CN107949155B - Reinforced circuit board and manufacturing method thereof - Google Patents
Reinforced circuit board and manufacturing method thereof Download PDFInfo
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- CN107949155B CN107949155B CN201711368122.6A CN201711368122A CN107949155B CN 107949155 B CN107949155 B CN 107949155B CN 201711368122 A CN201711368122 A CN 201711368122A CN 107949155 B CN107949155 B CN 107949155B
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- reinforcing plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The invention discloses a reinforced circuit board and a manufacturing method thereof, wherein the manufacturing method of the reinforced circuit board comprises the following steps: manufacturing a substrate; manufacturing a first reinforcing plate, wherein one surface of the first reinforcing plate is provided with a first adhesive used for bonding with the substrate; pressing the first reinforcing plate on the substrate, wherein an orthographic projection of the first reinforcing plate on the substrate is positioned in the substrate; manufacturing a second reinforcing plate, wherein one side of the second reinforcing plate is provided with a second adhesive used for bonding with the first reinforcing plate; and pressing the second reinforcing plate on the first reinforcing plate, wherein the orthographic projection of the second reinforcing plate on the first reinforcing plate covers the first reinforcing plate. The reinforcing circuit board is manufactured by the manufacturing method, and can be conveniently and reliably hung and buckled on a bearing object, so that the circuit board is convenient and quick to install.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a reinforced circuit board and a manufacturing method thereof.
Background
With the rapid development of electronic devices toward miniaturization, densification, high integration, and multi-functionalization, printed wiring boards are greatly restricted in terms of space, security, and the like. The circuit board with the traditional planar design can not meet the requirements of the current electronic equipment, so the circuit board with the reinforcement gradually occupies the market. However, the existing commonly used reinforcing circuit board can not meet some special installation requirements, if the circuit board is required to be hung and buckled on the electronic equipment, the corners of the circuit board are generally locked on the electronic equipment through fasteners, the fixing mode is more complicated, and the circuit board installation process is time-consuming and labor-consuming.
Disclosure of Invention
Therefore, the embodiment of the invention aims to overcome the defects of the prior art and provides the reinforced circuit board and the manufacturing method thereof.
In order to achieve the purpose, the embodiment of the invention adopts the following technical scheme:
the first aspect of the embodiments of the present invention provides a method for manufacturing a reinforcing circuit board, including the following steps:
s10: manufacturing a substrate;
s20: manufacturing a first reinforcing plate, wherein one surface of the first reinforcing plate is provided with a first adhesive used for bonding with the substrate;
s30: pressing the first reinforcing plate on the substrate, wherein an orthographic projection of the first reinforcing plate on the substrate is positioned in the substrate;
s40: manufacturing a second reinforcing plate, wherein one side of the second reinforcing plate is provided with a second adhesive used for bonding with the first reinforcing plate;
s50: and pressing the second reinforcing plate on the first reinforcing plate, wherein the orthographic projection of the second reinforcing plate on the first reinforcing plate covers the first reinforcing plate.
Further, the step S50 includes the following steps:
s51: placing a second matching plate on the substrate, wherein the second matching plate comprises a first backing plate and a second backing plate which are spliced, the first backing plate is provided with a first notch, the second backing plate is provided with a second notch, the first notch and the second notch are spliced to form a second accommodating groove matched with the appearance of the first reinforcing plate, the first reinforcing plate is positioned in the second accommodating groove, and the substrate is covered by the orthographic projection of a second spliced plate consisting of the second matching plate and the first reinforcing plate on the substrate;
s52: placing the second reinforcing plate on the first reinforcing plate, wherein the second reinforcing plate covers the first reinforcing plate and the second reinforcing plate;
s53: the pressing equipment applies pressure to the second reinforcing plate to press the second reinforcing plate on the first reinforcing plate;
s54: and after the second reinforcing plate and the first reinforcing plate are pressed, taking out the first cushion plate and the second cushion plate from two sides respectively.
