CN104601869B - Camera module and its flexible circuit board - Google Patents
Camera module and its flexible circuit board Download PDFInfo
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- CN104601869B CN104601869B CN201510050579.7A CN201510050579A CN104601869B CN 104601869 B CN104601869 B CN 104601869B CN 201510050579 A CN201510050579 A CN 201510050579A CN 104601869 B CN104601869 B CN 104601869B
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- conductive layer
- hole
- circuit board
- flexible circuit
- layer
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Abstract
A kind of flexible circuit board includes the first solder mask layer and the first conductive layer, first solder mask layer has mounting surface and the back side, first conductive layer is set to the back side, the mounting surface of first solder mask layer offers the first through hole through mounting surface and the back side, to which the part for making the first conductive layer correspond to first through hole is exposed, the bottom of the bracket of camera module passes through first through hole and is fitted with the first conductive layer by viscose glue, therefore, it avoids bracket and is fitted with solder mask layer by viscose glue, because the first conductive layer deformation quantity after high temperature is less than the deformation quantity of solder mask, therefore lens module, which can be improved, installs the flatness to flexible circuit board.A kind of camera module of application flexible circuit board is provided simultaneously.
Description
Technical field
The present invention relates to camera technical fields, more particularly to a kind of camera module and its flexible circuit board.
Background technique
With the development of technology, the image quality of camera is pursued higher and higher.And high pixel large aperture camera lens can be with
Preferable image effect is obtained, therefore high pixel large aperture camera lens increasingly has become a hot topic of research.Large aperture camera lens is to gradient
Susceptibility it is higher, the flatness after it requires on lens module group assembling to flexible circuit board is higher.However, being taken the photograph in traditional
As in head mould group, bracket is arranged in the mounting surface of flexible circuit board, but the solder mask on the mounting surface of flexible circuit board
Deformation is easily caused after by high temperature causes the flatness of flexible circuit board to reduce.
Summary of the invention
Based on this, it is necessary to install in view of the above-mentioned problems, providing one kind and lens module can be improved to flexible circuit board
Flatness camera module and its flexible circuit board.
A kind of flexible circuit board, including：
First solder mask layer, with mounting surface and the back side being oppositely arranged with the mounting surface；And
First conductive layer is set to the back side of the first solder mask layer；
Wherein, the mounting surface offers first through hole, and the first through hole runs through the mounting surface and the back side, with
The part for making first conductive layer correspond to first through hole is exposed, bottom of the first through hole for the bracket of camera module
It passes through and the bottom of the bracket is made to fit with first conductive layer by viscose glue, the first through hole is along the mounting surface
The shape for overlooking visual angle is identical as the shape of the bottom of bracket.
Shape of the first through hole along the vertical view visual angle of the mounting surface is rectangular box in one of the embodiments,
Shape.
The second through-hole, the first through hole are also provided on the first solder mask layer in one of the embodiments,
It is surrounded on the outside of second through-hole, second through-hole runs through the mounting surface and the back side, so that described first is conductive
The part that layer corresponds to the second through-hole is exposed, and second through-hole passes through for the bottom of image inductor and makes the image inductor
Bottom fitted with first conductive layer by viscose glue.
Shape of second through-hole along the vertical view visual angle of the mounting surface is " mouth " word in one of the embodiments,
Shape.
Second through-hole is " returning " font along the vertical view visual angle shape of the mounting surface in one of the embodiments,.
It in one of the embodiments, further include the first high-temperature-resistant layer, the second conductive layer and base stacked gradually, it is described
Adhesive-layer is provided between first high-temperature-resistant layer and the second conductive layer, first high-temperature-resistant layer is set to first conductive layer
Surface far from the first solder mask layer, is provided with viscose glue between first high-temperature-resistant layer and first conductive layer
Layer.
It in one of the embodiments, further include that the third conductive layer stacked gradually, the second high-temperature-resistant layer and the 4th are conductive
Layer, it is provided with adhesive-layer between adjacent two layers, the third conductive layer is set to the base far from second conductive layer
Surface, the 4th conductive layer are additionally provided with the second solder mask layer far from the surface of second high-temperature-resistant layer.
First conductive layer, the second conductive layer, third conductive layer and the 4th conductive layer are equal in one of the embodiments,
For copper foil.
A kind of camera module, including：
Flexible circuit board as described in any of the above one；
Imaging sensor is set on the flexible circuit board, and described image sensor and flexible circuit board electricity
Connection；
Bracket is set on the flexible circuit board, and the bottom of the bracket passes through the first through hole and described the
One conductive layer is fitted by viscose glue；And
Lens module is arranged on the bracket.
