TWI765732B - Lens module mounted on rigid-flex printed circuit board - Google Patents

Abstract

A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

Description

Rigid-flex board lens module

This creation is related to the field of a lens, especially a flexible-rigid combination board lens module.

The camera lens is an important functional component of electronic products such as mobile phones, tablets, and notebooks. With the rapid development of this consumer industry, it also drives the high growth of the camera industry. In particular, as these electronic products are thinned, the size of the imaging lens mounted in the electronic products needs to be further thinned.

The packaging mode of the traditional camera lens module has the following three packaging methods, namely: 1. CSP (Chip Scale Package) method, 2. COB (Chip On Board) method, 3. Flip Chip method.

The advantage of CSP packaging is that the packaging segment is completed by the front-end process, and the CSP-packaged chips have lower requirements on cleanliness because they are covered by glass. The yield rate is also good, the cost of the process equipment is low, and the process time is short. The challenges faced are poor light transmittance, high price, high height, and backlight penetration ghost phenomenon.

Due to the high cost of the Flip Chip process, it is difficult for general companies to adopt this process.

The COB package has the advantages of better image quality, lower packaging cost and lower module height. In addition, brand manufacturers gradually require module manufacturers to assemble and ship with the COB process. In the future, the COB process will become the camera mold. A trend in the development of group processes. There are two FPCB bonding processes in the post-process of COB packaging process, namely: 1. Hot Bar (solder paste hot pressing), 2. ACF (anisotropic conductive paste hot pressing)/ACP (anisotropic conductive paste hot pressing) ). Due to its low reliability, the Hot Bar has been basically unused at present; while the ACF/ACP needs to purchase additional equipment, causing the cost to rise sharply. Moreover, traditional packaging technologies such as wafer-level packaging processes are directly assembled according to the set tolerance parameters. As the number of superimposed components increases, the final With the increasing tolerance, the final shooting effect of the image, the ordinary COB process has no advantages and characteristics in the thickness of the module. The final lens installation is also unremarkable.

As the number of camera lens parts increases, the packaging yield decreases, and the overall thickness also increases. Therefore, how to make the overall thickness of the camera lens thinner and improve the yield rate is the relationship between the creator of this case and the industry. The direction in which the relevant manufacturers are eager to study and improve.

In order to improve the above-mentioned problems, one objective of the present invention is to provide a flexible-rigid board lens module that is thin and has integrated strength.

In order to achieve the above purpose, the present invention provides a flex-rigid board lens module, comprising: a flex-rigid board unit, having two rigid circuit boards and a flexible circuit board, the flexible circuit board is located between the two rigid circuit boards and combined with the two rigid circuit boards, and the flexible circuit board defines a second thickness smaller than a first thickness defined by each rigid circuit board; a photosensitive element is attached to the flexible circuit board and the flexible circuit board Electrical connection; a lens, aligned with the photosensitive element and fixed on the flexible circuit board, two gaps between the lens and the two rigid circuit boards are respectively filled with a gap glue, and the flexible circuit is strengthened by the gap glue The two junctions between the board and the two rigid circuit boards.

The photosensitive element is covered with a filter element.

The aforementioned lens is located on a light-sensing path of the light-sensing element, and the light-sensing element is located between the lens and the filter element.

The aforementioned flexible circuit board is combined with the two rigid circuit boards by a joining means without connectors or without soldering.

The aforementioned flexible circuit board and the photosensitive element are electrically connected together by a plurality of conductive lines.

Each of the aforementioned rigid circuit boards is covered by a casing, the gaps are located between the lens and the casing, and the gap glue is filled between the lens and the casing.

The aforementioned rigid circuit board has an inscribed edge adjacent to the flexible circuit board, the lens has two outer edges spaced apart from the inscribed edges of the adjacent rigid circuit boards, and the gaps are located at two outer sides of the lens, respectively between the edge and the inner edge of the two rigid circuit boards.

Each of the aforementioned casings has an inner casing wall that is aligned with the inner edge of the rigid circuit board, and is spaced apart from the two outer sides of the lens, respectively. The gap glue is filled on the inner casing wall of the casing and the lens, respectively. between the outer edges.

The aforementioned gap glue is a curing glue.