Further, first backing plate is equipped with at least two first breach, at least two first breach is located same row, the second backing plate be equipped with first breach complex second breach one by one, every first breach and correspond with it the cooperation of second breach is used for forming and holds one the second holding tank of first stiffening plate.
Further, in step S51, a second composite panel of the second panel and the first reinforcing panel is overlapped with the base panel.
Further, in step S51, a distance between an inner wall of the second receiving groove and an outer edge of the first reinforcing plate is 0.1mm to 0.2mm, and a difference between a thickness of the second plate and a thickness of the first reinforcing plate is ± 0.1 mm.
Furthermore, only the area of the second reinforcing plate corresponding to the first reinforcing plate is provided with the second adhesive.
Further, the step S30 includes the following steps:
s31: placing the first reinforcing plate on a substrate;
s32: placing a first matching plate on a substrate, wherein the first matching plate is provided with a first accommodating groove matched with the first reinforcing plate in shape, the first reinforcing plate is positioned in the first accommodating groove, and the substrate is covered by the projection of a first splicing plate formed by the first matching plate and the first reinforcing plate towards the substrate;
s33: and the pressing equipment applies pressure to the first reinforcing plate and the first matching plate so as to press the first reinforcing plate on the substrate.
Further, the step S20 includes the following steps:
s21: gluing the first reinforcing whole plate;
s22: and processing the first reinforcing whole plate into a preset shape to form the first reinforcing plate.
Further, the step S40 includes the following steps:
s41: gluing the second reinforcing whole plate;
s42: and processing the second reinforcing whole plate into a preset shape to form the second reinforcing plate.
A second aspect of the embodiments of the present invention provides a reinforcing circuit board manufactured by the above manufacturing method, where the reinforcing circuit board includes the substrate, the first reinforcing plate, and the second reinforcing plate.
Embodiments of the invention include the following advantages, however, it is not necessary for any product embodying the invention to achieve all of the following simultaneously:
1. in the reinforced circuit board and the manufacturing method thereof, the first reinforced plate with smaller size separates the second reinforced plate from the substrate to form a ladder combination plate structure, so that a gap for inserting the mounting plate on the object to be mounted is formed between the second reinforced plate and the substrate, the first reinforced plate can be supported on the mounting plate, the substrate is abutted against one surface of the mounting plate, and the second reinforced plate is abutted against the other surface of the mounting plate, so that the reinforced circuit board is hung and buckled on the mounting plate. When the reinforcement circuit board needs to be disassembled, the reinforcement circuit board can be directly taken out from the object to be loaded. Therefore, the reinforcing circuit board realizes the hanging and buckling installation of the circuit board, the installation is convenient and quick, and the disassembly is also convenient.
2. When the second reinforcing plate is pressed on the first reinforcing plate, the second reinforcing plate for assisting is arranged, and the second reinforcing plate and the first reinforcing plate are complementary to cover the base plate, so that the stress of the pressing equipment in the pressing process is balanced, the pressing equipment is prevented from being damaged, and the edge of the second reinforcing plate is prevented from being damaged due to no support when the second reinforcing plate is pressed. In addition, the second matching plate is innovatively designed into the first base plate and the second base plate in a half-and-half mode, and after the pressing is completed, the first base plate and the second base plate can be respectively pulled out from two sides, so that the second matching plate can be smoothly pulled out, and the situation that the second matching plate cannot be pulled out due to being clamped between the base plate and the second reinforcing plate is prevented.
3. Through join in marriage the board at the second and set up two at least second holding tanks for cooperate with two at least first stiffening plates, thereby can realize two or more second stiffening plates and press in batches simultaneously on first stiffening plate, show the preparation efficiency that has promoted the circuit board. Meanwhile, all the second accommodating grooves are located in the same row, namely only one first base plate and one second base plate are arranged, and the first base plate and the second base plate are guaranteed to be pulled out without obstruction.
