CN117715292A - Flexible circuit board, display module and display device - Google Patents
Flexible circuit board, display module and display device Download PDFInfo
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- CN117715292A CN117715292A CN202410102375.2A CN202410102375A CN117715292A CN 117715292 A CN117715292 A CN 117715292A CN 202410102375 A CN202410102375 A CN 202410102375A CN 117715292 A CN117715292 A CN 117715292A
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- circuit board
- flexible circuit
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- 238000000059 patterning Methods 0.000 claims abstract description 21
- 230000008602 contraction Effects 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 137
- 239000000758 substrate Substances 0.000 claims description 110
- 239000012790 adhesive layer Substances 0.000 claims description 43
- 210000000746 body region Anatomy 0.000 claims description 30
- 238000005452 bending Methods 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000002356 single layer Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 230000009471 action Effects 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
- H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the invention provides a flexible circuit board, a display module and a display device, wherein the flexible circuit board comprises a circuit board body and a shielding film. The circuit board body is provided with a main body area and a binding area; the main body area is provided with a first end and a second end which are oppositely arranged in a first direction, and the binding area is arranged at the first end of the main body area; the shielding film is arranged on one side of the circuit board body, orthographic projection of the shielding film on the circuit board body is positioned in the main body area; the shielding film is provided with a first shielding region, a patterning region and a second shielding region which are sequentially arranged along a first direction; a patterned region separates the first shielding region and the second shielding region; the patterning area extends along a second direction and is used for generating deformation when the shielding film contracts so as to release contraction stress; the first direction and the second direction are perpendicular to each other. The flexible circuit board of this application embodiment has solved the single face and has been equipped with shielding film, the thinner and softer flexible circuit board of plate body, can't bind the problem after toasting.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a flexible circuit board, a display module, and a display device.
Background
The display module is generally provided with an FPC (Flexible Printed Circuit, flexible circuit board), a shielding film and an electronic element adhered and fixed with the FPC are arranged on the FPC, and the FPC is provided with a binding area for being electrically connected with the display panel so as to realize a display function. When fixing electronic components to FPC, it is often necessary to dry the fixing glue by a baking process, which may cause shrinkage of the shielding film, for FPC with a shielding film on one side, a thinner and softer plate, for example: the shrinkage of the shielding film can cause the FPC to warp, so that the binding area of the FPC and the display panel cannot be bound (bound), and the flexible circuit board cannot be used.
Disclosure of Invention
The embodiment of the invention aims to provide a flexible circuit board, a display module and a display device, which are used for solving the problem that a shielding film is arranged on one side of the flexible circuit board, and the board body is thinner and softer and cannot be bound after baking. The specific technical scheme is as follows:
embodiments of a first aspect of the present application provide a flexible circuit board including a circuit board body and a shielding film. The circuit board body is provided with a main body area and a binding area; the main body area is provided with a first end and a second end which are oppositely arranged in a first direction, and the binding area is arranged at the first end of the main body area; the shielding film is arranged on one side of the circuit board body, and orthographic projection of the shielding film on the circuit board body is positioned in the main body area; the shielding film is provided with a first shielding region, a patterning region and a second shielding region which are sequentially arranged along the first direction; the patterned region separates the first shielding region and the second shielding region; the patterning region extends along a second direction and is used for generating deformation when the shielding film contracts so as to release contraction stress; the first direction and the second direction are perpendicular to each other.
In some embodiments of the present application, the patterned region is in a grid shape, and has a plurality of via structures arranged at intervals.
In some embodiments of the present application, the via structure is: triangular holes, rectangular holes, circular holes, elliptical holes or polygonal holes.
In some embodiments of the present application, the maximum dimension value of the via structure is 2mm or less;
the minimum distance between the edges of two adjacent through hole structures is in the range of 1-2mm.
In some embodiments of the present application, the main body region of the circuit board body includes: a connection region and a device region;
the connecting area is provided with a first connecting end and a second connecting end which are oppositely arranged in the first direction, and a third connecting end and a fourth connecting end which are oppositely arranged in the second direction;
the binding area is arranged at a first connecting end of the connecting area;
the orthographic projection of the shielding film on the circuit board body coincides with the connecting area;
the device region is used for setting an electronic element; the number of the device areas is one, and the device areas are positioned at the third connecting end or the fourth connecting end of the connecting area; or the number of the device areas is two, and the two device areas are respectively positioned at the third connecting end and the fourth connecting end of the connecting area.
In some embodiments of the present application, the attachment region is rectangular;
the first shielding region, the patterning region and the second shielding region are rectangular; the patterning region extends from the third connecting end to the fourth connecting end of the connecting region;
the first shielding region and the second shielding region are symmetrically arranged on two sides of the patterning region.
In some embodiments of the present application, in the second direction, the size of the binding region is smaller than the size of the connection region;
the binding area is arranged at the middle position of the first connecting end of the connecting area.
