JP6406453B2 - Resin substrate, resin substrate manufacturing method - Google Patents

Description

  The present invention relates to a resin substrate that includes a signal conductor and a ground conductor and is used by being partially bent.

  2. Description of the Related Art Conventionally, many circuit boards having flexibility have been adopted in electronic devices such as mobile communication terminals. In particular, in the case of an electronic device having a small housing such as a portable electronic device, the flexible substrate may be bent and used because the capacity can be improved while realizing the function as a circuit board.

  Patent Document 1 describes a flexible substrate that is used by being bent. In the flexible substrate described in Patent Document 1, a metal wiring is formed on the substrate, and a conductive polymer is formed so as to cover the wiring. In the flexible substrate described in Patent Document 1, disconnection failure does not occur even when it is bent repeatedly.

JP 2006-165341 A

  However, the conductive polymer film used in the flexible substrate described in Patent Document 1 is extremely thin. For this reason, the tolerance with respect to bending may be inadequate. In addition, the conductive polymer film has poor electromagnetic shielding properties.

  Accordingly, an object of the present invention is to provide a resin substrate having high resistance to cracking during bending and excellent electromagnetic shielding properties.

  The resin substrate of the present invention includes a dielectric body, a ground conductor, and a shield tape. The dielectric body can be bent. The ground conductor is formed in a dielectric body. The shield tape is disposed at the bent portion of the dielectric body, has a shape connected to the ground conductor, and has electromagnetic shielding properties.

  In this configuration, when the resin substrate is bent, the ground conductor is difficult to be disconnected in the middle, and even if the ground conductor is disconnected, the conductive state between the separated ground conductors is maintained by the shield tape. Moreover, the fall of the shield property of a bending part is suppressed.

  Moreover, the following structure may be sufficient as the resin substrate of this invention. The ground conductor is divided at the bent portion. A shield tape is disposed on the dielectric body where the ground conductor is divided.

  In this configuration, since there is no ground conductor in the bent portion, the bending is easy.

  The resin substrate of the present invention preferably has the following configuration. The shield tape includes a conductive adhesive and a metal foil. The back surface of the conductive adhesive is in contact with the dielectric body or the ground conductor. The metal foil is disposed on the surface of the conductive adhesive.

  In this configuration, since the shield tape is made of the conductive adhesive and the metal foil, it is possible to more reliably realize the suppression of the division at the time of bending and the decrease in the shielding property.

  In the resin substrate of the present invention, it is preferable that the end portion of the shield tape in the width direction of the dielectric element body overlaps the end portion of the ground conductor in the width direction of the dielectric element body.

  With this configuration, it is possible to more reliably suppress the cracking of the ground conductor.

  Further, the resin substrate of the present invention may include a signal conductor disposed at a midpoint in the thickness direction of the dielectric element body and spaced from the ground conductor.

  With this configuration, a transmission line having high resistance to bending is realized.

  Moreover, the following structure may be sufficient in the resin substrate of this invention. The ground conductor includes a first ground conductor and a second ground conductor at a position sandwiching the signal conductor in the thickness direction of the dielectric body. Shield tapes are disposed on the first ground conductor and the second ground conductor, respectively.

  With this configuration, a strip line having high resistance to bending and excellent electromagnetic shielding properties is realized.

  In the resin substrate of the present invention, it is preferable that metal plating is applied to a portion of the ground conductor exposed on the outer surface of the dielectric body and not covered with the shield tape.

  With this configuration, it is possible to improve the environmental resistance of the portion of the ground conductor exposed to the outside. At this time, metal plating is applied to the part where the shield tape is not placed, and metal plating is not applied to the part where the shield tape is placed. It can be improved. Moreover, it can suppress that it becomes difficult to bend because metal plating is not given to the shield tape part.

  In addition, the present invention is a method for manufacturing a resin substrate in which a plurality of dielectric sheets are stacked and provided with a bent portion, and includes the following steps. The method of manufacturing a resin substrate includes a step of forming a ground conductor on a predetermined dielectric sheet, a step of laminating a plurality of dielectric sheets and press-bonding them to form a dielectric element body, and a shield at a portion that can be a bent portion A step of applying a tape, and a step of performing metal plating on a ground conductor not covered with the shield tape in the dielectric body to which the shield tape is attached.

