200930566 九、發明說明： 【發明所屬之技術領域】 本發明涉及軟性電路板技術領域，特別涉及一種補強 板及包括該補強板之補強軟性電路板。 【先前技術】 隨著折疊行動電話與滑蓋行動電話等可折疊電子產品 之不斷發展，具有輕、薄、短、小以及可彎折特點之軟性 © 印刷電路板（Flexible Printed Circuit Board，FPCB)被廣泛應 用於電子產品中，以實現不同電路之間之電性連接。為了 獲得具有更好撓折性能之FPCB，改善FPCB所用基膜材料 之撓折性能成為研究熱點。請參見文獻Electrical Insulation Maganize，Volume 5，Issue 1，Jan.-Feb.，1989 Papers:15-23, “Applications of Polyimide Films to the Electrical and Electronic Industries in Japan” ° 為滿足可折疊電子產品多功能化之設計需求’安裝於 ® FPCB表面之電子元器件之數量亦相應增加°惟’與硬性電 路板相比具有良好撓折性能之FPCB，機械強度小、承載能 力低，並於使用過程中，如表面貼裝工藝（Surface Mount Technology，SMT )中安裝電子器件時’ FPCB易龜裂或受 損，無法承載較大質量或複數電子器件’阻礙實現可折疊 電子產品多功能化之發展。目前，如圖1所示’業界一般 將由聚醯亞胺（Polyimide，PI)材料製成之加強片110藉 由環氧樹脂製成之膠黏層120壓合於軟性基板130表面’ 200930566 以製作具有較高承載能力之補強FPCB10。惟，PI與環氧樹 月曰之熱衫脹係數（Coefficient of Thermal Expansion，CET) .不同，於壓合膠黏層120與加強片110於軟性基板13〇過 程中’包含PI之加強片110與包含環氧樹脂膠黏層12〇加 熱時，兩之膨脹與收縮程度不同，容易引起補強FpcB1〇 發生翹曲，增加後續表面貼裝電子元器件之難度。 _【發明内容】 有鑑於此，提供一種補強板及包括該補強板之補強軟 性電路板，以增加軟性電路板之機械強度，並避免軟性電 路板發生翹曲實屬必要。 以下將以複數實施例說明一種補強板及包括該補強板 之補強軟性電路板。 δ亥補強板，其由至少一聚醯亞胺層與至少一聚醚醯亞 胺層交替排列形成。該聚醚醯亞胺層由聚醚醯亞胺材料組 ❹成，該聚醚醯亞胺材料之結構通式Α為：200930566 IX. INSTRUCTIONS: TECHNICAL FIELD The present invention relates to the field of flexible circuit boards, and in particular to a reinforcing board and a reinforcing flexible circuit board including the reinforcing board. [Prior Art] With the continuous development of foldable electronic products such as folding mobile phones and slide mobile phones, the Flexible Printed Circuit Board (FPCB) is light, thin, short, small, and bendable. It is widely used in electronic products to achieve electrical connection between different circuits. In order to obtain FPCB with better flexing performance, it has become a research hotspot to improve the flexural properties of the base film materials used in FPCB. See the literature Electrical Insulation Maganize, Volume 5, Issue 1, Jan.-Feb., 1989 Papers: 15-23, “Applications of Polyimide Films to the Electrical and Electronic Industries in Japan” ° to meet the multi-functionality of foldable electronic products The design requirements 'the number of electronic components mounted on the surface of the FPCB is also increased accordingly. 'FPCB with good flexural performance compared to rigid boards, low mechanical strength, low load carrying capacity, and during use, such as When installing electronic devices in Surface Mount Technology (SMT), 'FPCB is prone to cracking or damage, and cannot carry large mass or multiple electronic devices' hinders the development of multi-functional folding products. At present, as shown in FIG. 1 , the reinforcing sheet 110 made of polyimide (PI) material is generally pressed onto the surface of the flexible substrate 130 by an adhesive layer 120 made of epoxy