In some embodiments of the present application, the flexible circuit board is a single-layer FPC, a two-layer FPC, or a three-layer FPC.
In some embodiments of the present application, the flexible circuit board is a single-layer board FPC; the body region includes: the first substrate layer, the first conductive layer and the second substrate layer are sequentially stacked; wherein the second substrate layer and the first conductive layer extend outwardly from the body region to form the binding region; the shielding film is arranged on one side of the second substrate layer away from the first substrate layer;
or, the flexible circuit board is a two-layer FPC; the body region includes: the third substrate layer, the second conductive layer, the first insulating adhesive layer, the third conductive layer and the fourth substrate layer are sequentially stacked; wherein the fourth substrate layer and the third conductive layer extend outwardly from the body region to form the binding region; the shielding film is arranged on one side of the fourth basal layer far away from the third basal layer;
or, the flexible circuit board is a three-layer FPC; the body region includes: a fifth basal layer, a fourth conductive layer, a sixth basal layer, a fifth conductive layer, a second insulating adhesive layer, a sixth conductive layer and a seventh basal layer which are sequentially stacked; wherein the sixth conductive layer and the seventh base layer extend outwardly from the body region to form the binding region; the shielding film is arranged on one side of the seventh basal layer far away from the fifth basal layer.
An embodiment of a second aspect of the present application provides a display module, where the display module includes the flexible circuit board according to any one of the embodiments of the first aspect.
In some embodiments of the present application, the display module further includes: a substrate, a display panel, and a battery;
the display panel comprises a display part, a bending part and a binding part which are sequentially connected; the bending part bends the binding part to the non-display side of the display part; the display part and the binding part are respectively positioned at two sides of the substrate; the binding part is fixed on the substrate;
the flexible circuit board is fixedly arranged on one side of the substrate far away from the display part; the main body area of the flexible circuit board is arranged at intervals with the binding part, and the binding area is bound with the binding part;
the battery is arranged on one side, far away from the substrate, of the binding part of the flexible circuit board and the display panel; and the front projection of the battery on the substrate covers the front projection of the main body area and the binding area of the flexible circuit board on the substrate, and has an overlapping area with the front projection of the binding part of the display panel on the substrate.
In some embodiments of the present application, the display module further includes: the first back film, the second back film, the first adhesive layer, the second adhesive layer, the protective adhesive layer and the chip;
the first back film is arranged between the display part and the substrate, and the orthographic projection of the first back film on the substrate covers the orthographic projection of the display part on the substrate;
the first adhesive layer is arranged between the first back film and the substrate, and the orthographic projection of the first adhesive layer on the substrate is positioned in the range of the substrate;
the second back film is arranged between the binding part and the substrate, and the orthographic projection of the second back film on the substrate covers the orthographic projection of the binding part on the substrate and is arranged at intervals with the main body area of the flexible circuit board;
the second adhesive layer is arranged between the second back film and the substrate, and the orthographic projection of the second adhesive layer on the substrate is positioned in the range of the substrate and is arranged at intervals with the main body area of the flexible circuit board;
the protective adhesive layer is coated on one side of the bending part of the display panel, which is far away from the flexible circuit board;
the chip is arranged on one side of the binding part of the display panel, which is far away from the substrate.
An embodiment of a third aspect of the present application provides a display device, including a display module of any one of the embodiments of the second aspect.
The embodiment of the invention has the beneficial effects that:
the flexible circuit board of the embodiment of the application comprises a circuit board body and a shielding film. The main body area of the circuit board body is provided with a first end and a second end which are oppositely arranged in a first direction, and the binding area is arranged at the first end of the main body area; the shielding film is arranged on one side of the circuit board body, orthographic projection of the shielding film on the circuit board body is positioned in the main body area; the shielding film is provided with a first shielding region, a patterning region and a second shielding region which are sequentially arranged along a first direction, wherein the patterning region extends along a second direction and is used for generating deformation when the shielding film contracts so as to release contraction stress; when the shielding film contracts, the shielding film applies contraction stress for warping the first end and the second end of the circuit board body, the circuit board body applies reverse force for the shielding film, the patterning area deforms under the action of the reverse force, the contraction stress of the shielding film is released, the first shielding area and the second shielding area cannot contract towards the direction close to the patterning area under the action of the contraction stress, the first end and the second end of the circuit board body are kept flat, warping does not occur, the position precision of the binding area is further guaranteed, the circuit board body can be better connected with the display panel, and the problem that the flexible circuit board with the shielding film and the thin and soft board body on one side cannot be bound after baking is solved.
