CN113242643B - Circuit board and display device - Google Patents
Circuit board and display device Download PDFInfo
- Publication number
- CN113242643B CN113242643B CN202110536754.9A CN202110536754A CN113242643B CN 113242643 B CN113242643 B CN 113242643B CN 202110536754 A CN202110536754 A CN 202110536754A CN 113242643 B CN113242643 B CN 113242643B
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- circuit board
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- rigid
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- 238000005452 bending Methods 0.000 claims abstract description 54
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 9
- 238000009825 accumulation Methods 0.000 abstract description 5
- 230000006835 compression Effects 0.000 abstract description 4
- 238000007906 compression Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The application discloses circuit board and display device, this circuit board include at least one deck flexible basic unit and the metal circuit layer of stromatolite setting, and this circuit board includes rigidity region and flexible region, and this rigidity region is located this flexible region both sides, is provided with the rigidity substrate on this rigidity region, and at least part this flexible region sets up to the wave structure, forms the region of buckling, and this wave structure extends to this rigidity region. According to the embodiment of the application, the integrated plate with the soft and hard structure is arranged, and at least part of the flexible area is arranged to be of the wavy structure so as to form the bending area, so that the circuit board can be folded, bent or flattened in-process, the wavy structure similar to a spring can be utilized, the accumulation and release of stress are realized through tiny stretching, compression and deformation, the higher bending times of the circuit board in the bending area are ensured, and the soft and hard integrated structure can avoid the strain of the soft board when being assembled, bending and pulling, so that the reliability of the circuit board in a folded product is improved.
Description
Technical Field
The present invention relates generally to the field of display technologies, and in particular, to a circuit board and a display device.
Background
The printed circuit board (Printed Circuit Board, PCB) is widely used as an aggregate of various electronic components for large-sized display products, and has an indispensable role in the display of a folding Notebook (NB). The requirement of the folding display on the popularity and the large size of the display screen is that a new requirement is put forward on the PCB, and if the requirement of the PCB can meet the working requirement, the PCB can be folded and can reach the bending times of more than one hundred thousand and twenty thousand times.
At present, two display surfaces of a folding NB are respectively bound with a PCB, and the two PCBs are connected with a flexible Connector (Bridge) through a Connector (Connector), so that the intercommunication of circuit information on the PCBs is realized.
With the structure, in the manufacturing process, each process inspection and the like needs to be carried out on the Bridge and the Connector, and damage is easily caused near the plugging positions of the Bridge and the Connector. In addition, because the arc length of the outer side film layer is larger than that of the inner side film layer in the bending state, when in the flattening state, the Bridge has an arc or is in a bulge state, and meanwhile, after being bent for many times along the central line, the Bridge continuously changes in the bending flattening state, so that the stress is continuously released and accumulated, and Bridge damage or Connector falling off are easily caused.
Disclosure of Invention
In view of the above-mentioned drawbacks or shortcomings in the prior art, it is desirable to provide a soft and hard integrated circuit board, which can ensure that the bending area of the PCB board can achieve a higher bending frequency by arranging the bending area into a wave structure, and avoid the soft board from being damaged by assembly and bending and pulling.
In a first aspect, an embodiment of the present application provides a circuit board, including at least one layer of flexible basic unit and metal circuit layer that the lamination set up, this circuit board includes rigid region and flexible region, and this rigid region is located this flexible region both sides, is provided with the rigidity substrate on this rigid region, and at least part this flexible region sets up to the wave structure, forms the region of buckling, and this wave structure extends to this rigid region.
In one implementation of this embodiment, the wave structure is uniformly disposed in the flexible region.
In one implementation manner of this embodiment, the peak at the middle position of the bending area is larger than the peak at the two side positions.
In one implementation manner of this embodiment, the wavelength at the middle position of the bending region is smaller than the wavelength at the two side positions.
In one implementation manner of this embodiment, the peak at the middle position of the bending region is larger than the peak at the two side positions, and the wavelength at the middle position of the bending region is smaller than the wavelength at the two side positions.
In one implementation manner of this embodiment, the circuit board further includes a supporting layer.
In one implementation of this embodiment, the supporting layer is disposed on a bottom layer of the circuit board.
