JP2007324521A - Multilayer substrate with built-in electronic components and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily replace or change the quantity of built-in electronic components. <P>SOLUTION: A multilayer substrate 26 with built-in electronic components consists of a first printed circuit board 40, a second printed circuit board 42 and an ACF 44. A countersunk hole 46 is formed in a first facing surface 40a of the first printed circuit board 40. A DSP 34 is provided in the countersunk hole 46. First contact terminals 48 are also provided in the countersunk hole 46. Second contact terminals 50 are provided on a second facing surface 42a of the second printed circuit board 42. The printed circuit boards 40 and 42 are thermocompression bonded to each other with the ACF 44 sandwiched therebetween so as to join the printed circuit boards 40 and 42 to each other and to electrically connect the first contact terminals 48 to the second contact terminals 50. Since the printed circuit boards 40 and 42 are joined to each other with the ACF 44 sandwiched therebetween, reheating can separate the printed circuit boards 40 and 42 from each other to expose the countersunk hole 46, thereby making possible to easily replace or change the quantity of the built-in DSP 34. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multilayer electronic component built-in substrate that incorporates an electronic component such as an IC chip, and an electronic device having this substrate.

  A mobile electronic device such as a mobile phone or a digital camera incorporates a printed circuit board on which various electronic components such as an IC chip are mounted. With the miniaturization and high functionality of electronic devices, printed circuit boards are required to be miniaturized and high-density mounting of electronic components. At this time, there is a limit to performing high-density mounting of electronic components while downsizing the printed circuit board. Therefore, in recent years, a multilayer electronic component built-in substrate is often used.

Multi-layer electronic component built-in boards are created by creating multiple printed circuit boards (electronic parts built-in boards) in which electronic parts are embedded in a resin layer, and then stacking these electronic parts built-in boards to electrically connect each board. (See Patent Documents 1 and 2). As described above, in the multilayer electronic component built-in substrate, since the electronic components that have been surface-mounted so far can be built in the substrate, the mounting density can be made higher than in the past. Conversely, if the number of electronic components mounted is the same, the area of the substrate can be made smaller than before, so that the substrate can be reduced in size.
Japanese Patent Laid-Open No. 2001-53413 (see pages 7, 8 and 6) Japanese Unexamined Patent Publication No. 2004-31476 (refer to pages 3 and 4 and FIG. 1)

  By the way, in the multilayer electronic component built-in substrate described in Patent Documents 1 and 2, the electronic component is embedded in the resin layer of each printed circuit board (electronic component built-in substrate). For this reason, when the specification of the electronic device is changed, it is not possible to replace the electronic component embedded in the resin layer or increase or decrease the number of electronic components built in the substrate. Therefore, the multilayer electronic component built-in substrate in which the specification change has occurred may be discarded, and many of the substrate and the electronic component are wasted. In addition, when the built-in electronic component fails, the replacement of the component cannot be easily performed.

  Moreover, the multilayer electronic component built-in substrate described in Patent Documents 1 and 2 cannot be manufactured using an existing printed circuit board production line because the manufacturing method is different from that of a normal printed circuit board. As a result, it is necessary to newly establish a production line, which causes extra costs.

  The present invention is for solving the above-described problems, and is a multilayer in which electronic components are built in, and the built-in electronic components can be easily replaced or the number of the built-in electronic components can be changed according to a change in the specifications of the electronic equipment. It is an object of the present invention to provide an electronic component built-in substrate and an electronic apparatus having the substrate.

  The present invention relates to a multilayer electronic component built-in substrate in which electronic components are disposed inside a substrate laminate in which a plurality of printed substrates are laminated, and the first and second printed substrates facing each other in the substrate laminate. A pair of connection terminals provided on both opposing surfaces, each of which is formed of an anisotropic conductive material, facing each tip, and disposed between the first and second printed circuit boards. An anisotropic conductive structure that electrically connects the pair of connection terminals by having a pressurizing portion sandwiched and pressed by the connection terminals having conductivity only in a direction substantially parallel to the stacking direction of the substrate laminate. And a member.

  A component mounting hole that is recessed by one step from the periphery is formed in one or both of the opposing surfaces of the first and second printed circuit boards, and the electronic component, and the electronic component in the component mounting hole, and It is preferable that a first connection terminal which is one of the pair of connection terminals is provided, and a second connection terminal which is the other of the pair of connection terminals is disposed at a position facing the component mounting hole.

  One of the first and second printed circuit boards is a flexible printed circuit board, and the other is a rigid printed circuit board, and the flexible printed circuit board extends continuously from a facing surface facing the rigid printed circuit board. It is preferable that the extended portion is provided with a connection terminal connected to another printed circuit board.

  It is preferable that the first and second printed circuit boards are formed in different shapes, and only a part of them is opposed to each other. The printed circuit board facing the component mounting hole and the anisotropic conductive member have mounting through holes formed in accordance with the position and shape of the component mounting hole. It is preferable that a part of the electronic component mounted in the hole pass through the mounting through hole.

  The substrate laminate includes a flexible printed circuit board which is a third printed circuit board different from the first and second printed circuit boards, and one of the first and second printed circuit boards includes a third printed circuit board. The flexible printed circuit board is provided with a fourth connection terminal at one end thereof, the fourth connection terminal is opposed to the third connection terminal, and the flexible printed circuit board is By being sandwiched between one of the first and second printed circuit boards and the anisotropic conductive member, the third and fourth connection terminals sandwich and pressurize the anisotropic conductive member. It is preferable that the third and fourth connection terminals are electrically connected via a pressure portion.

  The first and second printed circuit boards are formed with first and second electronic circuits including at least one or more electronic components, respectively, on both opposing surfaces of the first and second printed circuit boards. A pair of conductor posts electrically connected to the first and second electronic circuits are provided at positions facing each other, and when the first and second printed circuit boards are separated, It is possible to inspect the operation of the first and second electronic circuits individually by connecting to an inspection device via a conductor post, and the first and second printed circuit boards are connected via the anisotropic conductive member. Preferably, the first and second electronic circuits are electrically connected to form one product circuit.

  An information sheet on which various types of information are recorded is sandwiched between one of the first and second printed circuit boards and the anisotropic conductive member, and one of the printed circuit boards and the information sheet are joined together. A difference between the bonding force to be bonded and the bonding force to bond the anisotropic conductive member and the information sheet, when one of the printed circuit boards and the anisotropic conductive member are peeled, It is preferable that the information sheet is selectively attached to one of the printed circuit boards or the anisotropic conductive member.

  One of the first and second printed circuit boards has an electronic component mounted on a surface opposite to the anisotropic conductive member, and the printed circuit board on which the electronic component is mounted and the anisotropic conductive member A heat-dissipating through hole that is slightly smaller than the outer shape of the electronic component is formed in accordance with the position of the electronic component, and the other of the first and second printed circuit boards faces the electronic component. It is preferable that a heat radiating member extending is provided, and this heat radiating member is inserted through the heat radiating through hole and is in contact with the electronic component.

