CN105578747A - Rigid-flex board and manufacturing method thereof - Google Patents
Rigid-flex board and manufacturing method thereof Download PDFInfo
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- CN105578747A CN105578747A CN201610105561.7A CN201610105561A CN105578747A CN 105578747 A CN105578747 A CN 105578747A CN 201610105561 A CN201610105561 A CN 201610105561A CN 105578747 A CN105578747 A CN 105578747A
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- layer
- flexible substrate
- via hole
- substrate layer
- line layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Abstract
The invention discloses a rigid-flex board and a manufacturing method thereof. The rigid-flex board comprises a flexible substrate layer, a copper foil layer overlapped on the flexible substrate layer, a rigid layer, a circuit layer and a plurality of metal fixing pieces, wherein the rigid layer is overlapped on the copper foil layer; the circuit layer is overlapped on the rigid layer; the edge of the circuit layer is provided with a plurality of through holes; each through hole passes through the flexible substrate layer; each metal fixing piece comprises a main body, and a first extending board and a second extending board connected onto two ends of the main body; the main body is arranged in the through hole; the first extending board is laminated on the surface of the circuit layer; and the second extending board is laminated on the surface of the flexible substrate layer. According to the rigid-flex board and the manufacturing method thereof of the invention, through arranging the main body of each metal fixing piece in the through hole, the first extending board and the second extending board of the metal fixing piece are respectively laminated on the circuit layer and the flexible substrate layer, the lamination effects on the circuit layer and the flexible substrate layer by the first extending board and the second extending board are used, delamination can be prevented, and the use reliability of the rigid-flex board can be ensured.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of Rigid Flex and preparation method thereof.
Background technology
Rigid Flex makes its application more and more extensive because it has the character of soft board and hardboard simultaneously.
Existing Rigid Flex is adding man-hour, usually adopts and is directly pressed together on soft board by hardboard, and then carry out arranging devices on hardboard.
But, because hardboard is directly pressed together on soft board, in use or interface unit time, the pressing defective tightness between hardboard and soft board is easily caused owing to tearing energetically, and then cause hardboard and soft board layering, thus it is abnormal to make product connect appearance, cannot ensure the dependability of Rigid Flex.
Summary of the invention
In view of this, the invention provides one and prevent hardboard and soft board from occurring layering, improve Rigid Flex of dependability and preparation method thereof.
First aspect, the invention provides a kind of Rigid Flex, described Rigid Flex comprises flexible substrate layer and is stacked at the copper foil layer in described flexible substrate layer, wherein, described Rigid Flex also comprises hard layer, line layer and several metal fixings, described hard layer is stacked at the side that described copper foil layer deviates from described flexible substrate layer, described line layer is stacked on described hard layer, the edge of described line layer is provided with several via holes along the bearing of trend spread configuration of described line layer, and each described via hole is all through to described flexible substrate layer, several via holes described in several metal fixing correspondences described are arranged, described metal fixing comprises main body and is connected to the first extension board and second extension board at described main body two ends, described main body is located in described via hole, described first extension board is pressed on the surface that described line layer offers described via hole, described second extension board is pressed on the surface that described flexible substrate layer deviates from described copper foil layer.
Wherein, in the hole wall of each described via hole, be coated with metal coating, and described metal coating is metallic copper coating or metallic tin coating.
Wherein, the material of described metal fixing is copper or tin.
Wherein, the spacing between two adjacent described via holes is 2 ~ 3mm.
Wherein, the bore size of described via hole is 0.5mm ~ 8mm.
Wherein, described first extension board and the second extension board are all attached in described line layer and described flexible substrate layer by surface mounting technology.
Second aspect, present invention also offers a kind of method preparing above-mentioned Rigid Flex, the method comprises the following steps:
Flexible substrate layer etches cabling, obtains copper foil layer;
Flexible substrate layer etches cabling, obtains copper foil layer;
Pressing hard layer on described copper foil layer, and circuit is etched on described hard layer, obtain line layer;
There are several along the via hole of the bearing of trend spread configuration of described line layer in the edge of described line layer, and make described via hole be through to described flexible substrate layer;
In described via hole, fill metal derby, and carried out stove heating, obtain metal fixing.
Wherein, before step " is filled metal derby, and carried out stove heating, to obtain metal fixing " in described via hole, further comprising the steps of:
In the inwall metallizing coating of described via hole.
Wherein, described metal coating is metallic copper coating or metallic tin coating.