In one implementation of this embodiment, the support layer is disposed between the metal circuit layer and the flexible base layer.
In one implementation manner of this embodiment, a through hole is formed in a position of the supporting layer, where the supporting layer is located in the bending region.
In one implementation manner of this embodiment, the through holes are circular or rectangular, and are distributed in a delta shape on the supporting layer.
In one implementation of this embodiment, the support layer is a SUS material layer.
In a second aspect, embodiments of the present application provide a display device including a circuit board as described in the first aspect.
To sum up, the embodiment of the application provides a circuit board, through setting up the integrative board of soft or hard structure, and set up the region of buckling with the area of partly flexible at least for the wave structure, thereby make this circuit board at folding bending or flattening in-process, can utilize the wave structure of similar spring, realize the accumulation and the release of stress with little tensile compression deformation, guarantee that the circuit board reaches higher bending times in the region of buckling, and, soft or hard integrated structure can avoid because the equipment and buckle when pulling, the strain of soft board has promoted the reliability of circuit board in the folding product.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings, in which:
FIG. 1 is a schematic diagram of a prior art circuit board;
fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a circuit board according to another embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a circuit board according to another embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a circuit board according to another embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a circuit board according to another embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a circuit board according to another embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a circuit board according to another embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a circuit board according to another embodiment of the present disclosure;
fig. 10 is a schematic cross-sectional structure of a circuit board according to an embodiment of the present disclosure;
fig. 11 is a schematic cross-sectional structure of a circuit board according to another embodiment of the present disclosure;
fig. 12 is a schematic structural diagram of a supporting layer of a circuit board according to an embodiment of the present disclosure;
fig. 13 is a schematic structural view of a supporting layer of a circuit board according to another embodiment of the present disclosure;
fig. 14 is a schematic structural diagram of a supporting layer of a circuit board according to another embodiment of the present disclosure.
Reference numerals illustrate:
1-rigid circuit board, 2-component area, 3-connecting bridge, 4-connector, 5-soft and hard combined circuit board, 6-wave structure, 7-PSA layer, 8-supporting layer, 9-flexible base layer, 10-metal circuit layer, 11-rigid base layer, 12-PSR layer, 13-component layer, and 14-through hole.
Detailed Description
The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the invention are shown in the drawings.
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
It will be appreciated that with the continued development of display technology, flexible circuit boards are increasingly in demand and in use, and flexible OLED displays offer more possibilities for the display industry. The PCB is used as an aggregate of various electronic components, and plays an indispensable role in folding NB display.
Fig. 1 and fig. 2 show a PCB board of an NB in the prior art, and it can be observed from the drawing that the connection Bridge has an extended design compared with the display module, that is, because the arc length of the outer film layer is greater than the arc length of the inner film layer in the bending state, when in the flattened state, the connection Bridge has an arc or is in a bulged state. In addition, when the NB product is used, the NB product is bent for a plurality of times along the central line, so that Bridge is continuously changed in a bending and flattening state, the stress of the Bridge is continuously released and accumulated, and Bridge damage or Connector falling off and the like are easily caused.
In order to ensure that the display device needing to be bent is in the bending process, the performance of the circuit board is not affected, the bending area is prevented from being uneven, the device performance is abnormal, the bending area of the integrated board is set to be in a wavy form through the PCB integrated board with soft and hard combination, the PCB board with the similar spring has good toughness and restorability, and the bending times of more than hundred thousand and twenty thousand times can be realized.
In addition, because of the integrated arrangement of the soft and hard, the connectors can be prevented from being damaged by inserting and pulling out, falling off and the like, and more convenience is provided for the realization of the folding display product.
For better understanding and explanation, the circuit board provided in the embodiment of the present application is described in detail below with reference to fig. 3 to 14.
Fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present application, and as shown in fig. 3, the circuit board may include:
the circuit board comprises a rigid region and flexible regions, wherein the rigid regions are positioned on two sides of the flexible region, a rigid substrate is arranged on the rigid region, at least part of the flexible regions are arranged into wave structures to form bending regions, and the wave structures extend towards the rigid regions.
Specifically, in the circuit board in this application embodiment, a soft and hard integrated board body structure is formed by mutually overlapping the flexible base layer and the metal circuit layer, namely, a soft and hard integrated PCB integrated board is further provided with the rigid base layer on a part of the soft and hard integrated circuit board to form a rigid area, and the rest is the flexible area.
