CN110602881A - Circuit board and display device - Google Patents
Circuit board and display device Download PDFInfo
- Publication number
- CN110602881A CN110602881A CN201910880703.0A CN201910880703A CN110602881A CN 110602881 A CN110602881 A CN 110602881A CN 201910880703 A CN201910880703 A CN 201910880703A CN 110602881 A CN110602881 A CN 110602881A
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- China
- Prior art keywords
- component
- region
- circuit board
- component mounting
- mounting region
- Prior art date
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Telephone Set Structure (AREA)
Abstract
The application provides a circuit board and a display device, and relates to the technical field of display. The circuit board includes: a first component arrangement region; a second component arrangement region; and a flexible region connecting the first component mounting region and the second component mounting region; and the first component setting area and the second component setting area are respectively connected with the flexible area in a seamless mode. The embodiment of this application sets up respectively at the first component that is connected by the flexibility district through will originally setting up to two components and parts that the position is close to each other and sets up the district with the second component to effectively increased the interval between these two components and parts, and then avoided the emergence of welding accidental injury, that is to say, effectively improved the damage of welding operation to components and parts on the circuit board. In addition, the flexible region is arranged so that the first component setting region and the second component setting region can be in a stacked state, and therefore the problem that the circuit board cannot be placed into the display device when the flexible region is in a flattened state is effectively solved.
Description
Technical Field
The application relates to the technical field of display, in particular to a circuit board and a display device.
Background
For a display device with a smaller size, such as a smart watch, during soldering a component onto a circuit board, the soldering operation often mistakenly damages other components on the circuit board, thereby causing damages to other components.
Therefore, how to improve the damage of the components on the circuit board caused by the soldering operation becomes an urgent problem to be solved.
Disclosure of Invention
In view of the above, embodiments of the present disclosure are directed to providing a circuit board and a display device, so as to solve the problem of damage to components on the circuit board caused by a soldering operation in the prior art.
One aspect of the present application provides a circuit board, including: a first component arrangement region; a second component arrangement region; and a flexible region connecting the first component mounting region and the second component mounting region; the first component setting region and the second component setting region are respectively connected with the flexible region in a seamless mode.
In an embodiment of this application, when the flexible region is the exhibition flat state first component set up the district with the plane at second component set up the district place, and with first component set up the district with in the direction mutually perpendicular of the joint direction of second component set up the district, the size of flexible region is less than the size in first component set up the district, and/or, the size in flexible region is less than the size in second component set up the district.
In one embodiment of the present application, when the flexible region is bent to make the first component mounting region and the second component mounting region in a stacked state, an orthographic projection of the second component mounting region on the first component mounting region completely falls within the first component mounting region.
In one embodiment of the present application, the first component mounting region and/or the second component mounting region comprises a non-compliant sub-region.
Another aspect of the present application provides a display device, including: a housing including a receiving cavity; and a circuit board disposed within the receiving cavity; wherein, the circuit board includes: a first component arrangement region; a second component arrangement region; and a flexible region connecting the first component mounting region and the second component mounting region; the first component arrangement region and the second component arrangement region are respectively connected with the flexible region in a seamless mode; the flexible region is in a bending state, and the first component setting region and the second component setting region are in a stacked state.
In an embodiment of the present application, a photosensitive component is disposed on a first surface of the first component disposing area facing the second component disposing area; the photosensitive component is arranged on the periphery of the orthographic projection of the second component arrangement area on the first component arrangement area.
In one embodiment of the present application, the display device further comprises a display screen; the display screen is arranged on one side, far away from the first component arrangement area, of the second component arrangement area, and the near field communication coil of the near field communication circuit is arranged in the second component arrangement area.
In one embodiment of the present application, the near field communication coil is disposed at the second component disposition region toward the second surface of the display screen.
In one embodiment of the present application, the near field communication coil is integrally formed with the metal line of the second component mounting region.
In one embodiment of the present application, the display device further includes a control main circuit board; the circuit board is electrically connected with the control main circuit board.
The embodiment of this application sets up respectively at the first component that is connected by the flexibility district through will originally setting up to two components and parts that the position is close to each other and sets up the district with the second component to effectively increased the interval between these two components and parts, and then avoided the emergence of welding accidental injury, that is to say, effectively improved the damage of welding operation to components and parts on the circuit board. In addition, the flexible region is arranged so that the first component setting region and the second component setting region can be in a stacked state, and therefore the problem that the circuit board cannot be placed into the display device when the flexible region is in a flattened state is effectively solved.
