CN113242643A - Circuit board and display device - Google Patents
Circuit board and display device Download PDFInfo
- Publication number
- CN113242643A CN113242643A CN202110536754.9A CN202110536754A CN113242643A CN 113242643 A CN113242643 A CN 113242643A CN 202110536754 A CN202110536754 A CN 202110536754A CN 113242643 A CN113242643 A CN 113242643A
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- circuit board
- flexible
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- region
- wave
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- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 238000005452 bending Methods 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 9
- 238000009825 accumulation Methods 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 15
- 239000010408 film Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
Abstract
The application discloses circuit board and display device, this circuit board include at least one deck flexible basic unit and the metal circuit layer that the stromatolite set up, and this circuit board includes rigid area and flexible region, and this rigid area is located this flexible regional both sides, is provided with the rigidity substrate on this rigid area, and at least some this flexible region sets up to the wave structure, forms the regional of buckling, and this wave structure extends to this rigid area. This application embodiment is through the intergral template that sets up the soft or hard structure, and set up at least part of flexible region into wave structure in order to form the region of buckling, thereby make this circuit board fold and buckle or flat in-process of exhibition, can utilize the wave structure of similar spring, realize the accumulation and the release of stress with little tensile compressive deformation, the regional number of times of buckling that reaches that guarantees the circuit board and be in, and, the structure of soft or hard integration can avoid when dragging because equipment and buckling, the strain of soft board, the reliability of circuit board in the folding product has been promoted.
Description
Technical Field
The present invention generally relates to the field of display technologies, and in particular, to a circuit board and a display device.
Background
Printed Circuit Boards (PCBs) are used as an aggregate of various electronic components, and are widely applied to large-size display products, and especially have an indispensable role in display of notebook computers (Note books, NBs). The popularity of folding display and the requirement of large size of a display screen put forward new requirements for the PCB, and if the PCB can meet the working requirement, the PCB can be folded and can be bent for as many as one hundred thousand and more than twenty thousand times.
At present, two display surfaces of a folding NB are respectively bound with one PCB, and the two PCBs are connected with a flexible Connector (Bridge) through a Connector (Connector), so as to implement the intercommunication of circuit information on the PCBs.
For the structure, in the manufacturing process, each process inspection and the like need to insert and pull the Bridge and the Connector, and damage near the inserting and pulling positions of the Bridge and the Connector is easily caused. In addition, because the arc length of the outer film layer is greater than that of the inner film layer in the bent state, a radian exists on the Bridge or the Bridge is in a bulging state in the flattening state, and meanwhile, after the Bridge is bent for multiple times along the central line, the Bridge is continuously changed in the bent and flattened state, so that stress is continuously released and accumulated, and Bridge damage or Connector shedding is easily caused.
Disclosure of Invention
In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a flexible-rigid integrated circuit board, which can ensure that the bending area of the PCB board can reach a high bending frequency by setting the bending area to be a wave structure, and simultaneously avoid the flexible board from being damaged by pulling due to assembly and bending.
In a first aspect, an embodiment of the present application provides a circuit board, including at least one flexible base layer and a metal circuit layer, where the flexible base layer and the metal circuit layer are stacked, the circuit board includes a rigid region and a flexible region, the rigid region is located on two sides of the flexible region, a rigid substrate is disposed on the rigid region, at least a part of the flexible region is configured as a wave structure, a bending region is formed, and the wave structure extends toward the rigid region.
In one implementation of this embodiment, the wave structure is uniformly disposed in the flexible region.
In an implementation manner of this embodiment, a peak at the middle position of the bending region is larger than peaks at the two sides.
In an implementation manner of this embodiment, the wavelength at the middle position of the bending region is smaller than the wavelengths at the two side positions.
In an implementation manner of this embodiment, a peak at a middle position of the bending region is larger than peaks at two side positions, and a wavelength at the middle position of the bending region is smaller than wavelengths at two side positions.
In an implementation manner of this embodiment, the circuit board further includes a supporting layer.
