CN203365887U - Camera module group and hand-held communication apparatus employing same - Google Patents
Camera module group and hand-held communication apparatus employing same Download PDFInfo
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- CN203365887U CN203365887U CN201320444109.5U CN201320444109U CN203365887U CN 203365887 U CN203365887 U CN 203365887U CN 201320444109 U CN201320444109 U CN 201320444109U CN 203365887 U CN203365887 U CN 203365887U
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Abstract
The utility model discloses a camera module group and a hand-held communication apparatus employing the same. The camera module comprises a base seat and a circuit board, wherein the base seat comprises a first opening end and a second opening end which is arranged opposite to the first opening end, and the circuit board is arranged at the second opening end in a covering manner; the circuit board comprises a base plate, an electric conduction layer and a solder mask layer which are orderly laminated; the solder mask layer and the electric conduction layer are smaller than or equal to the base plate in size, and each of the peripheries of the solder mask layer and the electric conduction layer is an interval apart from a corresponding periphery of the base plate; the second opening end and the base plate are made of thermoplastic materials, and the base plate is as same as or similar to the second opening end in material molecular structure; the wall thickness of the second opening end is smaller than the interval between the periphery of the base plate and each of the peripheries of the solder mask layer and the electric conduction layer. The second opening end is directly connected with the marginal area of the surface, opposite to the second opening end, of the base plate in welded manner through ultrasonic waves. The camera module group is small in inclination error and clan and convenient in manufacture.
Description
[technical field]
The utility model relates to a kind of image acquiring device, particularly relates to a kind of camera module and adopts the hand-hold communication device of this camera module.
[background technology]
In traditional technology, mobile phone camera module 10(CCM, cell-phone camera module) connection sheet material and base 11 between be all to be fixedly connected with by glue.As shown in Figure 1, connect sheet material and take double-sided PCB as example, the substrate 12a of double-sided PCB 12 is FR4 epoxy resin cloth laminated board, two-sidedly is coated with copper 12b, and surface coverage ink layer 12c(coverlay outside).Be coated with glue 13 between base 11 and ink layer 12c, to be fixedly connected with base 11 and circuit board 12.
Yet there is following defect in traditional camera module:
(1) because glue 13 is plastic masss, there is certain mobility, have a small amount of glue 13 after pressing base 11 and overflow, easily pollute the camera module, affect the shooting effect of camera module.
(2) there is certain thickness in glue 13 after drying up, and the glue amount applied there are differences, after adopting glue 13 firm bankings 11 and circuit board 12, base 11 is larger with respect to circuit board 12 droop errors, shooting effect to the camera module has a significant impact, particularly the camera module of high pixel.
(3), because the glue 13 adopted is generally all high-temp glue, need the high-temperature baking of long period that it is solidified.
[summary of the invention]
In view of above-mentioned condition, be necessary to provide a kind of droop error less, manufacture comparatively totally, camera module easily.
A kind of camera module, it comprises:
For the base of tubular structure, described base has the first openend and the second openend relative with described the first openend and that made by thermoplastics; And
Lid is located at the circuit board of described the second openend, described circuit board comprises substrate, conductive layer and the welding resisting layer be cascading, the periphery of described welding resisting layer overlaps with the periphery of described conductive layer, and the second openend of described welding resisting layer and described base is oppositely arranged; The size of described welding resisting layer and described conductive layer all is less than the size of described substrate, and the periphery of described welding resisting layer and described conductive layer and the respective peripheral of described substrate, all at a distance of a spacing, expose to outside described welding resisting layer and described conductive layer the fringe region on the surface that described substrate is relative with described base; Described substrate is thermoplastic plate, and the molecular structure of the material of described substrate is identical or close with the molecular structure of the material of described the second openend;
Wherein, the wall thickness of described the second openend is less than or equal to the spacing of the respective peripheral of the periphery of described welding resisting layer and described conductive layer and described substrate, and described the second openend directly the fringe region on the surface relative with described the second openend with described substrate by supersonic welding, be connected together.
Compared to traditional technology, above-mentioned camera module at least has the following advantages:
(1) above-mentioned camera module utilizes the material characteristic of the second openend of the substrate of circuit board and base, adopt ultrasonic soldering, the contact area of the substrate of the second openend of base and circuit board is fused together, and, without glue, avoid glue to spill into the inside of camera module and pollute eyeglass or imageing sensor.
(2) the second openend of the base of above-mentioned camera module directly welds with the zone that the substrate of circuit board exposes to conductive layer and welding resisting layer, can not be subject to the flatness impact of welding resisting layer and conductive layer, and can be because of highly not inhomogeneous after glue curing, to reduce the droop error of base with respect to circuit board, thereby improve the shooting effect of above-mentioned camera module.