4. The second assembled plate formed by the second assembled plate and the first reinforcing plate is just as large as the base plate, on one hand, the base plate is protected by the second assembled plate in the pressing process, on the other hand, the second assembled plate is prevented from being too large, so that in the pressing process of the second assembled plate, the edge of the second assembled plate, which exceeds the base plate, is pressed and bent to influence the taking-out of the second assembled plate.
5. The distance between the inner wall of the second accommodating groove and the outer edge of the first reinforcing plate is 0.1-0.2 mm, so that the first reinforcing plate can be smoothly clamped into the second matching plate. The thickness difference between the second matching plate and the first reinforcing plate is within +/-0.1 mm, so that the second matching plate is flush with the first reinforcing plate as far as possible.
6. The second adhesive is arranged on the second reinforcing plate only in the area corresponding to the first reinforcing plate, so that the second reinforcing plate is prevented from being adhered to the second reinforcing plate in the laminating process, and the second reinforcing plate is prevented from being pulled out.
7. The first reinforcing plate is arranged in the process of pressing the first reinforcing plate, so that the phenomenon that the pressing equipment and the base plate are damaged is prevented.
8. The first reinforcing plate and the second reinforcing plate are manufactured by firstly gluing and then processing into corresponding shapes, so that the batch production efficiency of the first reinforcing plate and the second reinforcing plate can be effectively improved.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a reinforcing circuit board according to an embodiment of the present invention;
fig. 2 is a detailed flowchart of step S20 in fig. 1;
fig. 3 is a detailed flowchart of step S30 in fig. 1;
fig. 4 is a detailed flowchart of step S40 in fig. 1;
fig. 5 is a detailed flowchart of step S50 in fig. 1;
fig. 6 is a schematic structural view of a reinforcing circuit board according to an embodiment of the present invention;
fig. 7 is an exploded view of the reinforcing wiring board in fig. 6;
FIG. 8 is a schematic view of an application of the reinforcing wiring board of FIG. 6;
fig. 9 is a schematic view showing another application of the reinforcing wiring board of fig. 6;
FIG. 10 is a schematic structural diagram of a first panel according to an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a second board according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a second board according to another embodiment of the invention.
Description of reference numerals:
100. the base plate, 200, first stiffening plate, 210, head end, 220, insert the end, 300, second stiffening plate, 400, first joining in marriage the board, 410, first holding tank, 500, second joining in marriage the board, 510, first backing plate, 520, second backing plate, 530, second holding tank, 531, first breach, 532, second breach, 600, side shield, 700, wallboard, 710, mounting hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or be on the other element with an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Also, as used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, unless otherwise specified, the terms "first" and "second" and the like in the description are used for distinguishing various components, elements, steps and the like in the description, and are not used for representing logical relationships or sequential relationships among the various components, elements, steps and the like.
As shown in fig. 1, an embodiment of a method for manufacturing a reinforcing circuit board in an embodiment of the present invention includes the following steps:
s10: a substrate 100 is produced.
Specifically, the fabrication of the lines, holes and grooves is mainly completed on the substrate 100.
S20: manufacturing a first reinforcing plate 200, wherein one surface of the first reinforcing plate 200 is provided with a first adhesive used for bonding with the substrate 100. Optionally, the first adhesive is a thermosetting pure adhesive.
S30: the first reinforcing plate 200 is pressed on the substrate 100, wherein an orthographic projection of the first reinforcing plate 200 on the substrate 100 is located in the substrate 100, that is, an area of the first reinforcing plate 200 is smaller than an area of the substrate 100.
S40: manufacturing a second reinforcing plate 300, wherein the area of the first reinforcing plate 200 is smaller than that of the second reinforcing plate 300, and a second adhesive used for bonding with the first reinforcing plate 200 is arranged on one surface of the second reinforcing plate 300. Optionally, the second adhesive is a thermosetting pure adhesive.
S50: the second reinforcing plate 300 is pressed on the first reinforcing plate 200, wherein an orthographic projection of the second reinforcing plate 300 on the first reinforcing plate 200 covers the first reinforcing plate 200.