It will be appreciated that the rigid region where the rigid substrate is disposed, i.e., the non-foldable region, and the remaining region where the rigid substrate is not disposed, is the flexible region, multiple folds may be made.
It is also understood that the rigid region may be disposed on either side of the flexible region, as in NB products. Alternatively, a plurality of sets of spacing structures for the rigid regions and the flexible regions may be provided to form a plurality of bending regions. This is limited by the embodiments of the present application.
In this embodiment of the present application, in order to avoid multiple folding and flattening processes along the central line of the bending area of the flexible area, a bulge state appears on the flexible area, and avoid that Bridge in the prior art is continuously changed in the state of bending and flattening, stress of Bridge is continuously released and accumulated, and the Bridge is damaged or Connector falls off, so that at least part of the flexible area is set to a wave structure along the central line, and the bending area is formed.
It will be appreciated that the wave structure extends towards the rigid areas of both sides, i.e. such that the direction of elongation of the crest connection lines, or trough connection lines, on the wave structure passes through the rigid areas of both sides for stress relief, as shown in fig. 6.
For example, as shown in fig. 2, the circuit board with integrated soft and hard is applied to a folding notebook computer, that is, the flexible base layers on two sides are provided with rigid base layers to form a rigid area, and a flexible area is arranged between the two rigid areas to realize folding. All or the middle part of the flexible area is provided with a wave structure to form a bending area, and the extending direction of the wave structure is perpendicular to the direction of the central line, so that the wave structure can be utilized to realize stress buffering similar to a spring when the circuit board is folded along the central line, and the normal performance of the circuit board in multiple folds is ensured.
Alternatively, the wave structures of the flexible region in embodiments of the present application may be configured to be uniformly distributed, or may be configured to be non-treated near the rigid region and configured to be wave structures near the centerline.
For example, as shown in fig. 4 and fig. 5, the wave structure is uniformly arranged in the flexible area, that is, the substrate in the flexible area is arranged in a uniform wave structure, that is, the substrate is arranged near the center, and the wave peaks and the wave troughs of the wave structure are consistent, and the wavelengths are consistent.
It can be appreciated that the wavelength and the peak size of the wave structure can be determined according to practical situations, and the embodiment of the application is not limited thereto.
Further, in the embodiment of the present application, in order to further improve bending performance, the peak, trough and wavelength of the wave structure may be adjusted.
For example, as shown in fig. 7, in order to improve the bending performance, the peak at the middle position of the bending region may be set to be larger than the peak at the two side positions, that is, the sizes of the peak and the trough of the wave structure far from the center line position are set to be gradually smaller than the sizes of the peak and the trough of the wave structure near the center line position, so that the wave structure near the center line position can play a better role in buffering when being folded along the center line.
For another example, as shown in fig. 8, in order to improve bending performance, the wavelength of the middle position of the bending region may be set smaller than the wavelength of the two side positions, and the wavelength of the wave structure near the center line position may be set to be gradually smaller than the wavelength of the wave structure far from the center line position, so that the wave structure at the center line position may play a better role in buffering when being folded along the center line, even if the concentration of the wave structure at the center line position is greater than that at the two side positions.
For example, as shown in fig. 9, in order to better improve the bending performance, the peak at the middle position of the bending region may be set to be larger than the peak at the two side positions, and the wavelength at the middle position of the bending region may be set to be smaller than the wavelength at the two side positions, that is, the sizes of the peak and the trough of the wave structure far from the center line position may be set to be gradually smaller than the sizes of the peak and the trough of the wave structure near the center line position; and the size of the wavelength of the wave structure close to the central line position can be set to be gradually smaller than the wavelength size of the wave structure far away from the central line position, so that the concentration of the wave structure at the central line position is higher than that at two sides, and the wave structure in the flexible area gradually changes in wave crest, wave trough and density, and can play a better buffering role when being folded along the central line.
Optionally, the rigid base layer in the embodiment of the present application may be a polyester film flexible copper-clad laminate or a polyimide film flexible copper-clad laminate, and the flexible substrate may be a paper substrate, a composite substrate, a glass fiber cloth substrate, a resin-coated copper foil (RCC), a metal substrate, a ceramic substrate, or the like.
