CN109194852A - Camera module and electronic device - Google Patents

Camera module and electronic device Download PDF

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Publication number
CN109194852A
CN109194852A CN201811015783.5A CN201811015783A CN109194852A CN 109194852 A CN109194852 A CN 109194852A CN 201811015783 A CN201811015783 A CN 201811015783A CN 109194852 A CN109194852 A CN 109194852A
Authority
CN
China
Prior art keywords
pedestal
camera module
electronic
imaging sensor
optical filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811015783.5A
Other languages
Chinese (zh)
Inventor
薛兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201811015783.5A priority Critical patent/CN109194852A/en
Publication of CN109194852A publication Critical patent/CN109194852A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • H04N5/2253Mounting of pick-up device, electronic image sensor, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/225Television cameras ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
    • H04N5/2251Constructional details
    • H04N5/2254Mounting of optical parts, e.g. lenses, shutters, filters or optical parts peculiar to the presence or use of an electronic image sensor

Abstract

The embodiment of the present application discloses a kind of camera module, including camera lens, pedestal, optical filter and imaging sensor, pedestal is circuit board, pedestal has loophole, optical filter and imaging sensor are individually fixed in the side of pedestal, imaging sensor is electrically connected to pedestal, and imaging sensor receives the light signal for successively penetrating optical filter and loophole.Circuit board by being provided for the pedestal of fixed optical filter and imaging sensor by camera module provided by the embodiments of the present application and electronic device, so that the pedestal can not only carry out the transmission of electric signal with imaging sensor, it can also be as the bracket of optical filter and imaging sensor, one object two is used, save the composition of the device of camera module, so as to reduce the size of camera module, that is the small volume of the camera module of the structure, required space is smaller when being assemblied in electronic device, conducive to the layout of electronic device other devices.In addition, the embodiment of the present application also provides a kind of electronic devices.