  The printed circuit board provided with the heat radiating member has a heat radiating member fitting hole which is one step concave from the periphery of the surface facing the heat radiating through hole, and the heat radiating member fitting hole has the heat radiating member fitted in the heat radiating member fitting hole. It is preferable that the members are fitted and fixed. The printed circuit board provided with the heat radiating member has a heat radiating member through hole penetrating from the surface facing the heat radiating through hole to the opposite surface, and the heat radiating member through hole has the heat radiating member through the heat radiating member. It is preferable that the members are fitted and fixed.

  Moreover, it is preferable that the electronic device of this invention has a multilayer electronic component built-in board of any one of Claims 1 thru | or 11.

  The multilayer electronic component-embedded substrate of the present invention is provided on both opposing surfaces of a substrate laminate in which a plurality of printed boards are laminated and the first and second printed boards facing each other in the substrate laminate, respectively. A pressurizing portion that is sandwiched and disposed between the pair of connection terminals facing each other and the first and second printed circuit boards and sandwiched and pressed by the pair of connection terminals has conductivity. Since the anisotropic conductive member that electrically connects the pair of connection terminals is provided, the first and second printed circuit boards can be separated as necessary. Thereby, when the specification change of the electronic device in which the multilayer electronic component built-in substrate is incorporated occurs, it is possible to easily replace or change the number of the built-in electronic components. Furthermore, even when a defect in the built-in electronic component is found, the built-in electronic component can be easily replaced in the same manner, so that the repairability is improved.

  In addition, when manufacturing a multilayer electronic component built-in board, it is only necessary to join a normal rigid printed board or flexible printed board via an anisotropic conductive member, so an existing printed board manufacturing line or electronic component mounting line can be used. Can be used to manufacture a multilayer electronic component built-in substrate. As a result, there is no need to establish a new line.

  Moreover, the thickness of the multilayer electronic component built-in substrate can be reduced by using one of the first and second printed boards as a flexible printed board and the other as a rigid printed board. Moreover, by providing an extension part in the flexible printed circuit board and providing a connection terminal at the tip of the extension part, it is possible to connect to another printed circuit board or the like without providing a connector or the like. As a result, the manufacturing cost of the substrate can be reduced.

  In addition, since it is possible to manufacture a multilayer electronic component built-in board having a complex shape by joining printed boards of simple shapes, the number obtained from one collective printed board (original board) is increased. Can do. Therefore, the manufacturing cost of the substrate can be reduced as compared with the conventional case.

  Further, a component mounting hole that is one step concave from the surrounding is formed in one or both of the opposing surfaces of the first and second printed circuit boards, and the electronic component, and the electronic component in the component mounting hole, and Since one of the pair of connection terminals is provided and a through hole for mounting is formed in the printed circuit board facing the component mounting hole and the anisotropic conductive member, a tall electronic component is incorporated. In particular, the thickness (total thickness) including the electronic components of the multilayer electronic component built-in substrate can be suppressed.

  Also, since the flexible printed circuit board, which is the third printed circuit board, is sandwiched between one of the first and second printed circuit boards and the anisotropic conductive member, A connector for connection is unnecessary. As a result, the electronic component mountable area can be increased, so that more electronic components can be mounted.

  In addition, a pair of conductor posts are provided on both opposing surfaces of the first and second printed boards, and the conductor posts are used for inspection when the printed boards are separated, and one product circuit is used when the printed boards are joined. Since they are configured, it is possible to inspect whether or not the electronic components mounted individually function correctly before joining the two printed circuit boards. Further, the structure of the inspection device can be simplified as compared with the conventional case where the inspection is performed after both printed circuit boards are joined. Thereby, the cost of the inspection jig can be kept low.

  An information sheet on which various types of information are recorded is sandwiched between one of the first and second printed circuit boards and the anisotropic conductive member, so that one of the printed circuit boards and the information sheet are joined. When the anisotropic conductive member is peeled from one side of the printed circuit board by making the force different from the bonding force at which the information sheet and the anisotropic conductive member are bonded, the information sheet It is selectively attached to either one of the printed circuit boards or the anisotropic conductive member. As a result, it is possible to select whether or not to hide the various information recorded on the information sheet.

  Further, since the heat radiating member is built in, the heat stored in the multilayer electronic component built-in substrate can be radiated to the outside.

  Since the electronic apparatus according to the present invention has the multilayer electronic component built-in substrate according to any one of claims 1 to 11, it is possible to reduce the size and the cost. In addition, since the electronic component built in the multilayer electronic component built-in substrate can be easily replaced, there is an advantage that the repairability is excellent.

  FIG. 1 is an external perspective view of a camera-equipped mobile phone 10 corresponding to the electronic apparatus of the present invention. The camera-equipped cellular phone 10 is roughly divided into a telephone unit 14 including a reception unit 12 and a transmission unit 13 which are foldably connected by a hinge unit 11, and a camera module 15 incorporated in the reception unit 12. It is configured. A transparent protective plate 18 for protecting the lens unit 17 constituting the camera module 15 is exposed to the outside on the outer surface of the receiver 12.

  Although not shown, a liquid crystal display panel on which captured images and the like are displayed and a reception speaker are provided on the inner surface side of the reception unit 12. Further, on the inner surface side of the transmitter 13, in addition to the transmitter microphone 23, an operation unit 24 including a dial button for performing a dial operation during transmission, a shutter button, a zoom button, and the like operated during shooting. Is provided.

  The camera module 15 includes a lens unit 17 and a multilayer electronic component built-in substrate 26. Although not shown, the lens unit 17 includes a lens (not shown) disposed on the back surface of the protective plate 18 and a lens barrel that holds the lens. A lens moving mechanism for changing the zoom magnification by sliding the lens in the lens barrel, a motor for driving the lens moving mechanism, and the like may be provided.

  Various electronic components such as a solid-state imaging device (CCD) 28, a CCD driver IC 30, an A / D converter 32, a digital signal processor (DSP) 34, and an SDRAM 36 are mounted on the multilayer electronic component built-in substrate 26 (FIG. 2). And FIG. 3). Each electronic component described above is an example of an electronic component mounted on the multilayer electronic component built-in substrate 26, and the electronic component mounted on the substrate 26 is not limited thereto.

  The CCD 28 photoelectrically converts the optical image formed on the light receiving surface and outputs an analog imaging signal. The CCD driver IC 30 controls driving of the CCD 28. The A / D converter 32 converts the analog image signal output from the CCD 28 into digital image data. The DSP 34 performs various image processing such as gradation conversion processing, white balance processing, and gamma correction processing on the image data. The SDRAM 36 temporarily stores image data before image processing output from the A / D converter 32, image data subjected to image processing by the DSP 34, and the like.

  The multilayer electronic component built-in substrate 26 is miniaturized so that it can be incorporated into the camera-equipped mobile phone 10 (receiver 12) by incorporating at least one of the above-described electronic components, for example, the DSP 34 in this embodiment. Yes. At this time, when the specification of the camera-equipped mobile phone 10 is changed, for example, when the speed of image processing is increased or when the number of types of image processing is increased, the conventionally incorporated DSP 34 is replaced or the number of DSPs 34 is increased. There is a problem that it cannot be easily done. Further, since the DSP 34 cannot be easily replaced even when the DSP 34 breaks down, there is a problem that repairability is poor. Therefore, in the present invention, these problems can be solved by manufacturing the multilayer electronic component built-in substrate 26 using an anisotropic conductive material.