The flexible circuit board of this embodiment of the application, including the flexible circuit board of any embodiment of first aspect, when the shielding film takes place to shrink, the shielding film is applyed the shrink stress that makes its warpage for the first end and the second end of circuit board body, the circuit board body is applyed reverse force for the shielding film, under the effect of reverse force, the patterning area takes place deformation, the shrink stress of shielding film has been released, make first shielding area and second shielding area can not shrink under the effect of shrink stress, the direction that is close to the patterning area shrink, thereby make the first end and the second end of circuit board body keep level, can not take place the warpage, and then guaranteed the position accuracy of binding area, make it can be better be connected with display panel, the single face is equipped with the shielding film, the softer flexible circuit board of plate body, unable problem of binding after toasting, make flexible circuit board and display panel's connection more reliable, thereby display module stability has been improved.
The display device of this application embodiment, including the display module assembly of any embodiment of second aspect, the flexible circuit board that the display module assembly contained still can bind after toasting, and flexible circuit board and display panel's connection is more reliable to improved display module assembly's stability, and then improved display device's stability.
Of course, it is not necessary for any one product to practice the invention to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and other embodiments may be obtained according to these drawings to those skilled in the art.
FIG. 1 is a schematic diagram of a display module in the related art;
FIG. 2 is a diagram showing a connection relationship between a flexible circuit board and a display panel in the related art;
FIG. 3 is a top view of a flexible circuit board in an embodiment of the present application;
fig. 4 is a schematic structural diagram of a flexible circuit board according to a first embodiment of the present application;
FIG. 5 is an enlarged partial schematic view (circular aperture) at P in FIG. 3;
FIG. 6 is an enlarged schematic view of a portion of the portion P of FIG. 3 (square hole);
fig. 7 is a schematic structural diagram of a flexible circuit board according to a second embodiment of the present application;
fig. 8 is a schematic structural diagram of a flexible circuit board according to a third embodiment of the present application;
fig. 9 is a top view of a display module according to an embodiment of the disclosure;
fig. 10 is a schematic structural diagram of a display module according to an embodiment of the disclosure.
Reference numerals illustrate:
in fig. 1 and 2: a flexible circuit board 1; a first base layer 11; a first conductive layer 12; a first insulating adhesive layer 13; a second conductive layer 14; a second substrate layer 15; a shielding film 16; an electronic component 17; binding area 18; a substrate 2; a battery 3; a display panel 4; a display section 41; a bending portion 42; a binding portion 43; a chip 5; a first back film 91; a second back film 92; a first adhesive layer 93; a second glue layer 94; a protective adhesive layer 95;
in fig. 3 to 10: a flexible circuit board 10; a substrate 20; a display panel 30; a display unit 31; a bending portion 32; a binding portion 33; a battery 40; a first back film 51; a second back film 52; a first adhesive layer 61; a second glue layer 62; a protective adhesive layer 70; a chip 80; a circuit board body 100; a body region 110; a first end 1101; a second end 1102; a connection region 111; a first connection 1111; a second connection 1112; third connection 1113; a fourth connection end 1114; a device region 112; binding area 120; a conductive layer 101; an insulating layer 102; a first base layer 1011; a first conductive layer 1021; a second substrate layer 1012; a third substrate layer 1013; a second conductive layer 1022; a first insulating adhesive layer 1031; a third conductive layer 1023; a fourth substrate layer 1014; a fifth base layer 1015; a fourth conductive layer 1024; a sixth substrate layer 1016; a fifth conductive layer 1025; a second insulating adhesive layer 1032; a sixth conductive layer 1026; a seventh substrate layer 1017; a shielding film 200; a first shielding region 210; patterning region 220; a via structure 221; a second shielding region 230; an electronic component 300.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, those of ordinary skill in the art will be able to devise all other embodiments that are obtained based on this application and are within the scope of the present invention.
With the rapid development of electronic technology, display devices are becoming thinner and thinner, and the battery size is also becoming smaller, thereby resulting in insufficient endurance of the display devices. Therefore, how to thin the display device without reducing the battery capacity is a research direction of those skilled in the art.
As shown in fig. 1 and 2, fig. 1 is a schematic structural diagram of a display module in the related art, fig. 2 is a connection relation diagram of a flexible circuit board 1 and a display panel 4 in the related art, a display module included in a display device in the related art includes a substrate 2 and the display panel 4, and the display panel 4 includes a display portion 41, a bending portion 42 and a binding portion 43 which are sequentially connected; the bending portion 42 causes the binding portion 43 to be bent to the non-display side of the display portion 41; the substrate 2 is located between the display portion 41 and the binding portion 43; the binding portion 43 is fixed to the substrate 2; the binding portion 43 is provided with a chip 5 on a side away from the substrate 2. A first back film 91 is arranged between the substrate 2 and the display part 41, and a first adhesive layer 93 is arranged between the first back film 91 and the substrate 2; a second back film 92 is arranged between the substrate 2 and the binding part 43, and a second adhesive layer 94 is arranged between the second back film 92 and the substrate 2; the side of the bending part 42 away from the flexible circuit board 1 is coated with a protective adhesive layer 95. The flexible circuit board 1 and the battery 3 are both disposed on a side of the substrate 2 away from the display portion 41, and are disposed adjacently. The flexible circuit board 1 is provided with an electronic element 17 adhered and fixed with the flexible circuit board 1 at one side far away from the base plate 2, and the flexible circuit board 1 is provided with a binding area 18 used for binding with a binding part 43 of the display panel 4 so as to realize a display function. The flexible circuit board 1 is a multi-layer board FPC, occupies a large space, and thus causes a small battery capacity, and the cost of the multi-layer board FPC is high. The multi-layer board FPC described herein refers to a four-layer board FPC and the above flexible circuit board 1.