  In this method, a resin substrate having no metal plating at the bent portion, high resistance to bending, and excellent electromagnetic shielding properties is manufactured by a simple process.

  According to the present invention, it is possible to realize a resin substrate having high resistance to cracking during bending and excellent electromagnetic shielding properties.

It is a partial side view of an electronic device provided with the resin substrate which concerns on the 1st Embodiment of this invention. It is side surface sectional drawing of the resin substrate which concerns on the 1st Embodiment of this invention. 1 is an exploded plan view of a resin substrate according to a first embodiment of the present invention. It is side surface sectional drawing of the shield tape which concerns on the 1st Embodiment of this invention. It is a flowchart which shows the manufacturing method of the resin substrate which concerns on the 1st Embodiment of this invention. It is a partial side view of an electronic device provided with the resin substrate which concerns on the 2nd Embodiment of this invention. It is side surface sectional drawing of the resin substrate which concerns on the 2nd Embodiment of this invention. It is a decomposition | disassembly top view of the resin substrate which concerns on the 2nd Embodiment of this invention. It is a top view which shows the structure of the surface at the side of the 1st ground conductor of the resin substrate which concerns on the 3rd Embodiment of this invention. It is a top view which shows the structure of the surface by the side of the 1st ground conductor of the resin substrate which concerns on the 4th Embodiment of this invention. It is a top view which shows the structure of the surface by the side of the 1st ground conductor of the resin substrate which concerns on the 5th Embodiment of this invention. It is a top view which shows the structure of the surface at the side of the 1st ground conductor of the resin substrate which concerns on the 6th Embodiment of this invention. It is a top view which shows the structure of the surface by the side of the 2nd ground conductor of the resin substrate which concerns on the 7th Embodiment of this invention. It is a top view which shows the structure of the surface by the side of the 2nd ground conductor of the resin substrate which concerns on the 8th Embodiment of this invention.

  A resin substrate according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a partial side view of an electronic apparatus including a resin substrate according to the first embodiment of the present invention. In FIG. 1, the resin substrate shows a cross-sectional view. FIG. 2 is a side cross-sectional view of the resin substrate according to the first embodiment of the present invention. FIG. 3 is an exploded plan view of the resin substrate according to the first embodiment of the present invention.

  The resin substrate 10 is a long flat plate having a first direction as a length direction and a second direction as a width direction. The resin substrate 10 has a bent portion 102 at an intermediate position along the length direction. In the example of FIG. 1, the resin substrate 10 has a shape in which the flat portion 101, the bent portion 102, the flat portion 101, the bent portion 102, and the flat portion 101 are connected in this order along the length direction.

  Although a specific structure of the resin substrate 10 will be described later, a shield tape 60 is disposed in the bent portion 102.

  A connector 91 is mounted on one end of the resin substrate 10 in the length direction, and a connector 92 is mounted on the other end. The connector 91 is connected to the connector 911 on the circuit board 910. The connector 92 is connected to the connector 921 of the circuit board 920. Mounted components 912 and 913 are mounted on the circuit board 910. A mounting component 922 is mounted on the circuit board 920. The circuit board 910 and the circuit board 920 are spaced apart from each other with the resin substrate 10 interposed therebetween, and the respective flat plate surfaces are arranged in parallel. Even in such an arrangement mode of the circuit boards 910, 920, the circuit boards 910, 920 can be electrically connected by using the resin substrate 10 having the bent portion 102 according to the present invention. The connectors 91 and 92 are not essential components, and the pad electrodes formed on the surface of the resin substrate 10 and the circuit substrates 910 and 920 may be directly connected by a method such as solder connection or ultrasonic bonding.

  The resin substrate 10 includes a dielectric body 20, a signal conductor 30, a first ground conductor 50, a second ground conductor 40, a shield tape 60, and a protective film 80.

