JP2010187304A - Electronic device, manufacturing method thereof, solid-state imaging apparatus employing the same, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a compact and high-quality electric connection while connecting a lens actuator and a main substrate in a three-dimensional manner, in a solid-state imaging apparatus having an automatic focusing function. <P>SOLUTION: An electrode terminal formed in a distal end of a flexible substrate is provided with a through-hole or a through-recess, so that an inter-electrode connection is enhanced to obtain a compact and secure electric connection without using a socket or the like. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device, a manufacturing method thereof, a solid-state imaging apparatus using the electronic device, and a manufacturing method thereof, and more particularly, a small-sized solid-state imaging with an automatic focusing function formed using a semiconductor imaging device such as a portable camera. The present invention relates to an apparatus and a manufacturing method thereof.

  In recent years, the demand for small cameras for mobile phones, in-vehicle components, etc. has been rapidly increasing. This type of small camera uses a solid-state imaging device that outputs an image input as an electrical signal by an optical system such as a lens by a solid-state imaging device. With the downsizing and higher performance of this imaging device, the camera is further downsized and used in various fields, expanding the market as a video input device. In a conventional image pickup apparatus using a semiconductor image pickup device, components such as an LSI on which a lens, a semiconductor image pickup device, a driving circuit thereof, a signal processing circuit, and the like are mounted are respectively formed in a housing or a structure and combined. Conventionally, such a mounting structure is formed by mounting each element on a printed circuit board on a flat plate.

  Furthermore, high functionality is required for portable small cameras, and it is necessary to cope with an increase in the number of imaging pixels, addition of an automatic focus adjustment function, and further miniaturization. The increase in the number of imaging pixels and the reduction in size can be dealt with by the evolution of solid-state imaging devices in accordance with the progress of semiconductor technology. On the other hand, regarding the autofocus function, it is necessary to provide an actuator in the lens and control the actuator in conjunction with the information of the solid-state imaging device. Therefore, it is necessary that the lens actuator and the solid-state imaging device are electrically connected through the main circuit board.

  In this case, the actuator of the lens and the main circuit board are not on the same plane and are in a positional relationship that is three-dimensionally separated. Therefore, it is necessary to make a three-dimensional electrical connection. Therefore, in order to perform three-dimensional electrical wiring, as a conventional method, a method of combining a flexible substrate and a socket is used (Patent Document 1). In manufacturing, a method of manually inserting the electrode at the tip of the flexible substrate into the socket is employed.

However, such a structure requires a sufficient space around the lens and the substrate, and becomes large as a camera module. Moreover, when inserting it into the socket by hand, it takes time, or even if there is a problem in electrical contact by being inclined, it has been difficult to understand in appearance.
JP-A-11-103136

  As described above, since the method of Patent Document 1 is large as a camera module, it cannot be reduced in size, and the manufacturing method takes time and costs are affected and quality is reduced. I had a problem. Moreover, even if it is going to connect the flexible substrates with an electrode terminal with conductive media, such as a solder and a conductive adhesive, if there is a conductive medium, it will be unable to join between electrode terminals closely and will become easy to peel. There was a problem that a reliable electrical connection could not be obtained.

The present invention has been made in view of the above circumstances, and when connecting the electrode terminal of the flexible board drawn out from the electronic element and the terminal of the flexible board drawn out from the main board on which another electronic element is mounted, The purpose is to ensure reliable electrical connection as well as miniaturization and quality improvement.
In particular, the present invention ensures a reliable electrical connection when connecting the electrode terminal of the flexible board drawn out from the lens actuator and the terminal of the flexible board drawn out from the main board on which the solid-state imaging device is mounted, and automatically The object is to reduce the size and quality of a solid-state imaging device with a focus adjustment function.

  Therefore, in the present invention, a method of directly joining the electrode terminal of the flexible board and the terminal of the flexible board drawn out from the main board on which the electronic element is mounted is taken, and either one of the electrode terminals has a through hole and a through recess. And is electrically connected with an electrical connection medium made of a fluidizable conductive material such as solder or conductive adhesive in between. Secure electrical connection is ensured by ensuring escape of the electrical connection medium.

  The present invention is an electronic device having a connection portion to which a first electrode terminal of a first flexible substrate and a second electrode terminal of a second flexible substrate are connected through an electrical connection medium, the first device A through-hole is formed in one of the first electrode terminal of the flexible substrate and the second electrode terminal of the second flexible substrate, and the first electrode terminal of the first flexible substrate and the second electrode terminal The second electrode terminal of the second flexible substrate is in electrical contact with each other through the electrical connection medium arranged to enter the through hole.