(3) above-mentioned camera module adopts the second openend of ultrasonic soldering base and the substrate of circuit board, without adopting the glue bonding, avoids needing the high-temperature baking of long period, thereby makes the manufacture of above-mentioned camera module for convenience, simply.
Therein in embodiment, the wall thickness of described the second openend is less than the spacing of the respective peripheral of the periphery of described welding resisting layer and described conductive layer and described substrate.
In embodiment, the spacing between the periphery of described welding resisting layer and described conductive layer and the respective peripheral of described substrate is more than or equal to 0.35 millimeter therein, and the wall thickness of described the second openend is 0.25～0.30 millimeter.
In embodiment, described circuit board is double-sided PCB therein, and described conductive layer is two-layer, is located at respectively on opposing two surfaces of described substrate; Described welding resisting layer is two-layer, covers respectively described two conductive layers on the surface of described substrate, and wherein the described welding resisting layer of one deck and described the second openend are oppositely arranged, and the described welding resisting layer of one deck exposes to the described second openend outside in addition.
Therein in embodiment, the ring texture of the second openend of described base for being made by polycarbonate resin, acrylonitrile-butadiene-styrene resin or polymeric liquid crystal copolymer, described substrate corresponds to FR-4 epoxy resin cloth laminated board or polyimide pressing plate.
In embodiment, described conductive layer is the Copper Foil of being located on described substrate therein, and described welding resisting layer is the ink layer of being located on described conductive layer.
In embodiment, also comprise eyeglass and imageing sensor therein, described eyeglass is arranged in described the first openend, and described imageing sensor is arranged on described circuit board, and is electrically connected to described conductive layer; Described imageing sensor and described eyeglass be over against setting, and by described eyeglass photographic images.
Therein in embodiment, the end face of described the second openend is provided with ultrasound lines, described ultrasound lines is the raised structures around described the second openend ring-type of a week, and described the second openend directly welds together with the fringe region of described substrate by described ultrasound lines.
Therein in embodiment, described base comprises circular barrel and the putting part of rectangle, the opening of the bottom that described the second openend is described putting part, described barrel is communicated with the top of described putting part, described the first openend is the port of described barrel away from described putting part, described ultrasound lines is the rectangular ring structure, and the xsect of described ultrasound lines is V-arrangement, and the summit of described ultrasound lines is towards described substrate setting.
Simultaneously, the utility model also provides a kind of hand-hold communication device that adopts above-mentioned camera module.
A kind of hand-hold communication device, it comprises:
Have the housing of first surface and the second surface relative with described first surface, described first surface is provided with display window, and the fringe region that is positioned at described display window of described first surface or described second surface are provided with the shooting hole; And
Above-mentioned camera module, be arranged in described housing, and corresponding described shooting hole arranges.
[accompanying drawing explanation]
The structural representation that Fig. 1 is traditional camera module;
Structural representation before the base of the camera module that Fig. 2 is the utility model embodiment and the welding of the substrate of circuit board;
The enlarged drawing that Fig. 3 is the III part in Fig. 2;
Structural representation after the base that Fig. 4 is the camera module shown in Fig. 2 and the welding of the substrate of circuit board.
[embodiment]
For the ease of understanding the utility model, below with reference to relevant drawings, the utility model is described more fully.Provided preferred embodiment of the present utility model in accompanying drawing.But the utility model can be realized in many different forms, is not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the understanding of disclosure of the present utility model more comprehensively thorough.
It should be noted that, when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology that this paper is used are identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term used in instructions of the present utility model herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
Refer to Fig. 2, the camera module 100 of the utility model embodiment, comprise base 110, circuit board 120, eyeglass 130 and imageing sensor 140, base 110 is fixedly connected with circuit board 120, form a darkroom for accommodating imageing sensor 140, eyeglass 130 matches with imageing sensor 140, so that imageing sensor 140 obtains image.Above-mentioned camera module 100 can be mobile phone camera module (CCM, cell-phone camera module), notebook camera module, camera module etc., and in illustrated embodiment, the mobile phone camera module of take describes as example.
It should be noted that, the structure of base 110 is not limited to the mode of foregoing description, can be also the structure of other shapes, and for example, base 110 is the straight-tube shape structure.Base 110 structure that can be formed in one, also can be subassembly.