It should be noted that the present invention is not executed strictly according to the sequence of S10-S20-S30-S40-S50, but may be executed according to the sequence of S10-S20-S40-S30-S50, or the execution sequence may be adjusted accordingly according to actual needs.
The working principle of the present embodiment is explained in detail below: referring to fig. 6 to 9, the reinforcing circuit board manufactured by the above manufacturing method is provided with a first reinforcing plate 200 and a second reinforcing plate 300, the first reinforcing plate 200 with a smaller size separates the second reinforcing plate 300 from the substrate 100 to form a ladder composite board structure, so that a gap for inserting an installation plate (such as a side baffle 600 of a hook shown in fig. 8 or a wall plate 700 of a housing shown in fig. 9) on an object to be installed (such as an electronic device) is formed between the second reinforcing plate 300 and the substrate 100, the first reinforcing plate 200 can be supported on the installation plate, the substrate 100 abuts against one surface of the installation plate, and the second reinforcing plate 300 abuts against the other surface of the installation plate, so that the reinforcing circuit board is hung and fastened on the object to be installed. When the reinforcement circuit board needs to be disassembled, the reinforcement circuit board can be directly taken out from the object to be loaded. Therefore, the reinforcing circuit board is convenient and quick to install and convenient to disassemble. In addition, when the wall panel 700 of the housing of the object to be reinforced (e.g., electronic device) is provided with the mounting hole 710 with the size suitable for the first reinforcing plate 200, the first reinforcing plate 200 is clamped in the mounting hole 710, the substrate 100 with the electronic component mounted thereon can be arranged at the inner side of the housing and attached to one surface of the wall panel 700, the second reinforcing plate 300 is arranged at the outer side of the housing and attached to the other surface of the wall panel 700, on one hand, the hanging and buckling installation of the reinforcing circuit board is realized, and on the other hand, the second reinforcing plate 300 with a large area protects the substrate 100 and the component arranged on the substrate 100, thereby improving the use safety and stability of the reinforcing circuit board. It should be noted that fig. 8 and 9 are two specific application examples of the reinforcing-wiring board according to the present invention, however, it is understood that a person skilled in the art can install the reinforcing-wiring board in other application environments according to actual needs.
Specifically, as shown in fig. 2, step S20 specifically includes:
s21: and gluing the first whole reinforcing plate.
S22: the first reinforcing plate is processed into a predetermined shape to form the first reinforcing plate 200.
This kind of design can be unified on the whole board of a first reinforcement and cross gluey, and then unified processing cutting forms a plurality of first stiffening plates 200 again, compare in earlier with the whole board processing of first reinforcement form a plurality of independent stiffening plates after every stiffening plate alone cross gluey form, the efficiency of first stiffening plate 200 batch production can effectively be promoted to this embodiment. Of course, in another embodiment of the present invention, the first reinforcing plate may be processed into a corresponding shape, and then glued to form the first reinforcing plate 200.
Specifically, as shown in fig. 3, the step S30 includes the following steps:
s31: the first reinforcing plate 200 is placed on the substrate 100, and the first reinforcing plate 200 can be preliminarily adhered to the substrate 100 by the first adhesive thereon.
S32: referring to fig. 10, a first matching plate 400 is disposed on a substrate 100, the first matching plate 400 is provided with a first receiving groove 410 matching with the first reinforcing plate 200 in shape, and the first reinforcing plate 200 is located in the first receiving groove 410, that is, the first matching plate 400 surrounds the first reinforcing plate 200. The projection of the first combined plate composed of the first combined plate 400 and the first reinforcing plate 200 toward the substrate 100 covers the substrate 100.
Alternatively, the first assembled plate composed of the first assembled plate 400 and the first reinforcing plate 200 is overlapped with the base plate 100, and the overlapping means that the two components have the same size and the same position. In other embodiments, the area of the first composite board formed by the first panel 400 and the first reinforcing plate 200 may be larger than that of the substrate 100.
