The flexible printed circuit board comprises a bending region. A windowing region is arranged on the copper foil layer, the sticking layer, the covering layer and the reinforcing plate on one side, where reinforcing plate is arranged, of the bending region. The edge of the covering layer extends towards the interior of the windowing region and exceeds edges of the cooper foil layer, the sticking layer and the reinforcing layer of the windowing region. The edge of the reinforcing plate and the edge of the copper foil layer are not in the same vertical panel. Thus, dispersion of stress concentration points in the bending region is achieved and technical effects of reduction in risks of easy tearing of edges of the bending region and improvement of anti-bending ability of the flexible printed circuit are achieved.
Description
Technical field
The present invention relates to flexible PCB, say more specifically, what improvement related to is a kind of flexible PCB adding fixing structure and mobile terminal of bending edges of regions.
Background technology
Due to the characteristic that FPC (FlexiblePrintedCircuitBoard, flexible PCB) has softness, can bend, very it is applicable to being applied on mobile phone between some component often repeatedly bent. For flexible PCB, being respectively arranged with copper foil layer, adhesive-layer and tectum on the two sides of medium layer, two copper foil layers electroplate the upper and lower surface at medium layer respectively, and each tectum is all covered on corresponding copper foil layer by respective adhesive-layer.
Corresponding on flexible PCB, some special region just needs particularly soft, is easy to repeatedly bend. In existing flexible circuit board design, the general mode adopting one side to walk line, namely slices off the copper sheet of remainder layer, also removes the tectum covering copper sheet surface simultaneously, thus reaches regional area thinner thickness, is easy to the object that in use bends. Slicing off and be positioned at copper foil layer above medium layer, adhesive-layer and tectum, form the bending region of flexible PCB, this process also claims to window process, to subtract the thickness in thin flexible PCB bending region, makes it to be easier to bend.
But, after windowing, the edge section cutting copper just creates the step of a similar height, between bending region is inside and outside, the thickness of flexible PCB changes suddenly, make the edge section in this bending region easily produce stress in bending process to concentrate, thus cause flexible PCB to be fractureed, considerably increase the risk that this position flexible PCB is easily torn on the contrary.
Therefore, prior art still haves much room for improvement and develops.
Summary of the invention
It is an object of the invention to provide a kind of flexible PCB that can reduce the risk that bending edges of regions position is easily torn.
Another object of the present invention is to provide a kind of mobile terminal adopting above-mentioned flexible PCB.
In order to realize above-mentioned purpose, embodiment of the present invention provides following technical scheme:
The present invention provides a kind of flexible PCB, comprise medium layer, described medium layer both sides are provided with copper foil layer from inside to outside successively, adhesive-layer and tectum, the described tectum of one of described medium layer both sides is provided with stiffening plate, described flexible PCB comprises bending region, described bending region is provided with the described copper foil layer of the side of stiffening plate, described adhesive-layer, described tectum and described stiffening plate are provided with windowed regions, the edge of described tectum extends to described windowed regions inside, exceed the described copper foil layer of described windowed regions, the edge of adhesive-layer and described stiffening plate, the edge of described stiffening plate and the edge of described copper foil layer be not on a perpendicular.
Wherein, described copper foil layer and the edge of described adhesive-layer is exceeded at the edge of the described stiffening plate of described windowed regions.
Wherein, the edge of described stiffening plate is exceeded at the described copper foil layer of described windowed regions and the edge of described adhesive-layer.
Wherein, at the edge of described windowed regions, arbitrarily horizontal throw between the two is minimum is 0.3mm for described copper foil layer, described adhesive-layer, described tectum and described stiffening plate.
Wherein, described stiffening plate is metal alloy sheet material.
Wherein, described stiffening plate thickness is more than 0.1mm.
Wherein, described tectum comprises polyimide (PI) film and polyethylene terephthalate (PET) film.
Wherein, the thickness of described copper foil layer is 5��50 ��m
Wherein, described stiffening plate is fixed on described tectum by melting welding or viscose glue.
The present invention also provides a kind of mobile terminal, wherein, comprises any one flexible PCB above-mentioned.