resin. Reinforced FPCB10 with higher load carrying capacity. However, unlike the Coefficient of Thermal Expansion (CET) of the epoxy tree, the PI includes the PI reinforcing sheet 110 during the process of pressing the adhesive layer 120 and the reinforcing sheet 110 in the flexible substrate 13〇. When heated with 12 layers of epoxy resin, the degree of expansion and contraction is different, which tends to cause warpage of the reinforcing FpcB1〇 and increase the difficulty of subsequent surface mounting of electronic components. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a reinforcing plate and a reinforcing flexible circuit board including the reinforcing plate to increase the mechanical strength of the flexible circuit board and avoid warpage of the flexible circuit board. Hereinafter, a reinforcing plate and a reinforcing flexible circuit board including the reinforcing plate will be described in the plural embodiments. The δ hai reinforcing plate is formed by alternately arranging at least one polyimine layer and at least one polyether quinone layer. The polyether quinone imine layer is formed from a polyether quinone imine material, and the structural formula 该 of the polyether quinone imide material is:
該補強軟性電路板，其包括軟性電路板及貼合於軟性 電路板之補強板。該補強板由至少一聚酿亞胺層與至少一 聚謎醜亞胺層交替排列形成’該聚醚醯亞胺層由聚醚醯亞 胺材料組成，該聚醚醯亞胺材料之結構通式A為： 200930566The reinforcing flexible circuit board comprises a flexible circuit board and a reinforcing board attached to the flexible circuit board. The reinforcing plate is formed by alternately arranging at least one polyimine layer and at least one polymyglymine layer. The polyether quinone layer is composed of a polyether quinone material, and the structure of the polyether quinone material is Formula A is: 200930566
與先前技術相比，該補強板採用具有結構通式A之聚 趟醯亞胺層製作，由於該聚醚醯亞胺之熱膨脹係數與聚醯 亞胺之熱膨脹係數相近，即聚醚醯亞胺與聚醯亞胺受熱後 之膨脹與收縮率相近。因此，包括該補強板之軟性電路板 ®不容易發生翹曲，提高了結構穩定性，方便後續製程操作。 【實施方式】 下面將結合附圖及複數實施例對本技術方案實施例提 供之補強板及包括該補強板之補強軟性電路板作進一步詳 細說明。Compared with the prior art, the reinforcing plate is made of a polyimine layer having the structural formula A, since the thermal expansion coefficient of the polyether quinone is similar to that of the polyimine, ie, polyether quinone The swelling and shrinkage rates are similar to those of polyimine. Therefore, the flexible circuit board including the reinforcing plate is less prone to warpage, improves structural stability, and facilitates subsequent process operations. [Embodiment] Hereinafter, a reinforcing plate provided by an embodiment of the present technical solution and a reinforcing flexible circuit board including the reinforcing plate will be further described in detail with reference to the accompanying drawings and the embodiments.
