TWI461115B - Flexible printed circuit board - Google Patents

Flexible printed circuit board Download PDF

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Publication number
TWI461115B
TWI461115B TW098139507A TW98139507A TWI461115B TW I461115 B TWI461115 B TW I461115B TW 098139507 A TW098139507 A TW 098139507A TW 98139507 A TW98139507 A TW 98139507A TW I461115 B TWI461115 B TW I461115B
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circuit board
flexible circuit
stress concentration
zone
main body
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TW098139507A
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Chinese (zh)
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TW201119528A (en
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Jen Chieh Chou
Shu Juien Huang
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Au Optronics Corp
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Description

軟性電路板Flexible circuit board

本發明是一種軟性電路板,特別係一種具有緩衝區之軟性電路板。The present invention is a flexible circuit board, and more particularly to a flexible circuit board having a buffer.

由於全球資訊與通訊產品的蓬勃發展,也帶動印刷電路板(Printing Circuit Board,PCB)之市場,而軟性印刷電路板(Flexible Print Circuit;FPC)現已為許多電子產品之應用主流。Due to the rapid development of global information and communication products, the market for printed circuit boards (PCBs) has also been promoted, and the flexible printed circuit (FPC) is now the mainstream of many electronic products.

軟性電路板大量應用於需要輕薄短小基板的小型可攜式系統上,如:摺疊式手機、筆記型電腦、手錶與助聽器,以及電子醫療產品等應用。此外,近來之軟性電子更擴展應用至無線射頻辨識(Radio Frequency Identification,RFID)標籤與光電元件上。Flexible boards are used in small portable systems that require thin, light and short substrates, such as folding phones, notebooks, watches and hearing aids, and applications such as electronic medical products. In addition, recent soft electronic applications have been extended to radio frequency identification (RFID) tags and optoelectronic components.

然而,使用軟性電路板時,有一些設計上之限制,如:軟性電路板之尺寸與銅墊片的面積要比硬性印刷電路板(PCB)要大上一些;其次,必須製作特殊的焊片堆疊,否則銅可能會脫離介電層;再者,於軟性電路板的邊緣,若所預留之空間不足則將導致層與層之間剝離因而造成影響。此外,當軟性電路板受到彎折時,其因受力變形會導致電路毀損,將使得其應用之液晶顯示模組顯示異常。因此,開發解決上述問題之技術係產業界亟欲發展之方向。However, there are some design limitations when using a flexible circuit board. For example, the size of a flexible circuit board and the area of a copper pad are larger than those of a rigid printed circuit board (PCB). Second, special solder pieces must be fabricated. Stacking, otherwise copper may leave the dielectric layer; further, at the edge of the flexible circuit board, if the reserved space is insufficient, it will cause the layer to peel off between layers and thus affect. In addition, when the flexible circuit board is bent, the deformation of the flexible circuit board may cause the circuit to be damaged, which may cause the liquid crystal display module of the application to display abnormality. Therefore, the development of the technology that solves the above problems is the direction in which the industry wants to develop.

有鑑於此,本發明提出一種軟性電路板,包含:主體部,配置有電子元件;接合部,連結於連接器;連結部,其二端分別連結上述主體部與接合部,上述連結部包含緩衝區與應力集中區。其中,上述緩衝區位於應力集中區與接合部之間,而應力集中區則位於緩衝區與主體部之間。In view of the above, the present invention provides a flexible circuit board comprising: a main body portion, wherein an electronic component is disposed; a joint portion coupled to the connector; and a connecting portion, the two ends of which respectively connect the main body portion and the joint portion, wherein the joint portion includes a buffer Zone and stress concentration zone. Wherein, the buffer zone is located between the stress concentration zone and the joint portion, and the stress concentration zone is located between the buffer zone and the body portion.