Drawings
Fig. 1 is a schematic diagram of a circuit board in a flattened state in a flexible region according to an embodiment of the present application.
Fig. 2a and 2b are schematic views of a circuit board according to an embodiment of the present application, in which the flexible region is bent.
Fig. 3 is a schematic structural view of a display device according to an embodiment of the present application.
Fig. 4 is a schematic structural view of a display device according to another embodiment of the present application.
Fig. 5 is a schematic structural view of a display device according to still another embodiment of the present application.
Fig. 6 is a schematic configuration diagram of a display device according to still another embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
As described in the background, the circuit board of the display device is generally small in size for a small-sized display device. That is, when designing a circuit board, two adjacent components are usually disposed relatively close to each other. When a component needs to be soldered for electrical connection to a circuit board, heat generated by the soldering operation may affect an adjacent component on the circuit board, thereby causing accidental damage to the adjacent component. For example, for a smart watch, in order to meet the market demand of Near Field Communication (NFC), a Near Field Communication coil of a Near Field Communication circuit is soldered on a circuit board. However, for a smart watch, the space on the circuit board is very limited, and the soldering temperature can reach 300 ℃, so that the soldering operation can easily damage other components on the circuit board by mistake.
Therefore, if the occurrence of welding accidental injury can be avoided, the damage of welding operation on components on the circuit board can be effectively improved.
Fig. 1 is a schematic diagram of a circuit board 1 according to an embodiment of the present application in a flattened state in a flexible region 13. Fig. 2a and 2b are schematic diagrams of the circuit board 1 according to an embodiment of the present application in a bent state in the flexible region 13.
Based on this, the embodiment of the present application provides a circuit board 1. As shown in fig. 1, the circuit board 1 may include a first component disposition region 11, a second component disposition region 12, and a flexible region 13 connecting the first component disposition region 11 and the second component disposition region 12. The first component arrangement region 11 and the second component arrangement region 12 are seamlessly connected to the flexible region 13, respectively.
Specifically, the first component mounting region 11, the second component mounting region 12, and the flexible region 13 may represent different regions of the same circuit board 1, respectively, so that the first component mounting region 11 and the second component mounting region 12 may be seamlessly connected to the flexible region 13, respectively. In addition, the first component mounting region 11 and the second component mounting region 12 may also be seamlessly connected to the flexible region 13 through a process such as pressing.
Here, the flexible region 13 may be in a flattened state as shown in fig. 1, or in a bent state as shown in fig. 2a and 2b, so as to be suitable for different application scenarios. For example, when a component is provided for the circuit board 1, the flexible region 13 may assume a flattened state so as to dispose the component in the first component disposition region 11 or the second component disposition region 12. When the flexible region 13 is in a flattened state and the circuit board 1 cannot be placed in a display device, the flexible region 13 can be bent, that is, the flexible region 13 can be in a bent state, so that the first component setting region 11 and the second component setting region 12 can be in a stacked state, and the problem that the circuit board 1 cannot be placed in the display device is solved.
When flexible region 13 is the exhibition flat state, and the area that sets up district 11 at first component or the area that second component set up district 12 is the same with prior art's circuit board 1 area, prior art originally designed to set up respectively in first component setting district 11 and second component setting district 12 for two components that the position is close to each other, thereby effectively increased the interval between these two components, and then avoided the emergence of avoiding welding accidental injury, that is to say, effectively improved the damage of welding operation to components and parts on the circuit board 1.
It should be understood that when a component is disposed in the first component disposition region 11 or the second component disposition region 12, a soldering process may be used, and a non-soldering process may also be used, and the specific process used in the embodiment of the present application may not be limited.
In the embodiment of the present application, the first component mounting region 11 may be flexible or may be inflexible. Similarly, the second component disposition region 12 may exhibit flexibility or may exhibit non-flexibility. When both the first component disposition area 11 and the second component disposition area 12 exhibit flexibility, the circuit board 1 may be a flexible circuit board 1. When both the first component mounting region 11 and the second component mounting region 12 exhibit flexibility, or when one of the first component mounting region 11 and the second component mounting region 12 exhibits flexibility, that is, when the first component mounting region 11 and/or the second component mounting region 12 includes a non-flexible sub-region, the circuit board 1 may be a rigid-flex circuit board. For example, when the circuit board 1 is a rigid-flex circuit board, the circuit board 1 may be integrated with a main control circuit, i.e., the circuit board 1 may be a main control circuit board 8.