The lens module includes voice coil motor and camera lens in one of the embodiments, and the lens assembling is in described
On voice coil motor；Or
The voice coil motor and the bracket are integrally formed；Or
The lens module includes support base and camera lens, and the lens assembling is on the support base.
Above-mentioned flexible circuit board has at least the following advantages：
The mounting surface of first solder mask layer offers the first through hole through mounting surface and the back side, to make the first conduction
The part that layer corresponds to first through hole is exposed, and the bottom of the bracket of camera module passes through first through hole and passes through with the first conductive layer
Viscose glue fits, and therefore, avoids bracket and is fitted with solder mask layer by viscose glue, because the first conductive layer is after high temperature
Deformation quantity is less than the deformation quantity of solder mask, therefore lens module can be improved and install the flatness to flexible circuit board.
For above-mentioned camera module because applying above-mentioned flexible circuit board, lens module is set to flexible circuit board
Afterwards, lens module can be improved, the flatness to flexible circuit board is installed, to improve the image quality of camera module.
Detailed description of the invention
Fig. 1 is the top view of flexible circuit board in an embodiment；
Fig. 2 is the cross-sectional view of the line A-A along Fig. 1；
Fig. 3 is the top view of flexible circuit board in another embodiment；
Fig. 4 is the top view of flexible circuit board in a further embodiment.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
Term as used herein "vertical", "horizontal", "left" and "right" and similar statement simply to illustrate that
Purpose, be not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Camera module in one embodiment includes flexible circuit board 100, imaging sensor, bracket and lens module.
Fig. 1 and Fig. 2 is please referred to, specific in present embodiment, flexible circuit board 100 includes the first solder mask layer stacked gradually
110, the first conductive layer 120, the first high-temperature-resistant layer 130, the second conductive layer 140, base 150, third conductive layer 160, second are resistance to
Heat zone 170, the 4th conductive layer 180 and the second solder mask layer 190.
The back side 112 that first solder mask layer 110 has mounting surface 111 and is oppositely arranged with mounting surface 111.First is conductive
Layer 120 is set to the back side 112 of the first solder mask layer 110.Wherein, first through hole 111a is offered on mounting surface 111, first
Through-hole 111a runs through mounting surface 111 and the back side 112, so that the first conductive layer 120 is exposed corresponding to the part of first through hole 111a.
First conductive layer 120 is usually copper foil.Certainly, the material of the first conductive layer 120 can also for other electric conductivity preferably, in high temperature
The lower lesser material of deflection.
Bracket is set on flexible circuit board 100, and lens module is set on bracket.Specifically, the bottom of bracket passes through
First through hole 111a is fitted with the first conductive layer 120 by viscose glue, and first through hole 111a is along the vertical view visual angle of mounting surface 111
Shape is identical as the shape of frame bottom.For example, shape of the first through hole 111a along the vertical view visual angle of mounting surface 111 can be square
Shape framework shape.Certainly, in other embodiments, first through hole 111a along mounting surface 111 vertical view visual angle shape also
It can be other shapes, such as annular, as long as guaranteeing first through hole 111a along the shape and bracket at the vertical view visual angle of mounting surface 111
The shape of bottom is identical.
Specific in present embodiment, lens module includes voice coil motor and camera lens, and lens assembling is on voice coil motor.Sound
Coil motor can be integrally formed with bracket, and certainly, voice coil motor can also be assembled on bracket by dismountable mode.When
So, in other embodiments, lens module includes support base and camera lens, and lens assembling is on support base.
Specific in present embodiment, the second through-hole is also provided on the mounting surface 111 of the first solder mask layer 110
111b, first through hole 111a are surrounded on the outside of the second through-hole 111b.Second through-hole 111b runs through mounting surface 111 and the back side 112,
So that the first conductive layer 120 is exposed corresponding to the part of the second through-hole 111b.Specific in present embodiment, the second through-hole 111b
Shape along the vertical view visual angle of mounting surface 111 is " mouth " font.
Imaging sensor is set on flexible circuit board 100, and imaging sensor is electrically connected with flexible circuit board 100.Tool
Body, the bottom of imaging sensor pass through the second through-hole 111b and first conductive layer 120 and are fitted flexible circuit board by viscose glue
100 mounting surface 111 is also provided with third through-hole 111c, and shape of the third through-hole 111c along the vertical view visual angle of mounting surface 111 can
Think rectangular box shape.Third through-hole 111c runs through mounting surface 111 and the back side 112, so that 120 part of the first conductive layer is revealed
Out.First conductive layer 120 forms weld pad, one end of gold thread by plating mode again corresponding to the exposed portion of third through-hole 111c
It is connected with weld pad, the other end is connected with imaging sensor, and realization imaging sensor is electrically connected with flexible circuit board.Image sensing
Device is set on the first conductive layer 120, and when by high temperature, the deflection of the first conductive layer 120 is smaller, therefore increases image biography
Sensor is assembled to the flatness after flexible circuit board.It is led moreover, the bottom of imaging sensor passes through the second through-hole 111b with first
Electric layer 120 is fitted by viscose glue, saves the height of solder mask layer, and there are increasing in the distance between imaging sensor top surface and camera lens
Big trend, in order to guarantee that the distance between imaging sensor top surface and camera lens are certain, can by reducing the height of bracket, from
And reduce the height of entire camera module.