本發明之軟性電路板,其緩衝區為單層板體。由於當軟性電路板連結至連接器時,軟性電路板與連接器之交合處易有拱起現象,若於交合處設置一單層板體結構之緩衝區,使交合處成為一較柔軟之區域,則能避免軟性電路板連結至連接器時產生拱起之問題。In the flexible circuit board of the present invention, the buffer zone is a single layer board. When the flexible circuit board is connected to the connector, the intersection of the flexible circuit board and the connector is easy to be arched. If a buffer layer of a single-layer board structure is disposed at the intersection, the intersection becomes a softer area. , can avoid the problem of arching when the flexible circuit board is connected to the connector.

此外,本發明所提供之軟性電路板,其具有一複數層板體之應力集中區,利用多層板體結構之強度,進而增強承受應變之強度。當軟性電路板連結至連接器時,上述軟性電路板之連結部遭受外力而產生應力,使得連結部之轉折,因而容易產生應變而受損,因此,於連結部設置一應力集中區以便增加轉折之強度,再者,由於連結部於軟性電路板與連接器之交合處有一緩衝區,因此將使得承受最大應力之位置發生於緩衝區,如此即能降低上述轉折可能遭受之應力,進而避免轉折毀損,並且使接合部連結至電路控制板時,能夠達到訊號傳遞之功能,以利電路板能正常運作。In addition, the flexible circuit board provided by the invention has a stress concentration region of a plurality of layers, and utilizes the strength of the multi-layer structure to enhance the strength of the strain. When the flexible circuit board is coupled to the connector, the connecting portion of the flexible circuit board is subjected to an external force to generate stress, so that the connecting portion is deflected, thereby being easily strained and damaged. Therefore, a stress concentration region is provided at the connecting portion to increase the turning point. In addition, since the connecting portion has a buffer at the intersection of the flexible circuit board and the connector, the position where the maximum stress is applied occurs in the buffer zone, so that the stress that the above-mentioned turning may be suffered can be reduced, thereby avoiding the turning. When the damage is made and the joint is connected to the circuit control board, the signal transmission function can be achieved, so that the circuit board can operate normally.

以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art.

請參閱第1、2與3A圖所示,係為本發明之第一實施例中所揭露之軟性電路板1,包含有主體部10、接合部11與連結部12,其中,上述之軟性電路板1可應用於汽車的儀表板、車燈、LED照明或顯示器之背光模組等。Referring to Figures 1, 2 and 3A, the flexible circuit board 1 disclosed in the first embodiment of the present invention includes a main body portion 10, a joint portion 11 and a joint portion 12, wherein the above flexible circuit The board 1 can be applied to an automobile dashboard, a lamp, an LED lighting or a backlight module of a display.

主體部10,配置有電子元件13,上述電子元件13較佳地能為發光二極體(Light Emitting Diode,LED),上述僅為示例,然非以此為限。The electronic component 13 is disposed on the main body 10, and the electronic component 13 is preferably a light emitting diode (LED). The above is only an example, but not limited thereto.

接合部11,連結於一連接器14,上述連接器14係用以連結至一電路控制板15,據此達到訊號傳遞之功能。The joint portion 11 is coupled to a connector 14, and the connector 14 is coupled to a circuit control board 15, thereby achieving the function of signal transmission.

連結部12,其二端分別連結上述主體部10與接合部11,上述連結部12包含一緩衝區121與一應力集中區123。其中,上述緩衝區121位於應力集中區123與接合部11之間,而上述應力集中區123則位於緩衝區121與主體部10之間。此外,上述應力集中區123更包含一轉折1231,上述之轉折1231包含一圓角(R角)、鈍角或銳角之其中一者。The connecting portion 12 has two ends connected to the main body portion 10 and the joint portion 11, and the connecting portion 12 includes a buffer zone 121 and a stress concentration region 123. The buffer zone 121 is located between the stress concentration region 123 and the joint portion 11 , and the stress concentration region 123 is located between the buffer zone 121 and the main body portion 10 . In addition, the stress concentration region 123 further includes a turn 1231, and the turn 1231 includes one of a rounded corner (R angle), an obtuse angle, or an acute angle.