The embodiment of this application sets up respectively at first component setting district 11 and the second component setting district 12 connected by flexible region 13 through setting up two components and parts that the position is close to each other originally to effectively increased the interval between these two components and parts, and then avoided the emergence of welding accidental injury, that is to say, effectively improved the damage of welding operation to components and parts on circuit board 1. In addition, the flexible region 13 is arranged so that the first component mounting region 11 and the second component mounting region 12 can be stacked, thereby effectively avoiding the problem that the display device cannot be placed in the circuit board 1 when the flexible region 13 is in a flattened state.
In an embodiment of the present application, as shown in fig. 1, when the flexible region 13 is in the flattened state, in a direction perpendicular to the plane where the first component mounting region 11 and the second component mounting region 12 are located and the connection direction of the first component mounting region 11 and the second component mounting region 12, that is, perpendicular to the connection direction of the first component mounting region 11 and the second component mounting region 12 (as shown in a in fig. 1), a dimension h1 of the flexible region 13 may be smaller than both a dimension h2 of the first component mounting region 11 and a dimension h3 of the second component mounting region 12, or a dimension h1 of the flexible region 13 may be smaller than either a dimension h2 of the first component mounting region 11 or a dimension h3 of the second component mounting region 12, and a position 112 of the first component mounting region 11 not covered by the flexible region 13 and the second component mounting region 12 may be used for disposing a component having a higher dimension, A light sensing component 5 and the like.
For example, when the position 112 on the first component mounting region 11 not covered by the flexible region 13 and the second component mounting region 12 is set as a higher-sized component, it is possible to avoid that the second component mounting region 12 assumes an inclined state instead of a horizontal state after the higher-sized component supports the flexible region 13. It should be understood that the second component arrangement region 12 is not favorable for fixing the position of the second component arrangement region 12 when the second component arrangement region 12 is in the inclined state. That is, if the position of the entire circuit board 1 is not fixed, the components are easily damaged by impact. When the position 112 on the first component arrangement region 11 not covered by the flexible region 13 and the second component arrangement region 12 is set as the photosensitive component 5, the photosensitive component 5 can effectively sense light because of no blocking.
Furthermore, the position 112 on the first component setting area 11 not covered by the flexible area 13 and the second component setting area 12 is provided with a component or a photosensitive component 5 with a relatively high size, and compared with the other positions, when the first component setting area 11 and the second component setting area 12 are in a stacked state, the thickness of the circuit board 1 can be effectively reduced, thereby being beneficial to realizing ultra-thinning of the display device using the circuit board 1.
In one embodiment of the present application, as shown in fig. 2B, when the flexible region 13 is bent in the connecting direction of the first component disposition region 11 and the second component disposition region 12 (as shown in B in fig. 2B) to make the first component disposition region 11 and the second component disposition region 12 in the stacked disposition state, a dimension L1 of the first component disposition region 11 may be equal to or less than a dimension L2 of the second component disposition region 12 and a part of the flexible region 13.
Specifically, in the connecting direction of the first component arrangement region 11 and the second component arrangement region 12 (as shown in B in fig. 2B), when the dimension L1 of the first component arrangement region 11 is larger than the dimension L2 of the second component arrangement region 12 and the flexible region 13, and the orthographic projection of the second component arrangement region 12 on the first component arrangement region 11 cannot completely fall on the first component arrangement region 11, there may be a relative movement between the first component arrangement region 11 and the second component arrangement region 12 due to the flexible region 13, thereby being disadvantageous to the overall position fixing of the circuit board 1. As shown in fig. 2b, when the dimension L1 of the first component arrangement region 11 is less than or equal to the dimension L2 of the second component arrangement region 12 and a part of the flexible region 13, that is, the orthographic projection of the second component arrangement region 12 on the first component arrangement region 11 completely falls within the first component arrangement region 11, the position of the first component arrangement region 11 can be fixed by the housing 4 of the display apparatus, that is, the first component arrangement region 11 can be held and fixed in the housing 4 of the display apparatus, the second component arrangement region 12 can be held and fixed on the first component arrangement region 11, that is, the first component arrangement region 11 can be provided with a fixing column for fixing the second component arrangement region 12, thereby facilitating the position fixing of the circuit board 1 as a whole.
It should be understood that, in the case where the flexible region 13 is completely bent over the first component mounting region 11, that is, when the orthographic projection of the flexible region 13 on the first component mounting region 11 completely falls within the first component mounting region 11, in order to facilitate the position fixing of the whole circuit board 1, the size of the first component mounting region 11 may be smaller than or equal to the size of the second component mounting region 12 and the flexible region 13 in its entirety.