It will be appreciated that the specific materials of the rigid substrate and the flexible substrate in the embodiments of the present application are not limited, and may be flexibly selected according to practical applications.
According to the circuit board, the rigid substrate is formed on the surface of the flexible substrate through the flexible integrated flexible substrate, the soft and hard combined integrated circuit board is formed, and the flexible area laminated structure without the rigid substrate is set to be of a wavy structure with gradually changed density, wave crest and wave trough, so that the circuit board can be folded, bent or flattened in the folding process by utilizing the wavy structure similar to a spring, the stress accumulation and release can be realized through tiny stretching, compression and deformation, the higher bending times of the circuit board in the flexible area can be ensured, and the damage to the circuit board due to the assembly, bending and pulling of the flexible board can be avoided, and the reliability of the circuit board in a folded product is improved.
Optionally, in this application embodiment, in order to improve stability and firmness of the circuit board, a supporting layer may be added to the flexible substrate, for example, the circuit board may be reinforced on a single side, or the supporting layer may be disposed in the middle of the circuit board, so that each film layer on two sides of the supporting layer is symmetrical.
For example, as shown in fig. 10, for convenience of the process, a supporting layer may be disposed at the bottom of the circuit board such that the supporting layer is exposed, and other flexible substrates, metal layer circuits, and other components are disposed at the other side of the supporting layer.
It can be understood that, in this embodiment, the supporting layer is disposed, and when the supporting layer is made of a metal material, grounding of the circuit board can also be achieved.
For example, as shown in fig. 11, the supporting layer may be disposed in the middle of the circuit board, so that when the circuits on two sides of the bending region are symmetrical, the stress on two sides in the bending process is relatively balanced, peeling is not easy to be caused, and the bending stability is higher.
Alternatively, the support layer in the embodiments of the present application may be a metal layer, such as an alloy having a property of being able to be prepared into a thin film and being not easily broken.
For example, a SUS301 material layer having a good performance may be selected.
Alternatively, the thickness of the support layer may be in the range 200 μm to 400 μm.
It will be appreciated that the location, material composition and thickness of the support layer may be determined according to practical situations, and the embodiments of the present application are not limited thereto.
Optionally, in this embodiment of the present application, in order to improve bending performance of the circuit board, a through hole may be formed on the supporting layer located in the bending area.
For example, as shown in fig. 12, circular through holes may be opened on the support layer such that the circular through holes are uniformly distributed.
For another example, as shown in fig. 13 and 14, rectangular through holes may be formed in the supporting layer, so that the through holes are arranged in a delta shape.
It can be appreciated that, for the specific shape and arrangement of the through holes, the through holes can be designed according to practical situations, and the embodiment of the application does not limit the specific shape and arrangement.
Alternatively, as shown, for components disposed in the rigid region, a PSA layer disposed in the rigid region of the bottom layer, such as a PSA disposed at the bottom of the support layer, or a PSA layer disposed at the bottom of the PSR layer, and a PSR layer and a rigid base layer disposed at the bottom of the component layer, may be included.
On the other hand, the embodiment of the application also provides a display device which is formed based on the soft and hard combined integrated PCB in the embodiment.
To sum up, the embodiment of the application provides a circuit board and display device, through setting up the intergral template of soft or hard structure, and set up the area of buckling for the area of buckling with the flexible area of at least part, thereby make this circuit board at folding bending or flattening in-process, can utilize the wave structure of similar spring, with the accumulation and release that the accumulation of tiny tensile compression deformation realized stress, guarantee that the circuit board reaches higher bending times in the area of buckling, and, soft or hard integrated structure can avoid because the equipment and buckle when pulling, the fracture of soft board has promoted the reliability of circuit board in the folding product. .
The foregoing description is only of the preferred embodiments of the present application and is presented as a description of the principles of the technology being utilized. It will be appreciated by persons skilled in the art that the scope of the invention referred to in this application is not limited to the specific combinations of features described above, but it is intended to cover other embodiments in which any combination of features described above or equivalents thereof is possible without departing from the spirit of the invention. Such as the above-described features and technical features having similar functions (but not limited to) disclosed in the present application are replaced with each other.