一般而言,當材料在外力作用下不能產生位移時,它的幾何形狀和尺寸將發生變化,這種形變稱為應變。而當材料發生形變時,內部將產生大小相等但方向相反的反作用力用以抵抗外力,此種反作用力為應力。In general, when a material cannot be displaced by an external force, its geometry and size will change. This deformation is called strain. When the material is deformed, the internal will produce equal-sized but opposite-direction reaction forces to resist external forces, and this reaction force is stress.

承上所述,於組裝軟性電路板1至連接器14的同時,上述連結部12需受一外力方能被牽引並連結至連接器14,而當連結部12受外力時,連結部12同時於內部產生一相反於外力之應力,而此應力係集中於連結部12之轉折1231,也就是應力集中區123內。因此,於連結部12上設置一緩衝區121,用以緩衝應力集中區123所受之應力,避免連結部12因為遭受應力而使得轉折1231產生應變而受損,進而影響電路板之導通,而讓設於主體10之電子元件13無法作用。As described above, while the flexible circuit board 1 is being assembled to the connector 14, the connecting portion 12 is required to be pulled by an external force and coupled to the connector 14, and when the connecting portion 12 is subjected to an external force, the connecting portion 12 is simultaneously A stress opposite to the external force is generated internally, and the stress is concentrated in the turning 1231 of the joint portion 12, that is, in the stress concentration region 123. Therefore, a buffer zone 121 is disposed on the connecting portion 12 for buffering the stress applied to the stress concentration region 123, thereby preventing the connecting portion 12 from being strained and damaged due to stress, thereby affecting the conduction of the circuit board. The electronic component 13 provided in the main body 10 is rendered inoperable.

於第一實施例之較佳範例中,上述緩衝區121為單層板體,而應力集中區123為複數層板體,如第10、11與12圖所示,其中,x為基層,上述基層為一絕緣基材,較佳地可為聚脂(Polyester,PET)或聚醯亞胺(Polyimide,PI);y與y’為銅導體層;z與z’為覆蓋層。上述結構或材質僅為示例,本發明並非以此為限。In a preferred embodiment of the first embodiment, the buffer zone 121 is a single-layer plate body, and the stress concentration area 123 is a plurality of layer plates, as shown in FIGS. 10, 11 and 12, wherein x is a base layer, The base layer is an insulating substrate, preferably Polyester (PET) or Polyimide (PI); y and y' are copper conductor layers; z and z' are cover layers. The above structure or material is merely an example, and the present invention is not limited thereto.

將緩衝區121設計為單層板體,用以形成較為柔軟之區域,並將應力集中區123設置為一複數層板體,係用以提高其結構強度,當連結部12受一外力並產生一反抗之應力,由於上述緩衝區121與應力集中區123之設計,將使得上述應力將集中發生於上述之緩衝區121內,進而防止應力集中區123之轉折1231直接承受過大應力而導致斷裂的現象,並且進而避免軟性電路板1連結至連接器14時產生拱起之問題。The buffer zone 121 is designed as a single-layer plate body for forming a relatively soft region, and the stress concentration region 123 is set as a plurality of plate bodies for improving the structural strength thereof, and the joint portion 12 is subjected to an external force and generated. The stress of the resistance, due to the design of the buffer zone 121 and the stress concentration zone 123, will cause the stress to concentrate in the buffer zone 121, thereby preventing the transition 1231 of the stress concentration zone 123 from directly suffering from excessive stress and causing fracture. The phenomenon, and in turn, avoids the problem of arching when the flexible circuit board 1 is attached to the connector 14.

承上所述,於連結部12設置一複數層板體之緩衝區121,利用緩衝區121具有之單層板體的結構強度,讓連結部12不易受應力而產生形變,進而避免電路受到損壞,並且使接合部11連結至電路控制板15時,能夠達到訊號傳遞之功能,以利電路板能正常運作。As described above, the buffer portion 121 of the plurality of layers is disposed in the connecting portion 12, and the structural strength of the single-layer plate body of the buffer region 121 is utilized, so that the connecting portion 12 is less susceptible to stress and deformation, thereby preventing the circuit from being damaged. When the joint portion 11 is coupled to the circuit control board 15, the function of signal transmission can be achieved, so that the circuit board can operate normally.

