TWM616139U - Rigid-flex board lens module - Google Patents

Abstract

A flexible and hard combined board lens module, including a flexible and hard combined board unit, with two rigid circuit boards and a flexible circuit board combined between the two rigid circuit boards, a photosensitive element and a lens are arranged on the flexible circuit board Above, there are two gaps between the lens and the two rigid circuit boards to respectively fill a gap glue, thereby strengthening and strengthening the two joints between the flexible circuit board and the two rigid circuit boards, and after the gap glue is cured The flexible and hard combined board lens module is made into an integrated structure.

Description

Rigid-flex board lens module

This creation is related to a lens field, especially a soft and hard board lens module.

Camera lenses are important functional components of electronic products such as mobile phones, tablets, and notebooks. With the rapid development of this consumer industry, it has also driven the high growth of the camera industry. Especially in the thinning of these electronic products, the size of the camera lens installed in the electronic product needs to be thinner. There are three packaging methods for traditional camera lens modules: 1. CSP (Chip Scale Package) method, 2. COB (Chip On Board) method, and 3. Flip Chip method. The advantage of CSP packaging is that the packaging section is completed by the front-end process, and the CSP packaging chip is covered by glass, which requires low cleanliness. The yield rate is also good, the cost of the process equipment is low, and the process time is short. The challenge is that the light penetration rate is not good, the price is more expensive, the height is high, and the backlight penetrating ghost phenomenon. Due to the complexity of the process and the high cost of the Flip Chip process, it is difficult for general companies to adopt this process. COB packaging relies on the advantages of better image quality, lower packaging cost, and lower module height. In addition, brand manufacturers gradually require module manufacturers to assemble and ship with COB processes. In the future, COB processes will become camera modules. A trend in the development of group manufacturing processes. There are two FPCB bonding processes in the post process of COB packaging process, namely: 1. Hot Bar (hot pressing of solder paste), 2. ACF (hot pressing of anisotropic conductive adhesive) / ACP (hot pressing of anisotropic conductive paste) ). Because of its low reliability, Hot Bar has basically been adopted by no one at present; while ACF/ACP requires additional equipment to be purchased, which causes the cost to rise sharply. In addition, traditional packaging technologies such as wafer-level packaging processes are directly assembled according to the set tolerance parameters. As the number of superimposed components increases, the final fit tolerance becomes larger and larger. The final image shooting effect is compared with the ordinary COB process. There are no advantages and features in the thickness of the module. The final lens installation also has no obvious features. With more camera lens parts, the packaging yield is lower and the overall thickness also increases. Therefore, how to make the overall thickness of the camera lens thinner and improve the yield rate is the difference between the creator of this project and the industry engaged in this industry. The relevant manufacturers urgently want to study the direction of improvement.

