CN202151001U - Flexible circuit board and electronic device including the flexible circuit board - Google Patents
Flexible circuit board and electronic device including the flexible circuit board Download PDFInfo
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- CN202151001U CN202151001U CN201120205880U CN201120205880U CN202151001U CN 202151001 U CN202151001 U CN 202151001U CN 201120205880 U CN201120205880 U CN 201120205880U CN 201120205880 U CN201120205880 U CN 201120205880U CN 202151001 U CN202151001 U CN 202151001U
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- conductor layer
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- flexible pcb
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Abstract
The utility model relates to a flexible circuit board, including a first conductor layer and an insulated lower cover layer which is positioned under the first conductor layer. The lower cover layer does not cover the first conductor layer completely, and thereby an exposed portion is formed on the first conductor layer. Wherein the lower cover layer includes an extension penetration portion and a non-extension penetration portion; the structure of the extension penetration portion is suitable for extending and penetrating into a substrate, being positioned on the surface of the substrate; the structure of the non-extension penetration portion is suitable for extending far from the substrate, not being positioned on the surface of the substrate; and the first conductor layer is electrically connected with the second conductor layer on the substrate through the exposed portion. The utility model also relates to an electronic device including the flexible circuit board and the substrate connected with the flexible circuit board in the above method.
Description
Technical field
The utility model relates to flexible PCB (FPC) and comprises the electronic device of this flexible PCB.
Background technology
Flexible PCB (FPC) is widely used in various electronic devices (like clamshell phone) owing to its flexible characteristic.But in the design of routine; After FPC and substrate nation is fixed; The position of windowing of FPC conductor layer flushes or does not extend in the substrate with the edge of substrate, makes to be prone to cause position each parts (like the metal conductor layer) scratch of (or claiming window) of windowing in the FPC bending process.In the art, windowing is to instigate the part of the conductor layer in the FPC to come out, so that after FPC and the substrate binding, the conductor layer of this expose portion is realized being electrically connected with the conductor layer on the substrate.
The utility model content
The utility model relates in one aspect to a kind of flexible PCB, and this flexible PCB comprises: one first conductor layer; And lower floor's cover layer that is positioned at the insulation under said first conductor layer, said lower floor cover layer does not cover said first conductor layer fully, forms an expose portion on said first conductor layer thereby make; Wherein, Said lower floor cover layer comprises and extends into part and the non-part that extends into that this extends into and partly is configured as being suitable for extending in the substrate, is positioned on the substrate surface; This non-part that extends into is configured as being suitable for extending away from said substrate, is not positioned on the substrate surface; Through said expose portion, said first conductor layer is electrically connected with one second conductor layer on the said substrate.
The utility model also relates to a kind of electronic device, and it comprises a substrate and a flexible PCB, and this flexible PCB comprises: one first conductor layer; And lower floor's cover layer that is positioned at the insulation under said first conductor layer, said lower floor cover layer does not cover first conductor layer fully, forms an expose portion on first conductor layer thereby make; Wherein, said lower floor cover layer comprises and extends into part and the non-part that extends into, and this extends into and extends partially in the substrate, is positioned on the substrate surface, and this is non-to extend into part away from said substrate extension, is not positioned on the substrate surface; Comprise one second conductor layer on this substrate; Through said expose portion, said first conductor layer is electrically connected with second conductor layer on the said substrate.
Description of drawings
Fig. 1 shows FPC of the prior art and the connected mode of this FPC on substrate;
Fig. 2 shows the FPC according to an embodiment of the utility model;
The A figure of Fig. 3 and B figure have schematically illustrated the application of FPC on display of organic electroluminescence (OLED) 30 through the mode of front view and end view;
Fig. 4 has shown comprising of Fig. 3 concrete sketch map of OLED of FPC and a substrate of the utility model.
Specific embodiments
To combine accompanying drawing that some embodiments of the utility model are done detailed description below.