由於補強板之實際厚度很薄，且沿寬度方向上具有相 同之結構，為清楚表明補強板之結構，以下將結合補強板 局部剖面放大圖詳細說明補強板之結構（如圖2、圖3及圖 4所示）。相同地，亦採用局部剖面放大圖說明補強軟性電 路板之結構（如圖5及圖6所示），以方便理解。 請參閱圖2,為本技術方案第一實施例提供之補強板 处用於貼口於軟ί·生電路板，以提高軟性電路板之機械性 ^該補強板20由至少別與至少—聚賴亞胺 (Polyethemmde，ΡΕΙ)層 22〇 交替排列形成。ρι 層 之層數為N，PEU220之層數為M。根據電路板之不同設 200930566 計需要，PI層210之層數N與PEI層220之層數Μ之數值 . 可相等或不相等，因此補強板20之相對兩最外側可能同時 • 為ΡΙ層210、或同時為ΡΕΙ層220或一側為ΡΙ層210而另 一側為ΡΕΙ層220。該補強板20厚度為25μιη〜250μιη。其 中，ΡΙ層210厚度為25μιη~75μιη，或者ΡΕΙ層220厚度為 25μιη〜75μιη，可根據設計需要決定ΡΙ層210厚度與ΡΕΙ層 220厚度，只要滿足補強板20之總厚度為25μηι〜250μιη即 本實施例中，該補強板20為包括三層ΡΙ層210與兩 ΡΕΙ層220之五層複合補強板，即：Ν=3，Μ = 2。該ΡΕΙ層 220位於兩ΡΙ層210之間，用於黏結相鄰兩ΡΙ層210，以 形成補強板20。該補強板20之最外側為ΡΙ層210。該最 外側之ΡΙ層210用於與軟性電路板貼合。當然，補強板20 包括ΡΙ層210及ΡΕΙ層220之層數不限，可根據不同設計 需要來決定，只要Ν=Μ + 1 (即：最外側為ΡΙ層210 )即可。 ❹ 該ΡΕΙ層220由ΡΕΙ材料組成，該ΡΕΙ材料之結構通 式Α為.Since the actual thickness of the reinforcing plate is very thin and has the same structure along the width direction, in order to clearly show the structure of the reinforcing plate, the structure of the reinforcing plate will be described in detail below with reference to the enlarged cross-sectional view of the reinforcing plate (Fig. 2, Fig. 3 and Figure 4). Similarly, the structure of the reinforcing flexible circuit board (shown in Figures 5 and 6) is also illustrated by a partial cross-sectional enlarged view for easy understanding. Referring to FIG. 2, the reinforcing plate provided in the first embodiment of the present invention is used for attaching to a soft circuit board to improve the mechanical properties of the flexible circuit board. The reinforcing board 20 is at least combined with at least The layer of Polyethemmde (ΡΕΙ) is alternately arranged. The number of layers in the ρι layer is N, and the number of layers in the PEU 220 is M. According to the different requirements of the circuit board, the number of layers N of the PI layer 210 and the number of layers of the PEI layer 220 may be equal or unequal, so the opposite outermost sides of the reinforcing plate 20 may simultaneously be the layer 210. Or at the same time, the germanium layer 220 or one side is the germanium layer 210 and the other side is the germanium layer 220. The reinforcing plate 20 has a thickness of 25 μm to 250 μm. The thickness of the tantalum layer 210 is 25 μm to 75 μm, or the thickness of the tantalum layer 220 is 25 μm to 75 μm, and the thickness of the tantalum layer 210 and the thickness of the tantalum layer 220 can be determined according to design requirements, as long as the total thickness of the reinforcing plate 20 is 25 μm to 250 μm. In the embodiment, the reinforcing plate 20 is a five-layer composite reinforcing plate comprising three layers of tantalum layer 210 and two layers of layers 220, namely: Ν=3, Μ=2. The enamel layer 220 is located between the two enamel layers 210 for bonding the adjacent two ruthenium layers 210 to form the reinforced plate 20. The outermost side of the reinforcing plate 20 is a enamel layer 210. The outermost layer 210 is for bonding to a flexible circuit board. Of course, the number of layers of the reinforcing plate 20 including the enamel layer 210 and the enamel layer 220 is not limited, and may be determined according to different design needs, as long as Ν=Μ + 1 (ie, the outermost layer is the enamel layer 210). The crucible layer 220 is composed of a crucible material, and the structure of the crucible material is generally Α.