  The dielectric body 20 is a long plate that is long in the first direction and short in the second direction. The first direction is the length direction, and the second direction is the width direction. The dielectric body 20 is realized by laminating dielectric sheets 201, 202, and 203 along the thickness direction and press-bonding them. The dielectric sheets 201, 202, 203 are made of a flexible material. For example, the dielectric sheets 201, 202, and 203 are made of a liquid crystal polymer.

  A first ground conductor 50 is disposed on the surface of the dielectric sheet 201 (the surface opposite to the dielectric sheet 202 side). The signal conductor 30 is disposed on the surface of the dielectric sheet 202 (the surface facing the dielectric sheet 201). A second ground conductor 40 is disposed on the back surface of the dielectric sheet 203 (the surface opposite to the dielectric sheet 202 side). With this configuration, the resin substrate 10 realizes a strip line in which the signal conductor 30 is sandwiched between the first ground conductor 50 and the second ground conductor 40 in the thickness direction, and the signal conductors 30 are spaced apart from each other. The first ground conductor 50 and the second ground conductor 40 are connected by a plurality of interlayer connection conductors 220 extending in the thickness direction of the resin substrate 10. The signal conductor 30, the first ground conductor 50, and the second ground conductor 40 are made of a material having high conductivity such as copper (Cu).

  The signal conductor 30 is a linear conductor having a predetermined width. The signal conductor 30 has a shape extending from the vicinity of one end 21 of the dielectric element body 20 to the vicinity of the other end 22. The signal conductor 30 is disposed substantially at the center in the second direction (width direction) of the dielectric body 20.

  The first ground conductor 50 includes long conductors 51 and 52 and a bridge conductor 53. The long conductor 51 and the long conductor 52 have a shape extending along the first direction. The long conductor 51 and the long conductor 52 are spaced apart along the second direction. The bridge conductor 53 connects the long conductor 51 and the long conductor 52 at a plurality of locations spaced at intervals along the first direction. Thereby, the first ground conductor 50 has a structure including a plurality of openings 54 along the first direction. A conductor non-forming portion 56 is formed near one end 21 in the first direction of the dielectric element body 20 in the first ground conductor 50, and a connector conductor 711 is formed in the conductor non-forming portion 56. ing. The connector conductor 711 is connected to the signal conductor 30 by an interlayer connection conductor 721 that penetrates the dielectric sheet 201 in the thickness direction. By providing the plurality of openings 54, the first ground conductor 50 can easily adjust the characteristic impedance of the stripline to a predetermined characteristic impedance (for example, 50Ω) even if the thickness of the resin substrate 10 is reduced.

  The first ground conductor 50 includes a conductor non-forming portion 55 at an intermediate position along the first direction, specifically, at the bent portion 102 of the resin substrate 10.

  The second ground conductor 40 is disposed over substantially the entire back surface of the dielectric sheet 203. A conductor non-forming portion 46 is formed in the second ground conductor 40 near the other end 22 in the first direction of the dielectric element body 20, and a connector conductor 712 is formed in the conductor non-forming portion 46. ing. The connector conductor 712 is connected to the signal conductor 30 by an interlayer connection conductor 722 that penetrates the dielectric sheets 202 and 203 in the thickness direction.

  The second ground conductor 40 includes a conductor non-forming portion 45 at an intermediate position along the first direction, specifically, at the bent portion 102 of the resin substrate 10.

  The shield tape 60 is disposed in a shape that covers the conductor non-forming portion 55 of the first ground conductor 50 and the conductor non-forming portion 45 of the second ground conductor 40. FIG. 4 is a side cross-sectional view of the shield tape according to the first embodiment of the present invention. The shield tape 60 includes a conductive adhesive 61 and a metal foil 62. A metal foil 62 is attached to the surface of the conductive adhesive 61. A release sheet 600 is disposed on the back surface of the conductive adhesive 61, and the release sheet 600 is removed when being attached to the dielectric element body 20. Therefore, the back surface of the conductive adhesive 61 is in contact with the dielectric element body 20 in a state where the shield tape 60 is attached to the dielectric element body 20. The conductive adhesive 61 has a structure in which conductive particles 612 are dispersed in an adhesive 611. Specifically, the conductive adhesive 61 is made by dispersing metal powder such as nickel powder and carbon fiber in an acrylic adhesive. A conductive acrylic or polyester-based thermoplastic heat seal may be used. Thus, the conductive adhesive 61 has flexibility together with conductivity.