Fig. 1 shows the FPC that is bound to substrate 5 of the prior art, representes this FPC with numeral 1 among the figure.Shown in figure, this FPC1 comprises: upper strata strengthening course 7, for example PI strengthening course (polyimide film strengthening course); Lower floor's cover layer 4 of intermediate conductor layer 3 (like metal conductor layer) and insulation, for example PI cover layer (polyimides film coating); Said lower floor cover layer 4 does not cover intermediate conductor layer 3 fully, forms an expose portion on this intermediate conductor layer 3 thereby make.This expose portion is generally the predetermined position of windowing on the conductor layer, representes with 6 among the figure.As can be seen from the figure, an end of the position 6 of windowing of intermediate conductor layer 3 and the edge of substrate 5 flush or do not extend in the substrate 5 (or claiming to bind substrate 5); Conductor layer 6 on the conductor layer of this position 6 of windowing and the substrate ' be electrically connected.Be outstanding the present invention, the concrete connected mode between the conductor layer that has omitted the position of windowing that those of ordinary skills knew and the conductor layer of substrate, the conductor layer 6 on only schematically illustrated window position 6 and the substrate that wherein relates to '.Equally, as it will be clear to those of skill in the art that FPC can also comprise more multilayer usually, or layer still less, for example have only intermediate conductor layer and lower floor's cover layer.In the middle of test and using, FPC can bend as required.And the FPC of this structure is prone to cause the conductor layer scratch in the bending process, and the part shown in the circle of Fig. 1 is seen in the scratch zone.When the rectangular shape in substrate 5 edges or when sharper, the scratch phenomenon is even more serious.
In addition, FPC of the prior art also possibly be provided with a upper strata strengthening course 2.When if upper strata strengthening course 2 edges of FPC and lower floor's cover layer 4 edges design again on same vertical line; Cause FPC intermediate conductor layer (like metal conductor layer) to fracture more easily, cause breaking phenomena, badly damaged its conductor layer; Make FPC lose electric conductivity, cause product bad.
Fig. 2 shows the FPC 21 according to an embodiment of the utility model.As shown in Figure 2, this FPC 21 comprises: strengthening course 27, for example PI strengthening course (polyimide film strengthening course); Lower floor's cover layer 24 of intermediate conductor layer 23 (like metal conductor layer) and insulation, for example PI cover layer (polyimides film coating).Said lower floor cover layer 24 does not cover intermediate conductor layer 23 fully, forms an expose portion on this intermediate conductor layer 23 thereby make.Expose portion on the said intermediate conductor layer 23 be suitable for substrate 25 on conductor layer 26 ' be electrically connected.The part of lower floor's cover layer 24 of this FPC 21 extends in the substrate 25; Be positioned on the substrate surface; For ease of understanding; Partly be called and extend into part 28 extending into lower floor's cover layers in the substrate 25, lower floor's cover layer that will outside substrate 25, extend partly is called the non-part 29 that extends into; This extends into part 28 and is used to be attached to a substrate 25, and this non-part 29 that extends into is extended away from said substrate 25, promptly extends in the substrate outside, is not positioned on the substrate surface.The length that extends into part 28 is shown in " a " among Fig. 2.This design can prevent fractureing of conductor layer in the FPC bending process.
In some cases, because the conductor layer length on the substrate is fixed,, protect bending part, the part of the predetermined position 26 of windowing of sacrifice of the present invention or covering FPC for lower floor's cover layer is extended into substrate.In other words, a said part that extends into the predetermined position 26 of windowing on the conductor layer that part 28 covers flexible PCBs is to form the said expose portion on the said conductor layer.The length that is capped part of this position 26 of windowing can be chosen as being electrically connected of conductor layer on the conductor layer that do not influence on the flexible PCB and the said substrate.In this article; The conductor layer that does not influence on the flexible PCB means with being electrically connected of conductor layer on the said substrate: position 26 is covered by part along with windowing; The electrical connectivity of (under the conventional arrangement of flexible PCB shown in Figure 1 and substrate) did not take place significantly to change when the electrical connectivity of the conductor layer on conductor layer on the flexible PCB and the said substrate was capped with respect to the position 26 of windowing, and perhaps said change amount is in the acceptable scope of reality.This design can prevent the scratch of conductor layer in the FPC bending process, the relative position relation when need not again simultaneously to change original FPC plate and substrate binding.
Preferably, FPC can also comprise a upper strata strengthening course 22, and it is positioned on the strengthening course 27.Such as those of ordinary skills knowledge, strengthening course 27 is not necessarily.When FPC does not contain this strengthening course 27; This upper strata strengthening course 22 is located immediately on the conductor layer 23 and crosses and extends into part 28 and extend towards the non-part 29 that extends into the non-point of interface that extends into part 29, thereby makes upper strata strengthening course 22 and lower floor's cover layer 24 above substrate 25, lap arranged.Wherein crossing point of interface is " b " towards the non-part 29 extended length that extend into.This design can prevent fractureing of conductor layer in the FPC bending process better.
