CN107623982A - Flexible PCB and its laser cutting method - Google Patents
Flexible PCB and its laser cutting method Download PDFInfo
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- CN107623982A CN107623982A CN201710724343.6A CN201710724343A CN107623982A CN 107623982 A CN107623982 A CN 107623982A CN 201710724343 A CN201710724343 A CN 201710724343A CN 107623982 A CN107623982 A CN 107623982A
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- flexible pcb
- layer
- substrate
- pet film
- strengthening course
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Abstract
The present invention provides a kind of flexible PCB and its laser cutting method, flexible PCB includes the substrate layer and strengthening course being stacked, side of the substrate layer away from the strengthening course is provided with photopolymer layer, photopolymer layer is filled to the gap of flexible circuit plate surface, the flexible PCB of this structure can remove photopolymer layer after being cut by laser, it can be effectively prevented from because of carbon black caused by laser cutting, and the cutting efficiency of the flexible PCB of this structure is high, processing efficiency can be effectively improved, reduces cost.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to a kind of flexible PCB and its laser cutting method.
Background technology
Flexible PCB (Flexible Printed Circuit Board, FPCB) is made of the insulating substrate of flexibility
Printed circuit, there is many rigid printed circuit boards the advantages of not possessing.For example, FPCB can free bend, winding, folding,
Any arrangement can be required according to space layout.The volume of electronic product can be substantially reduced using FPCB, is applicable electronic product to height
The needs that density, miniaturization, high reliability direction are developed.Therefore, FPCB is in space flight, military affairs, mobile communication, laptop computer, meter
It is widely used on the fields such as calculation machine peripheral hardware, PDA, digital camera or product.Flexible PCB generally use laser is cut
The mode cut is processed, the PET that is generally sticked in the prior art on FPCB surface (Polythylene terephthalate,
Polyethylene terephthalate) film, then it is cut by laser, is taken off PET film after cutting, however, this method is processed
FPCB out easily produces carbon black in edge because of laser cutting, and cutting efficiency is low, influences the processing efficiency of product.
Therefore, it is necessary to provide a kind of laser cutting method of new flexible PCB and flexible PCB in fact, to keep away
Exempt from drawbacks described above.
The content of the invention
A kind of method that the technical problem to be solved in the invention is to provide flexible PCB and its laser cutting, with solution
Certainly the circuit board of prior art produces the problem of carbon black in process.
In order to solve the above technical problems, the invention provides a kind of flexible PCB, including the substrate layer being stacked and
Strengthening course, the strengthening course are arranged on any side surface of the substrate layer, the substrate layer away from the strengthening course one
Side is provided with photopolymer layer.
Preferably, the substrate layer includes substrate and is sticked in the cover layer of the substrate two sides.
Preferably, the substrate is Double-sided copper clad laminate.
Preferably, the Double-sided copper clad laminate includes two layers of calendering layers of copper and is located in poly- between two layers of calendering layers of copper
Acid imide film layer.
Preferably, the cover layer is made up of polyimides material.
Preferably, the photopolymer layer is the film layer made of be in the light glue or resin, and the thickness of the photopolymer layer arrives for 40
60μm。
Preferably, the strengthening course is made up of polyimides material, and the thickness of the strengthening course is 90 to 110 μm.
Preferably, side of the photopolymer layer away from the substrate layer is provided with PET film.
To solve the above problems, the present invention also provides a kind of laser cutting method of flexible PCB, it is characterised in that adopts
With flexible PCB as described above, comprise the following steps：
Using PET film as substrate, fold that to set photopolymer layer, substrate layer and strengthening course soft to be formed successively in the PET film
Property circuit board；
The flexible PCB row stacked on a pet film is cut by laser；
Remove PET film and photopolymer layer.
Preferably, the flexible PCB for posting PET film is carried out in laser cutting step, the flexible PCB is carried out
Fully separating formula cutting, half-separation type cutting is carried out to the PET film of flexible circuit plate surface.
Compared to prior art, flexible PCB of the invention includes the substrate layer and strengthening course being stacked, the base
Side of the material layer away from the strengthening course is provided with photopolymer layer, and photopolymer layer is filled to the gap of flexible circuit plate surface, this
The flexible PCB of kind structure can remove photopolymer layer after being cut by laser, and can be effectively prevented from because laser cutting
Caused by carbon black, and the cutting efficiency of the flexible PCB of this structure is high, can effectively improve processing efficiency, reduce into
This.
Brief description of the drawings
Fig. 1 is the structural representation of flexible PCB of the present invention.