該PEI材料之結構通式A之分子鏈上包含醚基團。該 醚基團增加結構通式A之分子鏈柔性，使PEI材料具有良 好之可撓折性。 9 200930566 另外’邊PEI材料熔融狀態時流動性好，並具有較好 之黏、纟。力’且PEI材料之熱膨脹係數為 16x10〜18xl〇 K1，其與？1材料之熱膨脹係數相近。因此， 於加熱由PEI層220黏結Η層加製作之補強板20時， PEI材料與PI材料之膨脹與收縮程度趨於一致可避免補 強板20發生勉曲。 PEI可由4，4’ -一备且- 一乱基一本醚、間苯二胺或對苯二胺中 2烧一酐於甲基乙酿胺溶液中經加熱縮聚並亞胺化製備獲 付w然，PEI亦可藉由其他方法製備獲得，只要製備之 PEI具有結構通式a即可。 «•月參閱圖3,為本技術方案第二實施例提供之補強板 3〇:其結構與本技術方案第一實施例提供之補強板2〇結構 相同區別在於，PI層31〇之層數為N與观層之層 數為Μ相同’即M=N。本實施例中，補強板π為包括兩 〇 π層與兩阳層320之四層複合補強板，即：μ=ν=2。 此時’該補強板30之相對兩最外側為一侧為？1層31〇，另 側為ΡΕΙ層320。该最外側之ρι層31〇或ρΕΐ層均 可用於與軟性電路板貼合。 »月參閱圖4’為本技術方案第三實施例提供之補強板 構與本技術方案第—實施例提供之補強板加結構 同區別在於，PI層41〇之層數為N與層㈣之層 =為Μ之關係為M=N+1。本實施例中，補強板4〇包括一 層410及貼合於PI@ 410相對兩側面之兩PEI層420, 200930566 即：M=2’ N=l。該補強板4〇之相對兩最外侧同時為pm •層420。該最外側之PEI層42〇用於與軟性電路板貼合。 請參關5，以包括本技術方案第—實施例提供之補強 板2 0之軟性電路板為例介紹本技術方案第四實施例提供之 補強軟性電路板50，其包括軟性電路板51〇、補強板2〇以 及膠黏層520。該軟性電路板51〇係由覆金屬基材經過一系 列製作工藝’如製作線路、導通孔、貼附保護膜或電鍍等 ❹工藝，製作而成之單面或雙面之單層或複數層電路基板。 該軟性電路板510具有一補強面511，用於與補強板2〇貼 合〇 該補強板20藉由膠黏層52〇貼合於軟性電路板51〇之 補強面511。本實施例中，位於補強板2〇之最外側之為ρι 層210。該PI層210經膠黏層52〇貼合於軟性電路板51〇 之補強面511。 該膠黏層520厚度為25μιη〜70μηι。本實施例中，膠黏 Ο層520由ΡΕΙ材料組成，該ΡΕΙ材料之結構通式八為： 广 0 It,c、 -Ν ! J ^ O- \(：入^ ch3The PEI material has an ether group on the molecular chain of the structural formula A. The ether group increases the flexibility of the molecular chain of the structural formula A, so that the PEI material has good flexibility. 9 200930566 In addition, the liquidity of the PEI material in the molten state is good, and it has good adhesion and enthalpy. Force' and the thermal expansion coefficient of the PEI material is 16x10~18xl〇 K1, and its 1 The thermal expansion coefficient of the material is similar. Therefore, when the reinforcing plate 20 which is bonded by the PEI layer 220 and the reinforced layer is heated, the degree of expansion and contraction of the PEI material and the PI material tends to be uniform to avoid distortion of the reinforcing plate 20. PEI can be prepared by heating polycondensation and imidization of 4,4'-one and one-and-one-one ether, m-phenylenediamine or p-phenylenediamine in 2-methylamine However, PEI can also be obtained by other methods, as long as the prepared PEI has the structural formula a. «•月月 Referring to FIG. 3, the reinforcing plate 3〇 provided by the second embodiment of the present technical solution has the same structure as the reinforcing plate 2〇 structure provided by the first embodiment of the present technical solution, and the number of layers of the PI layer 31〇 The number of layers of N and the view layer is the same as ''M=N'. In this embodiment, the reinforcing plate π is a four-layer composite reinforcing plate comprising two π π layers and two positive layers 320, that is, μ=ν=2. At this time, the opposite outermost sides of the reinforcing plate 30 are on one side? One layer is 31 〇 and the other side is ΡΕΙ layer 320. The outermost layer of the ρ1 layer or the Εΐ layer can be used for bonding to a flexible circuit board. Referring to FIG. 4', the reinforcing plate structure provided in the third embodiment of the present technical solution is different from the reinforcing plate adding structure provided in the first embodiment of the present technical solution in that the number of layers of the PI layer 41 is N and the layer (4) The relationship of layer = Μ is M = N + 1. In this embodiment, the reinforcing plate 4 includes