In order to improve the above-mentioned problems, one purpose of this creation is to provide a thin and integrated rigid-flex-board lens module. In order to achieve the above-mentioned purpose, this creation provides a flexible and hard combined board lens module, including: a flexible and hard combined board unit with two rigid circuit boards and a flexible circuit board, the flexible circuit board is located between the two rigid circuit boards And combined with the two rigid circuit boards, and the flexible circuit board defines a second thickness that is smaller than a first thickness defined by each rigid circuit board; a photosensitive element is attached to the flexible circuit board and the flexible circuit board Electrically connected; a lens, aligned with the photosensitive element and fixed on the flexible circuit board, there are two gaps between the lens and the two rigid circuit boards filled with a gap glue, and the flexible circuit is reinforced by the gap glue The two joints between the board and the two rigid circuit boards. A filter element is covered on the aforementioned photosensitive element. The aforementioned lens is located in a photosensitive path of the photosensitive element, and the photosensitive element is located between the lens and the filter element. The aforementioned flexible circuit board and the two rigid circuit boards are combined together by a joining method without connectors or soldering. The aforementioned flexible circuit board and the photosensitive element are electrically connected together by a plurality of conductive wires. Each of the aforementioned rigid circuit boards is covered by a casing, the gaps are located between the lens and the casing, and the gap glue is filled between the lens and the casing. The aforementioned rigid circuit board has an inscribed edge adjacent to the flexible circuit board, the lens has two outer edges spaced apart from the inscribed edges of the adjacent rigid circuit boards, and the gaps are respectively located on two outer sides of the lens Between the edge and the inscribed edge of the two rigid circuit boards. Each of the aforementioned housings has an inner housing wall that is aligned with the inscribed edge of the rigid circuit board, and is spaced apart from the two outer sides of the lens. The gap glue is respectively filled on the inner housing wall of the housing and the lens. Between the outside edges. The aforementioned gap glue is a curing glue. The aforementioned flexible circuit board constitutes a recessed area.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings. In this creation, unless otherwise clearly specified and limited, the terms "set", "installation", "connected", "connected", "fixed" and other terms should be understood in a broad sense. For example, it can be a fixed connection or a fixed connection. It is a detachable connection; it can be a mechanical connection; it can be directly connected or indirectly connected through an intermediate medium. For those with general knowledge in the technical field, they can understand the specific meaning of the above terms in this creation according to the specific situation. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, the meaning of "plurality" and "plurality" means two or more, unless otherwise specifically defined. Figures 1A-1C are the exploded schematic diagram of the creation and its partial enlarged schematic diagram; Figures 2A-2C are the combined schematic diagram of the creative and its partial enlarged schematic diagram. As shown in the figure, the rigid-flex board lens module 10 of the present creation includes a rigid-flex PCB unit 11 as a component carrier. The rigid-flex PCB unit 11 is a combination of two or two The above-mentioned rigid circuit board is a printed circuit board in which the circuit is connected through the flexible part. In this embodiment, the rigid-flex board unit 11 has two rigid circuit boards (PCB) 111 and a flexible circuit board (FPC) 112, and the flexible circuit board 112 is located between the two rigid circuit boards 111. The flexible circuit board 112 and the two rigid circuit boards 111 are joined together without a connector or welding. For example, holes are drilled in advance for the flexible circuit board 112 and the two rigid circuit boards 111 to be connected to the circuit layer , After bonding through precise positioning and positioning, use the conductive plated through holes between the layers to connect the circuits. The rigid circuit board 111 defines a first thickness H1, and the flexible circuit board 112 defines a second thickness H2 that is smaller than the first thickness H1. The difference in thickness between the two makes the flexible circuit board 112 opposite to the rigid circuit board 111. A recessed area A (as shown in Figure 1C). Two shells 116 respectively cover the rigid circuit board 111. The shell 116 is, for example, a metal (iron) shell or a plastic shell, which can be used to shield the electronic components on the rigid circuit board 111. The casing 116 both protects the electronic components on the rigid circuit board 111 and shields the electromagnetic waves generated by these electronic components, and prevents these electromagnetic waves from interfering with the operation of the photosensitive element 113 described later. Each rigid circuit board 111 has an inscribed edge 1111 adjacent to the flexible circuit board 112, and each housing 116 has an inner shell wall 1161 that is aligned with the inscribed edge 1111 of the rigid circuit board. A photosensitive element 113 is attached to the flexible circuit board 112 and electrically connected to the flexible circuit board 112. The photosensitive element 113 is covered with a filter element 114. The photosensitive element 113 is, for example, a CCD or CMOS. The filter element 114 For example, an infrared filter (IR Cut Filter) is used to filter out infrared rays and retain the colors visible to the naked eye. In one implementation, the flexible circuit board 112 is provided with a plurality of electrical (or metal) contacts 1121, and the photosensitive element 113 has a plurality of conductive wires (or electrical pins) 1131 corresponding to the electrical contacts electrically connected to the flexible circuit board 112. Point 1121. A lens 115 is aligned with the photosensitive element 113 and fixed on the flexible circuit board 112, the lens 115 is located in a photosensitive path of the photosensitive element 113, and the filter element 114 is located between the lens 115 and the photosensitive element 113. There are two gaps 118 between the lens 115 and the two rigid circuit boards 111 and the two housings 116 to fill a gap glue 117 respectively. The gap glue 117 is, for example, but not limited to, a curing glue that can be transformed from a liquid state to a solid state, and has strong adhesion and fast curing speed. In one implementation, the gap glue 117 uses UV curing glue. In detail, the lens 115 has two outer edges 1151 that are respectively spaced apart from the inscribed edges 1111 of the adjacent rigid circuit boards 111 and the inner shell walls 1161 of the housings 116. The two gaps 118 are respectively located in the lens 115 Between the two outer edges 1151 of the two rigid circuit boards 111 and the inscribed edges 1111 of the two rigid circuit boards 111 and the inner shell walls 1161 of the two shells 116. The gap glue 117 in the two gaps 118 not only fills up the two outer edges 1151 of the lens 115 and the inscribed edges 1111 of the two rigid circuit boards 111, but also fills the two outer edges 1151 of the lens 115. Between the inner shell walls 1161 of the two shells 116. In this way, the gap glues 117 can reinforce the joint between the flexible circuit board 112 and the two rigid circuit boards 111. In addition, the cured gap glue 117 makes the flexible and hard board lens module 10 of the present invention an integrated structure. In this creation, the lens 115, the photosensitive element 113, and the filter 114 are arranged on the flexible circuit board 112 with a relatively thin thickness, so that the thickness of the overall rigid-flex board lens module can be reduced to achieve the purpose of thinning. Furthermore, the joint between the flexible circuit board 112 and the two rigid circuit boards 111 is reinforced by the gap glue 117, so that the rigid-flex board lens module 10 becomes an integrated structure. This creation has been described in detail above, but what is described above is only a preferred embodiment of this creation, and should not limit the scope of implementation of this creation. That is to say, all equal changes and modifications made in accordance with the scope of the application for this creation shall still fall within the scope of the patent for this creation.