Claims (10)
1. The circuit board is characterized by comprising at least one flexible base layer and metal circuit layers which are arranged in a laminated manner, wherein the metal circuit layers on two sides of the circuit board are provided with rigid base layers, so that the circuit board is an integrated board comprising rigid areas and soft and hard combination of the flexible areas between the rigid areas; wherein the area provided with the rigid base layer is the rigid area, and the area not provided with the rigid base layer is the flexible area;
at least part of the flexible areas are arranged into wave structures to form bending areas, a plurality of groups of rigid areas and interval structures of the flexible areas form a plurality of bending areas, and the wave structures extend to the rigid areas on two sides along the central line of the flexible areas;
the circuit board also comprises a supporting layer, wherein the supporting layer is arranged opposite to the rigid areas and the flexible areas positioned between the rigid areas; wherein the support layer is a SUS material layer.
2. The circuit board of claim 1, wherein the wave structure is uniformly disposed in the flexible region.
3. The circuit board of claim 1, wherein the peak at the middle position of the bending region is larger than the peak at the two side positions.
4. The circuit board of claim 1, wherein the bending region has a wavelength at a middle position that is less than a wavelength at two side positions.
5. The circuit board of claim 1, wherein the peak at the middle position of the bending region is larger than the peak at the two side positions, and the wavelength at the middle position of the bending region is smaller than the wavelength at the two side positions.
6. The circuit board of claim 1, wherein the support layer is disposed on a bottom layer of the circuit board.
7. The circuit board of claim 1, wherein the support layer is disposed between the metal circuit layer and the flexible base layer.
8. The circuit board of claim 1, wherein the support layer is provided with a through hole at a position of the bending region.
9. The circuit board of claim 8, wherein the through holes are circular or rectangular and are distributed in a delta shape on the support layer.
10. A display device comprising a circuit board according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110536754.9A CN113242643B (en) | 2021-05-17 | 2021-05-17 | Circuit board and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110536754.9A CN113242643B (en) | 2021-05-17 | 2021-05-17 | Circuit board and display device |
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| CN113242643A CN113242643A (en) | 2021-08-10 |
| CN113242643B true CN113242643B (en) | 2024-01-16 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114596782B (en) * | 2022-03-17 | 2024-01-19 | 武汉华星光电半导体显示技术有限公司 | Folding screen equipment and flexible display module thereof |
| CN114859609B (en) * | 2022-06-22 | 2023-11-03 | 京东方科技集团股份有限公司 | Flexible circuit board, display device and preparation method of display device |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050102191A (en) * | 2004-04-21 | 2005-10-26 | 삼성전자주식회사 | Flexible printed circuit board |
| CN201585201U (en) * | 2010-01-28 | 2010-09-15 | 华为终端有限公司 | Electronic product with data connector and flexible printed circuit board |
| KR20140007560A (en) * | 2012-07-09 | 2014-01-20 | 하이디스 테크놀로지 주식회사 | Flexible printed circuit for prevention of crack |
| CN106207540A (en) * | 2016-08-03 | 2016-12-07 | 京东方科技集团股份有限公司 | A kind of flexible circuit board connector and electronic equipment |
| CN205864848U (en) * | 2016-08-01 | 2017-01-04 | 深圳市瑞通达精密线路板有限公司 | A kind of flexible circuit board with novel reinforced structure |
| CN106328599A (en) * | 2016-10-27 | 2017-01-11 | 上海天马微电子有限公司 | Flexible display device |
| CN206005000U (en) * | 2016-08-01 | 2017-03-08 | 深圳市瑞通达精密线路板有限公司 | A kind of multifunction flexible printed substrate |