Wherein, described metal derby is metallic copper or metallic tin.
Rigid Flex of the present invention and preparation method thereof, by offering several through via holes to flexible substrate layer on line layer, then the metal fixing that several are corresponding with via hole is set, the main body of metal fixing is located in via hole, then the first extension board of metal fixing and the second extension board are pressed together in line layer and flexible substrate layer respectively, utilize the first extension board and the second extension board to the pressing effect of line layer and flexible substrate layer, thus make line layer and flexible substrate layer, copper foil layer and hard layer can press together firmly, prevent the situation of plate bursting or layering, ensure the dependability of Rigid Flex.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic cross-section of the Rigid Flex that the embodiment of the present invention provides;
Fig. 2 is the structural representation of the Rigid Flex (omission metal fixing) that the embodiment of the present invention provides;
Fig. 3 is the structural representation of the hardboard part that the embodiment of the present invention provides;
Fig. 4 is the flow chart preparing the method for Rigid Flex that the embodiment of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature is as illustrated in the drawing described.Be appreciated that, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or layer time, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or intervening elements or layer can be there is.
Being appreciated that terminology used here is only to describe specific embodiment, not really wanting to limit the present invention.When here using, clearly state unless context separately has, otherwise singulative " " and " being somebody's turn to do " are also intended to comprise plural form.Further, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but does not get rid of other features one or more, entirety, step, element, assembly and/or its existence of combining or increase.Specification subsequent descriptions is for implementing better embodiment of the present invention, and right described description is to illustrate for the purpose of rule of the present invention, and is not used to limit scope of the present invention.Protection scope of the present invention is when being as the criterion depending on the claims person of defining.
See also Fig. 1 to Fig. 3, a kind of Rigid Flex 100 provided by the invention, described Rigid Flex 100 comprises flexible substrate layer 10, copper foil layer 20, hard layer 30, line layer 40 and metal fixing 50.Described copper foil layer 20 is stacked in described flexible substrate layer 10, and described hard layer 30 is stacked at the side that described copper foil layer 20 deviates from described flexible substrate layer 10.Described line layer 40 is stacked on described hard layer 30, and the edge of described line layer 40 is provided with several via holes 41 along the bearing of trend spread configuration of described line layer 40, and each described via hole 41 is all through to described flexible substrate layer 10.Described metal fixing 50 comprises main body 51 and is connected to first extension board 52 and second extension board 53 at described main body 51 two ends, described mainboard 51 is located in described via hole 41, described first extension board 52 is pressed on the surface that described line layer 40 offers described via hole 41, and described second extension board 53 is pressed on the surface that described flexible substrate layer 10 deviates from described copper foil layer 20.Be understandable that, described Rigid Flex 100 can be applicable in mobile terminal, and this mobile terminal can be mobile phone, panel computer, notebook computer etc., and described Rigid Flex 100 is responsible for the conduction between the electronic component in this mobile terminal.
The Rigid Flex 100 that the embodiment of the present invention provides, by the edge of described line layer 40, via hole 41 described in several is set, the main body 51 of described metal fixing 50 is set in described via hole 41, and the first extension board 52 of described metal fixing 50 is pressed on the surface that described line layer 40 offers described via hole 41, then the second extension board 53 of described metal fixing 50 is pressed on the surface that described flexible substrate layer 10 deviates from described copper foil layer 20.Utilize the fixation of described metal fixing 50, described line layer 40 and described flexible substrate layer 10 are pressed together under the pressing effect of described first extension board 52 and the second extension board 53 respectively all the time, prevent described line layer 40 from occurring and the situation that described copper foil layer 20 or hard layer 30 are separated, prevent line layer 40 to be connected the situation occurring losing efficacy with electronic devices and components, and then improve the dependability of described Rigid Flex 100.
In the present embodiment, described flexible substrate layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arrange described copper foil layer 20 in described flexible substrate layer 10, and described flexible substrate layer 10 can provide insulation environment for described copper foil layer 20 so that on described copper foil layer 20 etching signal cabling and ground connection cabling.Preferably, the thickness of described flexible substrate layer 10 can be 20 μm.Described flexible substrate layer 10 can arrange flex area (not shown) and non-flex area (not shown), described flex area is used for presenting flexibility, described Soft Bonding plate 100 is facilitated to produce deformation, and then facilitate described Rigid Flex 100 to connect external device, hard plate can be fixed in described non-flex area, thus improve the rigidity of described Soft Bonding plate 100, thus described Soft Bonding plate 100 is facilitated to be assemblied in terminal.
