CN105578723A - Flexible printed circuit and mobile terminal - Google Patents
Flexible printed circuit and mobile terminal Download PDFInfo
- Publication number
- CN105578723A CN105578723A CN201511028966.7A CN201511028966A CN105578723A CN 105578723 A CN105578723 A CN 105578723A CN 201511028966 A CN201511028966 A CN 201511028966A CN 105578723 A CN105578723 A CN 105578723A
- Authority
- CN
- China
- Prior art keywords
- extension
- flexible pcb
- substrate
- cover layer
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 5
- 238000000926 separation method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 230000002787 reinforcement Effects 0.000 abstract 5
- 239000000725 suspension Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- -1 PI) Polymers 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/053—Tails
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a flexible printed circuit. The flexible printed circuit comprises a substrate, a cover layer and a reinforcement plate, wherein the cover layer covers the surface of the substrate, the reinforcement plate is attached onto the surface, far away from the substrate, of the cover layer, the cover layer comprises a main body and an extension part, the main body is arranged between the substrate and the reinforcement plate, and the extension part is arranged outside the edges of the substrate and the reinforcement plate in a suspension way and used for separating the flexible printed circuit from other parts. With a method of arranging the extension part on the cover layer in contact with the reinforcement plate, the flexible printed circuit is separated from the other parts, separation can be proceeded by grapping the extension parts, the flexible printed circuit is prevented from being damaged during separation by a tool, and the technical effect of convenient separation is achieved.
Description
Technical field
The present invention relates to a kind of flexible PCB FPC (FlexiblePrintedCircuit) field, in particular, what improvement related to is a kind of flexible PCB and mobile terminal of facilitating separation.
Background technology
The arriving of digital Age, makes the dependence of the mankind to electronic product grow with each passing day.And in order in response to high-speed, the high-effect and compact requirement of electronic product now, there is the flexible PCB (FlexiblePrintedCircuit of flexural property; FPC), apply in various electronic installation in a large number, such as: all types of display, notebook, mobile phone, digital camera, personal digital assistant (PDA), printer and CD-ROM drive etc.
In prior art, FPC is normally pasted onto on the housing of mobile terminal by viscose glue by FPC in installation fixation procedure, when needing to change the position of FPC and maybe will taking off FPC, due to FPC by applied solid on housing, the instrument of so there is no is difficult to take off.By instrument (such as tweezers) if careless manipulation when taking off, FPC often can be poked by instrument, causes internal circuit that fracture or disrepair phenomenon may occur, finally causes the system failure.Simultaneously because the fault zone of this some is atomic little, naked eyes are not easily discovered, and also the maintenance personal made or user are difficult to detect, make the process of reparation occur obstacle.
Summary of the invention
The object of the present invention is to provide a kind of just can from the flexible PCB under housing is separated without the need to aid.
Another object of the present invention is to provide a kind of mobile terminal adopting above-mentioned flexible PCB.
To achieve these goals, embodiment of the present invention provides following technical scheme:
The invention provides a kind of flexible PCB, comprise substrate, cover cover layer and the stiffening plate of described substrate surface, described stiffening plate is attached at the surface away from described substrate of described cover layer, described cover layer comprises main body and extension, described main body is arranged between described substrate and described stiffening plate, described extension is suspended in the outside at described substrate and described stiffening plate edge, and described extension is for being separated described flexible PCB from miscellaneous part.
Wherein, the junction between described extension with described main body is that arc transition is connected.
Wherein, on the direction being parallel to the junction between described extension and described main body, the length that described extension extends is 3mm; On the direction perpendicular to the junction between described extension and described main body, the length that described extension extends is 5mm.
Wherein, described extension comprises the first extension and the second extension, and described first extension and described second extension are that 180 ° of directions are staggered and are distributed in the both sides of described substrate.
Wherein, described flexible PCB comprises two ends and two sides, described two sides are relatively arranged on the both sides of described two ends, and are connected between described two ends, and described first extension and described second extension lay respectively on described two sides.
Wherein, described flexible PCB comprises two ends and two sides, described two sides are relatively arranged on the both sides of described two ends, and are connected between described two ends, and described first extension and described second extension lay respectively on described two ends.
Wherein, described extension is pasted onto the side away from described stiffening plate of described substrate.
Wherein, described tectal material comprises flexible resin.
Wherein, the material of described flexible circuit board substrate comprises pi resin composite material.
The present invention also provides a kind of mobile terminal, comprises the flexible PCB described in above-mentioned any one.