  FIG. 2 is a cross-sectional view before joining the multilayer electronic component built-in substrate 26 according to the first embodiment of the present invention, and FIG. 3 is a cross-sectional view after joining the multilayer electronic component built-in substrate 26. The multilayer electronic component built-in substrate 26 includes a first printed circuit board 40 and a second printed circuit board 42 that face each other, and an anisotropic conductive film (ACF) 44. In the multilayer electronic component built-in substrate 26, the above-described electronic components are mounted on the first and second printed boards 40 and 42, and then both substrates 40 and 42 are bonded via an ACF (Anisotropic Conductive Film) 44. Manufactured by.

  The first printed circuit board 40 is a known rigid printed circuit board manufactured by, for example, impregnating an aramid fiber or glass fiber sheet with a thermosetting resin such as an epoxy resin and curing it by applying heat and pressure. The first printed circuit board 40 has a first facing surface 40a facing the second printed circuit board 42, and a first back surface 40b opposite to the first facing surface 40a. On both the surfaces 40a and 40b, although not shown, a wiring pattern made of a copper material is provided.

  A counterbore hole 46 corresponding to the component mounting hole of the present invention is formed on the first facing surface 40a by counterboring. The counterbore 46 is one step concave from the periphery, and the DSP 34 is mounted in the counterbore 46. More specifically, the DSP 34 is joined to a wiring pattern (not shown) formed at the bottom of the counterbore 46 by soldering. At this time, the counterbore hole 46 is formed to such a depth that the upper surface of the mounted DSP 34 does not protrude from the first facing surface 40a.

  The CCD 28 and the A / D converter 32 are mounted on the first back surface 40b. These are similarly joined by soldering onto a wiring pattern (not shown) formed on the first back surface 40b.

  On the wiring pattern (not shown) at the bottom of the counterbore 46, two first contact terminals 48 are provided so as to sandwich the DSP 34. The first contact terminal 48 is formed to be higher than the depth of the counterbore hole 46, and the upper end portion of the first contact terminal 48 is in a position protruding to the second printed circuit board 42 side from the first facing surface 40a. The first contact terminal 48 is electrically connected to the DSP 34 via a wiring pattern (not shown) on the bottom portion of the counterbore hole 46 and has a plated through hole formed in the first printed circuit board 40. It is also electrically connected to the CCD 28 and the A / D converter 32 via a wiring pattern (not shown) on the first back surface 40b (not shown).

  The second printed circuit board 42 is a rigid printed circuit board similar to the first printed circuit board 40 described above, and has a second facing surface 42a facing the first printed circuit board 40 and a second facing surface 42a opposite to the second facing surface 42a. 2 back surface 42b.

  On the second facing surface 42a, two second contact terminals 50 are provided at positions facing the first contact terminal 48 on the first facing surface 40a. That is, the front end portion of the first contact terminal 48 and the front end portion of the second contact terminal face each other with an ACF 44 described later interposed therebetween.

  The CCD driver IC 30 and the SDRAM 36 are mounted on the second back surface 42b, and these are joined to a wiring pattern (not shown) formed on the second back surface 42b by soldering. The two second contact terminals 50 are connected to the CCD through a plated through hole (not shown) formed in the second printed circuit board 42 and a wiring pattern (not shown) on the second back surface 42b. The driver IC 30 and the SDRAM 36 are electrically connected.

  The first and second printed circuit boards 40 and 42 are joined via the ACF 44 after the electronic components 28, 30, 32, 34, and 36 are mounted as described above. The ACF 44 corresponds to the anisotropic conductive member of the present invention, and is formed into a film after mixing fine conductive particles in a thermosetting adhesive resin. As this adhesive resin, a resin that can be cured by heating to bond both printed boards 40 and 42 and can be peeled off from both boards 40 and 42 by reheating is used. As the fine conductive particles, for example, nickel (Ni) having a diameter of several μm to several tens of μm is used. As is well known, the ACF 44 is electrically conductive only in the thickness direction (lamination direction of the two printed circuit boards 40 and 42) in the pressurization portion because the fine conductive particles come into contact with each other at the pressurization portion as is well known. In the surface direction, there is insulation. An example of such an ACF 44 is AC2104Y manufactured by Hitachi Chemical Co., Ltd.

  When joining the first and second printed circuit boards 40 and 42, the ACF 44 is superimposed on the first facing surface 40 a of the first printed circuit board 40. Next, the second printed circuit board 42 is overlaid on the ACF 44 so that the second contact terminal 50 faces the first contact terminal 48 of the first printed circuit board 40. Then, the second printed circuit board 42 is heated at a predetermined temperature while being pressurized at a predetermined pressure toward the first printed circuit board 40. As a result, the ACF 44 is thermally cured and the printed boards 40 and 42 are joined.

  At this time, since the both contact terminals 48 and 50 protrude toward the printed circuit boards 40 and 42 facing each other, the pressing portion 44a sandwiched and pressed by the both contact terminals 48 and 50 of the ACF 44 is in the thickness direction. Only have conductivity. Thereby, since the 1st contact terminal 48 and the 2nd contact terminal 50 are electrically connected, the 1st printed circuit board 40 and the 2nd printed circuit board 42 are electrically connected.

  As described above, the first and second printed circuit boards 40 and 42 are thermocompression bonded via the ACF 44 to complete the manufacture of the multilayer electronic component built-in board 26 incorporating the DSP 34. When the specification change regarding the image processing of the camera-equipped mobile phone 10 occurs or when the defect of the DSP 34 is confirmed in the inspection process, the multilayer electronic component built-in substrate 26 is reheated. As described above, since the ACF 44 can be peeled from both the substrates 40 and 42 by reheating, the ACF 44 and the second printed substrate 42 can be peeled from the first printed board 40 to expose the counterbore 46. As a result, the built-in DSP 44 can be easily replaced or the number thereof can be changed. When a change in the number of DSPs 44 is assumed, the counterbore holes 46 are formed in advance so that a plurality of DSPs 44 can be mounted, and the mounting wiring in which a plurality of DSPs 44 can be mounted on the bottom of the counterbore holes 46 is provided. A pattern is formed.

  Next, an example of a manufacturing procedure of the multilayer electronic component built-in substrate 26 will be described. First, the first printed circuit board 40 and the second printed circuit board 42 are manufactured using a known rigid printed circuit board manufacturing line. Both printed boards 40 and 42 are basically formed by the same procedure, but only the first printed board 40 is subjected to counterboring on the first facing surface 40a to form counterbored holes 46. Both manufactured printed circuit boards 40 and 42 are sent to an electronic component mounting line.

  In the electronic component mounting line, the above-described electronic components 28, 30, 32, 34, and 36 are mounted on both printed circuit boards 40 and 42 by soldering. The DSP 34 is mounted in the counterbore hole 46 of the first facing surface 40a of the first printed circuit board 40, and the CCD 28 and the A / D converter 32 are mounted on the first back surface 40b. At the same time, the first contact terminal 48 is soldered and joined to the bottom of the counterbore hole 46 of the first facing surface 40a. Further, the second contact terminal 50 is soldered and joined on the second facing surface 42a of the second printed circuit board 42, and the CCD driver IC 30 and the SDRAM 36 are mounted on the second back surface 42b. Both printed circuit boards 40 and 42 on which mounting of the electronic components 28, 30, 32, 34, and 36 is completed are sent to the joining line.