第3A至8圖係本發明之第二實施例所揭露之軟性電路板1,軟性電路板1之連結部12可為多種變化形狀,而緩衝區121與應力集中區123係針對連結部12之形狀,考量其轉折1231之位置,進而設計緩衝區12與應力集中區123之位置分佈,其中,第3A與3B圖:連結部12為一L型;第4圖:連結部12為一線型;第5圖:連結部12為一ㄣ型;第6圖:連結部12為一Y型;第7圖:連結部12為一倒Y型;第8圖:連結部12為一宀字型。3A to 8 are flexible circuit boards 1 according to a second embodiment of the present invention. The connecting portion 12 of the flexible circuit board 1 can have various shapes, and the buffer zone 121 and the stress concentration area 123 are directed to the connecting portion 12. The shape, considering the position of the turning 1231, and further designing the position distribution of the buffer zone 12 and the stress concentration zone 123, wherein the 3A and 3B drawings: the connecting portion 12 is an L-shaped; and the fourth drawing: the connecting portion 12 is a linear type; Fig. 5: The connecting portion 12 is a single-shaped type; the sixth drawing: the connecting portion 12 is a Y-shaped type; the seventh drawing: the connecting portion 12 is an inverted Y-shape; and the eighth drawing: the connecting portion 12 is a U-shaped type.

其中,上述圖示之緩衝區121須位於應力集中區123與接合部11之間,而應力集中區123須涵蓋轉折1231,用以增強轉折1231承受應力之強度。關於本實施例之緩衝區121與應力集中區123之位置與面積幅度僅為示例,本發明並不以此為限。The buffer zone 121 shown above should be located between the stress concentration zone 123 and the joint portion 11, and the stress concentration zone 123 must cover the turn 1231 to enhance the strength of the transition 1231 to withstand stress. The position and area width of the buffer zone 121 and the stress concentration zone 123 of the present embodiment are merely examples, and the present invention is not limited thereto.

另一方面,上述主體10亦能包含一複數層板體之結構,如第9圖所示,用以增加主體10與連結部12之整體結構強度,上述主體部10之複數層板體結構之位置或面積幅度僅為示例,本發明並不以此為限。On the other hand, the main body 10 can also include a structure of a plurality of layers, as shown in FIG. 9, for increasing the overall structural strength of the main body 10 and the joint portion 12, and the plurality of layers of the main body portion 10 are The position or area width is only an example, and the invention is not limited thereto.

根據以上所述,本發明之軟性電路板1之連結部12所設置之應力集中區123,其為複數層板體之結構,能夠增加連結部12承受應力之強度,再者,連結部12所設置之緩衝區121則設計為單層板體之結構,避免接合部11將連接器14拱起,藉此改善軟性電路板1與電路控制板15之連接器14結合時所造成之電路毀損問題,進而提升軟性電路板之整體效用。According to the above, the stress concentration region 123 provided in the connection portion 12 of the flexible circuit board 1 of the present invention is a structure of a plurality of layers, and can increase the strength of the connection portion 12 to withstand stress, and further, the connection portion 12 The buffer zone 121 is designed as a single-layer board structure, and the joint portion 11 is prevented from arching the connector 14, thereby improving the circuit damage caused by the combination of the flexible circuit board 1 and the connector 14 of the circuit board 15. To improve the overall effectiveness of the flexible circuit board.

本發明之第二實施例所揭露之軟性電路板1,包含主體部10、接合部11與連結部12,如第5圖所示。The flexible circuit board 1 disclosed in the second embodiment of the present invention includes a main body portion 10, a joint portion 11, and a joint portion 12, as shown in Fig. 5.