In one implementation of this embodiment, the supporting layer is disposed on a bottom layer of the circuit board.
In one implementation of this embodiment, the support layer is disposed between the metal circuit layer and the flexible base layer.
In an implementation manner of this embodiment, a through hole is formed in a position of the support layer located in the bending region.
In one implementation of this embodiment, the through holes are circular or rectangular and distributed in a delta shape on the supporting layer.
In one implementation of this embodiment, the support layer is a layer of SUS material.
In a second aspect, an embodiment of the present application provides a display device, including the circuit board according to the first aspect.
To sum up, the circuit board that this application embodiment provided, through the intergral template that sets up the soft or hard structure, and set up at least part of flexible region into wave structure in order to form the region of buckling, thereby make this circuit board fold or open the flat in-process of exhibition, can utilize the wave structure of similar spring, realize the accumulation and the release of stress with little tensile compressive deformation, guarantee that the bending area of circuit board is reaching higher number of times of buckling, and, the structure of soft or hard integration can avoid because the equipment and buckle when dragging, the strain of soft board, the reliability of circuit board in the folding product has been promoted.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of a circuit board according to the prior art;
fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a circuit board according to another embodiment of the present application;
fig. 4 is a schematic structural diagram of a circuit board according to another embodiment of the present application;
fig. 5 is a schematic structural diagram of a circuit board according to another embodiment of the present application;
fig. 6 is a schematic structural diagram of a circuit board according to another embodiment of the present application;
fig. 7 is a schematic structural diagram of a circuit board according to another embodiment of the present application;
fig. 8 is a schematic structural diagram of a circuit board according to another embodiment of the present application;
fig. 9 is a schematic structural diagram of a circuit board according to another embodiment of the present application;
fig. 10 is a schematic cross-sectional structure diagram of a circuit board according to an embodiment of the present application;
fig. 11 is a schematic cross-sectional structure diagram of a circuit board according to another embodiment of the present application;
fig. 12 is a schematic structural diagram of a supporting layer of a circuit board according to an embodiment of the present disclosure;
fig. 13 is a schematic structural diagram of a supporting layer of a circuit board according to another embodiment of the present application;
fig. 14 is a schematic structural diagram of a supporting layer of a circuit board according to yet another embodiment of the present application.
Description of reference numerals:
the circuit board comprises a rigid circuit board 1, a component area 2, a connecting bridge 3, a connector 4, a rigid-flexible circuit board 5, a wave structure 6, a PSA layer 7, a supporting layer 8, a flexible base layer 9, a metal circuit layer 10, a rigid base layer 11, a PSR layer 12, a component layer 13 and a through hole 14.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
It can be understood that with the continuous development of display technology, the demand and application of flexible circuit boards are more and more extensive, and the flexible OLED display provides more possibilities for the display industry. The PCB serves as an aggregate of various electronic components and plays an essential role in folding NB displays.
Fig. 1 and 2 show a PCB of NB in the prior art, and it can be observed from the drawings that the connection Bridge has an extended design compared to the display module, that is, because the arc length of the outer film layer is longer than that of the inner film layer in the bent state, the connection Bridge has an arc or exhibits a bulging state in the flattened state. In addition, in the use process of the NB product, the NB product is bent for multiple times along the central line, so that the Bridge is continuously changed in the bending and flattening state, the stress of the Bridge is continuously released and accumulated, and the Bridge is easily damaged or the Connector falls off.
This application is in the in-process of buckling in order to guarantee the display device that needs buckle, and the circuit board performance is not influenced, avoids causing the regional unevenness that forms of buckling, leads to the device performance unusual, through the PCB intergral template that sets up soft or hard combination, and the regional wave form that sets up to of buckling of this intergral template for the PCB board that has similar spring has good toughness and resilience, can realize reaching more than one hundred thousand, the number of times of buckling more than twenty thousand.
In addition, due to the soft and hard integrated arrangement, the Connector can be prevented from being damaged and falling off in plugging and pulling, and more convenience is provided for the realization of folding display products.