In the present embodiment, described copper foil layer 20 is plate film being arranged Copper Foil, and the ground connection cabling on described copper foil layer 20 and signal lead are Copper Foil and form through etching technics according to prescribed route structure.Ground connection cabling on described copper foil layer 20 and signal lead can be wholely set, and the signal lead on described copper foil layer 20 realizes the conduction between electric elements, and the ground connection cabling on described copper foil layer 20 carries out ground connection.
In the present embodiment, described hard layer 30 adopts polyethylene material, and described hard layer 30 has insulating properties characteristic, and described line layer 40 and described copper foil layer 20 are completely cut off mutually, thus facilitates the trace arrangements variation of described Rigid Flex 100.The non-flex area that described hard layer 30 may correspond to described flexible substrate layer 10 is arranged, thus the rigidity of described hard layer 30 can be utilized, the intensity of described Rigid Flex 100 on described non-flex area is increased, makes described Rigid Flex 100 in the not easily bending of described non-flex area.Meanwhile, described hard layer 30 is protected the circuit of described copper foil layer 20 at 20b place, described non-flex area, increases the structural soundness of described Rigid Flex 100.
In the present embodiment, described line layer 40 also can be that Copper Foil is shaping through etch process.Described line layer 40 can arrange circuit, thus the circuit configuration of described Rigid Flex 100 can be increased.
In the present embodiment, the edge of described line layer 40 is provided with several via holes 41 described, and described via hole 41 is along the edge of described line layer 40 around setting.Several via holes 41 described are manhole, and the distance of center circle of several via holes 41 described is 1mm from described edge, cause described via hole 41 to be punched at the edge of described line layer 40 to prevent described via hole 41 to be too near to the edge of described line layer 40, ensure the edge integrity of described line layer 40.Preferably, the bore size of described via hole 41 is 0.5mm ~ 8mm, thus can be convenient to the setting of follow-up described metal fixing 50.Be understandable that, in other embodiments, described via hole 41 also can be arranged according to actual processing apart from the distance at the edge of described line layer 40, if distance is 2mm or 3mm etc.
Further, the spacing between adjacent two described via holes 41 is 2mm ~ 3mm, thus can prevent too intensive between two adjacent via holes 41 and situation that is that cause likely occurring that two via holes are mutually through.Particularly, in order to strengthen the structural strength of described line layer 40 further, prevent described line layer 40 from causing remitted its fury owing to offering several via holes 41 described, the hole wall of described via hole 41 is coated with metal coating 411.Utilize described metal coating 411 to increase the tenor of described line layer 40, thus increase the overall construction intensity of described line layer 40.Preferably, described metal coating 411 is metallic copper coating or metallic tin coating.Described metal coating 411 can be processed in the lump when processing the circuit on described line layer 40.In addition, be understandable that, owing to there is described metal coating 411 in described via hole 41, therefore, the inwall of described via hole 41 also has electric conductivity, and now, described via hole 41 can be used as the conductive welding disk on described line layer 40, in order to be connected with other electronic devices and components, to realize electrically conducting of described line layer 40 and other electronic devices and components.
Further, because described via hole 41 is through to described flexible substrate layer 10 via described line layer 40, thus when the inwall of described via hole 41 is coated with described metal coating 411, the metal coating 411 namely in described via hole 41 also can increase the structural strength of described flexible substrate layer 10, described copper foil layer 20 and described hard layer 30.Meanwhile, utilize described via hole 41 also can in order to arrange electric-conductor to connect described line layer 40 and described copper foil layer 20.
The main body 51 of described metal fixing 50 is located in described via hole 41.In the present embodiment, described metal fixing 50 adopts metallic copper or metallic tin, so that while conduction, also can have certain fixed performance described line layer 40, hard layer 30, copper foil layer 20 and described flexible substrate layer 10 are fixed together, prevent described line layer 40 and described copper foil layer 20, flexible substrate layer 10 or described hard layer 30 from occurring the situation of layering, namely prevent the hardboard part of described Rigid Flex 100 from occurring plate bursting situation, ensure the dependability of described Rigid Flex 100.Be understandable that, in other embodiments, described metal fixing 50 also can adopt other conducting metals, such as metallic aluminium or argent etc.