  According to this configuration, for example, an electrical connection medium such as solder can be securely connected between the electrode terminals while escaping to the through hole, and a connector or the like is not used. It can contribute to miniaturization and high quality of devices.

  The solid-state imaging device of the present invention includes a first electrode terminal of a first flexible substrate connected to a lens actuator, and a second flexible substrate connected to a main substrate on which a solid-state imaging element is mounted. The electrode terminal of the first flexible substrate is connected through an electrical connection medium, and a through hole is formed in either the first electrode terminal of the first flexible substrate or the second electrode terminal of the second flexible substrate. And the first flexible substrate electrode terminal and the second flexible electrode terminal are in electrical contact with each other.

  According to this configuration, for example, an electrical connection medium such as solder can be securely connected between the electrode terminals while escaping to the through-hole, and a connector or the like is not used. This contributes to downsizing and high quality of the solid-state imaging device with a focus adjustment function.

  In another solid-state imaging device according to the present invention, a through-dent is formed at the tip of the electrode terminal in which the through-hole is formed, and an electrode is present in the other electrode terminal corresponding to the recess. It is characterized by that.

  According to this configuration, the electrical connection medium can be allowed to escape also to the through-dent part, and the electrical connection medium forms a fillet shape at the tip, and the adhesive electrode terminal is easily peeled off. Since it is possible to ensure strong adhesiveness against peeling of the film, high reliability with respect to further electrical connection can be obtained.

  Another solid-state imaging device of the present invention is characterized in that a plurality of the through holes are formed.

  According to this configuration, a large allowance for the escape of the electrical connection medium can be obtained, and the yield can be improved in terms of manufacturing with respect to the connection between the electrode terminals.

  Another solid-state imaging device according to the present invention is provided between the first electrode terminal of the first flexible substrate and the second electrode terminal of the second flexible substrate, at the through hole portion and at the distal end portion of the through recess portion. It is characterized by the presence of solder.

  According to this structure, the solder joint which formed the surface of the electrode terminal and the alloy layer can be taken, and more reliable electrical connection reliability can be obtained.

  Another solid-state imaging device according to the present invention is conductive between the first electrode terminal of the first flexible substrate and the second electrode terminal of the second flexible substrate, the through-hole portion, and the through-dent portion. It is characterized by the presence of an adhesive.

  According to this configuration, electrical connection can be performed at a lower temperature, the facility can be simplified, the thermal influence on other components can be reduced, and the quality of the manufacturing process can be improved.

An electronic device manufacturing method according to the present invention includes an electronic device having a first electrode terminal of a first flexible substrate and a connection portion to which the second electrode terminal of the second flexible substrate is connected through an electrical connection medium. A manufacturing method comprising:
Supplying an electrical connection conductor to the first electrode terminal of the first flexible substrate;
A second flexible substrate having a second electrode terminal is overlaid on the first flexible substrate supplied with the electrical connection conductor, and is formed on one of the electrode terminals of the first or second flexible substrate. And heating the electrical connection conductor so that the electrical connection conductor enters the cured through hole.

  According to this configuration, an electrical connection conductor that can be cured after fluidizing solder or the like is supplied to a necessary portion, and electrical connection between the electrode terminals can be reliably ensured.

  The solid-state imaging device manufacturing method of the present invention is connected to the main substrate on which the solid-state imaging device is mounted and the step of solder printing on the first electrode terminal of the first flexible substrate connected to the lens actuator. The method includes a step of performing solder printing on a second flexible substrate, and a step of pressing and heating the first flexible substrate and the second flexible substrate in an overlapping manner.

  According to this configuration, the solder can be supplied to necessary portions, and the electrical connection between the electrode terminals can be reliably ensured.

  Another manufacturing method of the solid-state imaging device according to the present invention includes a step of applying a conductive adhesive to the first electrode terminal of the first flexible substrate connected to the lens actuator, and a main in which the solid-state imaging device is mounted. The method includes a step of applying a conductive adhesive to a second flexible substrate connected to the substrate, and a step of heating the first flexible substrate and the second flexible substrate in an overlapping manner.

  According to this configuration, it is possible to supply conductive adhesive to necessary parts and to heat the electrodes without applying pressure at a low temperature to connect the electrode terminals, simplify the equipment, and heat the other parts. The influence can be reduced and the quality of the manufacturing process can be improved.