Wherein, the wall thickness D of the second openend 113 is less than or equal to the spacing L of the respective peripheral 121a of the periphery 123a of the periphery 125a of welding resisting layer 125 and conductive layer 123 and substrate 121, in present embodiment, the wall thickness D of the second openend 113 is less than the spacing L of the respective peripheral 121a of the periphery 123a of the periphery 125a of welding resisting layer 125 and conductive layer 123 and substrate 121, and the second openend 113 directly is connected together by supersonic welding with the fringe region on the surface relative with the second openend 113 of substrate 121.
See also Fig. 4, circuit board 120 can be single layer board 120, double-sided PCB 120 and multilayer circuit board 120 etc., and it all has substrate 121, conductive layer 123 and the welding resisting layer 125 be cascading.Specifically, in illustrated embodiment, circuit board 120 is double-sided PCB 120, and conductive layer 123 is two-layer, is located at respectively on opposing two surfaces of substrate 121.Welding resisting layer 125 is two-layer, covers respectively two conductive layers 123 on the surface of substrate 121, and wherein one deck welding resisting layer 125 and the second openend 113 are oppositely arranged, and one deck welding resisting layer 125 exposes to second openend 113 outsides of base 110 in addition.
Further, the material of the second openend 113 of base 110 is polycarbonate resin (PC, Polycarbonate), acrylonitrile-butadiene-styrene resin (ABS, Acrylonitrile Butadiene Styrene) and polymeric liquid crystal copolymer (LCP, Liquid Crystal Polymer) a kind of in, that is the ring texture that, the second openend 113 of base 110 is made by polycarbonate resin, acrylonitrile-butadiene-styrene resin or polymeric liquid crystal copolymer.Substrate 121 corresponds to FR-4 epoxy resin cloth laminated board or polyimide pressing plate (PI, Polyimide).Conductive layer 123 is for being located at the Copper Foil on substrate 121.Welding resisting layer 125 is for being located at the ink layer on conductive layer 123.
It should be noted that, " ring texture " herein is not limited to " circular ring structure ", also can straight-flanked ring, elliptical ring etc.
Further, the spacing L between the respective peripheral 121a of the periphery 125a of welding resisting layer 125 and the periphery 123a of conductive layer 123 and substrate 121 is more than or equal to 0.35 millimeter, and the wall thickness D of the second openend 113 is 0.25～0.30 millimeter.
See also Fig. 3, further, the end face of the second openend 113 of base 110 is provided with ultrasound lines 113a, the second openend 113 by ultrasound lines 113a directly and the fringe region of substrate 121 weld together.Preferably, ultrasound lines 113a is the raised structures around the second openend ring-type of 113 1 weeks of base 110.Specifically in the illustrated embodiment, the second openend 113 is rectangle, and ultrasound lines 113a is the rectangular ring structure.Because the end face of the second openend 113 of base 110 is provided with ultrasound lines 113a, can make concentration of energy on ultrasound lines 113a, correspondingly, dissolve each other Main Function on ultrasound lines 113a, can avoid the ultrasonic soldering energy inhomogeneous, to reduce the droop error of base 110 with respect to circuit board 120.
Further, the xsect of ultrasound lines 113a can be V-arrangement, and the summit of ultrasound lines 113a arranges towards substrate 121.Because the xsect of ultrasound lines 113a is V-arrangement, it was line with the substrate 121 of circuit board 120 and contacts before melting, so that ultrasonic soldering, and after welding, sealing is better, and weld also comparatively evenly, reduced the droop error of base 110 with respect to circuit board 120.
Certainly, in the utility model, the xsect of ultrasound lines 113a can be also other shapes, for example, semicircle, semicircle is oval, isosceles trapezoid etc.
Simultaneously, the utility model also provides a kind of manufacture method of above-mentioned camera module 100.The manufacture method of this camera module 100 comprises step a and step b.
Step a, be placed on base 110 on circuit board 120, and ultrasound lines 113a and substrate 121 are exposed to the corresponding butt of fringe region of welding resisting layer 125 and conductive layer 123.Preferably, ultrasound lines 113a is the second openend ring texture of 113 1 weeks around base 110, and for example, ultrasound lines 113a is the rectangular ring structure, and the fringe region that substrate 121 exposes to welding resisting layer 125 and conductive layer 123 also corresponds to rectangular ring.
Further, the xsect of ultrasound lines 113a can be V-arrangement, and the summit of ultrasound lines 113a arranges towards substrate 121.Because the xsect of ultrasound lines 113a is V-arrangement, it was line style with the substrate 121 of circuit board 120 and contacts before melting, so that ultrasonic soldering, and after welding, sealing is better, and weld also comparatively evenly, reduced the droop error of base 110 with respect to circuit board 120.