The circuit board 1 according to the embodiment of the present application is described above, and a display device according to the embodiment of the present application is described below with reference to fig. 3 to 6.
Fig. 3 is a schematic structural view of a display device according to an embodiment of the present application.
As shown in fig. 3, the display device may include a housing 4, the housing 4 including a receiving chamber 41, and a circuit board 1 disposed in the receiving chamber 41. The circuit board 1 may include a first component arrangement region 11, a second component arrangement region 12, and a flexible region 13 connecting the first component arrangement region 11 and the second component arrangement region 12. The first component mounting region and the second component mounting region 12 are seamlessly connected to the flexible region 13, respectively. In the accommodation chamber 41, the flexible region 13 is bent, and the first component mounting region 11 and the second component mounting region 12 are stacked.
Specifically, the circuit board 1 may be as shown in fig. 1. And the related details of the circuit board 1 can refer to the above embodiment related to the circuit board 1, and are not described herein again to avoid repetition.
In addition, the housing 4 of the display device may be used to wrap the circuit board 1, thereby preventing damage to the circuit board 1 from external force. Here, the display device may be a portable display device such as a smart watch, a smart bracelet, or the like, and the embodiment of the present application may not specifically limit the type of the display device.
The embodiment of this application sets up respectively at first component setting district 11 and the second component setting district 12 connected by flexible region 13 through setting up two components and parts that the position is close to each other originally to effectively increased the interval between these two components and parts, and then avoided the emergence of welding accidental injury, that is to say, effectively improved the damage of welding operation to components and parts on circuit board 1. In addition, the flexible region 13 is arranged so that the first component mounting region 11 and the second component mounting region 12 can be stacked, thereby effectively avoiding the problem that the display device cannot be placed in the circuit board 1 when the flexible region 13 is in a flattened state.
Fig. 4 is a schematic structural view of a display device according to another embodiment of the present application.
In one embodiment of the present application, as shown in fig. 4, the first component arrangement area 11 is provided with the photosensitive component 5 toward the first surface 111 of the second component arrangement area 12, and the photosensitive component 5 is arranged at the periphery of the orthographic projection of the second component arrangement area 12 in the first component arrangement area 11.
Specifically, as shown in fig. 2b and fig. 4, when the position 112 on the first component arrangement area 11 not covered by the flexible region 13 and the second component arrangement area 12 is set as the photosensitive component 5, that is, the photosensitive component 5 is arranged at the periphery of the orthographic projection of the second component arrangement area 12 on the first component arrangement area 11, the photosensitive component 5 can effectively sense light because of no blocking.
Furthermore, the photosensitive component 5 is disposed at the position 112, which is not covered by the flexible region 13 and the second component setting region 12, on the first component setting region 11, compared with the photosensitive component 5 disposed at other positions, for example, the photosensitive component 5 is disposed on the surface of the first component setting region 11 away from the second component setting region 12, when the first component setting region 11 and the second component setting region 12 are in a stacked state, the thickness of the circuit board 1 can be effectively reduced, thereby facilitating the realization of ultra-thinning of the display device using the circuit board 1.
Fig. 5 is a schematic structural view of a display device according to still another embodiment of the present application.
In one embodiment of the present application, as shown in fig. 4 and 5, the display device may further include a display screen 6. The display screen 6 is arranged on one side of the second component arrangement area 12 far away from the first component arrangement area 11, and the near field communication coil 7 of the near field communication circuit is arranged in the second component arrangement area 12.
In particular, the near field communication coil 7 of the near field communication circuit may be disposed at a position close to the display screen 6, so that the near field communication coil 7 of the display device may operate sensitively when the display device is disposed close to near field communication.
It should be understood that fig. 5 may be a side view of fig. 4. When the photosensitive component 5 is not shielded by the flexible region 13 and the second component setting region 12, the photosensitive component 5 can sense light through the through hole on the display screen 6, thereby assisting in controlling the main circuit to control the brightness of the display screen 6.
Furthermore, as for the other components 9 disposed on the circuit board 1, the other components may be disposed on the surface of the first component disposition region 11 facing the second component disposition region 12, or the surface of the second component disposition region 12 facing the first component disposition region 11, thereby facilitating the realization of ultra-thinning of a display device to which the circuit board 1 is applied.
In one embodiment of the present application, as shown in fig. 5, the near field communication coil 7 may be disposed at the second component disposition area 12 facing the second surface 121 of the display screen 6, so that the near field communication coil 7 is closer to the display screen 6, thereby further improving the operation sensitivity of the near field communication coil 7.