  As described above, according to the solid-state imaging device and the manufacturing method thereof according to the present invention, a small and high-quality electrical connection can be performed in the three-dimensional shape of the lens actuator and the main substrate, and the high-quality solid-state imaging device. Can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a perspective view of a solid-state imaging device of the present invention.
A first flexible substrate 2 is electrically connected to the lens housing 1 with an actuator, and a first electrode terminal 3 is formed at the tip. On the other hand, a second flexible substrate 6 is electrically connected to the main circuit board 5 on which the solid-state imaging device 4 is mounted, and a second electrode having a through hole 8 and a through recess 9 at the tip. A terminal 7 is formed, and the first and second electrode terminals are connected via solder as an electrical connection medium.

FIG. 2 is an enlarged partial perspective view of the electrode terminal portion including the second electrode terminal 7 formed at the distal end portion of the flexible substrate of the present invention.
The first electrode terminal 3 is formed on the surface of the first flexible substrate 2 electrically connected to the lens housing with the actuator, and the solder 10 is printed on the surface. On the other hand, a second electrode terminal 7 is formed at the tip of the second flexible substrate 6 electrically connected to the main circuit board on which the solid-state imaging device is mounted. A through hole 8 is formed, and a through recess 9 is formed at the tip. Moreover, the solder 11 is printed on the surface.

FIG. 3 is a partial perspective view showing a state in which the flexible boards of the present invention are connected to each other. 4 is a cross-sectional view of FIG.
The first flexible substrate 2 and the second flexible substrate 6 are electrically connected by being heated and pressurized so that the electrode terminals face each other. The solder 12 is solder that protrudes during connection. Similarly, the solder 13 protrudes at the time of connection to form a fillet. Between the electrode terminals, the entire surface of the solder 14 is filled with a uniform thickness to ensure an appropriate electrical connection state. Then, as shown in FIG. 4, the solder 12 and the solder 13 flow into the through hole 8 and the through recess 9 of the second flexible substrate 6 to form a fillet. Furthermore, the solder protrudes higher than the outer side surface of the second flexible substrate 6, and this constitutes a locking portion. Thus, the presence of the solder 12 and the solder 13 strengthens the close contact between the first flexible substrate 2 and the second flexible substrate 6.

FIG. 5 is a completed perspective view of the solid-state imaging device of the present invention.
The main circuit board 5 on which the solid-state imaging device 4 is mounted and the lens housing 1 with an actuator are electrically connected by an electrical connection portion 15 of a flexible board. The electrical connection portion 15 has the structure and state as described above, ensures electrical connection, and is firmly attached.
In the present embodiment, the electrode terminal portion is simply one terminal. However, the connection is actually a plurality of terminals, and the present invention can be implemented even in that case.
In the present embodiment, the number of through holes in the electrode terminal is one. However, the same effect can be obtained even if a plurality of through holes are provided, but the connection strength is much higher.
In this embodiment, the solder is used as the electrical connection medium. However, the same effect can be obtained even when a conductive adhesive is used as the conductive medium. In that case, the same effect can be obtained by applying the effect of the adhesive only by heating without applying pressure so as not to adhere to the heating tool.

  By adopting such a configuration and manufacturing method, it is possible to electrically connect the lens actuator and the main board in a small size and three-dimensionally with high quality. Therefore, it is possible to manufacture a small-sized solid-state imaging device having an automatic focus adjustment function.

(Second Embodiment)
Next, a second embodiment of the present invention will be described.
FIG. 6 is a cross-sectional view showing a state in which the flexible boards of the present invention are connected to each other. In the present embodiment, by adjusting the amount of solder and curing the solder while applying pressure, as shown in FIG. 6, it spreads at a portion that protrudes higher than the outer surface of the second flexible substrate 6. By making it larger than the diameter of the through-hole 12 and constituting the locking portion, a stronger removal preventing effect can be achieved. Thus, the presence of the solder 12 and the solder 13 strengthens the close contact between the first flexible substrate 2 and the second flexible substrate 6.
Also here, the first flexible substrate 2 and the second flexible substrate 6 are electrically connected by being heated and pressurized so that the electrode terminals face each other. The solder 12 is solder that protrudes during connection. Similarly, the solder 13 protrudes at the time of connection and forms a fillet. Between the electrode terminals, the entire surface of the solder 14 is filled with a uniform thickness to ensure an appropriate electrical connection state. Then, as shown in FIG. 6, the solder 12 and the solder 13 flow into the through hole 8 and the through recess 9 of the second flexible substrate 6 to form a fillet, and from the outer surface of the second flexible substrate 6. Furthermore, it expands at the part that protrudes higher, and this constitutes a locking portion having an H-shaped cross section, thereby providing a more reliable prevention effect.
Thus, the presence of the solder 12 and the solder 13 strengthens the close contact between the first flexible substrate 2 and the second flexible substrate 6.