主體部10,配置有電子元件13,上述電子元件13較佳地能為發光二極體(Light Emitting Diode,LED),上述僅為示例,然非以此為限。The electronic component 13 is disposed on the main body 10, and the electronic component 13 is preferably a light emitting diode (LED). The above is only an example, but not limited thereto.

接合部11,連結於一連接器14,上述連接器14係用以連結至一電路控制板15,據此達到訊號傳遞之功能。The joint portion 11 is coupled to a connector 14, and the connector 14 is coupled to a circuit control board 15, thereby achieving the function of signal transmission.

連結部12,其二端分別連結上述主體部10與接合部11,上述連結部12包含至少二應力集中區123與一緩衝區121,其中上述至少二應力集中區123分別位於連結連結部12的二側,而緩衝區121之至少一側鄰接於應力集中區123。此外,上述應力集中區123更包含一轉折1231,上述轉折1231包含一圓角(R角)、鈍角或銳角之其中一者。The connecting portion 12 has two ends connected to the main body portion 10 and the joint portion 11 respectively. The connecting portion 12 includes at least two stress concentration regions 123 and a buffer zone 121, wherein the at least two stress concentration regions 123 are respectively located at the joint portion 12 On both sides, at least one side of the buffer zone 121 is adjacent to the stress concentration zone 123. In addition, the stress concentration region 123 further includes a turn 1231, and the turn 1231 includes one of a rounded corner (R angle), an obtuse angle, or an acute angle.

於第三實施例之一較佳範例中,上述緩衝區121包含一單層板體,而應力集中區123包含一複數層板體。In a preferred embodiment of the third embodiment, the buffer zone 121 includes a single layer of plates, and the stress concentration zone 123 includes a plurality of layers.

本發明之第四實施例所揭露之軟性電路板1,包含主體部10、接合部11、連結部12與包覆材16,如第13圖所示。A flexible circuit board 1 according to a fourth embodiment of the present invention includes a main body portion 10, a joint portion 11, a joint portion 12, and a covering member 16, as shown in Fig. 13.

主體部10,配置有電子元件13,上述電子元件13較佳地能為發光二極體(Light Emitting Diode,LED),上述僅為示例,然非以此為限。The electronic component 13 is disposed on the main body 10, and the electronic component 13 is preferably a light emitting diode (LED). The above is only an example, but not limited thereto.

接合部11,連結連接於一連接器14,上述連接器14係用以連接至一電路控制板15,據此達到訊號傳遞之功能。The joint portion 11 is connected to a connector 14, and the connector 14 is connected to a circuit control board 15, thereby achieving the function of signal transmission.

連結部12,其二端分別連結上述主體部10與接合部11,上述連結部12包含至少一應力集中區123,上述應力集中區123更包含一轉折1231,上述轉折1231包含一圓角(R角)、鈍角或銳角之其中一者。The connecting portion 12 has two ends connected to the main body portion 10 and the joint portion 11 respectively. The connecting portion 12 includes at least one stress concentration region 123. The stress concentration region 123 further includes a turning portion 1231. The turning portion 1231 includes a round corner (R angle). One of the obtuse or acute angles.

包覆材16,位於該連結部12之表面,上述包覆材16能自連結部12延伸至主體部10而位於該主體部10之表面,並且位於電子元件13之間,如第13與14圖所示。上述包覆材16較佳地能為一黏性膠帶,上述包覆材之種類僅為示例,本發明並不以此為限。The covering member 16 is located on the surface of the connecting portion 12, and the covering member 16 can extend from the connecting portion 12 to the main body portion 10 on the surface of the main body portion 10, and is located between the electronic components 13, such as the 13th and 14th. The figure shows. The cover material 16 is preferably an adhesive tape, and the type of the cover material is merely an example, and the invention is not limited thereto.