Certainly, as shown in figure 3, in other embodiments, the second through-hole 111b is along the vertical view visual angle of mounting surface 111
Shape can also be " returning " font.Certainly, as shown in figure 4, in other embodiment, the second through-hole can not also be opened up
111b, and directly imaging sensor is set on the mounting surface 111 of the first solder mask layer 110.
First high-temperature-resistant layer 130, the second conductive layer 140 and base 150 are cascading, and the first high-temperature-resistant layer 130
It is provided with adhesive-layer 200 between the second conductive layer 140, is arranged between the first high-temperature-resistant layer 130 and first conductive layer 120
There is adhesive-layer 200, to increase the cohesive force between adjacent two layers.It is separate that first high-temperature-resistant layer 130 is set to the first conductive layer 120
The surface of first solder mask layer 110.The material of first high-temperature-resistant layer 130 can be polyimides (Polyimide, PI).When
So, in other embodiments, the material of the first high-temperature-resistant layer 130 can also be other materials resistant to high temperature.Second is conductive
Layer 140 can be copper foil.Certainly, the material of the second conductive layer 140 can also for other electric conductivity preferably, deflection at high temperature
Lesser material.
Third conductive layer 160, the second high-temperature-resistant layer 170 and the 4th conductive layer 180 stack gradually, and are arranged between adjacent two layers
There is adhesive-layer 200, to increase the cohesive force between adjacent two layers.Third conductive layer 160 is set to base 150 far from the second conduction
The surface of layer 140, the 4th conductive layer 180 are additionally provided with the second solder mask layer 190 far from the surface of the second high-temperature-resistant layer 170.
Third conductive layer 160 and the 4th conductive layer 180 can be copper foil.Certainly, the material of third conductive layer 160 and the 4th conductive layer 180
Matter can also for other electric conductivity preferably, the lesser material of deflection at high temperature.Second material resistant to high temperature can be polyamides
Imines (Polyimide, PI).Certainly, in other embodiments, the material of the second high-temperature-resistant layer 170 can also be other
Material resistant to high temperature.
Above-mentioned camera module and its flexible circuit board 100 have at least the following advantages：
The mounting surface 111 of first solder mask layer 110 offers the first through hole through mounting surface 111 and the back side 112
111a, to keep the first conductive layer 120 exposed corresponding to the part of first through hole 111a, the bottom of bracket passes through first through hole
111a is fitted with the first conductive layer 120 by viscose glue, therefore, is avoided bracket and is fitted with solder mask layer by viscose glue,
Because the first conductive layer 120 deformation quantity after high temperature is less than the deformation quantity of solder mask, lens module peace can be improved
Flatness after being filled to flexible circuit board 100.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of flexible circuit board, which is characterized in that including：
First solder mask layer, with mounting surface and the back side being oppositely arranged with the mounting surface；And
First conductive layer is set to the back side of the first solder mask layer；
Wherein, the mounting surface offers first through hole, and the first through hole runs through the mounting surface and the back side, so that institute
The part that the first conductive layer is stated corresponding to first through hole is exposed, and the first through hole is passed through for the bottom of the bracket of camera module
And the bottom of the bracket is made directly to fit by viscose glue with first conductive layer, the first through hole is along the mounting surface
The shape for overlooking visual angle is identical as the shape of the bottom of bracket.
2. flexible circuit board according to claim 1, which is characterized in that vertical view of the first through hole along the mounting surface
The shape at visual angle is rectangular box shape.
3. flexible circuit board according to claim 1, which is characterized in that be also provided on the first solder mask layer
Two through-holes, the first through hole are surrounded on the outside of second through-hole, and second through-hole runs through the mounting surface and the back
Face, so that the part that first conductive layer corresponds to the second through-hole is exposed, bottom of second through-hole for image inductor
It passes through and the bottom of the image inductor is made to fit with first conductive layer by viscose glue.
4. flexible circuit board according to claim 3, which is characterized in that vertical view of second through-hole along the mounting surface
The shape at visual angle is " mouth " font.