For better understanding and explanation, the circuit board provided by the embodiment of the present application is explained in detail below by fig. 3 to 14.
Fig. 3 is a schematic structural diagram of a circuit board according to an embodiment of the present application, and as shown in fig. 3, the circuit board may include:
at least one flexible basic unit and the metal circuit layer that the stromatolite set up, this circuit board include rigid region and flexible region, and this rigid region is located this flexible region both sides, is provided with rigid substrate on this rigid region, and at least some this flexible region sets up to the wave structure, forms the region of buckling, and this wave structure extends to this rigid region.
Specifically, in the circuit board in the embodiment of the present application, the flexible base layer and the metal circuit layer are overlapped to form a rigid-flexible integrated board structure, that is, a rigid-flexible integrated PCB board, and then the rigid base layer is disposed on a partial region of the rigid-flexible integrated circuit board to form a rigid region, and the rest portion is the flexible region.
It can be understood that the rigid region provided with the rigid substrate is a non-foldable region, and the other regions not provided with the rigid substrate are flexible regions, so that multiple folding can be performed.
It will also be appreciated that the rigid region may be disposed on both sides of the flexible region, as in NB products. Alternatively, a plurality of sets of spacing structures of the rigid regions and the flexible regions may be provided to form a plurality of bending regions. The embodiments of the present application do not limit this.
In the embodiment of the application, in order to avoid the situation that the flexible region bulges in the process of folding and flattening for multiple times along the central line of the bending region of the flexible region, the situation that the Bridge in the prior art is continuously changed in the state of bending and flattening, the stress of the Bridge is continuously released and accumulated, and the phenomenon that the Bridge is damaged or the Connector falls off is caused is avoided, and at least part of the flexible region is arranged into a wave structure along the central line to form the bending region.
It will be appreciated that the wave structure extends to the rigid regions on both sides, i.e. such that the crest connecting lines on the wave structure, or the elongation direction of the trough connecting lines, pass through the rigid regions on both sides to provide stress relief, as shown in fig. 6.
For example, as shown in fig. 2, the rigid-flexible circuit board is applied to a folding notebook computer, i.e., the flexible substrates on both sides are provided with rigid substrates to form rigid regions, and a flexible region is located between the two rigid regions to realize folding. The whole or the middle part of the flexible area is set into a wavy structure to form a bending area, and the extending direction of the wavy structure is perpendicular to the direction of the central line, so that when the flexible area is folded along the central line, the stress buffering similar to a spring can be realized by utilizing the wavy structure, and the normal performance of the circuit board in multiple folding is ensured.
Alternatively, the wave structures of the flexible region in the embodiments of the present application may be arranged in a uniform distribution, or may be arranged near the central line without treatment in the vicinity of the rigid region.
For example, as shown in fig. 4 and fig. 5, the wave structure is uniformly disposed in the flexible region, i.e., the substrate of the flexible region is disposed in a uniform wave structure, i.e., disposed in a wave structure near the center, and the wave crests and the wave troughs of the wave structure are uniform, and the wave lengths are uniform.
It can be understood that the wavelength and the peak size of the wave structure can be determined according to actual conditions, and the embodiment of the present application does not limit this.
Further, in the embodiment of the present application, in order to further improve the bending performance, the sizes of the wave crest, the wave trough and the wave length of the wave structure may be adjusted.
For example, as shown in fig. 7, in order to improve the bending performance, the peak at the middle position of the bending region may be set to be larger than the peaks at the two side positions, that is, the sizes of the peak and the valley of the wave structure far away from the center line position may be gradually smaller than the sizes of the peak and the valley of the wave structure near the center line position, so that the wave structure at the center line position can play a better buffering role when being folded along the center line.