再者,上述連結部12包含相對之一第一面12a與一第二面12b。其中,上述包覆材16係能與電子元件13一同位於上述之第一面12a,然而,上述包覆材16能由該第一面12a延伸至第二面12b,如第15A與15B圖所示。Furthermore, the connecting portion 12 includes a first surface 12a and a second surface 12b. Wherein, the covering material 16 can be located on the first surface 12a together with the electronic component 13. However, the covering material 16 can extend from the first surface 12a to the second surface 12b, as shown in Figures 15A and 15B. Show.

上述包覆材16必須覆蓋上述應力集中區123,當軟性電路板1組裝至連接器14之過程中,上述包覆材16能吸收並緩衝上述連結部12之應力集中區123所承受之應力,藉此避免連結部12因為遭受應力而使得轉折1231產生應變而受損,進而影響電路板之導通,而讓設於主體10之電子元件13無法順利運作。然而,本實施例之包覆材16所在位置僅為示例,本發明並不以此為限。The cladding material 16 must cover the stress concentration region 123. During the assembly of the flexible circuit board 1 to the connector 14, the cladding material 16 can absorb and buffer the stress experienced by the stress concentration region 123 of the connecting portion 12. Thereby, the connection portion 12 is prevented from being damaged by the stress caused by the transition 1231, thereby affecting the conduction of the circuit board, and the electronic component 13 provided in the main body 10 cannot be operated smoothly. However, the position of the covering material 16 of the present embodiment is merely an example, and the present invention is not limited thereto.

此外,上述包覆材16係為一黏性膠帶,能將軟性電路板1黏貼固定至一基座(未圖示),因此,本實施例所揭露之包覆材16不僅具有黏貼固定之功能,並且具有保護緩衝之作用,避免連結部12之轉折1231因承受應力而產生損壞。其中,上述基座較佳地係能為背光模組之基座,上述基座僅為示例,本發明並不以此為限。In addition, the covering material 16 is an adhesive tape, and the flexible circuit board 1 can be adhered and fixed to a pedestal (not shown). Therefore, the covering material 16 disclosed in the embodiment not only has the function of sticking and fixing. And has the function of protecting the buffer, and avoids the damage of the turning 1231 of the joint portion 12 due to the stress. The pedestal is preferably a pedestal of the backlight module, and the pedestal is only an example, and the invention is not limited thereto.

雖然本發明的技術內容已經以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神所作些許之更動與潤飾,皆應涵蓋於本發明的範疇內,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention are encompassed by the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

1...軟性電路板1. . . Flexible circuit board

10...主體部10. . . Main body

11...接合部11. . . Joint

12...連結部12. . . Linkage

12a...第一面12a. . . First side

12b...第二面12b. . . Second side

121...緩衝區121. . . Buffer

123...應力集中區123. . . Stress concentration zone

1231...轉折1231. . . Turn

13...電子元件13. . . Electronic component

14...連接器14. . . Connector

15...電路控制板15. . . Circuit control board

16...包覆材16. . . Covering material

第1圖為本發明第一實施例所揭露之軟性電路板之示意圖。FIG. 1 is a schematic diagram of a flexible circuit board according to a first embodiment of the present invention.

第2圖為本發明第一實施例所揭露之軟性電路板與連接器之連結示意圖。FIG. 2 is a schematic diagram showing the connection between a flexible circuit board and a connector according to the first embodiment of the present invention.

第3A至8圖為本發明第二實施例所揭露之軟性電路板中,連結部之各種態樣之示意圖。3A to 8 are schematic views showing various aspects of a joint portion in a flexible circuit board according to a second embodiment of the present invention.

第9圖為本發明第二實施例所揭露之軟性電路板中,主體部包含複數層板體之示意圖。FIG. 9 is a schematic view showing a flexible circuit board according to a second embodiment of the present invention, wherein the main body portion includes a plurality of layers.

第10圖為本發明第一實施例所揭露之應力集中區之複數層板體的結構示意圖FIG. 10 is a schematic structural view of a plurality of layers of a stress concentration zone according to a first embodiment of the present invention;

第11圖為本發明第一實施例所揭露之緩衝區之單層板體的結構示意圖。Figure 11 is a schematic view showing the structure of a single-layer board of the buffer zone disclosed in the first embodiment of the present invention.