S33: the pressing device applies pressure to the first reinforcing plate 200 and the first matching plate 400 to press the first reinforcing plate 200 on the substrate 100.
In this embodiment, the first matching board 400 is used for balancing when the first reinforcing board 200 is pressed, so as to prevent the substrate 100 from being damaged by pressure or the pressing device itself from being damaged due to uneven stress during the pressing process.
Specifically, as shown in fig. 4, the step S40 includes the following steps:
s41: and gluing the second reinforcing whole plate.
S42: the second reinforcing plate is processed into a predetermined shape to form the second reinforcing plate 300.
This kind of design can be unified on the whole board of a second reinforcement and cross gluey, and later unified processing cutting forms a plurality of second stiffening plates 300 again, can effectively promote the efficiency of second stiffening plate 300 batch production. Of course, in another embodiment of the present invention, the second reinforcing plate 300 can be formed by first processing the second reinforcing plate into a corresponding shape and then gluing the second reinforcing plate.
Specifically, as shown in fig. 5, the step S50 includes the following steps:
s51: referring to fig. 11, the second matching plate 500 is assembled on the substrate 100, and the second matching plate 500 includes a first pad plate 510 and a second pad plate 520 which are assembled, the first pad plate 510 is provided with a first notch 531, the second pad plate 520 is provided with a second notch 532, and the first notch 531 and the second notch 532 are assembled to form a second receiving groove 530 which matches with the shape of the first reinforcing plate 200. The first reinforcing plate 200 is located in the second receiving groove 530, and an orthographic projection of the second combined plate 500 and the first reinforcing plate 200 on the substrate 100 covers the substrate 100.
The distance between the inner wall of the second accommodating groove 530 and the outer edge of the first reinforcing plate 200 is 0.1mm to 0.2mm, so that the first reinforcing plate 200 can be smoothly clamped into the second matching plate 500. The difference between the thickness of the second matching plate 500 and the thickness of the first reinforcing plate 200 is within +/-0.1 mm, so that the second matching plate 500 is flush with the first reinforcing plate 200 as much as possible, and the pressing process is safely and smoothly carried out.
Optionally, the second assembled plate formed by the second assembled plate 500 and the first reinforcing plate 200 is overlapped with the base plate 100, and the overlapping means that the two components have the same size and the same position, on one hand, the second assembled plate 500 protects the base plate 100 during the pressing process, and on the other hand, the second assembled plate 500 is prevented from being too large, so that the edge of the second assembled plate 500 beyond the base plate 100 is pressed and bent during the pressing process of the second assembled plate 500, and the taking-out of the second assembled plate 500 is affected. In other embodiments, the area of the second composite board formed by the second panel 500 and the first reinforcing plate 200 may be larger than the area of the substrate 100.
S52: the second reinforcing plate 300 is placed on the first reinforcing plate 200, the second reinforcing plate 300 can be primarily bonded to the first reinforcing plate 200 by the second adhesive thereon, and the second reinforcing plate 300 covers the first reinforcing plate 200 and the second reinforcing plate 500.
S53: the pressing device applies pressure to the second reinforcing plate 300 to press the second reinforcing plate 300 on the first reinforcing plate 200.
S54: after the second reinforcing plate 300 and the first reinforcing plate 200 are press-fitted, the first shim plate 510 and the second shim plate 520 are respectively taken out from both sides.
In this embodiment, the second reinforcing plate 500 and the first reinforcing plate 200 are complementary to each other to cover the substrate 100, so that the stress is balanced during the lamination process of the lamination device, the damage of the lamination device is prevented, and the damage of the edge of the second reinforcing plate 300 due to the absence of support during the lamination is also prevented. In addition, since the second matching plate 500 is disposed around the first reinforcing plate 200 and clamped between the base plate 100 and the second reinforcing plate 300 during the pressing process, in order to prevent the second matching plate 500 from being unable to be pulled out after the pressing process, the second matching plate 500 is innovatively designed in half as the first cushion plate 510 and the second cushion plate 520 in the embodiment of the present invention, and after the pressing process is completed, the first cushion plate 510 and the second cushion plate 520 can be respectively pulled out from both sides, so that the second matching plate 500 can be pulled out smoothly.
