CN113225905A - Rigid-flex board lens module - Google Patents

Abstract

The invention provides a lens module of a rigid-flex board, which comprises a rigid-flex board unit, a flexible circuit board, a photosensitive element and a lens, wherein the rigid-flex board unit is provided with two rigid circuit boards and the flexible circuit board is combined between the two rigid circuit boards, the photosensitive element and the lens are arranged on the flexible circuit board, two gaps are arranged between the lens and the two rigid circuit boards and are respectively filled with a gap adhesive, so that two combined positions between the flexible circuit board and the two rigid circuit boards are reinforced, and the lens module of the rigid-flex board is integrated into a whole after the gap adhesive is solidified.

Description

Rigid-flex board lens module

Technical Field

The invention relates to the field of lenses, in particular to a rigid-flex board lens module.

Background

The camera lens is an important functional element of electronic products such as mobile phones, flat panels and notebooks, and with the rapid development of the consumer industry, the camera industry is also driven to grow highly. In particular, in the case of thinning of these electronic products, the size of an imaging lens mounted in the electronic product needs to be further thinned.

The traditional camera lens module has the following three packaging methods: 1. a Chip Scale Package (CSP) method, a Chip On Board (COB) method, and a Flip Chip (Flip Chip) method.

The CSP package has the advantages that the packaging section is completed by the front-end process, and the CSP packaged wafer has lower requirement on cleanliness because the CSP packaged wafer is covered by glass. The yield is also good, the cost of the processing equipment is low, the processing time is short, and the challenges are poor light transmittance, high price, high height and backlight penetration ghost phenomenon.

The Flip Chip construction method has complex process and high cost, so that the common company is difficult to adopt the process.

The COB package has the advantages of better image quality, lower packaging cost and lower module height, and in addition, a brand factory gradually requires a module manufacturer to assemble and deliver COB manufacture procedures, so that the COB manufacture procedures become a trend of development of camera module manufacture procedures in the future. The post-process of the COB packaging process has two FPCB attaching processes, which are respectively: hot Bar (solder paste Hot pressing), 2 ACF (anisotropic conductive paste Hot pressing)/ACP (anisotropic conductive paste Hot pressing). Hot Bar is basically not adopted at present due to low reliability; the ACF/ACP requires additional equipment to be purchased, which leads to a sudden cost increase. Moreover, the conventional packaging technology such as the wafer level packaging technology is directly assembled according to the set tolerance parameters, and as the number of the overlapped parts is increased, the final matching tolerance is increased, the final shooting effect of the image is achieved, and the common COB technology has no advantages and characteristics in the thickness of the module. The final lens mounting is also not distinctive.

As the packaging yield of the camera lens parts is lower and the overall thickness is increased, how to make the overall thickness of the camera lens thinner and improve the yield is a direction in which the present inventors and related manufacturers engaged in the industry are eagerly interested to research and improve.

Disclosure of Invention

In order to solve the above problems, an object of the present invention is to provide a thin rigid-flex board lens module with integrated strength.

To achieve the above object, the present invention provides a rigid-flex board lens module, comprising: the flexible circuit board is positioned between the two hard circuit boards and is combined with the two hard circuit boards together, and the flexible circuit board defines a second thickness which is smaller than a first thickness defined by each hard circuit board; a photosensitive element attached to the flexible circuit board and electrically connected with the flexible circuit board; and the lens is aligned with the photosensitive element and fixed on the flexible circuit board, two gaps are formed between the lens and the two hard circuit boards, and the two gaps are filled with gap glue respectively, so that two joints between the flexible circuit board and the two hard circuit boards are reinforced by the gap glue.

The photosensitive element is covered with a filter element.

The lens is positioned in a photosensitive path of the photosensitive element, and the photosensitive element is positioned between the lens and the filter element.

The flexible circuit board and the two rigid circuit boards are combined together by a combination means without a connector or soldering.

The flexible circuit board and the photosensitive element are electrically connected together by a plurality of conductive wires.

Each hard circuit board is covered by a shell, the gaps are positioned between the lens and the shell, and the gap glue is filled between the lens and the shell.