5. flexible circuit board according to claim 3, which is characterized in that vertical view of second through-hole along the mounting surface
Visual angle shape is " returning " font.
6. according to claim 1 to flexible circuit board described in 5 any one, which is characterized in that further include stacked gradually
One high-temperature-resistant layer, the second conductive layer and base are provided with adhesive-layer between first high-temperature-resistant layer and the second conductive layer, described
First high-temperature-resistant layer is set to surface of first conductive layer far from the first solder mask layer, first high-temperature-resistant layer
Adhesive-layer is provided between first conductive layer.
7. flexible circuit board according to claim 6, which is characterized in that further include the third conductive layer stacked gradually,
Two high-temperature-resistant layers and the 4th conductive layer are provided with adhesive-layer between adjacent two layers, and the third conductive layer is set to the base
Surface far from second conductive layer, the 4th conductive layer are additionally provided with second far from the surface of second high-temperature-resistant layer
Solder mask layer.
8. flexible circuit board according to claim 7, which is characterized in that first conductive layer, the second conductive layer, third
Conductive layer and the 4th conductive layer are copper foil.
9. a kind of camera module, which is characterized in that including：
Flexible circuit board as claimed in any of claims 1 to 8 in one of claims；
Imaging sensor is set on the flexible circuit board, and described image sensor is electrically connected with the flexible circuit board；
Bracket is set on the flexible circuit board, and the bottom of the bracket passes through the first through hole and leads with described first
Electric layer is fitted by viscose glue；And
Lens module is arranged on the bracket.
10. camera module according to claim 9, which is characterized in that the lens module includes voice coil motor and mirror
Head, the lens assembling is on the voice coil motor；Or
The voice coil motor and the bracket are integrally formed；Or
The lens module includes support base and camera lens, and the lens assembling is on the support base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510050579.7A CN104601869B (en) | 2015-01-30 | 2015-01-30 | Camera module and its flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510050579.7A CN104601869B (en) | 2015-01-30 | 2015-01-30 | Camera module and its flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104601869A CN104601869A (en) | 2015-05-06 |
| CN104601869B true CN104601869B (en) | 2018-11-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510050579.7A Expired - Fee Related CN104601869B (en) | 2015-01-30 | 2015-01-30 | Camera module and its flexible circuit board |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105142336A (en) * | 2015-09-01 | 2015-12-09 | 南昌欧菲光电技术有限公司 | Camera shooting module, printed circuit board and preparation method |
| CN107105144A (en) * | 2017-05-19 | 2017-08-29 | 信利光电股份有限公司 | A kind of CCM camera modules circuit board structure and CCM video cameras |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103389610A (en) * | 2013-07-24 | 2013-11-13 | 南昌欧菲光电技术有限公司 | Camera module, manufacturing method thereof and handheld communication device adopting camera module |
| CN203313286U (en) * | 2013-06-14 | 2013-11-27 | 南昌欧菲光电技术有限公司 | Camera assembly |
| CN103874320A (en) * | 2012-12-17 | 2014-06-18 | 纬创资通股份有限公司 | Circuit board and manufacturing method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4130668B2 (en) * | 2004-08-05 | 2008-08-06 | 富士通株式会社 | Substrate processing method |
| KR101263954B1 (en) * | 2006-08-22 | 2013-05-13 | 엘지이노텍 주식회사 | Camera module for reducing EMI ＆ RF noise |
| CN102238319A (en) * | 2010-04-26 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Image pickup device |
| KR101853827B1 (en) * | 2011-04-29 | 2018-05-02 | 엘지이노텍 주식회사 | Camera module |
| CN203365887U (en) * | 2013-07-24 | 2013-12-25 | 南昌欧菲光电技术有限公司 | Camera module group and hand-held communication apparatus employing same |
| CN203482483U (en) * | 2013-08-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Circuit board |
| CN203596976U (en) * | 2013-11-05 | 2014-05-14 | 南昌欧菲光电技术有限公司 | Circuit board and camera module group |
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2015
- 2015-01-30 CN CN201510050579.7A patent/CN104601869B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103874320A (en) * | 2012-12-17 | 2014-06-18 | 纬创资通股份有限公司 | Circuit board and manufacturing method thereof |
| CN203313286U (en) * | 2013-06-14 | 2013-11-27 | 南昌欧菲光电技术有限公司 | Camera assembly |
| CN103389610A (en) * | 2013-07-24 | 2013-11-13 | 南昌欧菲光电技术有限公司 | Camera module, manufacturing method thereof and handheld communication device adopting camera module |
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| CN104601869A (en) | 2015-05-06 |
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