For another example, as shown in fig. 8, in order to improve the bending performance, the wavelength at the middle position of the bending region may be set to be smaller than the wavelengths at the both side positions, and the wavelength of the wave structure near the center line may be set to be gradually smaller than the wavelength of the wave structure far from the center line, that is, the concentration of the wave structure at the center line position is greater than that at the both side positions, so that the wave structure at the center line position can play a better buffering role when folded along the center line.
For another example, as shown in fig. 9, in order to better improve the bending performance, the peak at the middle position of the bending region may be set to be larger than the peaks at the two side positions, and the wavelength at the middle position of the bending region may be set to be smaller than the wavelengths at the two side positions, that is, the sizes of the peak and the trough of the wave structure far away from the center line position may be gradually smaller than the sizes of the peak and the trough of the wave structure near the center line position; and, can set up the size of the wave length of the wave structure that is close to the center line position to be less than the wave length size of the wave structure of keeping away from the center line position gradually, even make the intensity of the wave structure of center line position be greater than both sides position to make the wave structure in this flexible region all have the gradual change on crest, trough and density, then when folding along the center line, the wave structure that can the center line position can play better cushioning effect.
Optionally, the rigid base layer in the embodiment of the present application may be a flexible copper clad laminate of a polyester film or a flexible copper clad laminate of a polyimide film, and the flexible substrate may be a paper substrate, a composite substrate, a fiberglass fabric substrate, a resin coated copper foil (RCC), a metal substrate, a ceramic substrate, or the like.
It can be understood that, the specific materials of the rigid base layer and the flexible base layer are not limited in the embodiments of the present application, and can be flexibly selected according to practical applications.
The circuit board of this application embodiment, through setting up flexible holistic flexible substrate, surface at flexible substrate forms the rigid substrate, form the integrated circuit board that soft or hard combines, and the flexible regional laminated structure that will not set up the rigid substrate sets up to density, the wave structure of crest and trough gradual change, thereby when this circuit board is folded along the central line in flexible region, make this circuit board fold or open the flat in-process folding, can utilize the wave structure of similar spring, realize the accumulation and the release of stress with little tensile compressive deformation, guarantee that the flexible region of circuit board at reaches higher number of times of buckling, and can avoid because the equipment and buckle when dragging, the strain of soft board, the reliability of circuit board in the folding product has been promoted.
Optionally, in this embodiment of the application, in order to improve stability and firmness of the circuit board, a supporting layer may be added to the flexible substrate, for example, the circuit board may be reinforced on a single side, or the supporting layer may be disposed in the middle of the circuit board, so that the film layers on the two sides of the supporting layer are symmetrical.
For example, as shown in fig. 10, for convenience of processing, a support layer may be disposed on the bottom of the circuit board such that the support layer is exposed, such that other flexible substrates, metal layer circuits, and other components are on the other side of the support layer.
It can be understood that, in the embodiment, the supporting layer is arranged in a manner that, when the supporting layer is made of a metal material, the circuit board can be grounded.
For another example, as shown in fig. 11, the supporting layer may be disposed at the middle position of the circuit board, so that when the circuits at the two sides of the bending region are symmetrical, the forces applied to the two sides during the bending process are relatively balanced, Peeling is not easily caused, and the bending stability is higher.
Alternatively, the support layer in the embodiment of the present application may be a metal layer, such as an alloy that can be prepared as a thin film and is not easily broken.
For example, a SUS301 material layer having a better performance may be selected.
Alternatively, the thickness of the support layer may be 200 μm to 400 μm.
It is understood that the arrangement position, material composition and thickness of the support layer can be determined according to practical situations, and the embodiment of the present application does not limit this.
Optionally, in this embodiment of the application, in order to improve the bending performance of the circuit board, a through hole may be formed in the support layer located in the bending region.
For example, as shown in fig. 12, circular through holes may be formed in the support layer, so that the circular through holes are uniformly distributed.
For example, as shown in fig. 13 and 14, rectangular through holes may be formed in the support layer so that the through holes are arranged in a delta shape.
It can be understood that the specific shape and arrangement of the through holes can be designed according to actual conditions, and the embodiment of the application does not limit the specific shape and arrangement of the through holes.