Described first extension board 52 and described second extension board 53 are connected to the two ends of described main body 51.In the present embodiment, described first extension board 52, second extension board 53 and described main body 51 are connected to form " work " character form structure.Preferably, adding man-hour, when can carry out surface mount operation on described line layer 40, described metal fixing 50 was being passed through the mode of stove heating, make described metal fixing 50 present molten condition, thus make the main body 51 of described metal fixing 50 can fill described via hole 41 completely.Simultaneously, because it is in molten condition, therefore there is certain mobility, thus can flow on surface that described flexible substrate layer 10 deviates from described copper foil layer 20 and flow on the surface of described line layer 40, to form described second extension board 53 and described first extension board 52 respectively, and then when it cools down, described main body 51 is solidified completely in described via hole 41, described first extension board 52 and the second extension board 53 are pressed together on the surface of described line layer 40 and the surface of described flexible substrate layer 10 respectively, thus realize the hardboard pressing portions effect together of described Rigid Flex 100, prevent plate bursting.
Refer to Fig. 4, be the method for the described Rigid Flex 100 of preparation that the embodiment of the present invention provides, the method comprises the following steps:
S1: etch cabling in described flexible substrate layer, obtain copper foil layer.
The object of this step is to form described copper foil layer in described flexible substrate layer, so that cabling and connection electronic devices and components, provides basis to described Rigid Flex 100 for electronic devices and components realize electrically conducting.In the present embodiment, in order to protect the cabling on described copper foil layer, described copper foil layer also can cover one deck coverlay, described coverlay fits on described copper foil layer by the mode of viscose glue.
S2: pressing hard layer on described copper foil layer, and circuit is etched on described hard layer, obtain line layer.
The object of this step is to form hardboard part in flexible substrate layer, utilizes described hard layer to strengthen the intensity of described flexible substrate layer, to form the hardboard part of described Rigid Flex.
S3: have several along the via hole of the bearing of trend spread configuration of described line layer in the edge of described line layer, and make described via hole be through to described flexible substrate layer.
The object of this step is to form several via holes described on the edge of described line layer, so that the carrying out of subsequent step.In the present embodiment, several via holes described all can be manhole.Described in the centre distance of several via holes described, the distance at line layer edge can be greater than or equal to 1mm, cause described via hole to run through the edge of described line layer to prevent the distance between described via hole and described line layer edge too little, guarantee the integrality at described line layer edge.
S4: fill metal derby in described via hole, and carried out stove heating, obtain metal fixing.
The object of this step is to form described metal fixing, fixes described line layer, described hard layer, copper foil layer and described flexible substrate layer with pressing.In the present embodiment, when carrying out this step, its concrete operations are:
Described line layer adopts surface mounting technology to be sticked electronic devices and components, then metal derby is positioned in via hole, carried out stove heating, metal derby is melted; After metal derby thawing, it has certain mobility, therefore, its part can be trapped in via hole, form main part, another part can flow along the bearing of trend of via hole, thus flows on the surface of line layer surface and flexible substrate layer, thus form the first extension board and the second extension board respectively, and then this main body, the first extension board and the second extension board form this metal fixing.Because this main part is filled in via hole, therefore, the tenor in via hole is increased, thus the structural strength of line layer can be increased.In addition, because the first extension board and the second extension board are pressed together on the surface of line layer and flexible substrate layer respectively, therefore, it is possible to make line layer and flexible substrate layer to press together, the situation of layering or plate bursting is prevented.
Further, before carrying out above-mentioned steps S4, further comprising the steps of:
S31: in the inwall metallizing coating of described via hole.
The object of this step is the structural strength in order to strengthen line layer, prevents from line layer being offered described via hole and causing the overall construction intensity of line layer to decline.In the present embodiment, this metal coating is metallic copper coating and metallic tin coating, while ensureing having certain structural strength, also has electric conductivity, so that conduction.
Be understandable that, after having carried out above-mentioned steps, also the above-mentioned Rigid Flex completed can be cooled, thus make this metal fixing present stationary state, and then ensure that it remains that stitching state is pressed together on line layer and flexible substrate layer surface, thus ensure its pressing compactness.