Embodiment of the present invention tool has the following advantages or useful effect:
The flexible PCB of the present invention, adopt at copper foil layer, adhesive-layer, tectum and stiffening plate uplifting window, to form bending region, and ensure described copper foil layer, described adhesive-layer, described tectum and described stiffening plate bending region edge not in the method for a plane, achieve the focal point of stress in dispersion bending region, the technique effect of the anti-crooking ability reach the risk reducing bending edges of regions position and being easily torn, strengthening flexible PCB.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, it is briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of first embodiment of the invention;
Fig. 2 is the structural representation of second embodiment of the invention;
Fig. 3 is the structural representation of third embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only the present invention's part embodiment, instead of whole embodiments. Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment one
Referring to Fig. 1, flexible PCB comprises medium layer 110, copper foil layer 120 (with 130), tectum 160 (with 170) and stiffening plate 180. Copper foil layer 120 and copper foil layer 130 are separately positioned on the upper and lower surface of medium layer 110, are also coated with tectum 160 (with 170) in copper foil layer 120 (with 130) outside. Copper foil layer 120 (with 130) is connected by adhesive-layer 140 (with 150) with tectum 160 (with 170). The outside of tectum 160 is also provided with stiffening plate 180, and the effect of stiffening plate 180 is to realize the local strengthening function to flexible PCB. Described flexible PCB comprise bending region, namely the bending region of described flexible PCB through process of windowing, need to slice off to be positioned at and bends copper foil layer 120 above region medium layer 110, adhesive-layer 140, tectum 160 and stiffening plate 180. In other words, the side windowed described in and be arranged on and be provided with stiffening plate. Wherein, the edge of described tectum 160 internally extends extension edge 161 to windowed regions 190, exceedes and the edge of covering copper layers of foil 120 and adhesive-layer 140. Same, the edge of described stiffening plate 180 also internally extends extension edge 181 to windowed regions 190, exceedes and the edge of tectum 160. Described copper foil layer 120, tectum 160 and stiffening plate 180 form a staged so that the edge of the bending copper foil layer 120 in region, tectum 160 and stiffening plate 180 staggers not in a perpendicular.
In the present embodiment, by copper foil layer 120 edge in bending region, tectum 160 edge and stiffening plate 180 edge are formed a staged, so that the height fall of Ge Tong edge and stiffening plate edge has a buffering, disperse the stress point concentrated, so that be unlikely to, when bending flexible PCB, the flexible PCB that fractures, enhance the anti-crooking ability of flexible PCB.
Further, in the preferred implementation of the flexible PCB bending region edge strengthening structure of the present invention, the extension edge 161 of described tectum 160 can exceed copper foil layer 120 and adhesive-layer 140 more than edge 0.3mm, such as 0.4mm, 0.5mm, 0.6mm etc.; With reason, the extension edge 181 of described stiffening plate 180 can exceed more than the edge 0.3mm of tectum 160, such as 0.4mm, 0.5mm, 0.6mm's etc. If the extension edge 181 of the extension edge 161 of tectum 160 and stiffening plate 180 is too long, also the bending performance of flexible PCB can be affected, therefore the upper limit of the size at the edge that the extension edge 161 of tectum 160 exceeds the size at copper foil layer 120 and adhesive-layer 140 edge, the extension edge 181 of described stiffening plate 180 can exceed tectum 160, depending on the size of windowed regions 190.
Further, copper foil layer 120 (with 130) is that 5��50 ��m of calendering Copper Foils or electrolytic copper foil form by thickness; Tectum 160 (with 170) generally by thickness be polyimide (PI) film of 5��50 ��m, polyethylene terephthalate (PET) film forms, it is bonded on copper foil layer by adhesive-layer, then realizes mortise by hot pressing. Described stiffening plate 180 can use the nonmetal plate of certain intensity, or use the stainless steel plate of more than thickness 0.1mm, aluminium sheet and have the metal alloy plate of certain intensity. Described stiffening plate 180 can be fixed on described tectum 160 by melting welding or viscose glue.
Apparent, in the present embodiment, it is also possible to the edge arranging described copper foil layer 120 internally extends extension edge to windowed regions 190, exceed the extension edge 161 of tectum 160. Same, the extension edge 161 of described tectum 160 exceedes the edge of stiffening plate 180. The manner can reach described copper foil layer 120, tectum 160 and stiffening plate 180 equally and form a staged so that the edge of the bending copper foil layer 120 in region, tectum 160 and stiffening plate 180 staggers not point-blank, has disperseed the stress point concentrated.