  The shield tape 60 on the second ground conductor 40 side is in contact with the second ground conductors 40 on both sides of the conductor non-forming part 45. Thereby, the second ground conductors 40 on both sides of the conductor non-forming part 45 are electrically connected by the shield tape 60.

  The shield tape 60 on the first ground conductor 50 side is in contact with the first ground conductors 50 on both sides of the conductor non-forming portion 55. Thereby, the first ground conductors 50 on both sides of the conductor non-forming portion 55 are conducted by the shield tape 60.

  An insulating protective film 80 is disposed on substantially the entire front surface (surface on the first ground conductor 50 side) and substantially entire back surface (surface on the second ground conductor 40 side) of the dielectric body 20. The protective film 80 can be omitted.

  By adopting such a configuration, the following operational effects can be obtained. As described above, since the conductive adhesive 61 of the shield tape 60 has flexibility compared to the metal foil alone, the shield tape 60 expands and contracts according to the bent shape even when the resin substrate 10 is folded and arranged. To do. The conductor formed on the dielectric sheet is affixed to the dielectric sheet by roughening the surface of the conductor. By performing such a roughening treatment, the conductor becomes brittle and easily breaks. However, since the shield tape 60 is pasted with an adhesive, it is difficult to break. Thereby, disconnection of the first ground conductor 50 and the second ground conductor 40 at the bent portion 102 can be suppressed.

  Further, since the shield tape 60 includes the metal foil 62, the electromagnetic shielding property is high, and the electromagnetic shielding property at the bent portion 102 can be maintained high.

  In the resin substrate 10 of the present embodiment, the shield tape 60 has a shape that reaches both ends of the dielectric body 20 in the second direction. In other words, the shield tape 60 on the second ground conductor 40 side is disposed so as to overlap the end portions 411 and 412 in the second direction of the second ground conductor 40. The shield tape 60 on the first ground conductor 50 side is disposed so as to overlap each end of the first ground conductor 50 in the second direction.

  When the resin substrate 10 is bent, the first and second ground conductors 50 and 40 may be cracked from the ends in the second direction. However, by using the arrangement mode of the shield tape 60 according to the present embodiment, the strength of the end portions 411, 412, 511, 512, 521, and 522 can be improved and the occurrence of cracks can be made difficult to occur.

  Moreover, even if these end portions 411, 412, 511, 512, 521, and 522 break, the progress of the crack can be suppressed. Furthermore, an electrical continuity state can be maintained.

  In addition, what is necessary is just to select the material of the metal foil 62 of the shield tape 60 suitably according to the importance of the required specification. Specifically, the metal used as the metal foil 62 of the shield tape 60 includes copper (Cu), aluminum (Al), Zn (zinc), and tin (Sn).

  These metals have a low elastic modulus in the order of tin (Sn), aluminum (Al), Zn (zinc), and copper (Cu) (Sn <Al <Zn <Cu). Therefore, from the viewpoint of protecting the ground conductor, tin (Sn) having a low elastic modulus may be selected for the metal foil 62.

  Moreover, these metals have low resistivity in the order of copper (Cu), aluminum (Al), Zn (zinc), and tin (Sn) (Cu <Al <Zn <Sn). Therefore, from the viewpoint of maintaining the electromagnetic shielding property when the ground conductor is divided, copper (Cu) having a low resistivity may be selected as the metal foil 62.

  The metal foil 62 can be made of nickel (Ni), iron (Fe), stainless steel (SUS), or the like.

  The metal foil 62 is preferably a rolled foil rather than an electrolytic foil. In general, electrolytic foils are hard with small crystal grains, and piezoelectric foils are soft. Therefore, the rolled foil is preferred.