It should be noted that only the region of the second reinforcing plate 300 corresponding to the first reinforcing plate 200 (i.e., the region enclosed by the dotted line in fig. 7) is provided with the second adhesive, so as to prevent the second plate 500 from adhering to the second reinforcing plate 300 during the lamination process, thereby preventing the second plate 500 from being pulled out.
It should be further noted that the first board assembly 400 and the second board assembly 500 may be the same board, that is, the first board assembly 400 and the second board assembly 500 both include a first pad 510 and a second pad 520 that are spliced together, the first board assembly 400 is placed when the first reinforcing board 200 is pressed, the first board assembly 400 is continuously used after the first reinforcing board 200 is pressed, and the second reinforcing board 300 is directly covered on the first reinforcing board 200 and the first board assembly 400 and is continuously pressed. In addition, the first board assembly 400 may also be configured as an integral board assembly as shown in fig. 10, the board assembly cannot be disassembled into two parts, the first reinforcing board 200 is pressed by a conventional board assembly balancing method, after the first reinforcing board 200 is pressed, the first board assembly 40 needs to be disassembled, and the second board assembly 500 needs to be replaced, where the second board assembly 500 includes a first pad 510 and a second pad 520, which are disassembled. In addition, when the second reinforcing plate 300 is pressed, a third matching plate (not shown in the drawings) can be placed, the third matching plate can be an integral matching plate similar to the first matching plate 400, a third accommodating groove matched with the second reinforcing plate 300 in shape is formed in the third matching plate, and the second reinforcing plate 300 is embedded in the third matching plate for pressing so as to protect the second reinforcing plate 300 and pressing equipment.
It should be noted that, in another embodiment, as shown in fig. 12, the first pad 510 is provided with at least two first gaps 531, at least two first gaps 531 are located in the same row, the second pad 520 is provided with second gaps 532 respectively matched with the first gaps 531, and each first gap 531 and the corresponding second gap 532 are matched to form a second accommodating groove 530 for accommodating one of the first reinforcing plates 200. And, when the second reinforcing plates 300 are pressed, the second reinforcing plates 300 are placed on the first reinforcing plates 200 in a one-to-one correspondence.
This embodiment is through setting up two at least second holding grooves 530 on board 500 is joined in marriage to the second for cooperate with two at least first stiffening plate 200, thereby can realize two or more second stiffening plates 300 and on the simultaneous batch pressfitting of first stiffening plate 200, the preparation efficiency of reinforcement circuit board has been promoted remarkably. Meanwhile, in order to ensure that the second matching plate 500 can be drawn out, all the second accommodating grooves 530 are located in the same row, that is, only one first shim plate 510 and one second shim plate 520 are provided, so that the first shim plate 510 and the second shim plate 520 are not obstructed when being drawn out. As shown in fig. 12: the first pad 510 of the a region and the second pad 520 of the B region may be extracted, the first pad 510 being extracted from above; the second pad 520 is drawn out from below. In addition, in the pressing process, the substrate 100 under the first stiffening plates 200 may be an independent substrate 100 corresponding to the first stiffening plates 200 one to one, or may be a whole large substrate.
It should be further noted that the sequence of all the steps of the manufacturing method described herein can be adjusted according to actual needs.
The following explains the manufacturing method of the reinforced circuit board by using a practical embodiment, and specifically includes the following steps:
(1) processing the substrate 100: the fabrication of the holes, lines and grooves of the substrate 100 is completed.
(2) Processing the first reinforcing plate 200: the first reinforcing plate is processed with thermosetting pure glue and then processed into a required shape to form the first reinforcing plate 200.
(3) Processing the first matching plate 400: a first receiving groove 410 is formed in the first plate 400 to match the shape of the first reinforcing plate 200.