If the flexible circuit board 1 with a smaller thickness is to be used instead of the multi-layer board FPC to reduce the occupied space of the flexible circuit board 1, as shown in fig. 2, taking a two-layer board FPC as an example, the flexible circuit board 1 includes a first base layer 11, a first conductive layer 12, a first insulating adhesive layer 13, a second conductive layer 14, a second base layer 15 and a shielding film 16 which are sequentially stacked. Since the fixing adhesive is often required to be baked when the electronic component 17 is fixed on the flexible circuit board 1, the baking process can cause the shielding film 16 to shrink, and the shrinking direction is shown in fig. 2, for the flexible circuit board 1 with the shielding film 16 on one side and the thinner and softer board body, the shrinking of the shielding film 16 can cause the flexible circuit board 1 to warp, so that the binding area 18 of the flexible circuit board 1 and the display panel 4 cannot be bound (bound), and the flexible circuit board 1 cannot be used. In order to solve the technical problems, the embodiment of the application provides a flexible circuit board, a display module and a display device.
It should be noted that, in the embodiment of the present application, the first direction may be a length direction of the flexible circuit board, and the second direction corresponds to a width direction of the flexible circuit board; or the first direction may be a width direction of the flexible circuit board, and the second direction corresponds to a length direction of the flexible circuit board.
As shown in fig. 3 and 4, fig. 3 is a top view of a flexible circuit board 10 according to an embodiment of the present application, fig. 4 is a schematic structural diagram of the flexible circuit board 10 according to a first embodiment of the present application, and an embodiment of the first aspect of the present application proposes a flexible circuit board 10, where the flexible circuit board 10 includes a circuit board body 100 and a shielding film 200 (EMI). Specifically, the circuit board body 100 has a main body region 110 and a binding region 120; the body region 110 has a first end 1101 and a second end 1102 disposed opposite in a first direction, and the binding region 120 is disposed at the first end 1101 of the body region 110; the shielding film 200 is arranged on one side of the circuit board body 100, and the orthographic projection of the shielding film 200 on the circuit board body 100 is positioned in the main body area 110; the shielding film 200 has a first shielding region 210, a patterned region 220, and a second shielding region 230 sequentially disposed along a first direction; a patterned region 220 (pattern region) separates the first shielding region 210 and the second shielding region 230; the patterned region 220 extends along the second direction to deform when the shielding film 200 contracts, so as to release the contraction stress; the first direction and the second direction are perpendicular to each other.
The flexible circuit board 10 of the embodiment of the present application includes a circuit board body 100 and a shielding film 200. The main body region 110 of the circuit board body 100 has a first end 1101 and a second end 1102 disposed opposite to each other in a first direction, and the binding region 120 is disposed at the first end 1101 of the main body region 110; the shielding film 200 is arranged on one side of the circuit board body 100, and the orthographic projection of the shielding film 200 on the circuit board body 100 is positioned in the main body area 110; the shielding film 200 has a first shielding region 210, a patterned region 220, and a second shielding region 230 sequentially arranged along a first direction, the patterned region 220 extending along a second direction to deform when the shielding film 200 is contracted to release contraction stress; when the shielding film 200 contracts, the shielding film 200 applies contraction stress to the first end 1101 and the second end 1102 of the circuit board body 100 to enable the first end 1101 and the second end 1102 to warp, the circuit board body 100 applies reverse force to the shielding film 200, the patterned area 220 deforms under the action of the reverse force, the contraction stress of the shielding film 200 is released, the first shielding area 210 and the second shielding area 230 cannot contract towards the direction close to the patterned area 220 under the action of the contraction stress, the first end 1101 and the second end 1102 of the circuit board body 100 are enabled to be kept flat and not to warp, the position accuracy of the binding area 120 is guaranteed, the circuit board body can be connected with the display panel 30 well, and the problem that the flexible circuit board 10 with the shielding film 200 and the thin and soft board body on one side cannot be bound after baking is solved.
In addition, the shielding film 200 has electromagnetic interference resistance, so that the electromagnetic interference resistance of the flexible circuit board 10 to the outside can be improved, and the flexible circuit board 10 can work normally in a harsher electromagnetic environment. The design scheme of the shielding film 200 in the embodiment of the application is suitable for various flexible circuit boards 10, and is particularly suitable for a single-sided EMI two-layer board FPC with a large area.
