KR20080089692A - Camera module - Google Patents

Abstract

A camera module is provided to remove the occurrence of noise and to commonly be used and standardized. A lens unit(120) includes a lens barrel(122). A holder(130) is combined with the lens unit and has a conductive material coated thereon. A PCB(Printed Circuit Board)(140) is combined with the holder and electrically connected with the conductive material. The conductive material is coated on the lens unit. The conductive material has conductivity of below 1ohm, and the combined portion is a conductive epoxy. The conductive material is coated on a lower surface of the lens unit and an upper surface of the holder, namely, the combined surfaces of the lens unit and the holder. A boss pin(133) is formed at a lower end of the holder, and the boss pin includes the conductive material coated thereon. The PCB includes a ground hole corresponding to the boss pin.

Description

Camera module {Camera module}

1 is a side cross-sectional view schematically showing a lens unit according to the embodiment.

2 is a side cross-sectional view schematically showing a holder according to the embodiment.

3 is a plan view of a printed circuit board according to an embodiment;

4 is a side cross-sectional view schematically showing a camera module according to the embodiment.

5 is an enlarged view of portion 'A' of FIG. 4.

In an embodiment, a camera module is disclosed.

Recently, with the development of communication technology and digital information processing technology, portable terminal technology in which various functions such as information processing and arithmetic, communication, image information input and output are integrated is emerging.

Examples include PDAs with digital cameras and communications, cell phones with digital cameras, and personal multi-media players (PMPs).

Also, due to the development of digital camera technology and information storage capability, mounting of high specification digital camera module is becoming more and more common.

Mobile devices such as mobile phones with a camera module generate electromagnetic interference (EMI) and radio frequency (RF) noise by the camera module, so that I / O loss of radio waves transmitted and received through the antenna This happens.

The EMI and RF noise are introduced into and emitted from devices such as an image sensor electrically connected to a printed circuit board, thereby affecting wireless sensitivity.

Therefore, even the same camera module influences the noise according to the position of the antenna.

For the above reasons, in order to minimize the influence of noise on the camera module when designing a mobile device, a redesign of the camera module or a redesign of the mobile device is required.

In addition, due to the application of a high-pixel camera module, various actuators are mounted, and as a result, an inductor component increases as a result of mounting an actuator driven by the interaction of a coil with a current flowing through a magnet, making it more vulnerable to EMI. It is a state.

The embodiment provides a camera module which prevents noise and enables common use and standardization of a camera module.

The camera module according to the embodiment includes a lens unit in which a lens barrel is formed; A holder coupled to the lens unit and coated with a conductive material; And a printed circuit board coupled to the holder and electrically connected to the conductive material.

Hereinafter, a camera module according to an embodiment will be described in detail with reference to the accompanying drawings.

1 is a side cross-sectional view schematically showing a lens unit, and FIG. 2 is a side cross-sectional view schematically showing a holder. 3 is a plan view of a printed circuit board, and FIG. 4 is a side cross-sectional view schematically illustrating a camera module.

The camera module according to the embodiment includes a lens unit, a holder, and a printed circuit board.

1 is a side cross-sectional view schematically showing a lens unit.

The lens unit 120 includes a lens barrel 122 including a lens 121 and an actuator 123 coupled to the lens barrel 122.

At least one lens 121 is coupled to the lens barrel 122, and the lens 121 collects light with the image sensor 141.

The actuator 123 is coupled to the lens barrel 122 and adjusts the focus by adjusting the position of the lens 121, so that the auto focus and optical zoom function can be implemented. As the actuator 123, a piezo-piezoelectric element, a stepping motor, a voice coil motor (VCM), or the like may be used.

In addition, a conductive paint 125 is coated on the outer circumferential surface of the lens unit 120 and the surface in contact with the holder 130, and the epoxy when the lens unit, the holder, and the printed circuit board are coupled to each other applies a conductive epoxy. . By applying the conductive paint 125 to the outer circumferential surface of the lens unit 120, electromagnetic waves generated from the actuator 123 does not affect the external device.

In addition, since electromagnetic waves generated by external devices do not affect the actuator 123, EMI and RF noise may be prevented. In addition, the conductive paint 125 is also applied to the surface in contact with the holder 130, thereby minimizing the impact on the image sensor 141 located below the holder 130 due to EMI and RF noise.

2 is a side cross-sectional view schematically showing the holder.