  Further, instead of the metal foil 62, a configuration in which a conductive adhesive is attached to a mesh-like conductor film, and a configuration in which various metal coatings (application of metal paste, plating, etc.) are applied to the conductive adhesive. Also good.

  In the above configuration, the first ground conductor 50 and the second ground conductor 40 are not subjected to metal plating, but may be subjected to metal plating. For example, nickel (Ni) / gold (Au) plating is used as the metal plating. The metal plating is applied to portions of the first ground conductor 50 and the second ground conductor 40 that are not covered with the shield tape 60. In other words, the surface of the shield tape 60 is not subjected to metal plating. By adopting such a configuration, it is possible to improve the environmental resistance of the first ground conductor 50 and the second ground conductor 40 and to suppress the bending portion 102 from being difficult to bend by metal plating. For example, when copper (Cu) is used for the first ground conductor 50 and the second ground conductor 40 and aluminum (Al) is used for the shield tape 60, the selectivity of metal plating can be easily realized, and the first ground conductor can be realized. Metal plating can be easily applied only to portions of the 50 and the second ground conductors 40 that are not covered with the shield tape 60. The surface of the shield tape 60 may be metal plated. In that case, the above effect cannot be obtained, but instead, the bent portion 102 can easily maintain the folded state after the folding.

  The resin substrate 10 having such a configuration is manufactured by the following steps. FIG. 5 is a flowchart showing a method for manufacturing a resin substrate according to the first embodiment of the present invention. FIG. 5 shows the case where metal plating is performed.

  Prepare a plurality of dielectric sheets with copper on one side. Conductive patterns of the signal conductor 30, the second ground conductor 40, and the first ground conductor 50 are formed on these dielectric sheets (S101). Specifically, unnecessary copper is removed by printing a resist on the copper bonding surface of the dielectric sheet and performing etching. The resist printed on the dielectric sheet is removed. The dielectric sheet on which the conductor pattern is formed is drilled with a laser at the position where the interlayer connection conductor is formed. A conductive paste is filled in the holes formed in the dielectric sheet.

  Next, a plurality of dielectric sheets are stacked and thermocompression bonded (S102). During this thermocompression bonding, the conductive paste is solidified to form an interlayer connection conductor.

  Next, the shield tape 60 is affixed to the bent portion 102 (the portion to be used at the time of installation) of the dielectric body that is a laminate.

  Next, metal plating is applied to the exposed conductor patterns, that is, the portions of the first ground conductor 50 and the second ground conductor 40 that are not covered with the shield tape 60 (S104).

  In this way, by performing metal plating after the shielding tape 60 is applied, only the portions of the first ground conductor 50 and the second ground conductor 40 that are not covered with the shielding tape 60 are easily subjected to metal plating. Can do.

  When the protective film 80 is disposed, the protective film 80 may be attached after forming the laminated body. The protective film is made of the same material as the dielectric sheet, and the protective film is formed at the time of lamination and thermocompression bonding. Also good. In this case, the shield tape 60 may be attached to the dielectric sheet before lamination.

  Next, a resin substrate according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a partial side view of an electronic apparatus including a resin substrate according to the second embodiment of the present invention. In FIG. 5, the resin substrate shows a cross-sectional view. FIG. 6 is a side cross-sectional view of a resin substrate according to the second embodiment of the present invention. FIG. 7 is an exploded plan view of a resin substrate according to the second embodiment of the present invention.

  The resin substrate 10A according to the present embodiment is a shield tape 60A attached to the first ground conductor 50A, the second ground conductor 40A, and the first ground conductor 50A side with respect to the resin substrate 10 according to the first embodiment. The configuration differs. Other configurations are the same as those of the resin substrate 10 according to the first embodiment.

  The first ground conductor 50A does not include a conductor non-forming portion, and is continuous along the first direction of the resin substrate 10A. In other words, the first ground conductor 50A is formed on all of the plurality of flat portions 101 and the plurality of bent portions 102 of the resin substrate 10A.