10: Soft and hard board lens module 11: Rigid and flexible board unit 111: rigid circuit board 1111: Inscribed edge 112: Flexible circuit board 1121: Electrical contact 113: photosensitive element 1131: conductive thread 114: filter element 115: lens 1151: Outer side 116: shell 1161: inner shell wall 117: Gap glue 118: Gap A: Recessed area H1: The first thickness H2: second thickness

Figures 1A-1C are an exploded schematic diagram of the creation and a partial enlarged schematic diagram; Figures 2A-2C are the combined schematic diagram of the creation and its partial enlarged schematic diagram.

10: Soft and hard board lens module

11: Rigid and flexible board unit

111: rigid circuit board

1111: Inscribed edge

112: Flexible circuit board

1121: Electrical contact

113: photosensitive element

1131: conductive thread

114: filter element

115: lens

1151: Outer side

116: shell

1161: inner shell wall

117: Gap glue

A: Recessed area

Claims (10)

A soft-hard combined board lens module, including: A rigid-flex board unit having two rigid circuit boards and a flexible circuit board, the flexible circuit board is located between the two rigid circuit boards and is combined with the two rigid circuit boards, and the flexible circuit board defines a second thickness Less than a first thickness defined by each rigid circuit board; A photosensitive element attached to the flexible circuit board and electrically connected to the flexible circuit board; A lens is aligned with the photosensitive element and fixed on the flexible circuit board. There are two gaps between the lens and the two rigid circuit boards filled with a gap glue, and the flexible circuit board and the two are reinforced by the gap glue. Two joints between rigid circuit boards. The rigid-flex board lens module according to claim 1, wherein the photosensitive element is covered with a filter element. The rigid-flex board lens module according to claim 2, wherein the lens is located in a photosensitive path of the photosensitive element, and the photosensitive element is located between the lens and the filter element. The rigid-flex board lens module according to claim 1, wherein the flexible circuit board and the two rigid circuit boards are combined by a bonding method without connectors or soldering. The rigid-flex board lens module according to claim 1, wherein the photosensitive element has a plurality of conductive wires electrically connected to the flexible circuit board. The rigid-flex board lens module according to claim 1, wherein each rigid circuit board is covered by a housing, the gaps are located between the lens and the housing, and the gap glue is filled in the lens and the housing. Between the shells. The rigid-flex board lens module according to claim 6, wherein each rigid circuit board has an inscribed edge adjacent to the flexible circuit board, and the lens has two outer edges spaced apart from adjacent inner rigid circuit boards. Connecting edges, and the gaps are respectively located between the two outer edges of the lens and the inner connecting edges of the two rigid circuit boards. The rigid-flex board lens module according to claim 7, wherein each shell has an inner shell wall that is aligned with the inner edge of the rigid circuit board, and is spaced apart from the two outer edges of the lens. The gap glue is respectively filled between the inner wall of the casing and the outer edge of the lens. The rigid-flex board lens module according to claim 1, wherein the gap glue is a curing glue. The rigid-flex board lens module according to claim 1, wherein the flexible circuit board forms a recessed area.

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