第12圖為本發明第一實施例所揭露之應力集中區連接緩衝區之剖面結構示意圖。Figure 12 is a cross-sectional view showing the connection buffer zone of the stress concentration zone disclosed in the first embodiment of the present invention.

第13至15A與15B圖為本發明第四實施例所揭露之軟性電路板之示意圖。13 to 15A and 15B are schematic views of a flexible circuit board according to a fourth embodiment of the present invention.

1...軟性電路板1. . . Flexible circuit board

10...主體部10. . . Main body

11...接合部11. . . Joint

12...連結部12. . . Linkage

121...緩衝區121. . . Buffer

123...應力集中區123. . . Stress concentration zone

1231...轉折1231. . . Turn

13...電子元件13. . . Electronic component

Claims (20)

一種軟性電路板,包含:一主體部,配置有一電子元件;一接合部,連結於一連接器;及一連結部,其二端分別連結該主體部與該接合部,該連結部包含:一緩衝區,該緩衝區為單層板體;及一應力集中區,位於該緩衝區與該主體部之間,而該緩衝區位於該應力集中區與該接合部之間,該應力集中區為複數層板體,其中當該連結部受一外力時應力集中於該應力集中區內,該緩衝區用以緩衝該應力集中區所受之應力。 A flexible circuit board comprising: a main body portion, an electronic component; an engaging portion coupled to a connector; and a connecting portion, the two ends of which respectively connect the main body portion and the engaging portion, the connecting portion comprising: a buffer zone, the buffer zone is a single-layer plate body; and a stress concentration zone is located between the buffer zone and the main body portion, and the buffer zone is located between the stress concentration zone and the joint portion, and the stress concentration zone is a plurality of layers, wherein stress is concentrated in the stress concentration region when the joint is subjected to an external force, and the buffer is used to buffer stress in the stress concentration region. 如請求項1之軟性電路板,其中,該應力集中區包含一轉折。 The flexible circuit board of claim 1, wherein the stress concentration zone comprises a turn. 如請求項2之軟性電路板,其中,該轉折包含一圓角(R角)、鈍角或銳角之其中一者。 A flexible circuit board as claimed in claim 2, wherein the transition comprises one of a rounded corner (R angle), an obtuse angle or an acute angle. 如請求項1之軟性電路板,其中,該電子元件包含一發光二極體。 The flexible circuit board of claim 1, wherein the electronic component comprises a light emitting diode. 如請求項1之軟性電路板,其中,該連接器用以連結至一電路控制板。 The flexible circuit board of claim 1, wherein the connector is for connecting to a circuit control board. 一種軟性電路板,包括:一主體部,設置有一電子元件;一接合部,設置有一連接器;及一連結部,其二端分別連結該主體部與該接合部,且該連結部包括至少二應力集中區與一緩衝區,其中該至少二應力集中區分別位於該連結部的二側,該緩衝區位於應力集中區與接合部之間,及該緩衝區之至少一側鄰接於該應力集中區,其中該緩衝區為單層板體,而各該應力集中區為複數層板體。 A flexible circuit board comprising: a main body portion provided with an electronic component; a joint portion provided with a connector; and a connecting portion, the two ends of which respectively connect the main body portion and the joint portion, and the joint portion includes at least two a stress concentration zone and a buffer zone, wherein the at least two stress concentration zones are respectively located on two sides of the joint portion, the buffer zone is located between the stress concentration zone and the joint portion, and at least one side of the buffer zone is adjacent to the stress concentration a zone, wherein the buffer zone is a single-layer plate, and each of the stress concentration zones is a plurality of layers. 如請求項6之軟性電路板,其中,該每一應力集中區包含一轉折。 The flexible circuit board of claim 6, wherein each stress concentration zone comprises a turn. 如請求項7之軟性電路板,其中,該轉折包含一圓角(R角)、鈍角或銳角之其中一者。 A flexible circuit board as claimed in claim 7, wherein the transition comprises one of a rounded corner (R angle), an obtuse angle or an acute angle. 如請求項6之軟性電路板,其中,該電子元件包含一發光二極體。 The flexible circuit board of claim 6, wherein the electronic component comprises a light emitting diode. 