Description

Camera module and electronic device
Technical field
This application involves technical field of electronic device, and in particular to a kind of camera module and electronic device.
Background technique
With the development of science and technology with the demand in market, the function that electronic equipment is realized is more and more, electronic equipment internal Space is more and more compacter, and in other words, the difficulty of the device arrangement of electronic equipment internal is higher and higher.And camera shooting in the prior art Head mould group makes the size of camera module larger since the element of composition is more, occupies the length-width direction of electronic equipment Biggish position influences the arrangement of other devices in electronic equipment.
Summary of the invention
The embodiment of the present application provides a kind of electronic device and drive control method.
In a first aspect, the embodiment of the present application provides a kind of camera module, including camera lens, pedestal, optical filter and image pass Sensor, the pedestal are circuit board, and the pedestal has loophole, and the optical filter and described image sensor are individually fixed in The side of the pedestal, described image sensor are electrically connected to the pedestal, and described image sensor receives successively through described The light signal of optical filter and the loophole.
Second aspect, the embodiment of the present application provide a kind of electronic device, including camera module.
Camera module provided by the embodiments of the present application and electronic device are by being provided for fixed optical filtering for circuit board The pedestal of piece and imaging sensor, so that the pedestal can not only carry out the transmission of electric signal with imaging sensor, additionally it is possible to make For the bracket of optical filter and imaging sensor, an object two is used, and the composition of the device of camera module is saved, so as to reduce The size of camera module, the i.e. small volume of the camera module of the structure, required space when being assemblied in electronic device It is smaller, conducive to the layout of electronic device other devices.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of application for those of ordinary skill in the art without creative efforts, can be with It obtains other drawings based on these drawings.
Fig. 1 is a kind of schematic diagram of electronic device provided by the embodiments of the present application;
Fig. 2 is the schematic diagram of the camera module of the electronic device in Fig. 1;
Fig. 3 is the schematic diagram of the camera module in another embodiment;
Fig. 4 is the schematic diagram of the camera module in another embodiment;
Fig. 5 is the schematic diagram of the V part of the electronic device in Fig. 1;
Fig. 6 is the schematic diagram of the Section VI part of the electronic device in Fig. 1.
Specific embodiment
In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present application Attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is only Some embodiments of the present application, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art Every other embodiment obtained without creative efforts, shall fall in the protection scope of this application.
Term " X-direction ", " Y-direction " in the description and claims of this application and above-mentioned attached drawing, etc. be to be used for Different directions are distinguished, rather than for describing specific direction.
Fig. 1 is please referred to, a kind of electronic device 100 is shown, which can be any electronic equipment, plate The smart machines such as computer, mobile phone, camera, personal computer, laptop, mobile unit, wearable device.Wherein, it is Convenient for description, Fig. 1 is please referred to, be in the visual angle with electronic device 100 is that reference is defined, the width of electronic device 100 Direction definition is X to the length direction of electronic device 100 is defined as Y-direction.The electronic device 100 has camera module 10.This In embodiment, front camera of the camera module 10 as electronic device 100 is set to the front of electronic device 100.Its In, the front of electronic device 100 is the display surface of electronic device 100.In other embodiments, camera module 10 can be used as The rear camera of electronic device 100 is set to the back side of electronic device 100.Wherein, the back side of electronic device 100 is electronics The non-display face of device 100.
Please with reference to Fig. 2, it is shown a kind of camera module 10, camera module 10 includes camera lens 1, pedestal 2, filters Piece 3 and imaging sensor 4, the pedestal 2 have loophole 21, and the optical filter 3 and described image sensor 4 are individually fixed in The side of the pedestal 2, described image sensor 4 are electrically connected to the pedestal 2, and the reception of described image sensor 4 successively penetrates The light signal 5 of the optical filter 3 and the loophole 21.
The course of work of camera module 10 are as follows: the eyeglass in camera lens 1 has the transmission of light signal 5, and the light signal 5 is successively Loophole 21 through optical filter 3 and pedestal 2 is transmitted on imaging sensor 4, and imaging sensor 4 is by incident 5 turns of light signal It is changed to electric signal, and light signal 5 is transmitted on the pedestal 2 i.e. circuit board being connected electrically, to realize camera module 10 shooting function.
By the way that circuit board to be provided for the pedestal 2 of fixed optical filter 3 and imaging sensor 4, so that the pedestal 2 is not only The transmission of electric signal can be carried out with imaging sensor 4, additionally it is possible to as the bracket of optical filter 3 and imaging sensor 4, an object two With saving the composition of the device of camera module 10, so as to reducing the size of camera module 10, i.e. the structure is taken the photograph As the small volume of head mould group 10, required space is smaller when being assemblied in electronic device 100, and it is other to be conducive to electronic device 100 The layout of device.
In one embodiment, the pedestal 2 is circuit board, substantially H-shaped.Pedestal 2 have the first side 22, second side 23 and in The loophole 21 of the first opening 211 and the second opening 212 is respectively formed on first side 22 and in second side 23.The first of pedestal 2 The edge of side 22 is mutually fixed with camera lens 1 by optics gum, to realize fixing assembling of the camera lens 1 in camera module 10. Second side 23 of pedestal 2 with other devices for fixing, for example, one end of flexible circuit board 6 can be fixed and be electrically connected to bottom Second side 23 of seat 2, the other end of flexible circuit board 6 can be electrically connected with the main circuit board in electronic device 100, be taken the photograph with realizing As the transmission of the electric signal of the main circuit board in head mould group 10 and electronic device 100.