Embodiment two
Referring to Fig. 2, the distinctive points of the present embodiment and embodiment one is, in windowed regions 190, the extension edge 161 of described tectum 160 exceeds the edge of stiffening plate 280, copper foil layer 120 edge and adhesive-layer 140 edge. In addition, the edge of described copper foil layer 120 exceeds the edge of described stiffening plate 280. Copper foil layer 120 edge of windowed regions 190, tectum 160 edge and stiffening plate 280 edge are interleaved. In other words, the edge of described stiffening plate with the edge of described copper foil layer not in a vertical plane.
In the present embodiment, by the edge of copper foil layer 120 edge in bending region, tectum 160 edge and stiffening plate 280 is staggered not in a perpendicular, so that the height fall at Ge Tong edge and stiffening plate edge, Ge Tong edge and cover layer edges place has a buffering, disperse the stress point concentrated, so that be unlikely to, when bending flexible PCB, the flexible PCB that fractures, enhance the anti-crooking ability of flexible PCB.
Further, in the preferred implementation of the flexible PCB bending region edge strengthening structure of the present invention, the extension edge 161 of described tectum 160 can exceed copper foil layer 120 and adhesive-layer 140 more than edge 0.3mm, such as 0.4mm, 0.5mm, 0.6mm etc.; With reason, more than the horizontal throw 0.3mm at the edge of the Edge Distance copper foil layer 120 of described stiffening plate 280, such as 0.4mm, 0.5mm, 0.6mm's etc. If the extension edge 161 of tectum 160 is too long, affecting the bending performance of flexible PCB, the horizontal throw at the edge of the Edge Distance copper foil layer 120 of stiffening plate 280 too far also can affect the reinforcing effect of flexible PCB. Therefore the extension edge 161 of tectum 160 exceeds the upper limit of size of horizontal throw at edge of the size at copper foil layer 120 and adhesive-layer 140 edge, the Edge Distance copper foil layer 120 of stiffening plate 280, depending on the size of windowed regions 190.
Further, copper foil layer 120 (with 130) is that 5��50 ��m of calendering Copper Foils or electrolytic copper foil form by thickness; Tectum 160 (with 170) generally by thickness be polyimide (PI) film of 5��50 ��m, polyethylene terephthalate (PET) film forms, it is bonded on copper foil layer by adhesive-layer, then realizes mortise by hot pressing. Described stiffening plate 280 can use the nonmetal plate of certain intensity, or use the stainless steel plate of more than thickness 0.1mm, aluminium sheet and have the metal alloy plate of certain intensity. Described stiffening plate 280 can be fixed on described tectum 160 by melting welding or viscose glue.
Apparent, the present embodiment can also be arranged on windowed regions 190, the edge of described tectum 160 exceeds the edge of stiffening plate 280. In addition, the edge of described stiffening plate 280 exceeds described copper foil layer 120 edge and described tectum 160 edge. The object that copper foil layer 120 edge of windowed regions 190, tectum 160 edge and stiffening plate 280 edge are interleaved can be reached equally.
Embodiment three
Referring to Fig. 3, flexible PCB comprises medium layer 310, copper foil layer 320 (with 330), tectum 360 (with 370) and stiffening plate 380. Copper foil layer 320 and copper foil layer 330 are separately positioned on the upper and lower surface of medium layer 310, are also coated with tectum 360 (with 370) in copper foil layer 320 (with 330) outside. Copper foil layer 320 (with 330) is connected by adhesive-layer 340 (with 350) with copper foil layer 320 (with 330). The outside of tectum 360 is also provided with stiffening plate 380, and the effect of stiffening plate 380 is to realize the local strengthening function to flexible PCB. Comprising of described flexible PCB bends region, and namely the bending region of described flexible PCB through process of windowing, need to slice off the copper foil layer 330, adhesive-layer 330, the tectum 370 that are positioned at above medium layer 310 and arrange windowed regions on stiffening plate 380. In other words, windowing of described copper foil layer, adhesive-layer and tectum is arranged on the side away from stiffening plate. Wherein, the edge of described tectum 370 internally extends extension edge 371 to windowed regions 390, exceedes and the edge of covering copper layers of foil 310 and adhesive-layer 350. The edge of described stiffening plate 380 also internally extends extension edge 381 to windowed regions 390, exceedes and the edge of tectum 360. The edge bending the copper foil layer 330 in region, tectum 370 and stiffening plate 380 is staggered not on a perpendicular.