Embodiment
Below in conjunction with drawings and embodiments, the invention will be further described.
Shown in reference picture 1, the present invention provides a kind of flexible PCB, including substrate layer 1, strengthening course 2, photopolymer layer 3 and PET
Film 4.
Strengthening course 2 and photopolymer layer 3 are located at the both sides of substrate layer 1 respectively, and PET film 4 is sticked in photopolymer layer 3 away from substrate layer 1
Side.Strengthening course 2 is adhesively fixed with substrate layer 1 by glue-line.
Strengthening course 2 is that PI (Polyimide, polyimides) material is made, and the thickness of strengthening course 2 is 90 to 110 μm, preferably
, it is 100 μm in the present embodiment.By 20 to 30 μm of AD glue (acroleic acid hot melts between strengthening course 2 and substrate layer 1
Glue) formed glue-line be adhesively fixed, in the present embodiment, preferably 25 microns of AD glue-lines.
Photopolymer layer 3 is the film layer made of be in the light glue or resin, and the thickness of photopolymer layer 3 is 40 to 60 μm of, it is preferred that
In the present embodiment, it is 50um.
Substrate layer 1 includes substrate 11 and is sticked in the cover layer 12 of the two sides of substrate 11.Substrate 11 is Double-sided copper clad laminate,
The substrate 11 is Dagwood structure, specifically includes two layers of calendering copper and the PI films being located between two layers of calendering layers of copper
Layer.The glue-line bonding wherein formed between PI film layers and calendering copper using AD glue is into a single integrated structure, specifically in the present embodiment,
The thickness of AD glue-lines between PI film layers and calendering copper is 12 to 13 μm.
Cover layer 12 is made up of PI materials, and thickness is 12 to 13 μm.And cover layer 12 and substrate 11 are formed by AD glue
Glue-line is adhesively fixed, and the bondline thickness between cover layer 12 and substrate 11 is 15 μm.
PET film 4 is directly fitted on photopolymer layer 3, because PET film 4 possesses viscosity in itself, without being glued by bonding agent
Connect.Photopolymer layer 3 is also fixed with the cover layer 12 of substrate layer 1 by the way of being directly bonded, because cover layer 12 is PI materials
Matter, also possesses certain viscosity, without setting bonding agent to realize fixation in addition.But due to PET film 4 and photopolymer layer 3
Adhesion is more than the adhesion of cover layer 12 and photopolymer layer 3,, can be with by removing PET film after being processed to flexible PCB
Photopolymer layer 3 is removed in the lump.
Certainly, in selectable other embodiment, PET film can also be not provided with flexible PCB, but right
When flexible PCB is processed, one layer of PET film is attached temporarily, and can implement.
The present invention also provides a kind of laser cutting method of flexible PCB, comprises the following steps：
Using PET film as substrate, fold that to set photopolymer layer, substrate layer and strengthening course soft to be formed successively in the PET film
Property circuit board；
The flexible PCB stacked on a pet film is cut by laser, wherein to flexible PCB in addition to PET film
Part carries out fully separating formula cutting, carries out half-separation type cutting to the PET film of flexible circuit plate surface, i.e., PET film is not by laser
Cutting cut-out；
PET film is removed, and removes the photopolymer layer to be fitted with PET film in the lump by PET film.
So, it is possible to prevente effectively from flexible PCB caused edge carbon black after laser cutting, in addition, comparing existing
The processing mode of technology, processing efficiency can be significantly improved, according to experimental verification, 1200S/ bars that can be from the prior art
Processing speed is promoted to 500S/ bars.
Compared to prior art, flexible PCB of the invention includes the substrate layer and strengthening course being stacked, the base
Side of the material layer away from the strengthening course is provided with photopolymer layer, and photopolymer layer is filled to the gap of flexible circuit plate surface, this
The flexible PCB of kind structure can remove photopolymer layer after being cut by laser, and can be effectively prevented from because laser cutting
Caused by carbon black, and the cutting efficiency of the flexible PCB of this structure is high, can effectively improve processing efficiency, reduce into
This.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of flexible PCB, it is characterised in that including the substrate layer and strengthening course being stacked, the strengthening course is arranged on
Any side surface of the substrate layer, side of the substrate layer away from the strengthening course are provided with photopolymer layer.
2. flexible PCB according to claim 1, it is characterised in that the substrate layer includes substrate and is sticked described
The cover layer of substrate two sides.
3. flexible PCB plate according to claim 2, it is characterised in that the substrate is Double-sided copper clad laminate.