Another embodiment according to the utility model relates to a kind of electronic device, and this electronic device comprises the substrate that FPC and FPC were connected to according to the utility model.This electronic device for example can be display of organic electroluminescence (OLED), clamshell phone etc.The A figure of Fig. 3 and B figure have schematically illustrated the application of FPC on display of organic electroluminescence (OLED) 30 through the mode of front view and end view.In the figure, the substrate 35 of display of organic electroluminescence (OLED) 30 is connected with FPC 31, and then realizes and being connected of outside line through FPC 31, shown in scheming.
Fig. 4 has shown comprising of Fig. 3 concrete sketch map of OLED of FPC 41 and a substrate 45 of the utility model.As shown in Figure 4, this FPC 41 comprises strengthening course 47; Intermediate conductor layer 43; With lower floor cover layer 44 (it comprise extend into part 48, the non-part 49 that extends into).The tectal part of the lower floor of FPC 41 extends into substrate 45 tops.Preferably, this FPC 41 can also be included in the upper strata strengthening course 42 of strengthening course 47 tops.According to another embodiment of the present invention, do not comprise strengthening course 47 among this FPC, upper strata strengthening course 42 is located immediately on the intermediate conductor layer 43.
Comparison diagram 4 and Fig. 2 can find, both are except the difference of Reference numeral, and FPC and the FPC position relation on substrate is identical, and therefore the description to Fig. 2 also is applicable to Fig. 4.Especially; In a preferred embodiment; Part in the predetermined position 46 of windowing can be extended entering part 48 and cover, the length a that is capped part can be chosen as conductor layer 46 on the conductor layer that do not influence on the flexible PCB and the said substrate ' be electrically connected.
Said FPC can adhere to substrate 45.
In this embodiment, preferably, when FPC bends and the substrate edges that comes in contact of FPC handle through edging, make it comprise edging part 50, make the anti scuffing effect better thus.In addition, preferably, between substrate and FPC lower floor coverlay, add and tape 51, with further enhancing FPC bend resistance ability.
On the substrate 45 circuit structure included among the OLED 52 and miscellaneous part can be set.
In addition, when FPC is applied to the electronic device beyond the OLED, will be provided with on the said substrate and the corresponding circuit structure of said electronic device.
The disclosed exemplary of preceding text is illustrative, and nonrestrictive.Under the situation that does not depart from spirit of the present invention or scope, can make various variations.The utility model is intended to comprise all changes known or development before this, correction, distortion, improvement and/or basic equivalent.
Claims (10)
1. flexible PCB, this flexible PCB comprises:
One first conductor layer; And
Lower floor's cover layer that is positioned at the insulation under said first conductor layer, said lower floor cover layer does not cover said first conductor layer fully, forms an expose portion on said first conductor layer thereby make;
Wherein, Said lower floor cover layer comprises and extends into part and the non-part that extends into that this extends into and partly is configured as being suitable for extending in the substrate, is positioned on the substrate surface; This non-part that extends into is configured as being suitable for extending away from said substrate, is not positioned on the substrate surface; Through said expose portion, said first conductor layer is electrically connected with one second conductor layer on the said substrate.
2. according to the flexible PCB of claim 1; Wherein, This extends into the part of the predetermined position of windowing on first conductor layer that part is configured as being suitable for covering flexible PCB; Forming the said expose portion on said first conductor layer, the length of this cover part is selected as being electrically connected of second conductor layer that do not influence on described first conductor layer and the said substrate.
3. according to the flexible PCB of claim 1 or 2; Also comprise a upper strata strengthening course, it is positioned on first conductor layer of flexible PCB and crosses said part and the said non-point of interface that extends into part of extending into towards the said non-part extension that extends into.
4. electronic device, it comprises a substrate and a flexible PCB, this flexible PCB comprises:
One first conductor layer; And
Lower floor's cover layer that is positioned at the insulation under said first conductor layer, said lower floor cover layer does not cover first conductor layer fully, forms an expose portion on first conductor layer thereby make;
Wherein, said lower floor cover layer comprises and extends into part and the non-part that extends into, and this extends into and extends partially in the substrate, is positioned on the substrate surface, and this is non-to extend into part away from said substrate extension, is not positioned on the substrate surface; Comprise one second conductor layer on this substrate; Through said expose portion, said first conductor layer is electrically connected with second conductor layer on the said substrate.