Alternatively, as shown in the figure, for the component disposed in the rigid region, a PSA layer disposed on the rigid region of the bottom layer, such as a PSA layer disposed on the bottom of the support layer, or a PSA layer disposed on the bottom of the PSR layer, and a PSR layer and a rigid substrate layer disposed on the bottom of the component layer may be included.
On the other hand, the embodiment of the application also provides a display device, and the display device is formed based on the integrated PCB with soft and hard combination in the embodiment.
To sum up, the circuit board and display device that this application embodiment provided, through the intergral template that sets up soft or hard structure, and set up at least part of flexible region into wave structure in order to form the region of buckling, thereby make this circuit board fold or open the flat in-process of exhibition, can utilize the wave structure of similar spring, realize the accumulation and the release of stress with small tensile compressive deformation, guarantee that the regional number of buckling that reaches of circuit board is being higher, and, the structure of soft or hard integration can avoid when dragging because equipment and buckling, the strain of soft board, the reliability of circuit board in the folding product has been promoted. .
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (12)
1. A circuit board is characterized by comprising at least one flexible base layer and at least one metal circuit layer which are arranged in a laminated mode, the circuit board comprises a rigid area and a flexible area, the rigid area is located on two sides of the flexible area, the rigid area is provided with the rigid base layer,
at least part of the flexible area is arranged into a wave structure to form a bending area, and the wave structure extends towards the rigid area.
2. The circuit board of claim 1, wherein the wave structures are uniformly disposed in the flexible region.
3. The circuit board of claim 1, wherein the wave peak at the middle position of the bending region is larger than the wave peaks at the two side positions.
4. The circuit board of claim 1, wherein the wavelength at the middle position of the bending region is smaller than the wavelength at the two side positions.
5. The circuit board of claim 1, wherein the wave peak at the middle position of the bending region is larger than the wave peaks at the two side positions, and the wave length at the middle position of the bending region is smaller than the wave length at the two side positions.
6. The circuit board of any one of claims 1-5, further comprising a support layer.
7. The circuit board of claim 6, wherein the support layer is disposed on a bottom layer of the circuit board.
8. The circuit board of claim 6, wherein the support layer is disposed between the metal circuit layer and the flexible base layer.
9. The circuit board of claim 6, wherein the support layer is provided with a through hole at a position of the bending region.
10. The circuit board of claim 9, wherein the through holes are circular or rectangular and are distributed in a delta shape on the supporting layer.
11. The circuit board of claim 6, wherein the support layer is a SUS material layer.
12. A display device comprising a circuit board according to any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110536754.9A CN113242643B (en) | 2021-05-17 | 2021-05-17 | Circuit board and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110536754.9A CN113242643B (en) | 2021-05-17 | 2021-05-17 | Circuit board and display device |
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| CN113242643A true CN113242643A (en) | 2021-08-10 |
| CN113242643B CN113242643B (en) | 2024-01-16 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114269063A (en) * | 2021-12-13 | 2022-04-01 | 中国电子科技集团公司第三十八研究所 | PCB board interconnection structure and method |
| CN114596782A (en) * | 2022-03-17 | 2022-06-07 | 武汉华星光电半导体显示技术有限公司 | Folding screen equipment and flexible display module thereof |
| CN114859609A (en) * | 2022-06-22 | 2022-08-05 | 京东方科技集团股份有限公司 | Flexible circuit board, display device and preparation method of display device |
| CN114269063B (en) * | 2021-12-13 | 2024-04-30 | 中国电子科技集团公司第三十八研究所 | PCB interconnection structure and method |
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| CN208141720U (en) * | 2018-05-28 | 2018-11-23 | 京东方科技集团股份有限公司 | Flexible strutting piece, flexible display substrates and display device |
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| CN114859609A (en) * | 2022-06-22 | 2022-08-05 | 京东方科技集团股份有限公司 | Flexible circuit board, display device and preparation method of display device |
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