The hard circuit board has an inner connecting edge adjacent to the flexible circuit board, the lens has two outer sides respectively spaced from the inner connecting edges of the hard circuit boards, and the gaps are respectively located between the two outer sides of the lens and the inner connecting edges of the hard circuit boards.

Each shell has an inner side shell wall which is cut to be equal to the inner connecting edge of the hard circuit board and respectively corresponds to two outer side edges of the lens at intervals, and the gap adhesives are respectively filled between the inner side shell wall of the shell and the outer side edges of the lens.

The gap glue is a curing glue.

The flexible circuit board forms a concave area.

The invention strengthens two joints between the flexible circuit board and the two hard circuit boards by reinforcing, and leads the lens module of the flexible and hard combined boards to be an integrated structure after the gap glue is solidified.

Drawings

FIGS. 1A-1C are exploded views and partially enlarged views of the present invention;

fig. 2A-2C are schematic diagrams of the combination of the present invention and a partial enlarged view thereof.

Description of reference numerals: a rigid-flex board lens module 10; a rigid-flex board unit 11; a hard type circuit board 111; an inscribed edge 1111; a flexible circuit board 112; electrical contacts 1121; a light-sensing element 113; electrically conductive lines 1131; a filter element 114; a lens 115; outer side 1151; a housing 116; an inner housing wall 1161; a gap paste 117; the gap 118; a recessed region A; a first thickness H1; second thickness H2.

Detailed Description

The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.

In the present invention, unless otherwise expressly specified or limited, the terms "disposed," "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected or detachably connected; may be a mechanical connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood according to specific situations by those having ordinary skill in the art.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "plurality" or "plural" means two or more unless specifically defined otherwise.

FIGS. 1A-1C are exploded views and partially enlarged views of the present invention; fig. 2A-2C are schematic diagrams of the combination of the present invention and a partial enlarged view thereof. As shown in the drawings, the lens module 10 of the present invention includes a Rigid-flex PCB (ridge-flex PCB) unit 11 as an element carrier, and the Rigid-flex PCB unit 11 is a printed circuit board in which two or more Rigid circuit boards are electrically connected through a flexible portion. The present embodiment shows that the flexible-rigid board unit 11 has two rigid circuit boards (PCBs) 111 and a flexible circuit board (FPC)112, and the flexible circuit board 112 is located between the two rigid circuit boards 111. The flexible printed circuit 112 and the two rigid printed circuit 111 are bonded together by a bonding method without a connector or soldering, such as: the flexible printed circuit board 112 and the circuit layers to be connected to the two rigid printed circuit boards 111 are drilled in advance, aligned by a precision positioning device and then bonded, and circuit connection is performed by using through-plated holes between the layers.

The hard circuit board 111 defines a first thickness H1, the flexible circuit board 112 defines a second thickness H2 smaller than the first thickness H1, and the difference between the thicknesses makes the flexible circuit board 112 form a recessed area a (see fig. 1C) relative to the hard circuit board 111.

Two cases 116 respectively cover the hard circuit board 111, and the case 116 is, for example, a metal (iron) case or a plastic case, and can be used to shield electronic components on the hard circuit board 111. The housing 116 protects the electronic components on the hard circuit board 111 and shields electromagnetic waves generated by the electronic components, thereby preventing the electromagnetic waves from interfering with the operation of the photosensitive element 113. Each of the rigid circuit boards 111 has an inner edge 1111 adjacent to the flexible circuit board 112, and each of the housings 116 has an inner wall 1161 aligned with the inner edge 1111 of the rigid circuit board.

A photosensitive element 113 attached to the flexible printed circuit 112 and electrically connected to the flexible printed circuit 112, wherein the photosensitive element 113 is covered with a Filter element 114, the photosensitive element 113 is, for example, a CCD or a CMOS, and the Filter element 114 is, for example, an infrared Filter (IR Cut Filter) for filtering out infrared rays and retaining visible colors. In one embodiment, the flexible printed circuit 112 is provided with a plurality of electrical (or metal) contacts 1121, and the photosensitive element 113 has a plurality of conductive wires (or electrical pins) 1131 electrically connected to the electrical contacts 1121 of the flexible printed circuit 112 correspondingly.