As shown in fig. 5 and 6, fig. 5 is a schematic partial enlarged view (circular hole) at P in fig. 3, and fig. 6 is a schematic partial enlarged view (square hole) at P in fig. 3, in some embodiments of the present application, the patterned region 220 is in a grid shape, and has a plurality of via structures 221 (pattern holes) arranged at intervals. The grid-like design allows the patterned region 220 to be more easily deformed, thereby better releasing the shrinkage stress. During the manufacturing process, pattern holes 221 may be designed by die cutting prior to the lamination of shielding film 200.
In some embodiments of the present application, the via structures 221 may be triangular holes, rectangular holes, circular holes, elliptical holes, or polygonal holes. In the embodiment shown in fig. 5, the via structures 221 are circular holes; in the embodiment shown in fig. 6, the via structures 221 are square holes. In other embodiments of the present application, the via structures 221 may be irregular shaped holes, as long as they can meet the stress release requirement, which is not limited in the present application. For the same patterned region 220, a single-shaped via structure 221 may be used, or multiple shapes may be mixed, which is not limited in this application.
In some embodiments of the present application, as shown in fig. 5 and 6, the maximum dimension value a of the via structure 221 is 2mm or less; the minimum distance b between the edges of two adjacent via structures 221 ranges from 1-2mm. According to the size design, the stress release requirement can be met, and meanwhile, a good shielding effect can be maintained.
In some embodiments of the present application, as shown in fig. 3, the main body region 110 of the circuit board body 100 includes a connection region 111 and a device region 112; the connection region 111 has a first connection end 1111 and a second connection end 1112 disposed opposite to each other in the first direction, and a third connection end 1113 and a fourth connection end 1114 disposed opposite to each other in the second direction; the binding area 120 is disposed at the first connection end 1111 of the connection area 111; the orthographic projection of the shielding film 200 on the circuit board body 100 coincides with the connection region 111; a device region 112 for disposing the electronic component 300; the number of device regions 112 is one, and is located at the third connection terminal 1113 or the fourth connection terminal 1114 of the connection region 111; alternatively, the number of device regions 112 is two, and the two device regions 112 are located at the third connection terminal 1113 and the fourth connection terminal 1114 of the connection region 111, respectively. By the arrangement, the electronic element 300 arranged on the device region 112 does not influence the arrangement of devices in the connection region 111, so that the connection region 111 can be used for arranging devices such as the battery 40, and the electronic element 300 of the device region 112 and the battery 40 do not have overlapping areas in the thickness direction of the flexible circuit board 10, thereby being beneficial to reducing the thickness of the display module.
In some embodiments of the present application, as shown in fig. 3, the connection region 111 is rectangular; the first shielding region 210, the patterned region 220, and the second shielding region 230 are rectangular; the patterned region 220 extends from the third connection terminal 1113 to the fourth connection terminal 1114 of the connection region 111, and the first shielding region 210 and the second shielding region 230 are symmetrically disposed at both sides of the patterned region 220. In this way, the processing is convenient, and the first shielding region 210 and the second shielding region 230 are symmetrically disposed at two sides of the patterned region 220, that is, the patterned region 220 is formed at the middle position of the shielding film 200, so that the deformation of the patterned region 220 is more uniform, and the shrinkage stress is released uniformly, so that the first end 1101 and the second end 1102 of the main body region 110 are not tilted, and remain flat.
In some embodiments of the present application, as shown in fig. 3, in the second direction, the size of the binding area 120 is smaller than the size of the connection area 111; the binding area 120 is disposed at an intermediate position of the first connection end 1111 of the connection area 111. With this arrangement, when the flexible circuit board 10 has a certain amount of shrinkage in the second direction, and thus warpage occurs at both ends in the second direction, since the size of the bonding area 120 in the second direction is smaller than that of the connection area 111, and the bonding area 120 is located at the middle position of the first connection end 1111 of the connection area 111, the warpage in the second direction does not substantially affect the flatness of the bonding area 120.
Further, the plate shapes of the binding area 120 and the connecting area 111 are axisymmetric, and the symmetry axes of the two are coincident, so that the symmetry of the flexible circuit board 10 is better.
In some embodiments of the present application, the flexible circuit board 10 is a single-layer FPC, a two-layer FPC, or a three-layer FPC, and is widely used.
In the first embodiment of the present application, as shown in fig. 4, fig. 4 is a schematic structural diagram of a flexible circuit board 10 according to the first embodiment of the present application, and the flexible circuit board 10 is a two-layer FPC; the body region 110 includes a third substrate layer 1013, a second conductive layer 1022, a first insulating adhesive layer 1031, a third conductive layer 1023, and a fourth substrate layer 1014, which are sequentially stacked; wherein fourth substrate layer 1014 and third conductive layer 1023 extend outwardly from body region 110 to form binding region 120; the shielding film 200 is disposed on a side of the fourth base layer 1014 remote from the third base layer 1013.