  In the bonding line, first, the ACF 44 is superimposed on the first facing surface 40 a of the first printed circuit board 40. Next, the second printed circuit board 42 is positioned and superimposed on the ACF 44. And both printed circuit boards 40 and 42 are thermocompression bonded with the ACF 44 sandwiched therebetween. As a result, the ACF 44 is thermally cured and the printed boards 40 and 42 are joined.

  Moreover, in the pressurization part 44a pressurized by the both contact terminals 48 and 50 of ACF44, it has electroconductivity only in the thickness direction because the fine electroconductive particle inside the inside contacts. As a result, the first contact terminal 48 and the second contact terminal 50 are electrically connected, and the first printed circuit board 40 and the second printed circuit board 42 are electrically connected. Thus, the manufacture of the multilayer electronic component built-in substrate 26 is completed.

  In this manner, a counterbore hole 46 is formed on the first counter surface 40a of the first printed circuit board 40, the DSP 34 is mounted in the counterbore hole 46, and then the first counter surface 40a is provided with the first through the ACF 44. By joining the two printed boards 42, the multilayer electronic component built-in board 26 having the DSP 34 built therein can be manufactured. Thereby, more electronic components can be mounted. In addition, if the number of components to be mounted is the same, the multilayer electronic component built-in substrate 26 can be made smaller than before, so that the cost can be reduced.

  In addition, since the multilayer electronic component built-in substrate 26 is manufactured by joining both the printed boards 40 and 42 via the ACF 44, the ACF 44 and the second printed board 42 are peeled off from the first printed board 40 by reheating. The counterbore 46 can be exposed. Thereby, when the specification change of the camera-equipped mobile phone 10 occurs, it is possible to easily replace the built-in electronic components or change the number. Further, even when a defect in an electronic component incorporated in the inspection process is found, the built-in electronic component can be easily replaced in the same manner, so that the repairability is improved.

  Further, when the multilayer electronic component built-in substrate 26 is manufactured, the first printed circuit board 40 and the second printed circuit board, which are known rigid printed circuit boards, may be joined via the ACF 44. The multilayer electronic component built-in substrate 26 can be manufactured using the mounting line.

  Although only the DSP 44 is built in the above embodiment, the present invention is not limited to this, and other A / D converter 32, CCD driver IC 30, SDRAM 36, etc. are built. Also good. In this case, a plurality of counterbore holes may be formed in the first counter surface 40a or the second counter surface 42a, and each electronic component may be mounted in each of the counterbore holes. Further, instead of mounting the electronic components one by one in the counterbore hole, the counterbore hole may be formed to have a large area and a plurality of electronic components may be mounted in the single counterbore hole. As a result, the number of electronic components that can be mounted can be further increased.

  Moreover, in the said embodiment, although the 1st contact terminal 48 is provided in the bottom part of the counterbore hole 46, this invention is not limited to this, You may be provided on the 1st opposing surface 40a. .

  In the above embodiment, the multilayer electronic component built-in substrate 26 formed by joining the two printed boards 40 and 42 has been described as an example, but the present invention is not limited to this. For example, a third printed circuit board is bonded to the second back surface 42b of the second printed circuit board 42 via the ACF 44, and a multilayer electronic component built-in substrate composed of a substrate laminate in which a plurality of printed circuit boards are bonded is formed in the same manner. Also good. In this case, since the second back surface 42b becomes the third facing surface, a counterbore hole in which an electronic component can be mounted can be formed on the third facing surface. As a result, the number of electronic components that can be mounted can be further increased.

  In the above embodiment, the first printed circuit board 40 and the second printed circuit board are bonded via the ACF 44, but the present invention is not limited to this, and anisotropic conductive instead of ACF. Bonding may be performed using an anisotropic conductive paste (ACP) made of a material, an anisotropic conductive adhesive (ACI), or the like. As these ACPs and ACIs, those which are cured by heating and bonded to both printed circuit boards 40 and 42 as in the above-described ACF 44 and can be peeled off from both the printed circuit boards 40 and 42 by reheating are used.

  In the above embodiment, the multilayer electronic component built-in substrate 26 incorporated in the camera-equipped cellular phone 10 has been described as an example. However, the present invention is not limited to this, and a digital camera, PDA, portable The present invention can be applied to a substrate with a built-in multilayer electronic component incorporated in various electronic devices such as a portable game machine, particularly a small portable electronic device.

  Next, the multilayer electronic component built-in substrate 56 according to the second embodiment of the present invention will be described with reference to FIGS. Here, the same members as those described in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted (hereinafter, the same applies to the third and subsequent embodiments). This multilayer electronic component built-in substrate 56 basically has the same configuration as the multilayer electronic component built-in substrate 26 of the first embodiment described above. However, in the multilayer electronic component built-in substrate 56, the second printed circuit board 58, which is a flexible printed circuit board, is connected to the first printed circuit board via the ACF 44 instead of the second printed circuit board 42 (see FIGS. 2 and 3) which is a rigid printed circuit board. Bonded on the substrate 40.

  The second printed circuit board 58 is a well-known flexible printed circuit board in which a wiring pattern is formed on both surfaces of a flexible film-like support such as polyimide. Similar to the second printed circuit board 42 described above, the second contact terminal 50 is soldered on the second facing surface 58a of the second printed circuit board 58, and the CCD driver IC 30 is formed on the second back surface 58b. And SDRAM 36 is mounted.

  Further, the second printed circuit board 58 has an extending portion 58 c that continues from the second facing surface 58 a that faces the first printed circuit board 40. The extended portion 58c protrudes in a direction parallel to the opposing surfaces 40a and 58a from the first printed board 40. A connection terminal 62 connected to another printed circuit board, for example, the main printed circuit board 60, is provided at the distal end of the extended portion 58c. The main printed circuit board 60 is mounted with, for example, a CPU that controls each part of the camera-equipped mobile phone 10, a ROM that stores programs and data necessary for operating each part of the telephone 10, and a RAM that is a working memory. Has been. At one end portion of the main printed circuit board 60, a connector portion 64 to which a connection terminal 62 is connected is provided.

  Similarly to the second printed circuit board 42 described above, the second printed circuit board 58 is positioned and overlapped on the ACF 44 so that the second contact terminal 50 faces the first contact terminal 48 of the first printed circuit board 40. . Then, the first printed board 40 and the second printed board 58 are joined via the ACF 44, whereby the multilayer electronic component built-in board 56 is manufactured. The multilayer electronic component built-in substrate 56 is electrically connected to the main printed circuit board 60 by connecting the connection terminals 62 of the extended portion 58 c to the connector section 64 of the main printed circuit board 60.

  As described above, in the multilayer electronic component-embedded substrate 56 of the second embodiment, since the flexible substrate having flexibility is used as the second printed circuit board 58, the effects described in the first embodiment described above are obtained. In addition to obtaining the same effect, the thickness of the multilayer electronic component built-in substrate 56 can be reduced. Furthermore, by providing the connection terminal 62 in the extending portion 58c of the second printed circuit board 58, it is possible to connect to another printed circuit board such as the main printed circuit board 60 without providing a connector or the like. Thus, by changing the materials of the first printed circuit board 40 and the second printed circuit board 58, multilayer electronic component built-in boards corresponding to various electronic device structures can be obtained.