In the present embodiment, by windowing in the side away from stiffening plate, by the copper foil layer 330 of windowed regions, tectum 370, and the edge of stiffening plate 380 on the other side staggers on perpendicular, so that the height fall of Ge Tong edge and stiffening plate edge has a buffering, disperse the stress point concentrated, so that be unlikely to, when bending flexible PCB, the flexible PCB that fractures, enhance the anti-crooking ability of flexible PCB.
Further, in the preferred implementation of the flexible PCB bending region edge strengthening structure of the present invention, the extension edge 371 of described tectum 370 can exceed copper foil layer 330 and adhesive-layer 350 more than edge 0.3mm, such as 0.4mm, 0.5mm, 0.6mm etc.; With reason, described stiffening plate 380 edge can exceed more than the edge 0.3mm of tectum 370, such as 0.4mm, 0.5mm, 0.6mm's etc. If the extension edge 371 of tectum 160 is too long, or stiffening plate 380 edge exceeds the too long bending performance that also can affect flexible PCB in edge of tectum 370, therefore the upper limit of the size at the edge that the extension edge 371 of tectum 370 exceeds the size at copper foil layer 330 and adhesive-layer 350 edge, described stiffening plate 380 edge can exceed tectum 370, depending on the size of windowed regions 390.
Further, copper foil layer 320 (with 330) is that 5��50 ��m of calendering Copper Foils or electrolytic copper foil form by thickness; Tectum 360 (with 370) generally by thickness be polyimide (PI) film of 5��50 ��m, polyethylene terephthalate (PET) film forms, it is bonded on copper foil layer by adhesive-layer, then realizes mortise by hot pressing. Described stiffening plate 380 can use the nonmetal plate of certain intensity, or use the stainless steel plate of more than thickness 0.1mm, aluminium sheet and have the metal alloy plate of certain intensity. Described stiffening plate 380 can be fixed on described tectum 360 by melting welding or viscose glue.
Apparent, in the present embodiment, it is also possible to the edge arranging described copper foil layer 330 internally extends extension edge to windowed regions 390, exceed the extension edge 371 of tectum 370. Same, the extension edge 371 of described tectum 370 exceedes the edge of stiffening plate 380. The manner can reach described copper foil layer 330, tectum 370 and stiffening plate 380 equally and form a staged so that the edge of the bending copper foil layer 330 in region, tectum 370 and stiffening plate 380 staggers not point-blank, has disperseed the stress point concentrated.
Apparent, in the present embodiment, stiffening plate is arranged on different side with windowing, as long as ensureing copper foil layer 330 edge and tectum 370 edge in bending region, and the edge of stiffening plate 380 on the other side staggers between two on perpendicular, just can disperse the stress point concentrated, so that be unlikely to, when bending flexible PCB, the flexible PCB that fractures, enhance the anti-crooking ability of flexible PCB. Other forms are repeated no more herein.
The present invention also provides a kind of mobile terminal adopting above-mentioned flexible PCB, and described mobile terminal can be mobile phone, panel computer, televisor, indicating meter, notebook computer, digital phase frame, navigating instrument etc.
Above-described enforcement mode, does not form the restriction to this technical scheme protection domain. The amendment done within any spirit in above-mentioned enforcement mode and principle, equivalent replace and improvement etc., all should be included within the protection domain of this technical scheme.
Claims (10)
1. a flexible PCB, it is characterized in that, comprise medium layer, described medium layer both sides are provided with copper foil layer from inside to outside successively, adhesive-layer and tectum, the described tectum of one of described medium layer both sides is provided with stiffening plate, described flexible PCB comprises bending region, described bending region is provided with the described copper foil layer of the side of stiffening plate, described adhesive-layer, described tectum and described stiffening plate are provided with windowed regions, the edge of described tectum extends to described windowed regions inside, exceed the described copper foil layer of described windowed regions, the edge of described adhesive-layer and described stiffening plate, the edge of described stiffening plate and the edge of described copper foil layer be not on a perpendicular.
2. flexible PCB as claimed in claim 1, it is characterised in that, described copper foil layer and the edge of described adhesive-layer is exceeded at the edge of the described stiffening plate of described windowed regions.