In the second embodiment of the present application, as shown in fig. 7, fig. 7 is a schematic structural diagram of a flexible circuit board 10 according to the second embodiment of the present application, and the flexible circuit board 10 is a single-layer board FPC; the body region 110 includes a first base layer 1011, a first conductive layer 1021, and a second base layer 1012, which are sequentially stacked; wherein the second substrate layer 1012 and the first conductive layer 1021 extend outwardly from the body region 110 to form the binding region 120; the shielding film 200 is disposed on a side of the second base layer 1012 away from the first base layer 1011.
In the third embodiment of the present application, as shown in fig. 8, fig. 8 is a schematic structural diagram of a flexible circuit board 10 according to the third embodiment of the present application, and the flexible circuit board 10 is a three-layer FPC; the body region 110 includes a fifth base layer 1015, a fourth conductive layer 1024, a sixth base layer 1016, a fifth conductive layer 1025, a second insulating adhesive layer 1032, a sixth conductive layer 1026, and a seventh base layer 1017, which are sequentially stacked; wherein a sixth conductive layer 1026 and a seventh substrate layer 1017 extend outwardly from the body region 110 to form a binding region 120; the shielding film 200 is disposed on a side of the seventh base layer 1017 remote from the fifth base layer 1015.
Specifically, a base layer and a conductive layer may constitute a substrate; the first to seventh base layers (1011-1017) may be PI (Polyimide) layers, and the first to sixth conductive layers (1021-1026) may be copper layers.
Embodiments of the second aspect of the present application provide a display module comprising the flexible circuit board 10 of any of the embodiments of the first aspect.
The display module of this embodiment includes the flexible circuit board 10 of any embodiment of the first aspect, when the shielding film 200 contracts, the shielding film 200 exerts the contraction stress that makes its warpage for the first end 1101 and the second end 1102 of the circuit board body 100, the circuit board body 100 exerts reverse force for the shielding film 200, under the effect of reverse force, the patterning region 220 takes place to deform, the contraction stress of the shielding film 200 has been released, make first shielding region 210 and second shielding region 230 can not contract under the effect of contraction stress, towards the direction that is close to the patterning region 220, thereby make the first end 1101 and the second end 1102 of the circuit board body 100 keep level, can not take place the warpage, and then guaranteed the position accuracy of bonding region 120, make it can be better be connected with the display panel 30, the problem that the single face is equipped with the shielding film 200, the board body is thinner and softer flexible circuit board 10, unable the bonding after toasting is solved, make the connection of flexible circuit board 10 and display panel 30 more reliable, thereby the stability of display module has been improved.
In some embodiments of the present application, as shown in fig. 9 and 10, fig. 9 is a top view of a display module according to an embodiment of the present application, and fig. 10 is a schematic structural diagram of the display module according to an embodiment of the present application, where the display module further includes a substrate 20 (BKT), a display panel 30 (PNL), and a battery 40; the display panel 30 includes a display portion 31, a bending portion 32, and a binding portion 33 connected in sequence, and in fig. 10, a broken line is a dividing line of the display portion 31, the bending portion 32, and the binding portion 33; the bending portion 32 causes the binding portion 33 to bend to the non-display side of the display portion 31; the display portion 31 and the binding portion 33 are respectively located at both sides of the substrate 20, and the binding portion 33 is fixed to the substrate 20; the flexible circuit board 10 is fixedly arranged on one side of the substrate 20 away from the display part 31; the main body area 110 of the flexible circuit board 10 is arranged at intervals with the binding part 33, and the binding area 120 is bound with the binding part 33; the battery 40 is disposed at a side of the binding portion 33 of the flexible circuit board 10 and the display panel 30 away from the substrate 20; the front projection of the battery 40 on the substrate 20 covers the front projection of the body region 110 and the binding region 120 of the flexible circuit board 10 on the substrate 20 and has an overlapping area with the front projection of the binding portion 33 of the display panel 30 on the substrate 20.
It will be appreciated that in the embodiment shown in fig. 10, the flexible circuit board 10 only shows the conductive layers 101 and the insulating layers 102 stacked and alternately arranged, wherein the insulating layers 102 may be a glue layer, a shielding film 200, and a substrate layer. The specific structure of the flexible circuit board 10 can be seen in fig. 4, 7 and 8.