Step b, adopt ultrasound wave to be irradiated with the position that substrate 121 connects ultrasound lines 113a, and compress base 110 and circuit board 120 simultaneously, makes to be fixedly connected with base 110 and circuit board 120 after ultrasound lines 113a melting.
When ul-trasonic irradiation during in thermoplastic plastics surface of contact, the dither that meeting generation per second is several ten thousand times, this dither that reaches certain amplitude, by upper weldment, ultrasonic energy is sent to welding zone, because interface place (contact area of the ultrasound lines 113a of the second openend 113 of base 110 and the substrate 121 of the circuit board 120) acoustic resistance of i.e. two welding of welding zone is large, therefore can produce localized hyperthermia.Due to the plastics poor thermal conductivity, can't distribute in time for the moment again, be gathered in welding zone, cause the surface of contact of two working of plastics (the second openend 113 of base 110, the substrate 121 of circuit board 120) to melt rapidly, after adding certain pressure, it is fused into one.After ultrasound wave fails, allow pressure continue several seconds, make its coagulation forming, so just form a firm strand, reach the purpose of welding, weld strength can be close to starting material intensity.
Compared to traditional technology, above-mentioned camera module 100 at least has the following advantages:
(1) above-mentioned camera module 100 utilizes the material characteristic of substrate 121 with second openend 113 of base 110 of circuit board 120, adopt ultrasonic soldering, the second openend 113 of base 110 is fused together with the contact area of the substrate 121 of circuit board 120, and, without glue, avoid glue to spill into the inside of camera module 100 and pollute eyeglass 130 or imageing sensor 140.
(2) the second openend 113 of the base 110 of above-mentioned camera module 100 directly welds with the fringe region that the substrate 121 of circuit board 120 exposes to conductive layer 123 and welding resisting layer 125, can not be subject to the flatness impact of welding resisting layer 125 and conductive layer 123, and can be because of highly not inhomogeneous after glue curing, to reduce the droop error of base 110 with respect to circuit board 120, thereby improve the shooting effect of above-mentioned camera module 100.
(3) above-mentioned camera module 100 adopts the second openend 113 of ultrasonic soldering base 110 and the substrate 121 of circuit board 120, without adopting the glue bonding, avoid needing the high-temperature baking of long period, thereby make above-mentioned camera module 100 manufactures for convenience, simply.
In addition, the utility model also provides a kind of hand-hold communication device, and this hand-hold communication device can be the electronic installations such as mobile phone, panel computer, and it comprises housing (not shown) and above-mentioned camera module 100.
Housing has first surface and the second surface relative with first surface, and first surface is provided with display window, and the fringe region that is positioned at display window of first surface or second surface are provided with takes hole.Camera module 100 is arranged in housing, and the corresponding hole of taking arranges.For example, for mobile phone, the shooting hole corresponding with preposition camera module 100 is positioned at the display window top of the fore shell of mobile phone, and the shooting hole corresponding with rearmounted camera module 100 is positioned on the back cover of mobile phone.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (10)
1. a camera module, is characterized in that, comprising:
For the base of tubular structure, described base has the first openend and the second openend relative with described the first openend and that made by thermoplastics; And
Lid is located at the circuit board of described the second openend, described circuit board comprises substrate, conductive layer and the welding resisting layer be cascading, the periphery of described welding resisting layer overlaps with the periphery of described conductive layer, and the second openend of described welding resisting layer and described base is oppositely arranged; The size of described welding resisting layer and described conductive layer all is less than the size of described substrate, and the periphery of described welding resisting layer and described conductive layer and the respective peripheral of described substrate, all at a distance of a spacing, expose to outside described welding resisting layer and described conductive layer the fringe region on the surface that described substrate is relative with described base; Described substrate is thermoplastic plate, and the molecular structure of the material of described substrate is identical or close with the molecular structure of the material of described the second openend;
Wherein, the wall thickness of described the second openend is less than or equal to the spacing of the respective peripheral of the periphery of described welding resisting layer and described conductive layer and described substrate, and described the second openend directly the fringe region on the surface relative with described the second openend with described substrate by supersonic welding, be connected together.
2. camera module as claimed in claim 1, is characterized in that, the wall thickness of described the second openend is less than the spacing of the respective peripheral of the periphery of described welding resisting layer and described conductive layer and described substrate.
3. camera module as claimed in claim 2, is characterized in that, the spacing between the periphery of described welding resisting layer and described conductive layer and the respective peripheral of described substrate is more than or equal to 0.35 millimeter, and the wall thickness of described the second openend is 0.25～0.30 millimeter.