  Next, a multilayer electronic component built-in substrate 66 according to a third embodiment of the present invention will be described with reference to FIGS. The multilayer electronic component built-in substrate 66 has basically the same configuration as the multilayer electronic component built-in substrate 26 of the first embodiment described above, but the second printed circuit board 68 has a different shape from the first printed circuit board 40. Is formed. In addition, the effect similar to the effect demonstrated in the above-mentioned 1st Embodiment is acquired also in the 3rd-9th embodiment described below.

  The second printed circuit board 68 is a rigid printed circuit board similar to the first printed circuit board 42 (see FIGS. 3 and 4) described above, and the second contact terminal 50 is soldered on the second facing surface 68a. In addition, a CCD driver IC 30 and an SDRAM 36 are mounted on the second back surface 68b. However, the second contact terminal 50 is soldered at a position shifted from the center of the second printed circuit board 68. As a result, the first printed circuit board 40 and the second printed circuit board 68 are bonded so that only a part thereof faces each other.

  Conventionally, a substrate having a complicated shape, such as the multilayer electronic component built-in substrate 66, has a problem that the manufacturing cost increases because the number of substrates that can be applied to a single collective printed circuit board (original substrate) is limited. . On the other hand, the multilayer electronic component built-in substrate 66 can be manufactured by joining the first and second printed boards 40 and 68 having simple shapes. For this reason, the number obtained from one collective printed circuit board can be increased. Therefore, the manufacturing cost of the substrate can be reduced as compared with the conventional case.

  Next, a multilayer electronic component built-in substrate 76 according to a fourth embodiment of the present invention will be described with reference to FIGS. This multilayer electronic component built-in substrate 76 also has basically the same configuration as the multilayer electronic component built-in substrate 26 of the first embodiment described above. However, the multilayer electronic component built-in substrate 76 has an electronic component that is taller than the thickness of the substrate 76, for example, an input power supply voltage is used as the drive voltage for each of the electronic components 28, 30, 32, 34, and 36 described above. A converter 78 for converting and outputting is mounted.

  The multilayer electronic component built-in board 76 is roughly composed of a first printed board 80, a second printed board 82, and an ACF 84. The first printed circuit board 80 has basically the same configuration as the first printed circuit board 40 described above except that a counterbore hole 85 different from the counterbore hole 46 is formed on the first facing surface 80a. . The converter 78 is mounted in the counterbore hole 85 by soldering.

  The second printed circuit board 82 and the ACF 84 also have basically the same configuration as the above-described second printed circuit board 42 and ACF 44 (see FIGS. 2 and 3), respectively. However, the second printed circuit board 82 and the ACF 84 are provided with converter insertion holes (for mounting) through which the upper portions of the converters 78 mounted in the counterbored holes 85 can be inserted at positions facing the counterbored holes 85 of the first printed circuit board 80. Through holes) 82c and 84b are formed. This prevents the converter 78 from interfering with the joining of the two printed boards 80 and 82, so that the first printed board 80 and the second printed board 82 can be joined via the ACF 84.

  In this way, in the multilayer electronic component built-in substrate 76 of the fourth embodiment, the converter insertion holes 82c and 84a are formed at positions facing the counterbore holes 85 of the second printed circuit board 82 and the ACF 84, thereby converting the converter 78. Such tall electronic components can also be incorporated. Thereby, the thickness (total thickness) of the multilayer electronic component built-in substrate including the electronic components to be mounted can be suppressed. As a result, the total thickness of the substrate can be suppressed particularly when a tall electronic component is incorporated.

  In the fourth embodiment described above, the case where the converter 78 is mounted as a tall electronic component has been described as an example, but the present invention is not limited to this. For example, even when an interface component used for connection to an external electronic component or a printed circuit board is mounted as a tall electronic component, the present invention can be applied to suppress the total thickness of the multilayer electronic component built-in substrate. it can. In the above-described fourth embodiment, the counterbore hole 85 is formed in the first opposing surface 80 of the first printed board 80, and the converter insertion hole 82c is formed in the second printed board 82. Is not limited to this. For example, a counterbore hole may be formed on the second facing surface 82 a of the second printed circuit board 82, and a converter insertion hole may be formed at a position facing the counterbore hole of the first printed circuit board 80.

  Next, a multilayer electronic component built-in substrate 86 according to a fifth embodiment of the present invention will be described with reference to FIGS. The multilayer electronic component built-in substrate 86 also has basically the same configuration as the multilayer electronic component built-in substrate 26 of the first embodiment described above. However, in addition to the ACF 44, a flexible printed circuit board (hereinafter simply referred to as a flexible circuit board) 88 is sandwiched between the first printed circuit board 40 and the second printed circuit board 42 constituting the multilayer electronic component built-in substrate 86.

  A third contact terminal 90 is provided on the second facing surface 42 a of the second printed circuit board 42. The third contact terminal 90 is electrically connected to the CCD driver IC 30, the SDRAM 36, and the second contact terminal 50 on the second printed circuit board 42 via a wiring pattern and a plated through hole (not shown).

  The flexible board 88 is a connection cable that electrically connects the multilayer electronic component built-in board 86 and another printed board, for example, a main printed board (not shown) on which a CPU or the like is mounted. The flexible substrate 88 has a substrate end portion 88 a sandwiched between the end portion of the first facing surface 40 a of the first printed circuit board 40 and the ACF 44. A fourth contact terminal 92 is provided on the side of the board end 88a that faces the second printed board 42 (second facing surface 42a).

  At the time of joining the first and second printed boards 40 and 42, the board end 88 a of the flexible board 88 is first superimposed on the end of the first facing surface 40 a of the first print 40. Next, the ACF 44 and the second printed circuit board 42 are sequentially overlapped on the first facing surface 40a and the substrate end portion 88a. Then, the printed boards 40 and 42 are thermocompression bonded with the ACF 44 and the board end 88a sandwiched therebetween, whereby the ACF 44 is thermoset and the printed boards 40 and 42 are joined.

  Further, at the joining of the two printed circuit boards 40 and 42, the pressure is applied by the pressurizing portion 44a pressed by the first and second contact terminals 48 and 50 of the ACF 44 and the third and fourth contact terminals 90 and 92. The pressing portion 44b has conductivity in the thickness direction (see FIG. 11). For this reason, the first and second contact terminals 48 and 50 are electrically connected, and the third and fourth contact terminals 90 and 92 are electrically connected. As a result, the flexible board 88 and the printed boards 40 and 42 (multilayer electronic component built-in board 86) are electrically connected.

  As described above, in the multilayer electronic component built-in substrate 86 of the fifth embodiment, the flexible substrate is interposed between the end portion of the first facing surface 40 a and the ACF 44 when the two printed circuit boards 40 and 42 are joined via the ACF 44. By sandwiching the substrate end 88a of 88, the flexible substrate 88 can be connected simultaneously with the incorporation of the DSP 34. This eliminates the need for a connector for connecting the flexible board 88, which was conventionally required. As a result, the electronic component mountable area on the first back surface 40b or the second back surface 42b can be increased, so that more electronic components can be mounted.