When the flexible circuit board 10 is a flexible circuit board 10 with thinner thickness such as a single-layer FPC, a two-layer FPC or a three-layer FPC, the area of the flexible circuit board 10 is enlarged according to the arrangement mode, wiring is convenient, the thickness of the flexible circuit board 10 is much thinner, the occupied space of the flexible circuit board 10 can be reduced, and more installation space is provided for the battery 40; the battery 40 may be disposed at a side of the binding portion 33 (pad binding region) of the flexible circuit board 10 and the display panel 30 away from the substrate 20, and the length of the battery 40 is increased, thereby increasing the capacity of the battery 40 and further improving the cruising ability of the display device. Taking a two-layer FPC as an example, compared with a multi-layer FPC, the two-layer FPC has the advantages of less consumption materials, fewer holes, simpler process and thinner thickness, and the cost of the two-layer FPC with the same plate surface size is 30% of that of the six-layer FPC. Under the condition that the thickness of the display device is the same, the design can reduce the occupied space of the flexible circuit board 10, so that the space for placing the battery 40 is more, the capacity of the battery 40 is increased, and the cost of the flexible circuit board 10 is reduced by more than 80%.
In some embodiments of the present application, as shown in fig. 9 and 10, the display module further includes a first back Film 51 (U-Film), a second back Film 52 (U-Film), a first adhesive layer 61 (PI glue), a second adhesive layer 62 (bonding tape), a protective adhesive layer 70, and a chip 80 (IC); the first back film 51 is provided between the display portion 31 and the substrate 20, and its front projection on the substrate 20 covers the front projection of the display portion 31 on the substrate 20; the first adhesive layer 61 is disposed between the first back film 51 and the substrate 20, and its orthographic projection on the substrate 20 is located within the range of the substrate 20; the second back film 52 is disposed between the binding portion 33 and the substrate 20, and its orthographic projection on the substrate 20 covers the orthographic projection of the binding portion 33 on the substrate 20 and is disposed at a distance from the main body region 110 of the flexible circuit board 10; the second adhesive layer 62 is disposed between the second back film 52 and the substrate 20, and its orthographic projection on the substrate 20 is located within the range of the substrate 20 and is spaced from the main body region 110 of the flexible circuit board 10; the protective adhesive layer 70 is coated on one side of the bending part 32 of the display panel 30 away from the flexible circuit board 10; the chip 80 is disposed at a side of the binding portion 33 of the display panel 30 away from the substrate 20.
The front projection of the first back film 51 on the substrate 20 covers the front projection of the display part 31 on the substrate 20, so as to support the display part 31, and the front projection can be contacted; the orthographic projection of the second back film 52 on the substrate 20 covers the orthographic projection of the binding portion 33 on the substrate 20, and plays a supporting role on the binding portion 33, and the two can be in contact arrangement, so that the stability of the display module is improved. The first adhesive layer 61 is used for fixing the first back film 51 and the substrate 20; the second adhesive layer 62 is used to fix the second back film 52 and the substrate 20. The protective adhesive layer 70 is disposed on a side of the bending portion 32 away from the flexible circuit board 10, which is beneficial to bending the same, and prevents the display panel 30 from being damaged due to stress concentration during bending, and specifically, the protective adhesive layer 70 may be MCL glue.
An embodiment of a third aspect of the present application provides a display device, including a display module of any one of the embodiments of the second aspect.
As shown in fig. 9, when the display device is a folding display device, the broken line shown in fig. 9 is a folding axis of the display device, and the display module may be disposed at one side of the folding axis.
The display device of this application embodiment, including the display module assembly of any embodiment of second aspect, the flexible circuit board 10 that the display module assembly contained still can bind after toasting, and flexible circuit board 10 and display panel 30's connection is more reliable to improved the stability of display module assembly, and then improved display device's stability.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In this specification, each embodiment is described in a related manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (13)
1. A flexible circuit board, comprising:
the circuit board body is provided with a main body area and a binding area; the main body area is provided with a first end and a second end which are oppositely arranged in a first direction, and the binding area is arranged at the first end of the main body area;
the shielding film is arranged on one side of the circuit board body, and orthographic projection of the shielding film on the circuit board body is positioned in the main body area; the shielding film is provided with a first shielding region, a patterning region and a second shielding region which are sequentially arranged along the first direction; the patterned region separates the first shielding region and the second shielding region; the patterning region extends along a second direction and is used for generating deformation when the shielding film contracts so as to release contraction stress;
the first direction and the second direction are perpendicular to each other.
2. The flexible circuit board of claim 1 wherein the patterned areas are in the form of a grid having a plurality of spaced apart via structures.
3. The flexible circuit board of claim 2, wherein the via structure is: triangular holes, rectangular holes, circular holes, elliptical holes or polygonal holes.
4. The flexible circuit board of claim 2 wherein the flexible circuit board comprises,
the maximum size value of the through hole structure is less than or equal to 2mm;
the minimum distance between the edges of two adjacent through hole structures is in the range of 1-2mm.
