JP2008078677A5 - - Google Patents
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- Publication number
- JP2008078677A5 JP2008078677A5 JP2007285878A JP2007285878A JP2008078677A5 JP 2008078677 A5 JP2008078677 A5 JP 2008078677A5 JP 2007285878 A JP2007285878 A JP 2007285878A JP 2007285878 A JP2007285878 A JP 2007285878A JP 2008078677 A5 JP2008078677 A5 JP 2008078677A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- shield
- wiring board
- printed wiring
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (5)
前記シールドフィルムは、カバーフィルムの片面に少なくとも導電性接着剤層を含むシールド層を設けたフィルムであって、その導電性接着剤層が前記基体フィルムに接着するように被覆してなり、
前記シールドフィルムの外側の面において、少なくとも一部が露出してその近傍のグランド部に接続可能に形成されたグランド部材を有するとともに、
前記カバーフィルムを突き破るように設けられ、前記導電性接着剤層と前記グランド部材とを接続する導電性フィラーを有することを特徴とするシールドフレキシブルプリント配線板。 In a shielded flexible printed wiring board formed by coating a shield film on at least one side of a base film in which a printed circuit and an insulating film are sequentially provided on a base film,
The shield film is a film in which a shield layer including at least a conductive adhesive layer is provided on one side of a cover film, and the conductive adhesive layer is coated so as to adhere to the base film,
On the outer surface of the shield film, at least a portion of the ground film is exposed and has a ground member formed so as to be connectable to a ground portion in the vicinity thereof
A shield flexible printed wiring board, comprising a conductive filler that is provided so as to break through the cover film and connects the conductive adhesive layer and the ground member.
前記グランド部材は、金属箔とその片面に設けられた導電性接着性樹脂層とからなり、前記導電性接着性樹脂は、前記金属箔と前記基体フィルムに良好な接着性を有することを特徴とするシールドフレキシブルプリント配線板。 In the shield flexible printed wiring board according to claim 1,
The ground member comprises a metal foil and a conductive adhesive resin layer provided on one side thereof, and the conductive adhesive resin has good adhesion to the metal foil and the base film. Shield flexible printed wiring board.
前記シールドフィルムは、カバーフィルムの片面に少なくとも導電性接着剤層を含むシールド層を設けたフィルムであって、その導電性接着剤層が前記基体フィルムに接着するように被覆してなり、
前記シールドフィルムの外側の面において、少なくとも一部が露出してその近傍のグランド部に接続可能に形成されたグランド部材を有し、
前記グランド部材が、前記シールドフィルム側の面に、前記シールドフィルムの途中まで貫入した導電性突出部を有していることを特徴とするシールドフレキシブルプリント配線板。 In a shielded flexible printed wiring board formed by coating a shield film on at least one side of a base film in which a printed circuit and an insulating film are sequentially provided on a base film,
The shield film is a film in which a shield layer including at least a conductive adhesive layer is provided on one side of a cover film, and the conductive adhesive layer is coated so as to adhere to the base film,
On the outer surface of the shield film, at least a portion is exposed and has a ground member formed so as to be connectable to a ground portion in the vicinity thereof,
The shield flexible printed wiring board, wherein the ground member has a conductive protrusion that penetrates halfway through the shield film on a surface on the shield film side.
前記グランド部材は、金属箔とその片面に設けられた接着性樹脂層とからなり、前記接着性樹脂は、前記導電性突出部以外の前記金属箔と前記シールドフィルムに良好な接着性を有することを特徴とするシールドフレキシブルプリント配線板。 In the shielded flexible printed wiring board according to claim 3,
The ground member includes a metal foil and an adhesive resin layer provided on one surface thereof, and the adhesive resin has good adhesion to the metal foil and the shield film other than the conductive protrusion. Shield flexible printed wiring board characterized by
前記グランド部材は、その長手方向が前記シールドフィルムの長手方向に直交するように配設されていることを特徴とするシールドフレキシブルプリント配線板。 In the shield flexible printed wiring board according to any one of claims 1 to 4,
The shield flexible printed wiring board, wherein the ground member is disposed so that a longitudinal direction thereof is orthogonal to a longitudinal direction of the shield film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007285878A JP4295794B2 (en) | 2001-06-29 | 2007-11-02 | Shield flexible printed wiring board |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001197878 | 2001-06-29 | ||
| JP2007285878A JP4295794B2 (en) | 2001-06-29 | 2007-11-02 | Shield flexible printed wiring board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002189385A Division JP2003086907A (en) | 2001-06-29 | 2002-06-28 | Shielded flexible printed wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008078677A JP2008078677A (en) | 2008-04-03 |
| JP2008078677A5 true JP2008078677A5 (en) | 2008-12-18 |
| JP4295794B2 JP4295794B2 (en) | 2009-07-15 |
Family
ID=39350343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007285878A Expired - Lifetime JP4295794B2 (en) | 2001-06-29 | 2007-11-02 | Shield flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4295794B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5528857B2 (en) * | 2010-03-11 | 2014-06-25 | タツタ電線株式会社 | Electromagnetic wave shielding film, flexible substrate using the same, and method for producing the same |
| JP5685098B2 (en) * | 2011-01-28 | 2015-03-18 | 京セラケミカル株式会社 | Manufacturing method of electronic parts |
| KR101978992B1 (en) * | 2011-04-28 | 2019-05-16 | 가부시키가이샤 가네카 | Novel flexible printed circuit integrated with conductive layer |
| JP6449111B2 (en) * | 2015-06-17 | 2019-01-09 | 住友電工プリントサーキット株式会社 | Shielding material, electronic parts and adhesive sheet |
| CN107787117A (en) * | 2016-08-30 | 2018-03-09 | 江苏华神电子有限公司 | FPC plate reinforcement joint tools and method |
| CN110691497B (en) * | 2018-07-06 | 2024-04-23 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN112867253A (en) * | 2020-12-31 | 2021-05-28 | 福莱盈电子股份有限公司 | Preparation method of electromagnetic shielding film and preparation method of circuit board structure |
-
2007
- 2007-11-02 JP JP2007285878A patent/JP4295794B2/en not_active Expired - Lifetime
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