| CN106796364A (en) * | 2014-08-30 | 2017-05-31 | 乐金显示有限公司 | Flexible display apparatus and its manufacture method including the distribution with strengthening part |
| CN107079579A (en) * | 2014-10-10 | 2017-08-18 | 苹果公司 | Signal traces pattern for flexible base board |
| CN107564413A (en) * | 2017-07-24 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | Collapsible display device |
| CN107835560A (en) * | 2017-10-20 | 2018-03-23 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof |
| CN108513436A (en) * | 2018-04-27 | 2018-09-07 | 维沃移动通信有限公司 | The circuit board and preparation method thereof of mobile terminal, mobile terminal |
| CN208141720U (en) * | 2018-05-28 | 2018-11-23 | 京东方科技集团股份有限公司 | Flexible strutting piece, flexible display substrates and display device |
| CN109413840A (en) * | 2018-11-06 | 2019-03-01 | 惠州市华星光电技术有限公司 | FPC board structure of circuit |
| CN109526141A (en) * | 2018-12-24 | 2019-03-26 | 江苏弘信华印电路科技有限公司 | A kind of ultra-thin rigid-flex combined board and preparation method thereof |
| CN110602881A (en) * | 2019-09-18 | 2019-12-20 | 昆山国显光电有限公司 | Circuit board and display device |
| CN210432024U (en) * | 2019-06-19 | 2020-04-28 | 绍兴上虞锴达电子有限公司 | Fine circuit flexible circuit board |
| CN112102723A (en) * | 2020-09-15 | 2020-12-18 | 京东方科技集团股份有限公司 | Display module, manufacturing method thereof and display device |
| CN212750239U (en) * | 2020-08-31 | 2021-03-19 | 太仓迪科力科技有限公司 | Supporting structure and display device |
-
2021
- 2021-05-17 CN CN202110536754.9A patent/CN113242643B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050102191A (en) * | 2004-04-21 | 2005-10-26 | 삼성전자주식회사 | Flexible printed circuit board |
| CN201585201U (en) * | 2010-01-28 | 2010-09-15 | 华为终端有限公司 | Electronic product with data connector and flexible printed circuit board |
| KR20140007560A (en) * | 2012-07-09 | 2014-01-20 | 하이디스 테크놀로지 주식회사 | Flexible printed circuit for prevention of crack |
| CN106796364A (en) * | 2014-08-30 | 2017-05-31 | 乐金显示有限公司 | Flexible display apparatus and its manufacture method including the distribution with strengthening part |
| CN107079579A (en) * | 2014-10-10 | 2017-08-18 | 苹果公司 | Signal traces pattern for flexible base board |
| CN205864848U (en) * | 2016-08-01 | 2017-01-04 | 深圳市瑞通达精密线路板有限公司 | A kind of flexible circuit board with novel reinforced structure |
| CN206005000U (en) * | 2016-08-01 | 2017-03-08 | 深圳市瑞通达精密线路板有限公司 | A kind of multifunction flexible printed substrate |
| CN106207540A (en) * | 2016-08-03 | 2016-12-07 | 京东方科技集团股份有限公司 | A kind of flexible circuit board connector and electronic equipment |
| CN106328599A (en) * | 2016-10-27 | 2017-01-11 | 上海天马微电子有限公司 | Flexible display device |
| CN107564413A (en) * | 2017-07-24 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | Collapsible display device |
| CN107835560A (en) * | 2017-10-20 | 2018-03-23 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof |
| CN108513436A (en) * | 2018-04-27 | 2018-09-07 | 维沃移动通信有限公司 | The circuit board and preparation method thereof of mobile terminal, mobile terminal |
| CN208141720U (en) * | 2018-05-28 | 2018-11-23 | 京东方科技集团股份有限公司 | Flexible strutting piece, flexible display substrates and display device |
| CN109413840A (en) * | 2018-11-06 | 2019-03-01 | 惠州市华星光电技术有限公司 | FPC board structure of circuit |
| CN109526141A (en) * | 2018-12-24 | 2019-03-26 | 江苏弘信华印电路科技有限公司 | A kind of ultra-thin rigid-flex combined board and preparation method thereof |
| CN210432024U (en) * | 2019-06-19 | 2020-04-28 | 绍兴上虞锴达电子有限公司 | Fine circuit flexible circuit board |
| CN110602881A (en) * | 2019-09-18 | 2019-12-20 | 昆山国显光电有限公司 | Circuit board and display device |
| CN212750239U (en) * | 2020-08-31 | 2021-03-19 | 太仓迪科力科技有限公司 | Supporting structure and display device |
| CN112102723A (en) * | 2020-09-15 | 2020-12-18 | 京东方科技集团股份有限公司 | Display module, manufacturing method thereof and display device |
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