  In the above-described fifth embodiment, the case where the substrate end portion 88a of the flexible substrate 88 is sandwiched between the end portion of the first facing surface 40a and the ACF 44 has been described as an example. However, the substrate end 88a of the flexible substrate 88 may be sandwiched between the end of the second facing surface 42a and the ACF 44.

  Next, a multilayer electronic component built-in substrate 96 according to the sixth embodiment of the present invention will be described with reference to FIGS. The multilayer electronic component built-in substrate 96 has basically the same configuration as the multilayer electronic component built-in substrate 26 of the first embodiment described above. However, in this multilayer electronic component built-in substrate 96, a plurality of copper posts (conductor posts) 98a, 98b made of a copper material are provided on the opposing surfaces 40a, 42a of the first and second printed boards 40, 42 facing each other. Are formed respectively.

  Each copper post 98a is formed in a substantially cylindrical shape, and is formed integrally with a wiring pattern (not shown) on the first facing surface 40a. Accordingly, the copper post 98a is electrically connected to the first electronic circuit including the CCD 28, the A / D converter 32, and the DSP 34 mounted on the first printed board 40.

  The copper post 98a is an inspection circuit for inspecting whether or not the first electronic circuit including the electronic components 28, 32, and 34 functions correctly when the printed boards 40 and 42 are separated. It functions as a part. Specifically, an inspection probe of an inspection jig (inspection device) (not shown) is brought into contact with the copper post 98a, and an inspection voltage is applied to each electronic component 28, 32, 34 from a part of the inspection probes. Then, by detecting the response of each electronic component 28, 32, 34 with the remaining inspection probes, whether or not each electronic component 28, 32, 34 of the first electronic circuit has failed is determined. Whether or not the soldering portions (not shown) of 32 and 34 are disconnected, whether or not the wiring patterns (not shown) and plated through holes (not shown) on both surfaces 40a and 40b are disconnected. Etc. can be inspected.

  The copper post 98 b is formed integrally with a wiring pattern (not shown) on the second facing surface 42 a and is electrically connected to a second electronic circuit including the CCD driver IC 30 and the SDRAM 36. Similarly to the copper post 98a, the copper post 98b includes the electronic components 30 and 36 mounted on the second printed board 42 when the two printed boards 40 and 42 are separated. It functions as an inspection circuit for inspecting whether or not the circuit functions correctly.

  When the first and second printed circuit boards 40 and 42 are joined via the ACF 44, the first and second printed circuit boards 40 and 42 are pressed by both the contact portions 48 and 50 of the ACF 44 and the copper posts 98a and 98b. The pressurizing portion 44c has conductivity in the thickness direction (see FIG. 13). Therefore, the first and second contact terminals 48 and 50 are electrically connected, and both the copper posts 98a and 98b are electrically connected. Thereby, when both the printed circuit boards 40 and 42 are joined, the first and second electronic circuits described above are electrically connected via the copper posts 98a and 98b. Accordingly, the copper posts 98a and 98b function as product circuits for operating the electronic components 28, 30, 32, 34, and 36 described above.

  As described above, in the multilayer electronic component built-in substrate 96 of the sixth embodiment, the copper posts 98a and 98b functioning as product circuits when the two printed boards 40a and 42b are joined are separated from each other by the printed boards 40a and 42b. In this case, since each of the electronic components 28, 30, 32, 34, and 36 is correctly functioned before the two printed circuit boards 40 and 42 are joined, the inspection circuit is made to function individually. It can be tested to see if it works. As a result, it is possible to prevent the production of the multilayer electronic component built-in substrate 96 in which a problem occurs. Further, since it is only necessary to bring the inspection probe into contact with the individual copper posts 98a and 98b at the time of inspection, the structure of the inspection jig is made more than when the inspection is performed after joining both the printed circuit boards 40 and 42 as in the prior art. It can be simplified. Thereby, the cost of the inspection jig can be kept low.

  In the sixth embodiment, the copper posts 98a and 98b made of a copper material are used as the conductor posts. However, the present invention is not limited to this, and instead of the copper posts 98a and 98. You may make it use the conductor post formed from various conductors.

  Next, a multilayer electronic component built-in substrate 106 according to a seventh embodiment of the present invention will be described with reference to FIGS. This multilayer electronic component built-in substrate 106 also has basically the same configuration as the multilayer electronic component built-in substrate 26 of the first embodiment described above. However, between the first printed circuit board 40 and the ACF 44 constituting the multilayer electronic component built-in substrate 106, an information sheet 108 on which various types of information, for example, a manufacturing number is recorded, is sandwiched. Examples of the information sheet 108 include a sheet-like member on which information is written by printing, a magnetic recording sheet on which information is written by a magnetic head, and an IC tag.

  The information sheet 108 is provided with an adhesive layer (not shown) on both sides thereof. This information sheet 108 is affixed on the first facing surface 40 a of the first printed circuit board 40 so that the information recording surface side faces the ACF 44 before the two printed circuit boards 40 and 42 are joined. On the first facing surface 40a and the information sheet 108, the ACF 44 and the second printed circuit board 42 are sequentially overlapped. Then, the ACF 44 is thermally cured by bonding the printed boards 40 and 42 to each other, and the printed boards 40 and 42 are joined. As a result, the information sheet 108 affixed on the first facing surface 40a is covered with the ACF 44 and the second printed circuit board 42, so that it cannot be seen from the outside.

  For example, when a problem occurs in the multilayer electronic component built-in substrate 106, the second printed circuit board 42 and the ACF 42 are sequentially peeled from the first printed circuit board 40. At this time, the adhesive force of the adhesive layer on the back surface side (side in contact with the first facing surface 40a) of the information sheet 108 is made stronger than the adhesive force of the adhesive layer on the information recording surface side (side in contact with the ACF 44). . Thereby, when the ACF 44 is peeled off from the first facing surface 40a, the information sheet 108 sticks to the first facing surface 40a. As a result, information such as the production number recorded on the information recording surface of the information sheet 108 is exposed to the outside. Then, based on the production number recorded in the information sheet 108, the cause of the failure is investigated.

  Further, there are cases where it is not desired to show the information recorded on the information sheet 108 to others. In this case, contrary to the above, the adhesive force of the adhesive layer on the back surface side of the information sheet 108 is made weaker than the adhesive force of the adhesive layer on the information recording surface side. Thereby, when the ACF 44 is peeled off from the first facing surface 40 a, the information sheet 108 is attached to the ACF 44. As a result, the information recording surface of the information sheet 108 can be hidden from the outside (see FIG. 15).

  As described above, in the multilayer electronic component-embedded substrate 106 according to the seventh embodiment of the present invention, the adhesive force of the adhesive layer on the back surface side of the information sheet 108 is different from the adhesive force of the adhesive layer on the information recording surface side. Thus, when the ACF 44 is peeled from the first facing surface 40a, the information sheet 108 can be selectively attached to the first facing surface 40a or the ACF 44. Thereby, it is possible to select whether or not to hide the information recorded on the information recording surface of the information sheet 108.