4. camera module as claimed in claim 1, is characterized in that, described circuit board is double-sided PCB, and described conductive layer is two-layer, is located at respectively on opposing two surfaces of described substrate; Described welding resisting layer is two-layer, covers respectively described two conductive layers on the surface of described substrate, and wherein the described welding resisting layer of one deck and described the second openend are oppositely arranged, and the described welding resisting layer of one deck exposes to the described second openend outside in addition.
5. camera module as claimed in claim 4, it is characterized in that, the ring texture of the second openend of described base for making in polycarbonate resin, acrylonitrile-butadiene-styrene resin or polymeric liquid crystal copolymer, described substrate corresponds to FR-4 epoxy resin cloth laminated board or polyimide pressing plate.
6. camera module as claimed in claim 4, is characterized in that, described conductive layer is the Copper Foil of being located on described substrate, and described welding resisting layer is the ink layer of being located on described conductive layer.
7. camera module as claimed in claim 1, is characterized in that, also comprises eyeglass and imageing sensor, and described eyeglass is arranged in described the first openend, and described imageing sensor is arranged on described circuit board, and be electrically connected to described conductive layer; Described imageing sensor and described eyeglass be over against setting, and by described eyeglass photographic images.
8. camera module as described as claim 1～7 any one, it is characterized in that, the end face of described the second openend is provided with ultrasound lines, described ultrasound lines is the raised structures around described the second openend ring-type of a week, and described the second openend directly welds together with the fringe region of described substrate by described ultrasound lines.
9. camera module as claimed in claim 8, it is characterized in that, described base comprises circular barrel and the putting part of rectangle, the opening of the bottom that described the second openend is described putting part, described barrel is communicated with the top of described putting part, and described the first openend is the port of described barrel away from described putting part, and described ultrasound lines is the rectangular ring structure, the xsect of described ultrasound lines is V-arrangement, and the summit of described ultrasound lines is towards described substrate setting.
10. a hand-hold communication device, is characterized in that, comprising:
Have the housing of first surface and the second surface relative with described first surface, described first surface is provided with display window, and the fringe region that is positioned at described display window of described first surface or described second surface are provided with the shooting hole; And
Camera module as described as claim 1～9 any one, be arranged in described housing, and corresponding described shooting hole arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320444109.5U CN203365887U (en) | 2013-07-24 | 2013-07-24 | Camera module group and hand-held communication apparatus employing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320444109.5U CN203365887U (en) | 2013-07-24 | 2013-07-24 | Camera module group and hand-held communication apparatus employing same |
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| Publication Number | Publication Date |
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| CN203365887U true CN203365887U (en) | 2013-12-25 |
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| CN201320444109.5U Expired - Fee Related CN203365887U (en) | 2013-07-24 | 2013-07-24 | Camera module group and hand-held communication apparatus employing same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103389610A (en) * | 2013-07-24 | 2013-11-13 | 南昌欧菲光电技术有限公司 | Camera module, manufacturing method thereof and handheld communication device adopting camera module |
| CN104601869A (en) * | 2015-01-30 | 2015-05-06 | 南昌欧菲光电技术有限公司 | Camera die set and flexible circuit board |
| CN109192707A (en) * | 2018-09-07 | 2019-01-11 | 昆山丘钛微电子科技有限公司 | Optical chip mould group and preparation method thereof |
| CN111665640A (en) * | 2019-03-08 | 2020-09-15 | 三赢科技（深圳）有限公司 | Structured light projection module and electronic device thereof |
-
2013
- 2013-07-24 CN CN201320444109.5U patent/CN203365887U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103389610A (en) * | 2013-07-24 | 2013-11-13 | 南昌欧菲光电技术有限公司 | Camera module, manufacturing method thereof and handheld communication device adopting camera module |
| CN103389610B (en) * | 2013-07-24 | 2016-04-13 | 南昌欧菲光电技术有限公司 | Camera module and manufacture method thereof, adopt the hand-hold communication device of this camera module |
| CN104601869A (en) * | 2015-01-30 | 2015-05-06 | 南昌欧菲光电技术有限公司 | Camera die set and flexible circuit board |
| CN109192707A (en) * | 2018-09-07 | 2019-01-11 | 昆山丘钛微电子科技有限公司 | Optical chip mould group and preparation method thereof |
| CN111665640A (en) * | 2019-03-08 | 2020-09-15 | 三赢科技（深圳）有限公司 | Structured light projection module and electronic device thereof |
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