5. according to the electronic device of claim 4; This extends into the part of the predetermined position of windowing on first conductor layer that part covers flexible PCB; Forming the said expose portion on said first conductor layer, the length that is capped part of this position of windowing is selected as being electrically connected of second conductor layer that do not influence on described first conductor layer and the said substrate.
6. according to the electronic device of claim 4 or 5, also comprise a upper strata strengthening course, it is positioned on first conductor layer of flexible PCB and crosses said part and the said non-point of interface that extends into part of extending into towards the said non-part extension that extends into.
7. according to the electronic device of claim 4 or 5, wherein when said flexible PCB bending and the substrate edges that comes in contact of said flexible PCB comprise the edging part.
8. according to the electronic device of claim 4 or 5, also comprise an adhesive tape, it connects lower floor's cover layer and said substrate.
9. according to the electronic device of claim 4 or 5, said flexible PCB adheres to said substrate.
10. according to the electronic device of claim 4 or 5, said electronic device is a display of organic electroluminescence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120205880U CN202151001U (en) | 2011-06-21 | 2011-06-21 | Flexible circuit board and electronic device including the flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120205880U CN202151001U (en) | 2011-06-21 | 2011-06-21 | Flexible circuit board and electronic device including the flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202151001U true CN202151001U (en) | 2012-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120205880U Expired - Lifetime CN202151001U (en) | 2011-06-21 | 2011-06-21 | Flexible circuit board and electronic device including the flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202151001U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106550537A (en) * | 2016-12-07 | 2017-03-29 | 友达光电（苏州）有限公司 | Flexible circuit plate module |
| WO2019100295A1 (en) * | 2017-11-23 | 2019-05-31 | 深圳市柔宇科技有限公司 | Fan-out structure of display panel, and preparation method and application thereof |
| CN113178137A (en) * | 2021-04-07 | 2021-07-27 | Tcl华星光电技术有限公司 | Drive substrate and display panel |
| CN113286417A (en) * | 2021-05-28 | 2021-08-20 | 昆山工研院新型平板显示技术中心有限公司 | Flexible printed circuit board and display device |
-
2011
- 2011-06-21 CN CN201120205880U patent/CN202151001U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106550537A (en) * | 2016-12-07 | 2017-03-29 | 友达光电（苏州）有限公司 | Flexible circuit plate module |
| CN106550537B (en) * | 2016-12-07 | 2018-12-18 | 友达光电（苏州）有限公司 | Flexible circuit plate module |
| WO2019100295A1 (en) * | 2017-11-23 | 2019-05-31 | 深圳市柔宇科技有限公司 | Fan-out structure of display panel, and preparation method and application thereof |
| CN113178137A (en) * | 2021-04-07 | 2021-07-27 | Tcl华星光电技术有限公司 | Drive substrate and display panel |
| CN113286417A (en) * | 2021-05-28 | 2021-08-20 | 昆山工研院新型平板显示技术中心有限公司 | Flexible printed circuit board and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: KUNSHAN VISIONOX TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WEIXINNUO DISPLAY TECH CO., LTD. Effective date: 20140410 Owner name: TSINGHUA UNIVERSITY Free format text: FORMER OWNER: TSINGHUA UNIVERSITY WEIXINNUO SCIENCE AND TECHNOLOGY CO., LTD., BEIJING Effective date: 20140410 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140410 Address after: 215300 Kunshan high tech Zone, Jiangsu Province, Feng Feng Road, No. 188, No. Patentee after: KUNSHAN VISIONOX TECHNOLOGY CO., LTD. Patentee after: Tsinghua University Address before: 215300 Kunshan high tech Zone, Jiangsu Province, Feng Feng Road, No. 188, No. Patentee before: Weixinnuo Display Tech Co., Ltd. Patentee before: Tsinghua University Patentee before: Weixinnuo Science and Technology Co., Ltd., Beijing |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 No. 188 Feng Feng Road, Kunshan hi tech Zone, Jiangsu, Kunshan Patentee after: Suzhou Qingyue Photoelectric Technology Co., Ltd Patentee after: TSINGHUA University Address before: 215300 No. 188 Feng Feng Road, Kunshan hi tech Zone, Jiangsu, Kunshan Patentee before: Kunshan Visionox Technology Co.,Ltd. Patentee before: TSINGHUA University |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120222 |
|
| CX01 | Expiry of patent term |