3. flexible PCB as claimed in claim 1, it is characterised in that, the edge of described stiffening plate is exceeded at the described copper foil layer of described windowed regions and the edge of described adhesive-layer.
4. as claimed in claim 2 or claim 3 flexible PCB, it is characterised in that, at the edge of described windowed regions, horizontal throw between the two is minimum arbitrarily is 0.3mm for described copper foil layer, described adhesive-layer, described tectum and described stiffening plate.
5. flexible PCB as claimed in claim 1, it is characterised in that, described stiffening plate is metal alloy sheet material.
6. flexible PCB as claimed in claim 5, it is characterised in that, described stiffening plate thickness is more than 0.1mm.
7. flexible PCB as claimed in claim 1, it is characterised in that, described tectum comprises polyimide (PI) film and polyethylene terephthalate (PET) film.
8. flexible PCB as claimed in claim 1, it is characterised in that, the thickness of described copper foil layer is 5��50 ��m.
9. flexible PCB as claimed in claim 1, it is characterised in that, described stiffening plate is fixed on described tectum by melting welding or viscose glue.
10. a mobile terminal, it is characterised in that, comprise the flexible PCB described in claim 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025696.4A CN105636333A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025696.4A CN105636333A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105636333A true CN105636333A (en) | 2016-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511025696.4A Pending CN105636333A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
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| Country | Link |
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| CN (1) | CN105636333A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106341942A (en) * | 2016-11-18 | 2017-01-18 | 东莞市五株电子科技有限公司 | Circuit board of quick-charging battery |
| WO2017113813A1 (en) * | 2015-12-29 | 2017-07-06 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN108882512A (en) * | 2018-08-30 | 2018-11-23 | 业成科技（成都）有限公司 | Flexible circuit board |
| CN116075043A (en) * | 2023-03-17 | 2023-05-05 | 深圳市华瀚宇电子科技有限公司 | FPC flexible circuit board with reinforcing structure and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929719A (en) * | 2005-08-24 | 2007-03-14 | 株式会社藤仓 | Printed circuit board and manufacturing method thereof |
| JP2008218748A (en) * | 2007-03-05 | 2008-09-18 | Hitachi Plasma Display Ltd | Display device and flexible printed wiring board |
| CN202310283U (en) * | 2011-10-28 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Hard fold flexible printed circuit board |
| CN202364466U (en) * | 2011-11-15 | 2012-08-01 | 惠州Tcl移动通信有限公司 | FPC (flexible printed circuit board) and reinforcing structure at edge of bent zone of FPC |
| US20150136448A1 (en) * | 2013-11-18 | 2015-05-21 | Kabushiki Kaisha Toshiba | Flexible Printed Wiring Board and Electronic Apparatus |
-
2015
- 2015-12-29 CN CN201511025696.4A patent/CN105636333A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1929719A (en) * | 2005-08-24 | 2007-03-14 | 株式会社藤仓 | Printed circuit board and manufacturing method thereof |
| JP2008218748A (en) * | 2007-03-05 | 2008-09-18 | Hitachi Plasma Display Ltd | Display device and flexible printed wiring board |
| CN202310283U (en) * | 2011-10-28 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Hard fold flexible printed circuit board |
| CN202364466U (en) * | 2011-11-15 | 2012-08-01 | 惠州Tcl移动通信有限公司 | FPC (flexible printed circuit board) and reinforcing structure at edge of bent zone of FPC |
| US20150136448A1 (en) * | 2013-11-18 | 2015-05-21 | Kabushiki Kaisha Toshiba | Flexible Printed Wiring Board and Electronic Apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017113813A1 (en) * | 2015-12-29 | 2017-07-06 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| US10779401B2 (en) | 2015-12-29 | 2020-09-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Flexible printed circuit board and mobile terminal |
| CN106341942A (en) * | 2016-11-18 | 2017-01-18 | 东莞市五株电子科技有限公司 | Circuit board of quick-charging battery |
| CN108882512A (en) * | 2018-08-30 | 2018-11-23 | 业成科技（成都）有限公司 | Flexible circuit board |
| CN116075043A (en) * | 2023-03-17 | 2023-05-05 | 深圳市华瀚宇电子科技有限公司 | FPC flexible circuit board with reinforcing structure and preparation method thereof |
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Application publication date: 20160601 |