  The second ground conductor 40A does not include a conductor non-forming portion, and is continuous along the first direction of the resin substrate 10A. In other words, the second ground conductor 40A is formed on all of the plurality of flat portions 101 and the plurality of bent portions 102 of the resin substrate 10A.

  A shield tape 60 </ b> A is disposed at the bent portion 102 on the first ground conductor 50 </ b> A side of the dielectric body 20.

  The shield tape 60 </ b> A on the first ground conductor 50 </ b> A side has a shape that covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50 </ b> A disposed in the bent portion 102. The shield tape 60A does not cover the opening 54 of the first ground conductor 50A. The shield tape 60 </ b> A has a shape that reaches both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20.

  The shield tape 60 on the second ground conductor 40A side is the same as that of the resin substrate 10 according to the first embodiment, but covers the second ground conductor 40A formed in the bent portion 102.

  Even with such a configuration, similarly to the first embodiment, it is possible to realize the resin substrate 10A having high resistance to cracking during bending and excellent electromagnetic shielding properties. Furthermore, in the resin substrate 10A of the present embodiment, since the ground conductor and the shield tape are laminated at the bent portion 102, the strength of the bent portion 102 can be improved. Even if the first or second ground conductor is broken at the bent portion, the ground function and the shield function can be ensured by the shield tape.

  In the present embodiment, even if the portions of the first ground conductor 50A and the second ground conductor 40A that are not covered with the shield tapes 60 and 60A are plated with metal, the covered portions are subjected to metal plating. Preferably not. Accordingly, it is possible to realize a resin substrate 10A that is excellent in environmental resistance, is easy to bend, and is not easily broken.

  Next, a resin substrate according to a third embodiment will be described with reference to the drawings. FIG. 9 is a plan view showing the configuration of the surface of the resin substrate according to the third embodiment of the present invention on the first ground conductor side.

  The resin substrate 10B according to the present embodiment is different from the resin substrate 10A according to the second embodiment in the configuration of the shield tape 60B on the first ground conductor 50B side. Other configurations are the same as those of the resin substrate 10A according to the second embodiment.

  The shield tape 60 </ b> B has a shape that covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50 </ b> B disposed in the bent portion 102. The shield tape 60B does not cover the opening 54 of the first ground conductor 50B. The shield tape 60B does not reach both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20. The shield tape 60B has a shape that reaches the end 511 of the long conductor 51 in the second direction. The end portion 511 is an end portion of the long conductor 51 on the end portion 23 side of the dielectric element body 20. The shield tape 60B has a shape that reaches the end 521 of the long conductor 52 in the second direction. The end 521 is an end of the long conductor 52 on the end 24 side of the dielectric body 20.

  Even with such a configuration, similarly to the second embodiment, it is possible to realize the resin substrate 10B having high resistance to cracking during bending and excellent electromagnetic shielding properties.

  Next, a resin substrate according to a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 10 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the fourth embodiment of the present invention.

  The resin substrate 10C according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60C on the first ground conductor 50C side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.

  The shield tape 60 </ b> C has a shape that covers the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50 </ b> C disposed in the bent portion 102. The shield tape 60C also covers the opening 54 of the first ground conductor 50C.

  Even with such a configuration, similarly to the third embodiment, it is possible to realize the resin substrate 10 </ b> C having high resistance to cracking during bending and excellent electromagnetic shielding properties.

  Next, a resin substrate according to a fifth embodiment of the present invention will be described with reference to the drawings. FIG. 11 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the fifth embodiment of the present invention.

  The resin substrate 10D according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60D on the first ground conductor 50D side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.

  The shield tape 60 </ b> D has a shape that covers the long conductors 51 and 52 of the first ground conductor 50 </ b> D disposed in the bent portion 102. The shield tape 60D does not cover the bridge conductor 53 of the first ground conductor 50D disposed in the bent portion 102. That is, the shield tape 60D is disposed only in a portion where the length in the second direction of the first ground conductor 50D is shorter than the length in the first direction.