In one embodiment of the present application, the near field communication coil 7 is integrally formed with the metal wiring of the second component disposition region 12.
In the embodiment of the present application, as shown in fig. 2B, in the connection direction (as shown in B in fig. 2B) between the first component arrangement region 11 and the second component arrangement region 12, when the size of the flexible region 13 is small and it is necessary to solder a component on the first component arrangement region 11, the soldering heat may still accidentally damage the component on the second component arrangement region 12. Similarly, when it is necessary to solder components on the second component arrangement region 12, the soldering heat may erroneously damage the components on the first component arrangement region 11. In such a case, the corresponding components may be integrally formed with the circuit board 1, i.e., in the process of manufacturing the circuit board 1, the preparation of the corresponding components is completed.
For example, when the near field communication coil 7 is disposed in the second component disposition area 12, the near field communication coil 7 is also patterned when the metal line of the second component disposition area 12 is patterned, so that the near field communication coil 7 and the metal line of the second component disposition area 12 can be integrally formed, thereby avoiding accidental damage to the components on the first component disposition area 11 due to welding of the near field communication coil 7.
Fig. 6 is a schematic configuration diagram of a display device according to still another embodiment of the present application.
In one embodiment of the present application, when the main control circuit of the display device is not integrated on the circuit board 1, as shown in fig. 6, the display device may further include a control main circuit board 8 disposed in the accommodating cavity 41, and the circuit board 1 is electrically connected to the control main circuit board 8, so as to realize the control of the circuit board 1 by the control main circuit board 8.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modifications, equivalents and the like that are within the spirit and principle of the present application should be included in the scope of the present application.
Claims (10)
1. A circuit board, comprising:
a first component arrangement region;
a second component arrangement region; and
a flexible region connecting the first component mounting region and the second component mounting region;
the first component setting region and the second component setting region are respectively connected with the flexible region in a seamless mode.
2. The circuit board according to claim 1, wherein when the flexible region is in a flattened state, in a direction perpendicular to a connection direction of the first component mounting region and the second component mounting region on a plane where the first component mounting region and the second component mounting region are located, a size of the flexible region is smaller than a size of the first component mounting region, and/or a size of the flexible region is smaller than a size of the second component mounting region.
3. The circuit board of claim 2, wherein when the flexible region is bent to make the first component mounting region and the second component mounting region in a stacked arrangement, an orthographic projection of the second component mounting region on the first component mounting region completely falls within the first component mounting region.
4. A circuit board according to any one of claims 1-3, characterized in that the first component arrangement region and/or the second component arrangement region comprise non-compliant sub-regions.
5. A display device, comprising:
a housing including a receiving cavity; and
the circuit board of claim 1 disposed within the receiving cavity;
the flexible region is in a bending state, and the first component setting region and the second component setting region are in a stacked state.
6. The display device according to claim 5, wherein a photosensitive element is provided on a first surface of the first component-disposing region facing the second component-disposing region;
the photosensitive component is arranged on the periphery of the orthographic projection of the second component arrangement area on the first component arrangement area.
7. The display device according to claim 5, further comprising a display screen;
the display screen is arranged on one side, far away from the first component arrangement area, of the second component arrangement area, and the near field communication coil of the near field communication circuit is arranged in the second component arrangement area.
8. The display device according to claim 7, wherein the near field communication coil is disposed on the second component disposition region facing the second surface of the display screen.
9. The display device according to claim 7, wherein the near field communication coil is integrally formed with the metal wiring of the second component mounting region.
10. The display device according to any one of claims 5 to 9, further comprising a control main circuit board disposed in the accommodation chamber;
the circuit board is electrically connected with the control main circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910880703.0A CN110602881A (en) | 2019-09-18 | 2019-09-18 | Circuit board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910880703.0A CN110602881A (en) | 2019-09-18 | 2019-09-18 | Circuit board and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110602881A true CN110602881A (en) | 2019-12-20 |
Family
ID=68860588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910880703.0A Pending CN110602881A (en) | 2019-09-18 | 2019-09-18 | Circuit board and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110602881A (en) |
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| CN113242643A (en) * | 2021-05-17 | 2021-08-10 | 京东方科技集团股份有限公司 | Circuit board and display device |
| CN113923863A (en) * | 2021-09-30 | 2022-01-11 | 京东方科技集团股份有限公司 | Flexible circuit device, display module and electronic device |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191220 |