TWI627879B - Flexible circuit board module - Google Patents

Abstract

A flexible circuit board module has a connecting end and an extending direction perpendicular to the connecting end, and includes a substrate, electronic components and N reinforcing plates. The electronic component and the N reinforcing plates are disposed on the first surface and the second surface of the substrate. N is a natural number equal to or greater than two. The N-1th reinforcing plate is disposed between the N-th reinforcing plate and the substrate, and includes at least a first reinforcing plate and a second reinforcing plate. The first reinforcing plate corresponds to the electronic component disposed on the second surface of the substrate. The second reinforcing plate is disposed on one side of the first reinforcing plate opposite to the substrate, and the width of the second reinforcing plate is greater than the width of the first reinforcing plate in the extending direction.

Description

Flexible circuit board module

The invention relates to a flexible circuit board module, in particular to a flexible circuit board module having a plurality of reinforcing plates to reduce the bending curvature.

Due to its bendable characteristics, flexible circuit boards are widely used in electronic products that require thinning and thinning, such as display panels, as electrical connection elements between units in electronic products.

A flexible board is usually provided on the back of the flexible circuit board to protect electronic components such as wafers on the flexible circuit board. However, the flexible circuit board is often bent during the assembly process of the electronic product or after the assembly is completed. At this time, the flexible circuit board is prone to dead bends on the edges of the reinforcing plate, that is, the bend with a large curvature, thereby causing damage to the flexible circuit board. Or the wiring on the flexible circuit board is easy to break, which makes the yield and reliability of the electronic products poor.

An embodiment of the present invention is to provide a flexible circuit board module having a plurality of reinforcing plates, which can reduce the bending curvature of the flexible circuit board and further improve the yield and reliability of the product.

An embodiment of the present invention provides The flexible circuit board module in the extending direction of the connection end includes a substrate, electronic components, and N reinforcing plates. The electronic components are disposed on the first surface of the substrate, and the N reinforcing plates are disposed on the second surface. N is a natural number equal to or greater than two. The N-1th reinforcing plate is disposed between the N-th reinforcing plate and the substrate, and includes at least a first reinforcing plate and a second reinforcing plate. The first reinforcing plate corresponds to the electronic component disposed on the second surface of the substrate. The second reinforcing plate is disposed on one side of the first reinforcing plate opposite to the substrate, and the width of the second reinforcing plate is greater than the width of the first reinforcing plate in the extending direction.

In some embodiments, the width of the first reinforcing plate in the extending direction is greater than the width of the electronic component.

In some embodiments, both sides of the orthographic projection of the second reinforcing plate on the substrate in the extending direction protrude from the orthographic projection of the electronic component on the substrate.

In some embodiments, both sides of the first projection amount of the first reinforcing plate on the substrate in the extending direction protrude from the positive projection amount of the electronic component on the substrate.

In some embodiments, the surface of each of the N reinforcing plates facing the substrate has an adhesive layer.

In some embodiments, the thickness of the N-1th reinforcing plate is greater than the thickness of the Nth reinforcing plate.

In some embodiments, the pitch of the orthographic projection of the second reinforcing plate on the substrate in the extending direction is greater than the thickness of the first reinforcing plate.

In some embodiments, the pitch of the orthographic projection of the Nth reinforcing plate on the substrate in the extension direction is greater than the thickness of the orthographic projection of the N-1th reinforcing plate on the substrate.

In some embodiments, the material rigidity of the N reinforcing plates is greater than the material rigidity of the substrate.

In some embodiments, the material rigidity of the N-1th reinforcing plate is greater than that of the Nth reinforcing plate.

100‧‧‧ flexible circuit board module

102‧‧‧ substrate

1021‧‧‧First surface

1022‧‧‧Second surface

104‧‧‧Electronic components

106 (1) ‧‧‧1st reinforcement board

106 (2) ‧‧‧ 2nd reinforcement board

110‧‧‧Connector

X‧‧‧ extension direction

d1, d2‧‧‧ distance

h1, h2‧‧‧thickness

206 (N) ‧‧‧th Nth reinforcement board

208 (N) ‧‧‧Nth adhesive layer

FIG. 1 is a schematic side view of a flexible circuit board module according to an embodiment of the present invention.

FIG. 2 is a schematic top view of FIG. 1.

FIG. 3 is a schematic side view of another embodiment of the flexible circuit board module of the present invention.

FIG. 4 is a schematic side view of each reinforcing plate 206 (N) in FIG. 3.

In the following, a plurality of embodiments of the present invention will be disclosed graphically. For the sake of clarity, many practical details will be described in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and components will be shown in the drawings in a simple and schematic manner.