A lens 115 is aligned with the photosensitive element 113 and fixed on the flexible printed circuit 112, the lens 115 is located in a photosensitive path of the photosensitive element 113, and the filter element 114 is located between the lens 115 and the photosensitive element 113. Two gaps 118 are formed between the lens 115 and the two hard circuit boards 111 and the two shells 116 to fill up a gap paste 117 respectively. The gap paste 117 is, for example but not limited to, a curing paste that can be transformed from a liquid state to a solid state, and has strong adhesion and fast curing speed. In one implementation the gap paste 117 is a UV curable paste.

In detail, the lens 115 has two outer sides 1151 respectively spaced from the inner edges 1111 of the hard circuit boards 111 and the inner walls 1161 of the shells 116, and the two gaps 118 are respectively located between the two outer sides 1151 of the lens 115 and the inner edges 1111 of the hard circuit boards 111 and the inner walls 1161 of the shells 116. The gap paste 117 in the two gaps 118 not only fills up the two outer sides 1151 of the lens 115 and the inner edges 1111 of the two hard circuit boards 111, but also fills up the space between the two outer sides 1151 of the lens 115 and the inner walls 1161 of the two shells 116. Thus, the gap paste 117 can reinforce the joint between the flexible printed circuit 112 and the two rigid printed circuit 111. And the cured gap glue 117 makes the rigid-flex board lens module 10 of the present invention an integrated structure.

The lens module of the present invention can reduce the thickness of the whole rigid-flex board lens module to achieve the purpose of thinning by disposing the lens 115, the photosensitive element 113 and the filter 114 on the flexible circuit board 112 with a smaller thickness. The gap glue 117 is used to reinforce the joint between the flexible circuit board 112 and the two rigid circuit boards 111, so that the rigid-flex board lens module 10 is an integrated structure.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A rigid-flex board lens module, comprising:

the flexible circuit board is positioned between the two hard circuit boards and is combined with the two hard circuit boards together, and the flexible circuit board defines a second thickness which is smaller than a first thickness defined by each hard circuit board;

a photosensitive element attached to the flexible circuit board and electrically connected with the flexible circuit board;

and the lens is aligned with the photosensitive element and fixed on the flexible circuit board, two gaps between the lens and the two hard circuit boards are respectively filled with a gap adhesive, and two joints between the flexible circuit board and the two hard circuit boards are reinforced by the gap adhesive.

2. The blade lens module as recited in claim 1, wherein: the photosensitive element is covered with a filter element.

3. The rigid-flex board lens module according to claim 2, wherein: the lens is located in a photosensitive path of the photosensitive element, and the photosensitive element is located between the lens and the filter element.

4. The blade lens module as recited in claim 1, wherein: the flexible circuit board and the two rigid circuit boards are combined together by a combination means without a connector or soldering.

5. The blade lens module as recited in claim 1, wherein: the photosensitive element has a plurality of conductive wires electrically connected to the flexible printed circuit board.

6. The blade lens module as recited in claim 1, wherein: each hard circuit board is covered by a shell, the two gaps are positioned between the lens and the shell, and the gap glue is filled between the lens and the shell.

7. The blade lens module as recited in claim 6, wherein: each hard circuit board has an inner connecting edge adjacent to the flexible circuit board, the lens has two outer sides respectively spaced from the inner connecting edges of the two hard circuit boards, and the gap is respectively located between the two outer sides of the lens and the inner connecting edges of the two hard circuit boards.

8. The blade lens module as recited in claim 7, wherein: each shell is provided with an inner side shell wall which is aligned with the inner connecting edge of the hard circuit board, the inner side shell wall respectively corresponds to two outer side edges of the lens at intervals, and the gap glue is respectively filled between the inner side shell wall of the shell and the outer side edges of the lens.

9. The blade lens module as recited in claim 1, wherein: the gap glue is a curing glue.

10. The blade lens module as recited in claim 1, wherein: the flexible circuit board forms a concave area.

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