a layer 410 and two PEI layers 420 attached to opposite sides of the PI@410, 200930566: M=2' N=l. The opposite outermost sides of the reinforcing plate 4 are simultaneously pm • layer 420. The outermost PEI layer 42 is for bonding to a flexible circuit board. Referring to FIG. 5, a flexible circuit board 50 according to a fourth embodiment of the present technical solution, including a flexible circuit board 51, is provided as an example of a flexible circuit board including a reinforcing board 20 provided in the first embodiment of the present technical solution. Reinforcing plate 2〇 and adhesive layer 520. The flexible circuit board 51 is a single layer or a plurality of layers of one or two sides which are made of a metal-clad substrate through a series of manufacturing processes such as making a circuit, a via hole, a protective film or a plating process. Circuit board. The flexible circuit board 510 has a reinforcing surface 511 for bonding to the reinforcing plate 2, and the reinforcing plate 20 is adhered to the reinforcing surface 511 of the flexible circuit board 51 by the adhesive layer 52. In this embodiment, the outermost layer of the reinforcing plate 2 is a layer ρ1. The PI layer 210 is bonded to the reinforcing surface 511 of the flexible circuit board 51A via the adhesive layer 52. The adhesive layer 520 has a thickness of 25 μm to 70 μm. In this embodiment, the adhesive layer 520 is composed of a tantalum material, and the structure of the tantalum material is eight: wide 0 It, c, -Ν ! J ^ O- \(: into ^ ch3
II 0 il0 a PEI材料熔融狀態時流動性好，具有較好之黏結力，且 PEI材料之熱膨脹係數為16χ1〇-6〜18χ1〇-6κ-ι。同理可知， 加熱由膠黏層520黏結軟性電路板51〇與補強板2〇製作之 補強軟性電路板50時，膠黏層52〇之pEI材料與補強板 11 200930566 之pi材料之膨脹與收縮程度趨於一致，可避免補強軟性電 路板50發生翹曲。 . 可理解，補強軟性電路板5〇亦可為包括第二實施例提 供之補強板30或第三實施例提供之補強板4〇之軟性電路 板510，以增加軟性電路板51〇之機械強度。 •請參閱圖6’以包括本技術方案第一實施例提供之補強 板20之軟性電路板為例介紹本技術方案第五實施例提供之 ❹補強軟性電路板60,其結構與補強軟性電路板5〇之結構相 似，區別在於補強板20直接貼合於軟性電路板61〇形成補 強軟性電路板60，沒有使用膠黏劑。該軟性電路板61〇之 補強面611與補強板2〇接觸並貼合。 本實施例中，位於補強板2〇之最外侧之為^層21〇。 由於溶融狀態時流動性較好’亦具有黏結力，故補強板加 最外側之Η層210可起膠黏劑之作用，使補強板2〇 性電路板610貼合。 ' ° 可理解，補強軟性電路板60亦可為包括第二實施例提 供之補強板30或第三實施例提供之補強板4()之軟性電路 板610，以增加軟性電路板61〇之機械強度。 此外’ PEI材料與PI材料均具有黏性，惟阳 =較：材料之黏結力更佳。因此，為保證補強軟性電 最構 離或分層’優選地，使用pei材料製作 提出專利申請 綜上所述，本發明確已符合發明專利之要件 惟’以上所述者僅為本發明之較佳實施方 12 200930566 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作<等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係先前技術提供之補強FPCB之剖面圖。 圖2係本技術方案第一實施例提供之補強板之局部剖 面放大圖。II 0 il0 a PEI material has good fluidity in the molten state and has good cohesive force, and the thermal expansion coefficient of PEI material is 16χ1〇-6~18χ1〇-6κ-ι. Similarly, when the flexible flexible circuit board 50 made of the flexible circuit board 51 and the reinforcing board 2 is bonded by the adhesive layer 520, the pEI material of the adhesive layer 52 and the pi material of the reinforcing board 11 200930566 expand and contract. The degree of convergence tends to be uniform, and warpage of the reinforcing flexible circuit board 50 can be avoided. It can be understood that the reinforcing flexible circuit board 5 can also be a flexible circuit board 510 including the reinforcing board 30 provided in the second embodiment or the reinforcing board 4 provided in the third embodiment to increase the mechanical strength of the flexible circuit board 51. . Please refer to FIG. 6 ′ for