5. The flexible circuit board of claim 1 wherein the flexible circuit board comprises,
the main area of the circuit board body comprises: a connection region and a device region;
the connecting area is provided with a first connecting end and a second connecting end which are oppositely arranged in the first direction, and a third connecting end and a fourth connecting end which are oppositely arranged in the second direction;
the binding area is arranged at a first connecting end of the connecting area;
the orthographic projection of the shielding film on the circuit board body coincides with the connecting area;
the device region is used for setting an electronic element; the number of the device areas is one, and the device areas are positioned at the third connecting end or the fourth connecting end of the connecting area; or the number of the device areas is two, and the two device areas are respectively positioned at the third connecting end and the fourth connecting end of the connecting area.
6. The flexible circuit board of claim 5 wherein the flexible circuit board comprises,
the connecting area is rectangular;
the first shielding region, the patterning region and the second shielding region are rectangular; the patterning region extends from the third connecting end to the fourth connecting end of the connecting region;
the first shielding region and the second shielding region are symmetrically arranged on two sides of the patterning region.
7. The flexible circuit board of claim 5 wherein the flexible circuit board comprises,
in the second direction, the size of the binding area is smaller than the size of the connecting area;
the binding area is arranged at the middle position of the first connecting end of the connecting area.
8. The flexible circuit board according to any one of claims 1 to 7, wherein the flexible circuit board is a single-layer board FPC, a two-layer board FPC, or a three-layer board FPC.
9. The flexible circuit board of claim 8 wherein the flexible circuit board comprises,
the flexible circuit board is a single-layer FPC; the body region includes: the first substrate layer, the first conductive layer and the second substrate layer are sequentially stacked; wherein the second substrate layer and the first conductive layer extend outwardly from the body region to form the binding region; the shielding film is arranged on one side of the second substrate layer away from the first substrate layer;
or, the flexible circuit board is a two-layer FPC; the body region includes: the third substrate layer, the second conductive layer, the first insulating adhesive layer, the third conductive layer and the fourth substrate layer are sequentially stacked; wherein the fourth substrate layer and the third conductive layer extend outwardly from the body region to form the binding region; the shielding film is arranged on one side of the fourth basal layer far away from the third basal layer;
or, the flexible circuit board is a three-layer FPC; the body region includes: a fifth basal layer, a fourth conductive layer, a sixth basal layer, a fifth conductive layer, a second insulating adhesive layer, a sixth conductive layer and a seventh basal layer which are sequentially stacked; wherein the sixth conductive layer and the seventh base layer extend outwardly from the body region to form the binding region; the shielding film is arranged on one side of the seventh basal layer far away from the fifth basal layer.
10. A display module, comprising: the flexible circuit board of any of claims 1 to 9.
11. The display module of claim 10, wherein the display module further comprises: a substrate, a display panel, and a battery;
the display panel comprises a display part, a bending part and a binding part which are sequentially connected; the bending part bends the binding part to the non-display side of the display part; the display part and the binding part are respectively positioned at two sides of the substrate; the binding part is fixed on the substrate;
the flexible circuit board is fixedly arranged on one side of the substrate far away from the display part; the main body area of the flexible circuit board is arranged at intervals with the binding part, and the binding area is bound with the binding part;
the battery is arranged on one side, far away from the substrate, of the binding part of the flexible circuit board and the display panel; and the front projection of the battery on the substrate covers the front projection of the main body area and the binding area of the flexible circuit board on the substrate, and has an overlapping area with the front projection of the binding part of the display panel on the substrate.
12. The display module of claim 11, wherein the display module further comprises: the first back film, the second back film, the first adhesive layer, the second adhesive layer, the protective adhesive layer and the chip;
the first back film is arranged between the display part and the substrate, and the orthographic projection of the first back film on the substrate covers the orthographic projection of the display part on the substrate;
the first adhesive layer is arranged between the first back film and the substrate, and the orthographic projection of the first adhesive layer on the substrate is positioned in the range of the substrate;
the second back film is arranged between the binding part and the substrate, and the orthographic projection of the second back film on the substrate covers the orthographic projection of the binding part on the substrate and is arranged at intervals with the main body area of the flexible circuit board;
the second adhesive layer is arranged between the second back film and the substrate, and the orthographic projection of the second adhesive layer on the substrate is positioned in the range of the substrate and is arranged at intervals with the main body area of the flexible circuit board;
the protective adhesive layer is coated on one side of the bending part of the display panel, which is far away from the flexible circuit board;
the chip is arranged on one side of the binding part of the display panel, which is far away from the substrate.
13. A display device comprising the display module of any one of claims 10 to 12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410102375.2A CN117715292A (en) | 2024-01-24 | 2024-01-24 | Flexible circuit board, display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410102375.2A CN117715292A (en) | 2024-01-24 | 2024-01-24 | Flexible circuit board, display module and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117715292A true CN117715292A (en) | 2024-03-15 |
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ID=90155519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410102375.2A Pending CN117715292A (en) | 2024-01-24 | 2024-01-24 | Flexible circuit board, display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117715292A (en) |
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2024
- 2024-01-24 CN CN202410102375.2A patent/CN117715292A/en active Pending
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