  As shown in the resin substrate 10 in FIG. 1, the resin substrate 10 </ b> D is bent at a midpoint in the first direction so that a crease is formed in the second direction. Therefore, the part where the length in the second direction is shorter than the length in the first direction is likely to be divided. For this reason, by using the shield tape 60D of this embodiment, the division of the first ground conductor 50D in which the length in the second direction is shorter than the length in the first direction is suppressed, and the electrical conduction state is maintained. be able to. Moreover, the shield tape 60D can be made small by using the configuration of the present embodiment.

  Next, a resin substrate according to a sixth embodiment of the present invention will be described with reference to the drawings. FIG. 12 is a plan view showing the configuration of the surface on the first ground conductor side of the resin substrate according to the sixth embodiment of the present invention.

  The resin substrate 10E according to the present embodiment is different from the resin substrate 10B according to the third embodiment in the configuration of the shield tape 60E on the first ground conductor 50E side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.

  The shield tape 60 </ b> E is disposed on the surfaces of the long conductors 51 and 52 and the bridge conductor 53 of the first ground conductor 50 </ b> E disposed in the bent portion 102. The width of the shield tape 60 </ b> E is narrower than the widths of the long conductors 51 and 52 and the bridge conductor 53. Here, the widths of the long conductors 51 and 52 and the bridge conductor 53 mean the shorter one of the length in the first direction and the length in the second direction.

  Even with such a configuration, even if a crack occurs in the first ground conductor 50E, the progress of the crack can be suppressed by the shield tape 60E, and the electrical conduction state can be maintained.

  Next, a resin substrate according to a seventh embodiment of the present invention will be described with reference to the drawings. FIG. 13 is a plan view showing the configuration of the surface on the second ground conductor side of the resin substrate according to the seventh embodiment of the present invention.

  The resin substrate 10F according to the present embodiment is different from the resin substrate 10A according to the second embodiment in the configuration of the shield tape 60F on the second ground conductor 40F side. Other configurations are the same as those of the resin substrate 10B according to the third embodiment.

  The shield tape 60F has a shape that covers the second ground conductor 40F disposed in the bent portion 102. The shield tape 60F does not reach both end portions 23 and 24 in the second direction (width direction) of the dielectric body 20. The shield tape 60F has a shape that reaches the end 411 of the second ground conductor 40F in the second direction. The end portion 411 is an end portion on the end portion 23 side of the dielectric body 20 in the second ground conductor 40F. The shield tape 60F has a shape that reaches the end 421 of the second ground conductor 40F in the second direction. The end portion 421 is an end portion on the end portion 24 side of the dielectric body 20 in the second ground conductor 40F.

  Next, a resin substrate according to an eighth embodiment of the present invention will be described with reference to the drawings. FIG. 14 is a plan view showing the configuration of the surface on the second ground conductor side of the resin substrate according to the eighth embodiment of the present invention.

  The resin substrate 10G according to the present embodiment is different from the resin substrate 10F according to the sixth embodiment in the configuration of the shield tape 60G on the second ground conductor 40G side. Other configurations are the same as those of the resin substrate 10F according to the sixth embodiment.

  The shield tape 60G is disposed on the surface of the second ground conductor 40G disposed in the bent portion 102. The length of the shield tape 60G in the second direction is narrower than the length of the second ground conductor 40G in the second direction.

  Even if it is such a structure, even if a crack generate | occur | produces in the 2nd ground conductor 40G, the progress of this crack can be suppressed with the shield tape 60G, and an electrical continuity state can be maintained.

  In addition, the structure of each above-mentioned embodiment can be combined suitably.

  In the above-described embodiments, the first ground conductor has the opening. However, both the first ground conductor and the second ground conductor may have a shape having no opening. In this case, the shield tape attached to the first ground conductor may be the same shape as the shield tape attached to the second ground conductor.

  Further, in each of the above-described embodiments, the configuration of the stripline is shown, but the configuration of a microstripline may be used. In this case, the resin substrate may not be a multilayer substrate in which a plurality of dielectric sheets are laminated, but may be a single layer substrate in which a conductor pattern is formed on the front and back surfaces. In the case of a single-layer substrate, a signal conductor may be disposed on the front surface and a ground conductor may be disposed on the back surface.