Please refer to FIG. 1 and FIG. 2, which are a schematic side view and a top view of a specific embodiment of the present invention, respectively. This embodiment is a flexible circuit board module 100 having a connecting end 110, which can be used with other electronic components such as display panels or printing The circuit board is electrically connected and has an extending direction X perpendicular to the connection end 110. The flexible circuit board module 100 includes a substrate 102, an electronic component 104, a first reinforcing plate 106 (1), and a second reinforcing plate 106 (2). The electronic component 104 may be a driving chip, and is disposed on the first surface 1021 of the substrate 102, and the first reinforcing plate 106 (1) is disposed on the second surface 1022 opposite to the first surface 1021. The second reinforcing plate 106 (2) is provided on one side of the first reinforcing plate 106 (1) with respect to the substrate 102. In other words, from the view of FIG. 1, the electronic component 104, the substrate 102, the first reinforcing plate 106 (1), and the second reinforcing plate 106 (2) are listed in order from the top. The width of the second reinforcing plate 106 (2) in the extending direction X is larger than the width of the first reinforcing plate 106 (1).

In this embodiment, the width 106 (1) of the first reinforcing plate in the extending direction X is larger than the width of the electronic component 104. Thus, when the flexible circuit board is bent, the first reinforcing plate 106 (1) can effectively protect the electronics Element 104.

In this embodiment, the orthographic projection of the second reinforcing plate 106 (2) on the substrate 102 on both sides in the extending direction X protrudes from the orthographic projection of the electronic component 104 on the substrate 102, so as a flexible circuit board mold When the group 100 is bent, the electronic components 104 are covered within both sides of the second reinforcing plate 106 (2), and thus can be more effectively protected. Furthermore, in this embodiment, both sides of the first projection amount of the first reinforcing plate 106 (1) on the substrate 102 may protrude from the distance d1 of the positive projection amount of the electronic component 104 on the substrate 102, where d1 is greater than 0, In this way, when the flexible circuit board module 100 is bent, the electronic components 104 are covered within the two sides of the first reinforcing plate 106 (1), which can be more effectively protected. However, the present invention is not limited to this. When the flexible circuit board module 100 has only one side being more likely to be bent, the first reinforcing plate 106 (1) or the second reinforcing plate 106 (2) may protrude from only one side. The electronic component 104 can provide protection to the more vulnerable side.

In this embodiment, the distance d2 between the orthographic projection of the second reinforcing plate 106 (1) on the substrate 102 in the extension direction X may be greater than the first projection amount of the orthographic projection of the first reinforcing plate 106 (1) on the substrate 102. The thickness h1 of the reinforcing plate 106 (1), so that the substrate 102 can contact and be supported by the second reinforcing plate 106 (2) when it is subjected to a small amount of bending, and it is more difficult to make the substrate 102 ) The edge is dead.

In this embodiment, the thickness h1 of the reinforcing plate 106 (1) may be greater than the thickness h2 of the reinforcing plate 106 (2). Because the thickness of the reinforcing plate 106 (1) near the base plate 102 is thick, a better effect of protecting and supporting the electronic component 104 can be achieved. In contrast, the thickness of the reinforcing plate 106 (2) is smaller, and it is more flexible. It can be bent along with the substrate 102, and can avoid the substrate 102 on the edge of the reinforcing plate 106 (2) under the premise of providing a certain supporting force. The effect of death. However, the present invention is not limited to this. In another embodiment, the thickness of the first reinforcing plate 106 (1) may be the same as that of the second reinforcing plate 106 (2). The rigidity is greater than that of the second reinforcing plate 106 (2) to achieve a similar effect. Or the thickness and rigidity of the reinforcing plate can be adjusted at the same time to achieve similar effects.

The embodiment of the present invention as shown in FIG. 1 has only two reinforcing plates, including the first reinforcing plate 106 (1) and the second reinforcing plate 106 (2). However, there may be more than three reinforcing plates. For example, FIG. 3 is a schematic side view of another specific embodiment of the present invention. In the embodiment of FIG. 3, the flexible circuit board module 200 includes N reinforcing plates 206 (1) to 206 (N), where N is a natural number equal to or greater than 2.