  In the seventh embodiment described above, the information sheet 108 is sandwiched between the first printed circuit board 40 and the ACF 44, but the present invention is not limited to this, and the second printed circuit board 42 and The information sheet 108 may be sandwiched between the ACF 44. Also in this case, the information recorded on the information recording surface of the information sheet 108 is hidden by making the adhesive force of the adhesive layer on the back side of the information sheet 108 different from the adhesive force of the adhesive layer on the information recording surface side. Whether or not can be selected.

  In the seventh embodiment described above, the information sheet 108 is pasted on the first facing surface 40a so that the information recording surface side faces the ACF 44. However, the present invention is not limited to this. The information sheet 108 may be pasted on the first facing surface 40a upside down. In this case as well, the information recorded on the information recording surface of the information sheet 108 is similarly obtained by making the adhesive force of the adhesive layer on the back side of the information sheet 108 different from the adhesive force of the adhesive layer on the information recording surface side. Whether to hide or not can be selected.

  Next, a multilayer electronic component built-in substrate 116 according to an eighth embodiment of the present invention will be described with reference to FIGS. This multilayer electronic component built-in substrate 116 also has basically the same configuration as the multilayer electronic component built-in substrate 26 of the first embodiment described above. However, the multilayer electronic component built-in substrate 116 includes a heat dissipation member 117 for heat dissipation in addition to the DSP 34. Further, the multilayer electronic component built-in substrate 116 controls the operation of each part of the heat-generating electronic component having a larger calorific value than the above-described electronic components 28, 30, 32, 34, 36, for example, the camera-equipped mobile phone 10. A CPU 118 is mounted.

  The multilayer electronic component built-in board 116 is roughly composed of a first printed board 119, a second printed board 120, and an ACF 121. The first printed circuit board 119 is basically the same as the first printed circuit board 40 described above except that a heat radiation member fitting hole 122 that is one step concave from the periphery is formed on the first facing surface 119a. It is a configuration.

  As the heat dissipating member 117, a columnar aluminum material (aluminum column) extending in a direction perpendicular to both opposing surfaces 119a and 120a of both printed circuit boards 119 and 120 is used. The heat dissipating member 117 is inserted and held in a heat dissipating member fitting hole 122 having one end 117a formed on the first facing surface 119a.

  Inside the first printed circuit board 119, a heat radiation pattern 123 extending in a direction parallel to the opposing surfaces 119a and 120a is provided. One end portion 123 a of the heat radiation pattern 123 abuts on the heat radiation member 117 in the heat radiation member fitting hole 122, and the other end portion 123 b is exposed from the side end portion of the first printed circuit board 119.

  The ACF 121 is overlaid on the first facing surface 119 a of the first printed circuit board 119. The ACF 121 is basically the same as the ACF 44 described above. However, the ACF 121 has a heat radiating through hole 121a through which the heat radiating member 117 can be inserted at a position facing the heat radiating member fitting hole 122. A second printed circuit board 119 is overlaid on the ACF 121.

  The second printed circuit board 120 is basically the same as the second printed circuit board 42 described above. However, a heat radiating through hole 120 c is formed in the second printed circuit board 120 at a position facing the heat radiating member fitting hole 122. The heat radiating through hole 120c and the heat radiating through hole 121a are formed to be slightly smaller than the outer shape of the CPU 118. A CPU 118 is mounted on the second back surface 120b of the second printed circuit board 120 so as to straddle the heat radiating through hole 120c.

  When the second printed circuit board 120 is overlaid on the ACF 120, the other end 117b of the heat radiating member 117 opposite to the one end 117a is fitted into the heat radiating through hole 120c of the substrate 120. At this time, the heat dissipating member 117 is formed at such a height that the other end portion 117 b abuts against the bottom surface of the CPU 118. Then, the ACF 120 is thermoset by thermocompression bonding the both printed circuit boards 119 and 120, and the both printed circuit boards 119 and 120 are joined.

  As described above, in the multilayer electronic component built-in substrate 116 according to the eighth embodiment of the present invention, the heat radiation member 117 can be built in a state of being in contact with the bottom surface of the CPU 118. For this reason, the heat of the CPU 118 can be radiated to the outside via the heat radiating member 117 and the heat radiating pattern 123. In addition, the heat stored in the multilayer electronic component built-in substrate 116 by the operation of each of the electronic components 28, 30, 32, 34, and 36 other than the CPU 117 can be radiated to the outside. Thereby, the heating of the multilayer electronic component built-in substrate 116 can be prevented.

  Next, the multilayer electronic component built-in substrate 126 according to the ninth embodiment of the present invention will be described with reference to FIGS. The multilayer electronic component built-in board 126 has basically the same structure as the multilayer electronic component built-in board 116 of the above-described eighth embodiment, and is roughly composed of a first printed board 119, a second printed board 120, and an ACF 121. The DSP 34 and the heat dissipation member 127 are incorporated. However, in the multilayer electronic component built-in board 126, a heat radiation member fitting hole 128 is formed in the first printed board 119 instead of the heat radiation member fitting hole 122 and the heat radiation pattern 123.

  The heat radiating member 127 is inserted into the heat radiating member fitting hole 128. The heat dissipating member 127 is formed by forming an aluminum material in a columnar shape in the same manner as the heat dissipating member 117 described above. A retaining flange 130 is provided on the outer surface of the heat dissipating member 127. The retaining flange 130 holds the heat radiating member 127 inserted into the heat radiating member fitting hole 128 in a state where one end portion 127a protrudes from the first back surface 119b. The heat dissipating member 127 is formed at such a height that the other end portion 127b contacts the bottom surface of the CPU 118 when the two printed circuit boards 119 and 120 are joined via the ACF 121.

  As described above, the multilayer electronic component built-in substrate 126 according to the ninth embodiment of the present invention can also be incorporated with the heat dissipation member 127 in contact with the bottom surface of the CPU 118. For this reason, the heat of the CPU 118 can be radiated to the outside through the one end portion 127 a of the heat radiating member 127. Further, the heat stored in the multilayer electronic component built-in board 126 by the operation of each electronic component 28, 30, 32, 34, 36 can also be dissipated to the outside. Thereby, the heating of the multilayer electronic component built-in substrate 126 can be prevented. At this time, although not shown, the cooling effect of the multilayer electronic component built-in substrate 126 can be further enhanced by forming the one end portion 127a of the heat dissipation member 127 in a fin shape.

  In the eighth and ninth embodiments described above, since the CPU 118 is mounted on the second back surface 120b of the second printed circuit board 120, the heat radiation member fitting hole 122 or the heat radiation member is fitted into the first printed circuit board 119. Although the joint hole 128 is formed and the heat radiating through hole 120c is formed in the second printed circuit board 120, the present invention is not limited to this. For example, when the CPU 118 is mounted on the first back surface 119a of the first printed circuit board 119, a heat radiating member fitting hole is formed in the second printed circuit board 120, and a heat radiating through hole is formed in the first printed circuit board 119. You may make it form.

  In the eighth and ninth embodiments described above, the heat radiation members 117 and 127 are made of aluminum materials having high thermal conductivity formed in a columnar shape, but the present invention is not limited to aluminum materials. Alternatively, the heat radiating member may be formed using various materials having high thermal conductivity, for example, copper. Further, as described above, the first printed circuit board 119 and the second printed circuit board 120 can be easily separated. For this reason, the heat dissipation of the multilayer electronic component built-in substrate can be controlled by changing the type of the heat dissipation member in accordance with the temperature rise of the multilayer electronic component built-in substrate.