The aforementioned flexible circuit board forms a recessed area.

10: Rigid-flex board lens module

11: Rigid-flex board unit

111: Rigid circuit board

1111: Inscribed edge

112: Flexible circuit board

1121: Electrical contacts

113: Photosensitive element

1131: Conductive thread

114: filter element

115: Lens

1151: Outside edge

116: Shell

1161: Inner shell wall

117: Gap glue

118: Gap

A: sunken area

H1: first thickness

H2: Second thickness

Figures 1A-1C are the exploded schematic diagram of the creation and its partial enlarged schematic diagram; Figures 2A-2C are the combined schematic diagram of the creation and its partial enlarged schematic diagram.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.

In this creation, unless otherwise expressly specified and limited, terms such as "arrangement", "installation", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or It is a detachable connection; it can be a mechanical connection; it can be directly connected or indirectly connected through an intermediate medium. For those with ordinary knowledge in the technical field, the specific meanings of the above terms in the present creation can be understood according to specific situations.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" and "plurality" mean two or more, unless otherwise expressly and specifically defined.

Figures 1A-1C are the exploded schematic diagram of the creation and its partial enlarged schematic diagram; Figures 2A-2C are the combined schematic diagram of the creation and its partial enlarged schematic diagram. As shown in the figure, the Rigid-flex PCB lens module 10 of the present creation includes a Rigid-flex PCB unit 11 as a component carrier. The Rigid-flex PCB unit 11 is a kind of two or two The above rigid circuit board is a printed circuit board for circuit connection through the flexible part. In this embodiment, the flex-rigid board unit 11 has two rigid circuit boards (PCB) 111 and a flexible circuit board (FPC) 112 , and the flexible circuit board 112 is located between the two rigid circuit boards 111 . The flexible printed circuit board 112 and the two rigid printed circuit boards 111 are joined together by means of bonding without connectors or soldering, for example, drilling holes in the circuit layers to be connected between the flexible printed circuit board 112 and the two rigid printed circuit boards 111 in advance , through precise positioning and alignment, and then bonding, using the conductive plated through holes between the layers for circuit connection.

A first thickness H1 defined by the rigid circuit board 111, a second thickness H2 defined by the flexible circuit board 112 is smaller than the first thickness H1, and the flexible circuit board 112 is formed relative to the rigid circuit board 111 by the difference in thickness between the two A recessed area A (as shown in Figure 1C).

The two casings 116 respectively cover the rigid circuit board 111 , and the casing 116 is, for example, a metal (iron) casing or a plastic casing, which can be used to shield the electronic components on the rigid circuit board 111 . The casing 116 also protects the electronic components on the hard circuit board 111 and shields the electromagnetic waves generated by the electronic components, so as to prevent the electromagnetic waves from interfering with the operation of the photosensitive element 113 described later. Each rigid circuit board 111 has an inscribed edge 1111 adjacent In the flexible circuit board 112, each casing 116 has an inner side wall 1161 aligned with the inner edge 1111 of the rigid circuit board.

A photosensitive element 113 is attached to the flexible circuit board 112 and electrically connected to the flexible circuit board 112 . The photosensitive element 113 is covered with a filter element 114 . The photosensitive element 113 is, for example, a CCD or a CMOS, and the filter element 114 For example, an infrared filter (IR Cut Filter) is used to filter out infrared rays and retain the color visible to the naked eye. In one implementation, the flexible circuit board 112 is provided with a plurality of electrical (or metal) contacts 1121 , and the photosensitive element 113 has a plurality of conductive lines (or electrical pins) 1131 corresponding to the electrical contacts electrically connected to the flexible circuit board 112 . Point 1121.

A lens 115 is aligned with the photosensitive element 113 and fixed on the flexible circuit board 112 , the lens 115 is located in a photosensitive path of the photosensitive element 113 , and the filter element 114 is located between the lens 115 and the photosensitive element 113 . There are two gaps 118 between the lens 115 , the two rigid circuit boards 111 and the two housings 116 , which are respectively filled with a gap glue 117 . The gap glue 117 is, for example, but not limited to, a curing glue that can change from a liquid state to a solid state, and has strong adhesion and fast curing speed. In one implementation, the gap glue 117 uses UV curing glue.