4. flexible PCB plate according to claim 3, it is characterised in that the Double-sided copper clad laminate includes two layers of calendering
Layers of copper and the polyimide film being located between two layers of calendering layers of copper.
5. flexible PCB plate according to claim 2, it is characterised in that the cover layer is polyimides material system
Into.
6. flexible PCB according to claim 1, it is characterised in that the photopolymer layer is by by being in the light glue or resin is made
Film layer, the thickness of the photopolymer layer is 40 to 60 μm.
7. flexible PCB according to claim 1, it is characterised in that the strengthening course is made up of polyimides material,
The thickness of the strengthening course is 90 to 110 μm.
8. according to the flexible PCB described in claim 1 to 7 any one, it is characterised in that the photopolymer layer is away from described
The side of substrate layer is provided with PET film.
9. a kind of laser cutting method of flexible PCB, it is characterised in that using as described in claim 1 to 7 any one
Flexible PCB, comprise the following steps：
Using PET film as substrate, folded successively in the PET film and set photopolymer layer, substrate layer and strengthening course to form flexible electrical
Road plate；
The flexible PCB stacked on a pet film is cut by laser；
Remove PET film and photopolymer layer.
10. the laser cutting method of flexible PCB according to claim 9, it is characterised in that to posting the soft of PET film
Property circuit board carry out in laser cutting step, fully separating formula cutting is carried out to the flexible PCB, to flexible circuit plate surface
PET film carry out half-separation type cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710724343.6A CN107623982A (en) | 2017-08-22 | 2017-08-22 | Flexible PCB and its laser cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710724343.6A CN107623982A (en) | 2017-08-22 | 2017-08-22 | Flexible PCB and its laser cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107623982A true CN107623982A (en) | 2018-01-23 |
Family
ID=61088679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710724343.6A Pending CN107623982A (en) | 2017-08-22 | 2017-08-22 | Flexible PCB and its laser cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107623982A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109164658A (en) * | 2018-09-30 | 2019-01-08 | Oppo广东移动通信有限公司 | Electrochromic device and preparation method thereof, casting of electronic device and electronic equipment |
| CN111730218A (en) * | 2020-06-23 | 2020-10-02 | 深圳市合川医疗科技有限公司 | Laser cutting method for microfluidic chip |
| CN115226317A (en) * | 2022-06-06 | 2022-10-21 | 嘉兴温良电子科技有限公司 | Process for preventing micro short circuit by windowing black protective film through laser cutting |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59178193A (en) * | 1983-03-29 | 1984-10-09 | Toshiba Corp | Laser working machine |
| JP2007514328A (en) * | 2003-12-18 | 2007-05-31 | インテル コーポレイション | Laser dicing method and apparatus |
| CN101098591A (en) * | 2006-06-26 | 2008-01-02 | 景硕科技股份有限公司 | Patterned method for tape coiling type thin object in automated process |
| CN105392283A (en) * | 2015-10-16 | 2016-03-09 | 广州杰赛科技股份有限公司 | Process for realizing no carbon black on pattern in laser edge-milling |
| CN106141451A (en) * | 2016-07-22 | 2016-11-23 | 京东方科技集团股份有限公司 | A kind of film assembly cutting method and device |
-
2017
- 2017-08-22 CN CN201710724343.6A patent/CN107623982A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59178193A (en) * | 1983-03-29 | 1984-10-09 | Toshiba Corp | Laser working machine |
| JP2007514328A (en) * | 2003-12-18 | 2007-05-31 | インテル コーポレイション | Laser dicing method and apparatus |
| CN101098591A (en) * | 2006-06-26 | 2008-01-02 | 景硕科技股份有限公司 | Patterned method for tape coiling type thin object in automated process |
| CN105392283A (en) * | 2015-10-16 | 2016-03-09 | 广州杰赛科技股份有限公司 | Process for realizing no carbon black on pattern in laser edge-milling |
| CN106141451A (en) * | 2016-07-22 | 2016-11-23 | 京东方科技集团股份有限公司 | A kind of film assembly cutting method and device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109164658A (en) * | 2018-09-30 | 2019-01-08 | Oppo广东移动通信有限公司 | Electrochromic device and preparation method thereof, casting of electronic device and electronic equipment |
| CN111730218A (en) * | 2020-06-23 | 2020-10-02 | 深圳市合川医疗科技有限公司 | Laser cutting method for microfluidic chip |
| CN115226317A (en) * | 2022-06-06 | 2022-10-21 | 嘉兴温良电子科技有限公司 | Process for preventing micro short circuit by windowing black protective film through laser cutting |
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Application publication date: 20180123 |