Embodiment of the present invention tool has the following advantages or beneficial effect:
By being the method cover layer that described stiffening plate contacts being arranged extension in the present invention, achieve when flexible PCB is separated from peculiar parts, can be separated by catching described extension, the object of described flexible PCB can be damaged when avoiding use instrument to be separated, reach the convenient technique effect be separated.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flexible circuit board structure schematic diagram of first embodiment of the invention;
Fig. 2 is the A-A schematic cross-section of the flexible PCB had described in Fig. 1;
Fig. 3 is the flexible circuit board structure schematic diagram of second embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1 and Fig. 2, flexible PCB of the present invention comprises substrate 10, first cover layer 11, second cover layer 12 and stiffening plate 13, described first cover layer 11 covers described substrate 10 front, described second cover layer 12 covers described substrate back, described stiffening plate 13 is attached to outside described second cover layer 12, described second cover layer 12 comprises main body (unnumbered) and extension 120, described main body is arranged between described substrate 10 and described stiffening plate 13, and described extension 120 is suspended in outside the edge of described substrate 10 and described stiffening plate 13.Described stiffening plate 13 not only can be used for strengthening the intensity of described flexible PCB, also by binding agent, stiffening plate 13 bond, to fix described flexible PCB with the housing of equipment is fixing in the present invention.The effect of described extension 120 is, when needing flexible PCB to be separated from the housing of equipment, can realize by capturing extension 120, thus eliminate the use of separating tool (such as tweezers), thus avoid in separation process, separating tool scratches FPC, causes the generation that flexible PCB internal break, bad connection etc. are abnormal.
Concrete, refer to Fig. 1, described flexible PCB comprises two ends 101 and two sides 102 being connected described two ends, and namely described two sides 102 are relatively arranged on the both sides of described two ends 101, and is connected between described two ends.Described extension 120 comprises the first extension 121 and the second extension 122, and described first extension 121 and described second extension 122 lay respectively on two sides.Namely described first extension 121 and described second extension 122 are arranged on different sides.Preferred further, described first extension 121 and described second extension 121 are staggered in 180 ° of directions, i.e. described first extension 121 and described second extension 122 distribution in diagonally opposing corner as far as possible, the phenomenon concentrated with relieve stresses.
Further, because extension 120 is the position that in flexible PCB, the second cover layer 12 extends out.Can by the substrate 10 of the inside of extension 120 be removed, only the second cover layer 12 of retention surface, thus can ensure that extension 120 has good suppleness, bending can be realized.After the stiffening plate 13 of flexible PCB fits to the housing of equipment, and described flexible PCB install fixing after, extension 120 can be bent 180 ° according to demand, the mode of being pasted by glue fits on the first cover layer 11, and namely described extension 120 can be pasted onto the side away from described stiffening plate of described substrate 10 by glue.Make extension 120 not occupy product space, thus subtract the volume of flexible PCB.When needs are separated flexible PCB, extension 120 can be taken off from stiffening plate, then catch extension 120, the housing of flexible PCB from equipment is separated.
Further, in order to prevent the stress of extension 120 and the second cover layer 12 main body junction from concentrating, the junction between extension 120 and the main body of described second cover layer 12 can be connected by arc transition, to disperse the stress of junction.
In a preferred embodiment, the length of described extension 120 is 5mm (the m size namely in Fig. 2), and wide is 3mm (the n size namely in Fig. 2).In other words, the length of described extension on the direction being parallel to the junction between described extension and described main body is 3mm, and described extension length on the direction perpendicular to the junction between described extension and described main body is 5mm.In the present embodiment, specifically define the length and width of extension, the extension under these length and width had both facilitated user to pull out button, and flexible circuit plate bulk can not be caused again too large.
More preferably, the substrate 10 described in leading portion can comprise pi resin composite material.
Further, described substrate 10 also comprises copper foil layer (scheming not shown), copper foil layer is that 5 ~ 50 μm of rolled copper foils or electrolytic copper foil form by thickness.
Further, described cover layer generally comprises flexible resin, such as polyimides (Polyimide, PI), PETG (PolyethyleneTerephthalate, PET) or PEN (PolyethyleneNaphthalate, PEN) make.Namely described first extension 121 and described second extension 122 can comprise flexible resin, and thickness can select 0.04 ~ 0.05mm.With under the flexible prerequisite of guarantee, reduce tectal thickness.Described cover layer is bonded on copper foil layer on the substrate by viscose glue, then realizes strong bonded by hot pressing.Further, described stiffening plate 13 can use the nonmetal plate of some strength, or uses the corrosion resistant plate of more than thickness 0.1mm, aluminium sheet and have the metal alloy plate of some strength.Described stiffening plate 13 can be fixed on described cover layer 12 by melting welding or be adhesively fixed.
Refer to Fig. 3, the distinctive points of the present embodiment and first embodiment is, described extension 220 is arranged on two ends 101 of described flexible PCB, described extension 220 comprises the first extension 221 and the second extension 222, first extension 221 and the second extension 222 and splits on two ends 101.In other words, namely described first extension 221 and the second extension 222 are arranged on different ends.
Preferred further, described first extension 221 and the second extension 222 are staggered in 180 ° of directions, i.e. described first extension 221 and described second extension 222 distribution in diagonally opposing corner as far as possible, the phenomenon concentrated with relieve stresses.