a flexible circuit board 60 according to a fifth embodiment of the present invention, which is a flexible circuit board including the reinforced board 20 provided by the first embodiment of the present technical solution. The structure and the reinforced flexible circuit board are provided. The structure of the 5〇 is similar, except that the reinforcing plate 20 is directly attached to the flexible circuit board 61 to form the reinforcing flexible circuit board 60, and no adhesive is used. The reinforcing surface 611 of the flexible circuit board 61 is in contact with and bonded to the reinforcing plate 2A. In this embodiment, the outermost layer of the reinforcing plate 2 is the layer 21〇. Since the fluidity in the molten state is good, the bonding force is also applied. Therefore, the reinforcing layer plus the outermost layer 210 can function as an adhesive, so that the reinforcing board 2 is bonded. It can be understood that the reinforcing flexible circuit board 60 can also be a flexible circuit board 610 including the reinforcing plate 30 provided in the second embodiment or the reinforcing plate 4 () provided in the third embodiment to increase the mechanical structure of the flexible circuit board 61. strength. In addition, both the PEI material and the PI material are viscous, but the positivity = is better: the bonding strength of the material is better. Therefore, in order to ensure that the reinforcing soft electric is most detached or layered 'preferably, using the pei material to make a patent application, the present invention has indeed met the requirements of the invention patent, but the above is only the comparison of the present invention. Good implementation party 12 200930566, can not limit the scope of patent application in this case. Any equivalents or modifications made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of a reinforced FPCB provided by the prior art. Fig. 2 is a partial cross-sectional enlarged view of a reinforcing plate according to a first embodiment of the present technical solution.
圖3係本技術方案第二實施例提供之補強板之局部剖 面放大圖。 圖4係本技術方案第三實施例提供之補強板之局部剖 面放大圖。 圖5係本技術方案第四實施例提供之補強軟性電路 之局部剖面放大圖。 圖6係本技術方案第五實施例提供之補強軟性電 之局部剖面放大圖。 〇 10 110 120 ， 520 130 20 ， 30 ， 40 210 ， 310 ， 410 220 ， 320 ， 420 【主要元件符號說明】 補強FPCB 加強片 膠黏層 軟性基板 補強板 PI層 PEi層 13 60 200930566 補強軟性電路板 50， 軟性電路板 510 補強面 511 ，610 ，611Fig. 3 is a partial cross-sectional enlarged view of a reinforcing plate according to a second embodiment of the present technical solution. Fig. 4 is a partial cross-sectional enlarged view of a reinforcing plate according to a third embodiment of the present technical solution. Figure 5 is a partial cross-sectional enlarged view of a reinforcing soft circuit according to a fourth embodiment of the present technical solution. Fig. 6 is a partial cross-sectional enlarged view showing the reinforced soft electric power provided by the fifth embodiment of the present technical solution. 〇10 110 120 , 520 130 20 , 30 , 40 210 , 310 , 410 220 , 320 , 420 [Main component symbol description ] Reinforced FPCB Reinforced sheet adhesive layer Soft substrate reinforcement board PI layer PEi layer 13 60 200930566 Reinforced flexible circuit board 50, flexible circuit board 510 reinforcing surface 511, 610, 611
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