In detail, the lens 115 has two outer edges 1151 spaced apart from the inscribed edges 1111 of the adjacent rigid circuit boards 111 and the inner shell walls 1161 of the casings 116 respectively, and the two gaps 118 are located between the lens 115 , respectively. between the two outer edges 1151 of the two rigid circuit boards 111 and the inner side walls 1161 of the two housings 116 . The gap glue 117 in the two gaps 118 not only fills the two outer edges 1151 of the lens 115 and the inscribed edges 1111 of the two rigid circuit boards 111 , but also fills the two outer edges 1151 of the lens 115 respectively. between the inner shell walls 1161 of the two shells 116 . In this way, the gap glues 117 can strengthen the joint between the flexible circuit board 112 and the two rigid circuit boards 111 . And the cured gap glue 117 makes the rigid-flex panel lens module 10 of the present invention an integrated structure.

In this invention, the lens 115 , the photosensitive element 113 and the filter 114 are arranged on the thin flexible circuit board 112 as described above, so as to reduce the thickness of the entire flexible and rigid combination board lens module to achieve the purpose of thinning. Furthermore, the junction between the flexible circuit board 112 and the two rigid circuit boards 111 is reinforced by the gap glue 117 , so that the rigid-flex lens module 10 becomes an integrated structure.

The creation has been described in detail above, but the above is only a preferred embodiment of the creation, and should not limit the scope of implementation of the creation. That is, all equivalent changes and modifications made in accordance with the scope of the application of this creation shall still fall within the scope of the patent of this creation.

10: Rigid-flex board lens module

11: Rigid-flex board unit

111: Rigid circuit board

1111: Inscribed edge

112: Flexible circuit board

1121: Electrical contacts

113: Photosensitive element

1131: Conductive thread

114: filter element

115: Lens

1151: Outside edge

116: Shell

1161: Inner shell wall

117: Gap glue

A: sunken area

Claims (10)

A flex-rigid board lens module, comprising: a flex-rigid board unit with two rigid circuit boards and a flexible circuit board, the flexible circuit board is located between the two rigid circuit boards and combined with the two rigid circuit boards , and the flexible circuit board defines a second thickness smaller than a first thickness defined by each rigid circuit board; a photosensitive element is attached to the flexible circuit board and is electrically connected to the flexible circuit board; a lens is aligned with the The photosensitive element is fixed on the flexible circuit board, and there are two gaps between the lens and the two rigid circuit boards respectively filled with a gap glue, and the gap between the flexible circuit board and the two rigid circuit boards is strengthened by the gap glue of the two junctions. The rigid-flex panel lens module according to claim 1, wherein the photosensitive element is covered with a filter element. The rigid-flex board lens module as claimed in claim 2, wherein the lens is located on a light-sensing path of the light-sensing element, and the filter element is located between the lens and the light-sensing element. The flex-rigid board lens module as claimed in claim 1, wherein the flex circuit board and the two rigid circuit boards are combined together by means of bonding without connectors or without soldering. The flex-rigid board lens module as claimed in claim 1, wherein the photosensitive element has a plurality of conductive wires electrically connected to the flexible circuit board. The flex-rigid board lens module as claimed in claim 1, wherein each rigid circuit board is covered by a casing, the gaps are located between the lens and the casing, and the gap glue is filled between the lens and the casing. between the shells. The flex-rigid board lens module of claim 6, wherein each rigid circuit board has an inscribed edge adjacent to the flexible circuit board, and the lens has two outer edges spaced apart from the inner edges of the adjacent rigid circuit boards, respectively. connecting edges, and the gaps are respectively located between the two outer edges of the lens and the inner connecting edges of the two rigid circuit boards. The flex-rigid board lens module as claimed in claim 7, wherein each shell has an inner shell wall that is flush with the inscribed edge of the rigid circuit board, and is spaced apart corresponding to the two outer sides of the lens, and the like The gap glue is respectively filled between the inner shell wall of the housing and the outer edge of the lens. The rigid-flex panel lens module according to claim 1, wherein the gap glue is a curing glue. The flex-rigid board lens module as claimed in claim 1, wherein the flexible circuit board forms a recessed area.

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