  In addition, although illustration is abbreviate | omitted, you may make it combine two or more above-mentioned 2nd-9th embodiment as needed.

1 is an external perspective view of a camera-equipped mobile phone in which a multilayer electronic component built-in substrate according to the present invention is incorporated. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 1st Embodiment of this invention. It is sectional drawing which showed the state after joining of the multilayer electronic component built-in board | substrate of the 1st Embodiment of this invention. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 2nd Embodiment of this invention. It is sectional drawing which showed the state after joining of the multilayer electronic component built-in board | substrate of the 2nd Embodiment of this invention. It is a top view of the multilayer electronic component built-in substrate according to the third embodiment of the present invention. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 3rd Embodiment of this invention. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 4th Embodiment of this invention. It is sectional drawing which showed the state after joining of the multilayer electronic component built-in board | substrate of the 4th Embodiment of this invention. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 5th Embodiment of this invention. It is sectional drawing which showed the state after joining of the multilayer electronic component built-in board | substrate of the 5th Embodiment of this invention. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 6th Embodiment of this invention. It is sectional drawing which showed the state after joining of the multilayer electronic component built-in board | substrate of the 6th Embodiment of this invention. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 7th Embodiment of this invention. It is sectional drawing which showed the state after joining of the multilayer electronic component built-in board | substrate of the 7th Embodiment of this invention. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 8th Embodiment of this invention. It is sectional drawing which showed the state after joining of the multilayer electronic component built-in board | substrate of the 8th Embodiment of this invention. It is sectional drawing which showed the state before joining of the multilayer electronic component built-in board | substrate of the 9th Embodiment of this invention. It is sectional drawing which showed the state after joining of the multilayer electronic component built-in board | substrate of the 9th Embodiment of this invention.

Explanation of symbols

10 Mobile phone with camera 26, 56, 66, 76, 86, 96, 106 Multi-layer electronic component built-in substrate 34 DSP
40, 80, 119 First printed circuit board 40a First facing surface 40b First back surface 42, 82, 120 Second printed circuit board 42a Second facing surface 42b Second back surface 44, 84, 121 ACF
46 Counterbored hole 48 First contact terminal 50 Second contact terminal 116, 126 Multi-layer electronic component built-in substrate

Claims (12)

In a multilayer electronic component built-in substrate in which electronic components are arranged inside a substrate laminate in which a plurality of printed boards are laminated,
A pair of connection terminals provided on both opposing surfaces of the first and second printed circuit boards facing each other in the substrate laminate, and facing the respective front end portions;
A pressurizing portion formed of an anisotropic conductive material, sandwiched between the first and second printed circuit boards and sandwiched and pressed by the pair of connection terminals is a stacking direction of the substrate stack A substrate with a built-in multilayer electronic component, comprising: an anisotropic conductive member that electrically connects the pair of connection terminals by having conductivity only in a direction substantially parallel to the substrate.   A component mounting hole that is recessed by one step from the periphery is formed in one or both of the opposing surfaces of the first and second printed circuit boards, and the electronic component, and the electronic component in the component mounting hole, and A first connection terminal that is one of the pair of connection terminals is provided, and a second connection terminal that is the other of the pair of connection terminals is disposed at a position facing the component mounting hole. The multilayer electronic component built-in substrate according to claim 1. Of the first and second printed circuit boards, one is a flexible printed circuit board and the other is a rigid printed circuit board,
The flexible printed circuit board has an extended portion that is continuous from an opposing surface that faces the rigid printed circuit board, and the extended portion is provided with a connection terminal that is connected to another printed circuit board. 3. The multilayer electronic component built-in substrate according to claim 1 or 2.   4. The multilayer electronic component built-in substrate according to claim 1, wherein the first and second printed circuit boards are formed in different shapes, and only a part thereof is opposed to each other.   In the printed circuit board facing the component mounting hole and the anisotropic conductive member, a mounting through hole formed in accordance with the position and shape of the component mounting hole is formed, and the component mounting hole 5. The multilayer electronic component-embedded substrate according to claim 1, wherein a part of the mounted electronic component is inserted through the mounting through-hole. The substrate laminate includes a flexible printed circuit board that is a third printed circuit board different from the first and second printed circuit boards,
One of the first and second printed circuit boards is provided with a third connection terminal,
The flexible printed circuit board is provided with a fourth connection terminal at one end thereof, the fourth connection terminal faces the third connection terminal, and the flexible printed circuit board has the first and second connection terminals. By being sandwiched between one of the printed circuit boards and the anisotropic conductive member, the third and fourth connection terminals sandwich and pressurize the anisotropic conductive member, and through the pressure portion, 6. The multilayer electronic component built-in substrate according to claim 1, wherein the third and fourth connection terminals are electrically connected. The first and second printed circuit boards are formed with first and second electronic circuits including at least one or more electronic components, respectively, on both opposing surfaces of the first and second printed circuit boards. Is provided with a pair of conductor posts electrically connected to the first and second electronic circuits at positions facing each other,
When the first and second printed circuit boards are separated from each other, the first and second electronic circuits can be individually inspected by connecting to an inspection device via the conductor post. When the first printed circuit board and the second printed circuit board are connected via the anisotropic conductive member, the first and second electronic circuits are electrically connected to form one product circuit. Item 7. The multilayer electronic component built-in substrate according to any one of Items 1 to 6.   An information sheet on which various types of information are recorded is sandwiched between one of the first and second printed circuit boards and the anisotropic conductive member, and one of the printed circuit boards and the information sheet are joined together. A difference between the bonding force to be bonded and the bonding force to bond the anisotropic conductive member and the information sheet, when one of the printed circuit boards and the anisotropic conductive member are peeled, The multilayer electronic component built-in substrate according to claim 1, wherein the information sheet is selectively attached to either one of the printed circuit boards or the anisotropic conductive member. . One of the first and second printed circuit boards has an electronic component mounted on a surface opposite to the anisotropic conductive member, and the printed circuit board on which the electronic component is mounted and the anisotropic conductive member Is formed with a heat dissipation through hole that is slightly smaller than the outer shape of the electronic component in accordance with the position of the electronic component,
A heat radiating member extending toward the electronic component is provided on the other of the first and second printed circuit boards, and the heat radiating member is inserted into the heat radiating through hole and comes into contact with the electronic component. The multilayer electronic component built-in substrate according to claim 1, wherein the substrate is a multilayer electronic component built-in substrate.   The printed circuit board provided with the heat radiating member has a heat radiating member fitting hole which is one step concave from the periphery of the surface facing the heat radiating through hole. The multilayer electronic component built-in substrate according to claim 9, wherein the members are fitted and fixed.   The printed circuit board provided with the heat radiating member has a heat radiating member through hole penetrating from the surface facing the heat radiating through hole to the opposite surface, and the heat radiating member is inserted into the heat radiating member through hole. The multilayer electronic component built-in substrate according to claim 9, wherein the substrate is fitted and fixed.   An electronic apparatus comprising the multilayer electronic component built-in substrate according to claim 1.

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