  In the above embodiment, the connection of the solid-state imaging device has been described. However, the present invention is not limited to the solid-state imaging device. It is effective for general connection.

  As described above, according to the present invention, since a small and reliable connection can be realized, the present invention is not limited to a solid-state imaging device, but includes electronic terminals such as personal computers and mobile phones, as well as home appliances. It is effective for electrical connection in various electronic devices.

1 is a perspective view showing a solid-state imaging device according to a first embodiment of the present invention. It is the fragmentary perspective view which expanded the electrode terminal part formed in the front-end | tip part of the flexible substrate of this invention. It is the fragmentary perspective view which showed the state which connected the flexible substrates of this invention. It is the fragmentary sectional view which showed the state which connected the flexible substrates of this invention. It is a perspective view of the completion figure of the solid-state imaging device of the present invention. It is the fragmentary sectional view which showed the state which connected the flexible substrates in the 2nd Embodiment of this invention.

DESCRIPTION OF SYMBOLS 1 Lens housing | casing 2 with an actuator 1st flexible substrate 3 1st electrode terminal 4 Solid-state image sensor 5 Main circuit board 6 2nd flexible substrate 7 2nd electrode terminal 8 Through-hole 9 Through-dent part 10, 11, 12 , 13, 14 Solder 15 Electrical connection

Claims (9)

An electronic device having a connection portion to which a first electrode terminal of a first flexible substrate and a second electrode terminal of a second flexible substrate are connected through an electrical connection medium,
A through-hole is formed in either the first electrode terminal of the first flexible substrate or the second electrode terminal of the second flexible substrate, and the first electrode of the first flexible substrate The terminal and the second electrode terminal of the second flexible substrate are in electrical contact with each other through the electrical connection medium disposed so as to enter the through hole. device. The first electrode terminal of the first flexible substrate connected to the lens actuator and the second electrode terminal of the second flexible substrate connected to the main substrate on which the solid-state imaging device is mounted are electrically connected. A solid-state imaging device connected through
A through-hole is formed in either the first electrode terminal of the first flexible substrate or the second electrode terminal of the second flexible substrate, and the first electrode of the first flexible substrate The autofocus, wherein the terminal and the second electrode terminal of the second flexible substrate are in electrical contact with each other through the electrical connection medium disposed so as to enter the through hole. Solid-state imaging device with adjustment function. The solid-state imaging device according to claim 2,
A solid-state imaging device with an automatic focusing function, wherein a through-dent is formed at the tip of the electrode terminal in which the through-hole is formed, and the electrode is present at the other electrode terminal corresponding to the recess. The solid-state imaging device according to claim 2 or 3,
A solid-state imaging device with an automatic focus adjustment function in which a plurality of the through holes are formed. The solid-state imaging device according to any one of claims 2 to 4,
A solid-state imaging device with an automatic focus adjustment function in which solder exists between the first electrode terminal of the first flexible substrate and the second electrode terminal of the second flexible substrate, in the through hole portion, and in the through recess portion. . The solid-state imaging device according to any one of claims 2 to 4,
With an automatic focus adjustment function in which a conductive adhesive is present between the first electrode terminal of the first flexible substrate and the second electrode terminal of the second flexible substrate, in the through hole portion, and in the through recess portion. Solid-state imaging device. A method for manufacturing an electronic device having a connection portion in which a first electrode terminal of a first flexible substrate and a second electrode terminal of a second flexible substrate are connected through an electrical connection medium,
Supplying an electrical connection conductor to the first electrode terminal of the first flexible substrate;
A second flexible substrate having a second electrode terminal is overlaid on the first flexible substrate supplied with the electrical connection conductor, and formed on one of the electrode terminals of the first or second flexible substrate. And a step of heating the electrical connection conductor so that the electrical connection conductor enters and cures in the through hole.   Solder printing on the first electrode terminal of the first flexible substrate connected to the lens actuator, and solder printing on the second flexible substrate connected to the main substrate on which the solid-state imaging device is mounted, and A method of manufacturing a solid-state imaging device with an automatic focus adjustment function, comprising: a step of pressing and heating the first flexible substrate and the second flexible substrate so that the solder enters the through hole.   Applying a conductive adhesive to the first electrode terminal of the first flexible substrate connected to the lens actuator, and conducting to the second flexible substrate connected to the main substrate on which the solid-state imaging device is mounted A solid with an automatic focus adjustment function comprising: a step of applying a conductive adhesive; and a step of heating the conductive adhesive so as to enter the through-hole by overlapping the first flexible substrate and the second flexible substrate. Manufacturing method of imaging apparatus.

Images