(4) The first reinforcing plate 200 is bonded to the first matching plate 400 and then pressed on the substrate 100 by a matching plate balancing method.
(5) The first distribution board 400 is removed.
(6) And processing a second matching plate 500, wherein the second matching plate 500 consists of a first base plate 510 and a second base plate 520, the first base plate 510 and the second base plate 520 are respectively provided with a first notch 531 and a second notch 532, the first notch 531 and the second notch 532 can be spliced to form a second accommodating groove 530 matched with the shape of the first reinforcing plate 200, the distance between the second matching plate 500 and the single side of the first reinforcing plate 200 is 0.1-0.2 mm, and the thickness difference between the second matching plate 500 and the first reinforcing plate 200 is controlled to be +/-0.1 mm.
(7) The second plate 500 is padded on the substrate 100, and at this time, the first reinforcing plate 200 is located in the second plate 500, and only one row of the second accommodating grooves 530 can be formed in the second plate 500, because more than one row of the second accommodating grooves 530 are formed, the middle cushion plate cannot be taken out.
(8) And processing the second reinforcing plate 300, processing the second reinforcing whole plate by thermosetting pure glue, and processing the second reinforcing whole plate into a required shape to form the second reinforcing plate 300.
(9) The second reinforcing plates 300 are placed on the first reinforcing plates 200 in a one-to-one correspondence, and the second reinforcing plates 300 are pressed according to a plate matching method.
(10) After the press-fitting, the first pad 510 and the second pad 520 are respectively pulled out from both sides, thereby completing the manufacture of the reinforcing circuit board.
In addition, the invention also provides a reinforced circuit board manufactured by the manufacturing method. The reinforcing circuit board comprises the substrate 100, the first reinforcing plate 200 and the second reinforcing plate 300, and a welding pad used for welding a component is arranged on one side of the substrate 100, which deviates from the first reinforcing plate 200. The reinforcing circuit board can be conveniently and reliably hung and buckled on a bearing object, so that the circuit board is convenient and quick to install.
In the present embodiment, referring to fig. 6 to 9, the first reinforcing plate 200 is "T" shaped, and includes a head end 210 and an insertion end 220, wherein the width of the head end 210 is larger to ensure the bonding strength between the base plate 100 and the second reinforcing plate 300. The insertion end 220 can be inserted into the mounting hole 710 of the object to be mounted for limiting the position of the reinforcing circuit board and preventing the reinforcing circuit board from moving. The shape of the first reinforcing plate 200 may be designed according to actual needs, and it is only necessary to ensure that the area size of the first reinforcing plate 200 is smaller than that of the substrate 100 and the second reinforcing plate 300.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (9)
1. A manufacturing method of a reinforced circuit board is characterized by comprising the following steps:
s10: manufacturing a substrate;
s20: manufacturing a first reinforcing plate, wherein one surface of the first reinforcing plate is provided with a first adhesive used for bonding with the substrate;
s30: pressing the first reinforcing plate on the substrate, wherein an orthographic projection of the first reinforcing plate on the substrate is positioned in the substrate;
s40: manufacturing a second reinforcing plate, wherein one side of the second reinforcing plate is provided with a second adhesive used for bonding with the first reinforcing plate;
s50: pressing the second reinforcing plate onto the first reinforcing plate, wherein an orthographic projection of the second reinforcing plate on the first reinforcing plate covers the first reinforcing plate;
the step S50 includes the steps of:
s51: placing a second matching plate on the substrate, wherein the second matching plate comprises a first backing plate and a second backing plate which are spliced, the first backing plate is provided with a first notch, the second backing plate is provided with a second notch, the first notch and the second notch are spliced to form a second accommodating groove matched with the appearance of the first reinforcing plate, the first reinforcing plate is positioned in the second accommodating groove, and the substrate is covered by the orthographic projection of a second spliced plate consisting of the second matching plate and the first reinforcing plate on the substrate;
s52: placing the second reinforcing plate on the first reinforcing plate, wherein the second reinforcing plate covers the first reinforcing plate and the second reinforcing plate;
s53: the pressing equipment applies pressure to the second reinforcing plate to press the second reinforcing plate on the first reinforcing plate;
s54: and after the second reinforcing plate and the first reinforcing plate are pressed, taking out the first cushion plate and the second cushion plate from two sides respectively.