Please continue to refer to FIG. 3. In this embodiment, the thickness of the reinforcing plate 206 (N) decreases as it moves away from the substrate 202, that is, the thickness of the N-1th reinforcing plate 206 (N-1) is greater than the thickness of the N-th reinforcing plate 206. (N) thickness. The first reinforcement plate 206 (1) near the base plate 202 has the thickest thickness, which can achieve better protection and support for electronic components 204 effects. In contrast, the N-th reinforcing plate 206 (N) has a smaller thickness and better flexibility. The more it can be bent along with the substrate 202, the more it can avoid the substrate 202 from reinforcing the plate 206 (providing a certain support force). N) The effect of edge folding. However, the present invention is not limited to this. In another embodiment, the thicknesses of the N reinforcing plates 206 (1) -206 (N) may all be the same, and by making the N-1th reinforcing plate 206 (N-1) The stiffness is greater than that of the Nth reinforcing plate 206 (N) to achieve a similar effect. Or the thickness and rigidity of the reinforcing plate can be adjusted at the same time to achieve similar effects. In this embodiment, the rigidity of the materials of the N reinforcing plates 206 (1) -206 (N) can be made greater than that of the substrate 202, so as to achieve better effects of reinforcing and protecting the electronic components 204.

In this embodiment, the orthographic projection of the N-th reinforcing plate 206 (N) on the substrate 202 in the extension direction X may protrude from the orthographic projection of the N-1th reinforcing plate 206 (N-1) on the substrate 202 by It is larger than the thickness of the N-1th reinforcing plate 206 (N), so that the substrate 202 can contact and be supported by the Nth reinforcing plate 206 (N) when it is subjected to a small amount of bending. 1 The edges of the reinforcing plate 206 (N-1) are folded dead.

Please refer to FIG. 4. FIG. 4 is a schematic side view of the N-th reinforcing plate 206 (N) in FIG. N) also has an N-th adhesive layer 208 (N) located on the upper surface of the N-th reinforcing plate 206 (N), that is, the surface of the N-th reinforcing plate 206 (N) facing the substrate 102. The Nth reinforcing plate 206 (N) is fixed to the previous N-1st reinforcing plate 206 (N-1) through the Nth adhesive layer 208 (N). The thickness of the N-th reinforcing plate 206 (N) mentioned in the previous description includes the thickness of the N-th adhesive layer 208 (N).

Although the present invention has been disclosed in various embodiments as above, it is not intended to limit the present invention. Any person skilled in the art will not depart from the essence of the present invention. Within the scope of Shenhe, various changes and retouching can be made. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

Claims (11)

A flexible circuit board module has a connecting end and an extending direction perpendicular to the connecting end. The circuit board module includes: a substrate having a first surface and a second surface opposite to each other; and an electronic component disposed on The first surface of the substrate; and N reinforcing plates, each of which has a width smaller than that of the substrate, where N is a natural number equal to or greater than 2, and an N-1th reinforcing plate of the N reinforcing plates It is arranged between an N-th reinforcing plate and the substrate, wherein the N-reinforcing plates include at least a first reinforcing plate and a second reinforcing plate, and the first reinforcing plate corresponds to the electronic component provided on the substrate. On the second surface, the second reinforcing plate is disposed on a side of the first reinforcing plate opposite to the substrate, and a width of the second reinforcing plate in the extending direction is greater than a width of the first reinforcing plate. For example, the flexible circuit board module of the first patent application scope, wherein the width of the N-th reinforcing plate is larger than the width of the N-1-th reinforcing plate in the extending direction. For example, the flexible circuit board module of the first patent application scope, wherein the width of the first reinforcing plate in the extending direction is greater than the width of the electronic component. For example, in the flexible circuit board module of the first scope of the patent application, in the extending direction, both sides of the projection amount of the second reinforcing plate on the substrate project from the projection amount of the electronic component on the substrate . For example, in the flexible circuit board module of the first patent application scope, in the extending direction, both sides of the first projection amount of the first reinforcing plate on the substrate project from the positive projection amount of the electronic component on the substrate. . For example, the flexible circuit board module of the first patent application scope, wherein each of the N reinforcing plates has an adhesive layer on the surface facing the substrate. For example, the flexible circuit board module of the first patent application scope, wherein the thickness of the N-1th reinforcing plate is greater than the thickness of the Nth reinforcing plate. For example, in the flexible circuit board module of the first patent application scope, the orthographic projection of the second reinforcing plate on the substrate in the extending direction is greater than the pitch of the orthographic projection of the first reinforcing plate on the substrate by more than The thickness of the first reinforcing plate. For example, in the flexible circuit board module of the first patent application range, the orthographic projection of the Nth reinforcing plate on the substrate in the extending direction protrudes from the orthographic projection of the N-1th reinforcing plate on the substrate. The pitch is greater than the thickness of the N-1th reinforcing plate. For example, the flexible circuit board module of the first patent application scope, wherein the material rigidity of the N reinforcing plates is greater than that of the substrate. For example, the flexible circuit board module of the first scope of the patent application, wherein the material rigidity of the N-1th reinforcing plate is greater than that of the Nth reinforcing plate.