KR101263954B1 - Camera module for reducing EMI ＆ RF noise - Google Patents

Abstract

The present invention relates to a camera module that reduces electromagnetic interference and wireless noise, and has a feature of coating a holder surface of a camera module with a conductive material and opening a solder resist in an outer area of a PCB substrate. To this end, the camera module of the present invention is a lens that receives the light of the image, the IR filter located on the image sensor to block the infrared rays from the outside, and the structure for holding the lens and the IR filter, the entire surface PCB to which the outer region is maintained in the ground state by removing the holder coated with a predetermined conductive material and the solder resist on the surface of the outer region, and mounting the lower end of the holder on the grounded outer region. A substrate is provided. In addition, the width of the outer region is formed to a thickness equal to the thickness of the lower end of the holder in contact with the PCB substrate, the holder has two or more boss pins coated with a conductive material at the bottom of the PCB board by the boss pin The holder is fixedly mounted.

Camera Module, Camera Phone, EMI, RF, Noise, PCB, Conductive, Ground, Holder

Description

Camera module reduces electromagnetic interference and wireless noise {Camera module for reducing EMI & RF noise}

1 is a cross-sectional view of a camera module according to an embodiment of the present invention.

2 is a plan view of the PCB substrate used in the camera module according to an embodiment of the present invention as seen from above.

3 is a perspective view illustrating a holder mounted on a PCB substrate according to an embodiment of the present invention.

Description of the Related Art [0002]

11: image sensor 13: holder

18: PCB 19a, 19b: boss pin

21: circuit pattern area 24: outer area

The present invention relates to a camera module that reduces electromagnetic interference and wireless noise.

In general, various mobile communication terminals such as cellular phones, CDMA phones, PDAs, and the like have a network transmission and multimedia functions of daily information. In that regard, as image transmission becomes popular, photography has become increasingly part of mobile communication terminals. Palm-size devices with built-in digital cameras, such as PDAs and cellular phones, have the advantage of taking pictures or transferring images at any time. Accordingly, the demand for a mobile communication terminal containing a camera module is greatly increasing.

On the other hand, at a general power frequency, the bioenergy is greatly affected, and heat is accompanied by microwaves in a mobile communication terminal or a microwave oven. X-rays or gamma rays, which are very high in frequency, have strong penetrability and can be fatal. Electromagnetic waves are a kind of electromagnetic energy generated from the flow of electricity and magnetism. In other words, when electricity flows, electric and magnetic fields are generated at the same time around them. In order to shield such electromagnetic interference (EMI), EMI is shielded by conductive inorganic materials, composites of organic materials and inorganic materials, magnetic shielding, and grounding.

Likewise, EMI and RF noise are the main problems in the camera module used in the current mobile communication terminal. Compared to the camera module which is being standardized and shared, the mobile communication terminal in which the camera module is mounted still depends on the design and the design of the developer. As a result, even the same camera module may have different EMI and RF noise depending on the type of mobile communication terminal.

These EMI and RF noises significantly reduce the wireless sensitivity, which affects the redesign of the camera module and the design of the mobile communication terminal. After all, in the current state of the camera module is exposed to EMI and RF noise as it is, the design of the camera module to suppress this situation is urgently required.

The present invention has been made to solve the above problems, it is an object of the present invention to propose a camera module structure for reducing the EMI and RF noise that can affect the operation of the camera module.

In order to achieve the above object, the camera module of the present invention, as a structure for holding the lens and the IR filter, the lens receiving the light of the image incident, the IR filter located on the image sensor to block the infrared rays from the outside, The holder is coated with a predetermined conductive material on its entire surface, and the solder resist on the surface of the outer area is removed so that the outer area remains in a ground state, and the lower end of the holder is placed on the outer area in the ground state. A PCB board mounted is provided.

In addition, the width of the outer region is formed to a thickness equal to the thickness of the lower end of the holder in contact with the PCB substrate, the holder has two or more boss pins coated with a conductive material at the bottom of the PCB board by the boss pin The holder is characterized in that the fixed mounting.

Hereinafter, the detailed description of the preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the reference numerals to the components of the drawings it should be noted that the same reference numerals as possible even if displayed on different drawings.

1 is a cross-sectional view of a camera module according to an embodiment of the present invention.

The PCB 13 has a holder 13 having an opening 17 for exposing the image sensor 11 to the upper surface of the substrate 18. The opening 17 is attached to the IR filter 12 to block the infrared rays from the outside in the form of a film. In addition, a connector (not shown in FIG. 1) for transmitting an optical signal generated by the image sensor 11 to the main board is connected to the PCB board 18.

The holder 13 near the edge of the opening 17 extends vertically upward, and the barrel 15 for fixing the lens 14 is fixed to the inner sidewall of the holder 13. The barrel 15 may be screwed as in FIG. 1 or may be straight without the screw.

 In the present invention, the surface of the holder 13 is coated with a conductive material so that the surface of the holder 13 remains conductive. However, in order to keep the conductive state of the surface of the holder 13 smoothly, the resistance of the surface should be 1 ohm or less. This is possible by applying a conductive paint having low resistance to the surface of the holder 15.

On the other hand, the holder 13 is located in the outer region (18a, 18b) of the PCB substrate 18, the outer region (18a, 18b) of the PCB substrate 18, unlike the conventional PCB substrate is formed of a circuit pattern Without the solder resist (solder resist) has a structure that is open (open). The solder resist is a coating part used to protect a specific area against etching solution, plating solution, soldering, etc. in the manufacturing and testing process by preventing the etching solution, plating solution, and lead from invading. Therefore, when the solder resist is removed (opened) from the outer regions 18a and 18b of the PCB substrate 18, the surface of the outer regions 18a and 18b on the PCB substrate 18 becomes the ground region and thus the conductivity of the holder. The paint is in contact with the underside.