如請求項6之軟性電路板,其中,該連接器用以連結至一電路控制板。 The flexible circuit board of claim 6, wherein the connector is for connecting to a circuit control board. 一種軟性電路板,包含:一主體部,配置有一電子元件;一接合部,連接於一連接器;一連結部,其二端分別連結該主體部與該接合部,該連結部包含一應力集中區及一緩衝區,該緩衝區位於該應力集中區與該接合部之間,其中該緩衝區為單層板體,及該應力集中區為複數層板體;及一包覆材,位於該連結部,且該包覆材覆蓋該應力集中區。 A flexible circuit board comprising: a main body portion configured with an electronic component; a joint portion connected to a connector; a connecting portion, the two ends of which respectively connect the main body portion and the joint portion, the joint portion including a stress concentration And a buffer zone between the stress concentration zone and the joint portion, wherein the buffer zone is a single-layer plate body, and the stress concentration zone is a plurality of layer plates; and a cladding material is located at the a joint portion, and the covering material covers the stress concentration region. 如請求項11之軟性電路板,其中,該包覆材由該連結部延伸至該主體部而位於該主體部之表面。 The flexible circuit board of claim 11, wherein the covering material extends from the joint portion to the main body portion and is located on a surface of the main body portion. 如請求項12之軟性電路板,其中,該包覆材位於該電子元件之間。 A flexible circuit board as claimed in claim 12, wherein the cladding material is located between the electronic components. 如請求項11之軟性電路板,其中,該應力集中區包含一轉折。 The flexible circuit board of claim 11, wherein the stress concentration zone comprises a turn. 如請求項14之軟性電路板,其中,該轉折包含一圓角(R角)、鈍角或銳角之其中一者。 A flexible circuit board as claimed in claim 14, wherein the transition comprises one of a rounded corner (R angle), an obtuse angle or an acute angle. 如請求項11之軟性電路板,該包覆材包含一黏性膠帶。 In the flexible circuit board of claim 11, the covering material comprises an adhesive tape. 如請求項11之軟性電路板,該連結部包含相對之一第一面與一第二面,該包覆材與該電子元件位於該第一面。 The flexible circuit board of claim 11, wherein the connecting portion comprises a first surface and a second surface, and the cladding material and the electronic component are located on the first surface. 如請求項17之軟性電路板,該包覆材由該第一面延伸至該第二面。 The flexible material of claim 17, the cladding material extending from the first side to the second side. 如請求項11之軟性電路板,其中,該電子元件包含一發光二極體。 The flexible circuit board of claim 11, wherein the electronic component comprises a light emitting diode. 如請求項11之軟性電路板,其中,該連接器用以連接至一電路控制板。The flexible circuit board of claim 11, wherein the connector is for connecting to a circuit control board.
TW098139507A 2009-11-20 2009-11-20 Flexible printed circuit board TWI461115B (en)

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US11670900B2 (en) 2019-02-05 2023-06-06 Emergency Technology, Inc. Universal smart adaptor

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TWI287159B (en) * 2000-04-25 2007-09-21 Casio Computer Co Ltd Display module
TW200939933A (en) * 2006-09-15 2009-09-16 Sumitomo Bakelite Co Connector unit, flexible substrate thereof, manufacturing method, and electronic equipment

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Publication number Priority date Publication date Assignee Title
TWI287159B (en) * 2000-04-25 2007-09-21 Casio Computer Co Ltd Display module
TW200939933A (en) * 2006-09-15 2009-09-16 Sumitomo Bakelite Co Connector unit, flexible substrate thereof, manufacturing method, and electronic equipment

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11670900B2 (en) 2019-02-05 2023-06-06 Emergency Technology, Inc. Universal smart adaptor

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