The holder 130 is positioned below the lens unit 120 and includes an IR (infrared ray) blocking filter 131. The holder 130 has an outer circumferential surface and a surface in contact with the lens unit 120. The conductive paint 125 is applied.

By applying the conductive paint 125 to the outer circumferential surface of the holder 130, EMI and RF noise due to electromagnetic waves generated by an external device and electromagnetic waves generated by the image sensor 141 can be prevented.

In addition, the conductive paint 125 is also applied to a surface where the lens unit 120 and the holder 130 are in contact, so that electromagnetic waves generated from the actuator 123 of the lens unit 120 are installed in the holder 130. Since noise does not flow into the device such as the image sensor 141, related noise may be prevented.

In addition, a boss pin 133 coated with the conductive paint 125 is formed at a lower end of the holder 130. The boss pin 133 is formed to be coupled to the ground hole 143 of the printed circuit board 140. The conductive paint 125 applies a conductive material of 1 ohm or less. In addition, two or more boss pins 133 may be formed.

3 is a plan view schematically illustrating a printed circuit board.

The printed circuit board 140 includes the image sensor 141, the ground hole 143, and the ground pattern 142 for converting an optical signal into an electrical signal. The ground pattern 142 is formed by removing a solder resist (not shown) applied on the printed circuit board 140. Solder resist is a material that coats the surface of the laminate to prevent lead from depositing on areas other than the soldering area. It also protects the circuit by preventing corrosion of the copper plate.

The ground hole 143 is formed corresponding to the boss pin 133 formed at the lower end of the holder 130, the boss pin 133 is inserted into the ground hole 143 is grounded.

Figure 4 is a side cross-sectional view schematically showing a camera module according to the embodiment, made of a combination of Figures 1-3.

The holder 130 illustrated in FIG. 2 is coupled to the bottom of the lens unit 120 illustrated in FIG. 1. The printed circuit board 140 shown in FIG. 3 is coupled to the bottom surface of the holder 130, so that the outer peripheral surfaces of the lens unit 120 and the holder 130 are covered with the conductive paint 125. In addition, the boss pin 133 formed at the lower end of the holder 130 is inserted into the ground hole 143 of the printed circuit board 140 so that the conductive paint 125 is covered with the lens unit 120. The outer circumferential surface of the holder 130 is grounded.

5 is an enlarged view of portion 'A' of FIG. 4.

The boss pin 133 formed at the bottom of the holder 130 is inserted into the ground hole 143 of the printed circuit board 140, the holder 130 and the printed circuit board 140 is Connected and grounded. The conductive paint 125 is applied to the outer surface of the camera module to be connected to the ground hole 143, thereby blocking various noises.

Although the above description has been made based on the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains may not have been exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

According to the camera module according to the embodiment, EMI and RF noise can be prevented by applying a conductive paint to the lens portion and the holder.

In addition, since the camera module is located anywhere in the communication device is not affected by electromagnetic waves, it is unnecessary to redesign the camera module due to noise, and provides a camera module that can be used and standardized.

Claims (12)

A lens unit in which a lens barrel is formed; A holder coupled to the lens unit and coated with a conductive material; And And a printed circuit board coupled to the holder and electrically connected to the conductive material. The method of claim 1, A camera module comprising a conductive material applied to the lens unit. The method according to claim 1 or 2, The conductive material has a conductivity of 1 ohm or less, and the portion to be bonded is a camera module comprising a conductive epoxy. The method according to claim 1 or 2, A camera module comprising a conductive material coated on the lower surface of the lens unit and the upper surface of the holder, which are coupling surfaces of the lens unit and the holder. The method according to claim 1 or 2, Camera module comprising a boss pin formed on the bottom of the holder. The method of claim 5, The boss pin is a camera module comprising a conductive material applied. The method of claim 5, The printed circuit board is a camera module comprising a ground hole corresponding to the boss pin is formed. The method of claim 5, The boss module is a camera module, characterized in that formed two or more. The method of claim 5, And the boss pin is coupled to the ground hole. The method of claim 1, The printed circuit board is formed with an image sensor and a ground pattern, And the conductive material is electrically connected to a ground pattern. The method of claim 1, The holder module camera comprises an IR blocking filter. The method according to claim 1 or 2, And the conductive material is applied to an outer circumferential surface of at least one of the lens unit and the holder.

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