Therefore, when the holder 13 having the surface coated with the conductive material is located in the outer regions 18a and 18b of the PCB substrate from which the solder resist is removed, the holder 13 is the outer region of the PCB substrate 18. 18a, 18b) are in contact with the surface and consequently conduct with the outer area of the PCB to maintain the ground state. As described above, the surface of the holder 13 maintains the ground state, thereby preventing EMI and RF noise.

On the other hand, the holder 13 is fixed to the PCB substrate 18 by the boss pins 19a, 19b at two points, and the lower surface of the holder 13 is an outer portion 18a, 18b) has a surface contact form. Therefore, the ground state of the holder 13 can be effectively maintained by this structure, which will be described with reference to FIGS. 2 and 3.

2 is a plan view of the PCB substrate used in the camera module according to an embodiment of the present invention as seen from above, and FIG. 3 is a perspective view showing a holder mounted on the PCB substrate according to an embodiment of the present invention.

Referring to FIGS. 2 and 3, various passive elements and circuit patterns are formed in the circuit pattern region 21 of the PCB substrate 18. An IR filter and a lens are formed on the PCB substrate 18. Is equipped with a holder 13 is mounted, the image sensor 11 for imaging the captured image is located at the center of the PCB substrate 18.

Unlike the conventional PCB, the PCB 18 is formed only in the circuit pattern region 21, which is an inner part of the holder, and the outer region 24 has solder resist without forming a circuit pattern. It has a structure that is removed (opened). The solder resist is a resist used for a portion that does not require plating, and is a coated portion used to protect a specific area against etching solution, plating solution, solder, etc. during the manufacturing and testing process. Therefore, the outer region 24 on the PCB substrate 18 from which the solder resist is removed (opened) is maintained in the ground state without forming any circuit pattern. The thickness 25 of the outer region of the PCB substrate has a width equal to the thickness of the lower end of the holder to open the solder resist.

As described above, the solder resist is removed with respect to the outer region 24 of the PCB, and the bottom surface of the holder 13 is positioned at the lower end of the holder 13 in the outer region 24. Surface contact is made with the outer region 24 of the PCB substrate 18 in a state.

On the other hand, in general, the holder 13 has a structure to support and fix the PCB using two boss pins (boss pin), in the present invention also has a structure using such a boss pin, as shown in Figure 1 The spin is in contact with the PCB substrate. The boss pins 19a and 19b serve as fixing pins that support the PCB substrate at two or more positions among four portions of the lower end of the holder, and do not have a separate pin but form two pins at the bottom of the holder 13. It has a structure integrated with the holder.

In the present invention, the boss pins 19a and 19b for fixing and holding the holder 13 are also integrated with the holder. In particular, the surface of the boss pins 19a and 19b, like the holder surface, is coated with a predetermined conductive material. It is characterized by. As described above, the boss pins 19a and 19b coated with the conductive material are fixedly supported on the PCB board, thereby contacting the boss pin 19a of the holder and the outer region 24 of the PCB board. The contact maintains the ground conduction state. Therefore, the boss pin in the present invention is characterized in that the ground.

As described above, by opening a solder resist on the outer region 24 of the PCB substrate, surface contact is possible, and thus the potential difference between the surface of the holder 13 and the outer region 24 of the PCB substrate is eliminated. Therefore, the surface of the holder 13 can effectively maintain the ground state such as the outer region 24 of the PCB substrate.

While the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Therefore, the patent scope of the present invention is not to be determined by the above-described embodiments, and it will be apparent that the claims are not limited to the claims as well as the equivalent scope.

As described above, the present invention has the effect of reducing EMI and RF noise on the camera module by coating the holder surface of the camera module with a conductive material and opening the solder resist in the outer region of the PCB. .

Claims (16)

A lens, IR filter which blocks infrared rays from the outside, A structure for holding and mounting the lens and the IR filter, the holder having an entire surface coated with a predetermined conductive material; PCB substrate which removes the solder resist on the surface of the outer region so that the outer region remains in the ground state and the lower end of the holder is in contact with the outer region in the ground state Camera module having a. The camera module of claim 1, wherein a width of the outer region is formed to a thickness equal to a thickness of a lower end of the holder in contact with the PCB substrate. The camera module of claim 1, wherein at least two boss pins coated with a conductive material at the bottom of the holder are integrated with the holder so that the holder is fixed to the PCB substrate by the boss pins. The camera module according to any one of claims 1 to 3, wherein the holder is grounded with the PCB substrate. delete lens; Image sensor; A printed circuit board on which the image sensor is mounted and an outer area thereof is grounded; and A holder supporting the lens and fixed to the printed circuit board; The holder is conductive to the surface of the camera module is the holder and the printed circuit board is grounded. The camera module of claim 6, wherein a perimeter of the outer area of the printed circuit board is grounded. The camera module of claim 6, wherein the printed circuit board ground region is formed by removing a solder resist on a surface of an outer region. delete The camera module of claim 6, wherein the holder surface is entirely conductive. The camera module of claim 6, further comprising a boss pin fixed to the printed circuit board on a lower surface of the holder. The camera module of claim 11, wherein the holder surface and the boss pin surface are conductive. The camera module of claim 11, wherein the boss pin is two or more. The camera module of claim 6, wherein a circuit pattern area and an image sensor are positioned inside an outer area of the printed circuit board. The camera module of claim 6, wherein the conductive treatment of the holder surface is performed by applying a conductive paint. The camera module of claim 14, wherein the circuit pattern area of the printed circuit board is solder resist.

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