It should be understood that hollow out forms the inner wall 24 of the pedestal 2 on the pedestal 2, the inner wall 24 encloses the region connect For the loophole 21, the inner wall 24 has the first wall section 241 and is convexly equipped in the second wall section 242 of the first wall section 241, The optical filter 3 and described image sensor 4 are individually fixed in the side of the second wall section 242.Specifically, inner wall 24 is rank Scalariform.The side of second wall section 242 is substantially the first side 22 of pedestal 2, and optical filter 3 is fixed on the first side 22 by optics gum On, and optical filter 3 covers the first opening 211 of loophole 21, enables the light for being incident to optical filter 3 all by filtering The optical filtering of piece 3 is enclosed in the region connect in the second wall section 242 again to be transmitted.The other side of second wall section 242 and imaging sensor 4 It is fixed, and imaging sensor 4 covers the third opening 213 of loophole 21, so that the light after filtering through optical filter 3 can It all arrives on imaging sensor 4, in other words, imaging sensor 4 can receive the light enclosed in the region connect in the second wall section 242 Line signal 5, and electric signal is converted by the light signal 5, it is further transmitted on the pedestal 2 of electrical connection.The inner wall of the structure 24 connect imaging sensor 4 along the Y direction with pedestal 2, compared with the existing technology in circuit board and pedestal 2 between in X The technical solution that direction is connected by wire saves camera module 10 while X-direction size, also because no longer needing to set It sets more brackets and saves the size of camera module 10 in the Y direction, provide a kind of smaller camera module of volume 10.Certainly, in other embodiments, as shown in figure 3, loophole 21 can also be clear opening, optical filter 3 and imaging sensor 4 It is individually fixed on the first side 22 and second side 23 of pedestal 2.
It should be understood that described image sensor 4, which is contained in the first wall section 241, encloses the region connect.In the present embodiment, The region that first wall section 241 is surrounded then can be used in accommodating imaging sensor 4, and in other words, described image sensor 4 is contained in institute It states the first wall section 241 and encloses the region connect, avoid being damaged because imaging sensor 4 is located at the outside of pedestal 2.And image sensing Device 4 is located at the inside of pedestal 2, further reduces the size of camera module 10 in the Y direction, to reduce due to image sensing Device 4 and pedestal 2 being fixedly connected with relationship and making the increased size in the Y direction of camera module 10 along the Y direction, guarantee camera shooting The size of head mould group 10 not only in an X direction is smaller, and size in the Y direction is also smaller.And make the Y-direction of camera module 10 Size is larger.Certainly, in other embodiments, as shown in figure 4, imaging sensor 4 can also part stretching pedestal 2.
It should be understood that the first pad 25 is respectively set in the pedestal 2 and described image sensor 4 please with reference to Fig. 5 With the second pad 41, conduct piece 7 is connected between first pad 25 and second pad 41.In the present embodiment, first Wall section 241, which is located on the side of the inside of pedestal 2, is equipped with first pad of circle 25, corresponding, image around third opening 213 Sensor 4 is also equipped with second pad of circle 41, and the second pad 41 and the first pad 25 of imaging sensor 4 align, conductive Between the first pad 25 and the second pad 41, realization pedestal 2 is electrically connected part 7 with imaging sensor 4.In the present embodiment, Conduct piece 7 is the conducting sphere of metal material.Wherein it is possible to which conduct piece 7 is welded on the second pad 41.Specifically, to conduction Part 7 and the second pad 41 carry out ultrasonic Welding, the detailed process of the ultrasound Welding are as follows: to conduct piece 7 and the second pad 41 While ultrasonic Wave heating is carried out, the contact surface of conduct piece 7 and the second pad 41 has plastic deformation, and the oxygen of the two phase-contact surface Changing film can be destroyed, and activate phase-contact surface, in other words, two metal of phase-contact surface meeting phase counterdiffusion, thus by conduct piece 7 It is fixed on the second pad 41.The modular imaging sensor 4 (abbreviation image conduction mould group) for being provided with conduct piece 7 can be with Further realize fixation and the electricity of pedestal 2 and image conduction mould group with the technique of ultrasonic bond with the first pad 25 on pedestal 2 again Connection.Pedestal 2 not only realizes the reliability that is electrically connected of the pedestal 2 with imaging sensor 4 by conducting sphere with imaging sensor 4, Also the reliability being fixedly connected of pedestal 2 along the Y direction with imaging sensor 4 is further ensured.Certainly, in other embodiments In, conduct piece 7 can with the metalwork of form of springs, if can be realized pedestal 2 and imaging sensor 4 realize simultaneously it is fixed and The relationship of electrical connection.
Further, referring to figure 2., the camera module 10 further includes flexible circuit board 6 and conductive film 8, described soft Property circuit board 6 is sticked through conductive film 8 and is electrically connected on the side of the pedestal 2, and the flexible circuit board 6 is close to the figure As sensor 4.In the present embodiment, flexible circuit board 6 is fixed in second side 23 of pedestal 2 by conductive film 8.The present embodiment In, conductive film 8 is anisotropic conductive film (Anisotropic Conductive Film, ACF).Please with reference to Fig. 6, bottom It is equipped with third pad 26 in second side 23 of seat 2, the 4th pad 61 is equipped on flexible circuit board 6, therebetween sets conductive film 8 Flexible circuit board 6 is placed in pedestal 2 on pedestal 2, and with the relative positional relationship of the 4th pad 61 alignment third pad 26 After in second side 23, makes the metal ion between conductive film 8 damaged by temperature, time, pressure, realize 61 He of the 4th pad In other words the conducting of third pad 26 realizes the electric connection of flexible circuit board 6 and pedestal 2.Meanwhile conductive film 8 can harden and So that flexible circuit board 6 is with pedestal 2 except the position at pad is mutually fixedly connected.
The electronic device 100 of camera module 10 provided by the embodiments of the present application and the application camera module 10 is clapped According to process are as follows: it is incident that light signal 5 successively encloses the region that connects through camera lens 1, optical filter 3 and the first wall section 241, until by image Sensor 4 receives, and the light signal 5 of receiving is converted to electric signal and be transferred to and fixed and be electrically connected with itself by imaging sensor 4 On the pedestal 2 connect, telecommunications is further transmitted on the mainboard in electronic device 100 by pedestal 2 through flexible circuit board 6, real The camera function of existing camera module 10.
Camera module 10 provided by the embodiments of the present application and electronic device 100 are by the way that circuit board to be provided for fixing The pedestal 2 of optical filter 3 and imaging sensor 4, so that the pedestal 2 can not only carry out the transmission of electric signal with imaging sensor 4, It can also be used as the bracket of optical filter 3 and imaging sensor 4, an object two, save the composition of the device of camera module 10, So as to reduce the size of camera module 10, the i.e. small volume of the camera module 10 of the structure, it is assemblied in electronics dress Required space is smaller when setting in 100, conducive to the layout of 100 other devices of electronic device.
The embodiment of the present application is described in detail above, specific case used herein to the principle of the application and Embodiment is expounded, the description of the example is only used to help understand the method for the present application and its core ideas; At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the application There is change place, in conclusion the contents of this specification should not be construed as limiting the present application.