The present invention also provides a kind of mobile terminal adopting above-mentioned flexible PCB, and described mobile terminal can be mobile phone, panel computer, television set, display, notebook computer, DPF, navigator etc.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a flexible PCB, it is characterized in that, comprise substrate, cover cover layer and the stiffening plate of described substrate surface, described stiffening plate is attached at the surface away from described substrate of described cover layer, described cover layer comprises main body and extension, described main body is arranged between described substrate and described stiffening plate, and described extension is suspended in the outside at described substrate and described stiffening plate edge, and described extension is for being separated described flexible PCB from miscellaneous part.
2. flexible PCB as claimed in claim 1, it is characterized in that, the junction between described extension with described main body is that arc transition is connected.
3. flexible PCB as claimed in claim 2, is characterized in that, on the direction being parallel to the junction between described extension and described main body, the length that described extension extends is 3mm; On the direction perpendicular to the junction between described extension and described main body, the length that described extension extends is 5mm.
4. flexible PCB as claimed in claim 1, it is characterized in that, described extension comprises the first extension and the second extension, and described first extension and described second extension are that 180 ° of directions are staggered and are distributed in the both sides of described substrate.
5. flexible PCB as claimed in claim 4, it is characterized in that, described flexible PCB comprises two ends and two sides, described two sides are relatively arranged on the both sides of described two ends, and being connected between described two ends, described first extension and described second extension lay respectively on described two sides.
6. flexible PCB as claimed in claim 4, it is characterized in that, described flexible PCB comprises two ends and two sides, described two sides are relatively arranged on the both sides of described two ends, and being connected between described two ends, described first extension and described second extension lay respectively on described two ends.
7. flexible PCB as claimed in claim 1, it is characterized in that, described extension is pasted onto the side away from described stiffening plate of described substrate.
8. flexible PCB as claimed in claim 1, it is characterized in that, described tectal material comprises flexible resin.
9. flexible PCB as claimed in claim 1, it is characterized in that, the material of described substrate comprises pi resin.
10. a mobile terminal, is characterized in that, comprises the flexible PCB described in claim 1-9 any one.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511028966.7A CN105578723B (en) | 2015-12-29 | 2015-12-29 | A kind of flexible PCB and mobile terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201511028966.7A CN105578723B (en) | 2015-12-29 | 2015-12-29 | A kind of flexible PCB and mobile terminal |
Publications (2)
Publication Number | Publication Date |
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CN105578723A true CN105578723A (en) | 2016-05-11 |
CN105578723B CN105578723B (en) | 2018-07-06 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201511028966.7A Expired - Fee Related CN105578723B (en) | 2015-12-29 | 2015-12-29 | A kind of flexible PCB and mobile terminal |
Country Status (1)
Country | Link |
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CN (1) | CN105578723B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108575047A (en) * | 2018-06-06 | 2018-09-25 | 江苏聚泰科技有限公司 | A kind of FPC wiring boards for touch screen |
CN113093877A (en) * | 2021-04-08 | 2021-07-09 | 浪潮商用机器有限公司 | Memory card protection device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1041594A (en) * | 1996-07-23 | 1998-02-13 | Toshiba Corp | Flexible printed circuit board |
CN201550355U (en) * | 2009-09-28 | 2010-08-11 | 苏州达方电子有限公司 | Thin film circuit board and keyboard thereof |
CN103501576A (en) * | 2013-09-30 | 2014-01-08 | 扬州华盟电子有限公司 | Flexible circuit board for LED (Light Emitting Diode) LCD (Liquid Crystal Display) |
CN203883175U (en) * | 2014-06-06 | 2014-10-15 | 广东欧珀移动通信有限公司 | Btb connector |
-
2015
- 2015-12-29 CN CN201511028966.7A patent/CN105578723B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1041594A (en) * | 1996-07-23 | 1998-02-13 | Toshiba Corp | Flexible printed circuit board |
CN201550355U (en) * | 2009-09-28 | 2010-08-11 | 苏州达方电子有限公司 | Thin film circuit board and keyboard thereof |
CN103501576A (en) * | 2013-09-30 | 2014-01-08 | 扬州华盟电子有限公司 | Flexible circuit board for LED (Light Emitting Diode) LCD (Liquid Crystal Display) |
CN203883175U (en) * | 2014-06-06 | 2014-10-15 | 广东欧珀移动通信有限公司 | Btb connector |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108575047A (en) * | 2018-06-06 | 2018-09-25 | 江苏聚泰科技有限公司 | A kind of FPC wiring boards for touch screen |
CN108575047B (en) * | 2018-06-06 | 2023-10-03 | 江苏聚泰科技有限公司 | FPC circuit board for touch screen |
CN113093877A (en) * | 2021-04-08 | 2021-07-09 | 浪潮商用机器有限公司 | Memory card protection device |
Also Published As
Publication number | Publication date |
---|---|
CN105578723B (en) | 2018-07-06 |
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
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CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180706 |