Rigid Flex of the present invention and preparation method thereof, by offering several through via holes to flexible substrate layer on line layer, then the metal fixing that several are corresponding with via hole is set, the main body of metal fixing is located in via hole, then the first extension board of metal fixing and the second extension board are pressed together in line layer and flexible substrate layer respectively, utilize the first extension board and the second extension board to the pressing effect of line layer and flexible substrate layer, thus make line layer and flexible substrate layer, copper foil layer and hard layer can press together firmly, prevent the situation of plate bursting or layering, ensure the dependability of Rigid Flex.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example ", " some examples " or similar " the first embodiment " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a Rigid Flex, comprise flexible substrate layer and be stacked at the copper foil layer in described flexible substrate layer, it is characterized in that, described Rigid Flex also comprises hard layer, line layer and several metal fixings, described hard layer is stacked at the side that described copper foil layer deviates from described flexible substrate layer, described line layer is stacked on described hard layer, the edge of described line layer is provided with several via holes along the bearing of trend spread configuration of described line layer, and each described via hole is all through to described flexible substrate layer, several via holes described in several metal fixing correspondences described are arranged, described metal fixing comprises main body and is connected to the first extension board and second extension board at described main body two ends, described main body is located in described via hole, described first extension board is pressed on the surface that described line layer offers described via hole, described second extension board is pressed on the surface that described flexible substrate layer deviates from described copper foil layer.
2. Rigid Flex according to claim 1, is characterized in that, is coated with metal coating in the hole wall of each described via hole, and described metal coating is metallic copper coating or metallic tin coating.
3. Rigid Flex according to claim 1, is characterized in that, the material of described metal fixing is copper or tin.
4. Rigid Flex according to claim 1, is characterized in that, the spacing between two adjacent described via holes is 2 ~ 3mm.
5. Rigid Flex according to claim 1, is characterized in that, the bore size of described via hole is 0.5mm ~ 8mm.
6. Rigid Flex according to claim 1, is characterized in that, described first extension board and the second extension board are all attached in described line layer and described flexible substrate layer by surface mounting technology.
7. prepare a method for Rigid Flex according to claim 1, it is characterized in that, it comprises the following steps:
Flexible substrate layer etches cabling, obtains copper foil layer;
Pressing hard layer on described copper foil layer, and circuit is etched on described hard layer, obtain line layer;
There are several along the via hole of the bearing of trend spread configuration of described line layer in the edge of described line layer, and make described via hole be through to described flexible substrate layer;
In described via hole, fill metal derby, and carried out stove heating, obtain metal fixing.
8. preparation method according to claim 7, is characterized in that, before step " is filled metal derby, and carried out stove heating, to obtain metal fixing " in described via hole, further comprising the steps of:
In the inwall metallizing coating of described via hole.
9. preparation method according to claim 8, is characterized in that, described metal coating is metallic copper coating or metallic tin coating.
10. preparation method according to claim 7, is characterized in that, described metal derby is metallic copper or metallic tin.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105561.7A CN105578747B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and preparation method thereof |
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| CN201610105561.7A CN105578747B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex and preparation method thereof |
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| CN105578747A true CN105578747A (en) | 2016-05-11 |
| CN105578747B CN105578747B (en) | 2019-04-05 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108601246A (en) * | 2018-06-26 | 2018-09-28 | 江西志博信科技股份有限公司 | The production method that high-frequency microwave prints HDI wiring boards |
| CN114245619A (en) * | 2021-12-28 | 2022-03-25 | 深圳市深合达电子有限公司 | Printed circuit board pressing structure and multilayer printed circuit board |
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| US20060019075A1 (en) * | 2004-07-26 | 2006-01-26 | Samsung Electro-Mechanics Co., Ltd. | Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof |
| CN201323703Y (en) * | 2008-11-25 | 2009-10-07 | 苏州群策科技有限公司 | Soft-hard composite circuit board structure |
| CN204191017U (en) * | 2014-08-28 | 2015-03-04 | 深圳市比亚迪电子部品件有限公司 | A kind of multilayer circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20060019075A1 (en) * | 2004-07-26 | 2006-01-26 | Samsung Electro-Mechanics Co., Ltd. | Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof |
| CN201323703Y (en) * | 2008-11-25 | 2009-10-07 | 苏州群策科技有限公司 | Soft-hard composite circuit board structure |
| CN204191017U (en) * | 2014-08-28 | 2015-03-04 | 深圳市比亚迪电子部品件有限公司 | A kind of multilayer circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108601246A (en) * | 2018-06-26 | 2018-09-28 | 江西志博信科技股份有限公司 | The production method that high-frequency microwave prints HDI wiring boards |
| CN114245619A (en) * | 2021-12-28 | 2022-03-25 | 深圳市深合达电子有限公司 | Printed circuit board pressing structure and multilayer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578747B (en) | 2019-04-05 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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