Claims (10)

1. a kind of camera module, which is characterized in that including camera lens, pedestal, optical filter and imaging sensor, the pedestal is electricity Road plate, the pedestal have loophole, and the optical filter and described image sensor are individually fixed in the side of the pedestal, institute It states imaging sensor and is electrically connected to the pedestal, described image sensor, which receives, successively penetrates the optical filter and the loophole Light signal.
2. camera module according to claim 1, which is characterized in that the pedestal and described image sensor are set respectively The first pad and the second pad are set, is connected with conduct piece between first pad and second pad.
3. camera module according to claim 2, which is characterized in that first pad and second pad are opposite It is quasi-.
4. camera module according to claim 3, which is characterized in that the conduct piece is conducting sphere.
5. camera module according to any one of claims 1 to 4, which is characterized in that hollow out is formed on the pedestal The inner wall of the pedestal, it is the loophole that the inner wall, which encloses the region connect, and the inner wall has the first wall section and is convexly equipped in institute The second wall section of the first wall section is stated, the optical filter and described image sensor are individually fixed in the side of the second wall section.
6. camera module according to claim 5, which is characterized in that described image sensor is contained in first wall Section encloses the region connect.
7. camera module according to claim 6, which is characterized in that the anti-dazzling screen covers opening for the loophole Mouthful.
8. camera module according to claim 7, which is characterized in that described image sensor covers the loophole Another opening.
9. camera module according to any one of claims 1 to 4, which is characterized in that the camera module is also wrapped Flexible circuit board and conductive film are included, the flexible circuit board is sticked through conductive film and is electrically connected on the side of the pedestal, and The flexible circuit board is close to described image sensor.
10. a kind of electronic device, which is characterized in that including camera module described in claim 1 to 9 any one.
CN201811015783.5A 2018-08-31 2018-08-31 Camera module and electronic device Pending CN109194852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811015783.5A CN109194852A (en) 2018-08-31 2018-08-31 Camera module and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811015783.5A CN109194852A (en) 2018-08-31 2018-08-31 Camera module and electronic device

Publications (1)

Publication Number Publication Date
CN109194852A true CN109194852A (en) 2019-01-11

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Application Number Title Priority Date Filing Date
CN201811015783.5A Pending CN109194852A (en) 2018-08-31 2018-08-31 Camera module and electronic device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110243798A (en) * 2019-07-19 2019-09-17 江南大学 Chlorophyll fluorescence instrument
WO2021196221A1 (en) * 2020-04-03 2021-10-07 南昌欧菲光电技术有限公司 Photosensitive assembly, camera module and electronic device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120079049A (en) * 2012-06-19 2012-07-11 엘지이노텍 주식회사 Camera module and method for manufacturing thereof
CN103973943A (en) * 2013-01-31 2014-08-06 鸿富锦精密工业(深圳)有限公司 Double-camera module
CN108055444A (en) * 2018-01-11 2018-05-18 维沃移动通信有限公司 A kind of camera module and mobile terminal

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120079049A (en) * 2012-06-19 2012-07-11 엘지이노텍 주식회사 Camera module and method for manufacturing thereof
CN103973943A (en) * 2013-01-31 2014-08-06 鸿富锦精密工业(深圳)有限公司 Double-camera module
CN108055444A (en) * 2018-01-11 2018-05-18 维沃移动通信有限公司 A kind of camera module and mobile terminal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110243798A (en) * 2019-07-19 2019-09-17 江南大学 Chlorophyll fluorescence instrument
WO2021196221A1 (en) * 2020-04-03 2021-10-07 南昌欧菲光电技术有限公司 Photosensitive assembly, camera module and electronic device

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Application publication date: 20190111

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