2. The method according to claim 1, wherein the first backing plate has at least two first notches, the at least two first notches are located in the same row, the second backing plate has second notches matching the first notches one by one, and each first notch matches the corresponding second notch to form a second receiving groove for receiving one of the first reinforcing plates.
3. The method of manufacturing a reinforcing-wiring board according to claim 1, wherein in step S51, a second composite plate made of the second reinforcing plate and the second plate is superposed on the base plate.
4. The method of manufacturing a reinforcing circuit board according to claim 1, wherein in step S51, a distance between an inner wall of the second receiving groove and an outer edge of the first reinforcing plate is 0.1mm to 0.2mm, and a difference between a thickness of the second fitting plate and a thickness of the first reinforcing plate is ± 0.1 mm.
5. The method of manufacturing a reinforcing-wiring board according to claim 1, wherein the second adhesive is provided only on a region of the second reinforcing plate corresponding to the first reinforcing plate.
6. The method for manufacturing a reinforcing-wiring board according to claim 1, wherein the step S30 includes the steps of:
s31: placing the first reinforcing plate on a substrate;
s32: placing a first matching plate on a substrate, wherein the first matching plate is provided with a first accommodating groove matched with the first reinforcing plate in shape, the first reinforcing plate is positioned in the first accommodating groove, and the substrate is covered by the projection of a first splicing plate formed by the first matching plate and the first reinforcing plate towards the substrate;
s33: and the pressing equipment applies pressure to the first reinforcing plate and the first matching plate so as to press the first reinforcing plate on the substrate.
7. The manufacturing method of the reinforcing circuit board according to any one of claims 1 to 6, wherein the step S20 includes the steps of:
s21: gluing the first reinforcing whole plate;
s22: and processing the first reinforcing whole plate into a preset shape to form the first reinforcing plate.
8. The manufacturing method of the reinforcing circuit board according to any one of claims 1 to 6, wherein the step S40 includes the steps of:
s41: gluing the second reinforcing whole plate;
s42: and processing the second reinforcing whole plate into a preset shape to form the second reinforcing plate.
9. A reinforcing-wiring board manufactured by the manufacturing method of any one of claims 1 to 8, the reinforcing-wiring board including the substrate, the first reinforcing plate, and the second reinforcing plate.
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| CN201711368122.6A CN107949155B (en) | 2017-12-18 | 2017-12-18 | Reinforced circuit board and manufacturing method thereof |
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| TWI745823B (en) * | 2019-12-31 | 2021-11-11 | 頎邦科技股份有限公司 | Stiffener structure of flexible print circuit board |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
Citations (2)
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|---|---|---|---|---|
| CN205491438U (en) * | 2016-04-07 | 2016-08-17 | 东莞市溢信高电子有限公司 | New -type multilayer flexible line way plate structure |
| CN106550537A (en) * | 2016-12-07 | 2017-03-29 | 友达光电（苏州）有限公司 | Flexible circuit plate module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6162441B2 (en) * | 2013-03-15 | 2017-07-12 | 株式会社エンプラス | Substrate reinforcement structure |
| CN206100657U (en) * | 2016-08-31 | 2017-04-12 | 硕诺科技（深圳）有限公司 | Preceding shell of cell -phone of moulding plastics in alloy support mould |
| CN106793460A (en) * | 2016-12-20 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of new ladder wiring board and preparation method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205491438U (en) * | 2016-04-07 | 2016-08-17 | 东莞市溢信高电子有限公司 | New -type multilayer flexible line way plate structure |
| CN106550537A (en) * | 2016-12-07 | 2017-03-29 | 友达光电（苏州）有限公司 | Flexible circuit plate module |
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