  In each of the above-described embodiments, the example in which the shield tape is disposed on the front surface and the back surface of the dielectric element body has been described. However, the shield tape may be disposed only on the front surface or only on the back surface.

  Furthermore, a shield tape may be arranged so as to be wrapped around the side surface of the dielectric body. In this configuration, the shield tape can also function as an interlayer connection conductor.

  Moreover, in the above-mentioned description, the aspect which arrange | positions a shield tape with respect to all the bending parts in a resin substrate was shown. However, when the resin substrate has a plurality of bent portions and curved portions, and there are bent portions and curved portions to the extent that the ground conductor does not break, the shielding tape for these portions can be omitted. That is, the resin substrate can be bent or curved at a location where the shield tape is not disposed, as long as the ground conductor is not cracked.

  In the above description, a long resin substrate is shown. However, the above-described bending is also applied to a resin substrate that is not long, such as a resin substrate having a small difference in length in two directions perpendicular to the thickness direction. The configuration of the part can be applied.

10, 10A, 10B, 10C, 10D, 10E, 10F, 10G: Resin substrate 20: Dielectric body 30: Signal conductors 40, 40A, 40F, 40G: Second ground conductors 45, 46: Conductor non-forming portion 50, 50A, 50B, 50C, 50D, 50E: first ground conductor 51, 52: long conductor 53: bridge conductor 54: opening 55, 56: conductor non-formation part 60, 60A, 60B, 60C, 60D, 60E, 60F 60G: Shield tape 61: Conductive adhesive 62: Metal foil 80: Protective film 91, 92: Connector 101: Flat part 102: Bent part 201, 202, 203: Dielectric sheet 220: Interlayer connection conductor 400, 500: Conductor non-forming portion 600: Release sheet 611: Adhesive 612: Conductive particles 711, 712: Connector conductors 721, 722: Interlayer connection conductor 10,920: the circuit board 911 and 921: connector 912,913,922: mount components

Claims (9)

A foldable dielectric element;
A flat film ground conductor formed on the dielectric body;
A shield tape that is disposed in the bent portion of the dielectric body and is electrically connected to the ground conductor and has electromagnetic shielding properties;
With
The ground conductor is
Having at least one opening,
A portion of the opening covered by the shield tape and a portion not covered;
The said bent portion said shield tape is arranged,
Resin substrate.   The resin substrate according to claim 1, wherein the dielectric element body has a long shape.   In the bent portion where the shield tape is arranged,
  The length in the width direction of the ground conductor is shorter than the length in the width direction of the opening,
  The resin substrate according to claim 2. The shield tape is
A conductive adhesive whose back surface is in contact with the dielectric element body or the ground conductor;
A metal foil disposed on the surface of the conductive adhesive;
The resin substrate in any one of Claims 1 thru | or 3 provided with these. The end of the shield tape in the width direction of the dielectric body overlaps the end of the ground conductor in the width direction of the dielectric body,
The resin substrate according to claim 1 . A signal conductor disposed apart from the ground conductor at a middle position in the thickness direction of the dielectric body,
The resin substrate according to any one of claims 1 to 5 . The ground conductor includes a first ground conductor and a second ground conductor at a position sandwiching the signal conductor in a thickness direction of the dielectric body,
The shield tape is disposed on each of the first ground conductor and the second ground conductor,
The resin substrate according to claim 6 . The portion exposed to the outer surface of the dielectric element body in the ground conductor and the portion not covered with the shield tape is subjected to metal plating.
A resin substrate according to any one of claims 1 to 7. A method for producing a resin substrate comprising a plurality of dielectric sheets and a bent portion,
Forming a ground conductor on a predetermined dielectric sheet;
Laminating and crimping the plurality of dielectric sheets to form a dielectric body; and
A step of attaching a shield tape to a portion that can be the bent portion;
And performing metal plating on the ground conductor which is not covered with the shielding tape in said dielectric body, wherein the shielding tape is stuck,
The manufacturing method of the resin substrate which has.

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