JP6628608B2 - Electronic equipment and imaging device - Google Patents

Description

  The present invention relates to an electronic device and an imaging device, and more particularly to an electronic device that accommodates a circuit board on which an electronic circuit is mounted in a housing.

  2. Description of the Related Art In recent years, performance of electronic devices represented by digital cameras and the like has been improved along with miniaturization. The component mounting density of printed circuit boards tends to be higher due to miniaturization. The heat generation amount of the semiconductor element tends to increase due to the performance improvement. Such an increase in the amount of heat generated may cause a malfunction of the electronic device or damage the semiconductor element itself. Therefore, it is necessary to effectively diffuse local heat generated by the semiconductor element. As a technique for diffusing local heat generation over a wide area in a housing, a configuration in which a part of a member having high thermal conductivity is directly or indirectly contacted with a heat source is known (see Patent Document 1).

  Usually, an electronic device includes a substrate on which a plurality of electronic components are mounted, and a chassis member is electrically connected to ground wiring of the substrate. In addition, there are many conductive members inside the electronic device. If one electrical connection is made to all the conductive members including the heat sink, the number of screwed parts between parts and the number of adhesive parts such as conductive double-sided tape may increase. is there. Thus, a method of electrically connecting components having conductivity while suppressing an increase in the number of components has already been disclosed (see Patent Document 2).

JP 2007-174526 A International Publication No. 2009-063734

  In Patent Literature 1, a solid-state imaging device and a heat radiator are connected via a heat radiator to conduct heat generated by the solid-state image sensor to the heat radiator. As a material applied to the heat sink, a metal having relatively high thermal conductivity is often used. When the conductive heat sink is not electrically connected to the metal chassis of the electronic device, it becomes a floating metal member and becomes an antenna for unnecessary electromagnetic waves, transmitting unnecessary electromagnetic waves to various parts of the electronic device. Transmission path. Therefore, it is desirable that the heat radiating plate is directly or indirectly connected to a metal chassis constituting the electronic device.

  Patent Document 2 discloses a method in which one connection member is used to simultaneously electrically connect a printed circuit board and two housings. This connection member is fixed to the printed circuit board by screw fastening, and has a connection portion whose tip branches into two. The connection portions are electrically connected to separate housings, respectively, so that the printed circuit board and the two housings are simultaneously electrically connected. In this case, since the connection member is disposed between the screw fastening portion of the printed circuit board and the housing, there is a possibility that the miniaturization of the device may be hindered.

  The present invention has been made in view of the above circumstances, and has as its object to provide an electronic device that can be electrically connected to a plurality of conductive components without hindering downsizing of the electronic device body.

  In order to solve the above problems, an electronic device according to the present invention includes a first component having a conductive region, a first component having a first opening in the conductive region, and a conductive region. A second component having a second opening in the conductive region, a second component having a step portion partially contacting the second opening, and a third component including the conductive region. A conductive elastic body including a region having conductivity, the second component, wherein the stepped portion is inserted into the first opening, The conductive elastic body is disposed between the component and the third component, and a part of the conductive elastic body extends from the second opening toward the second opening, and It is characterized by being held in pressure contact between the step and the third component.

  According to the present invention, it is possible to provide an electronic device capable of electrically connecting a plurality of conductive parts without hindering downsizing of the electronic device body.

1 is an external perspective view of an imaging device according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of a back cover unit in the imaging device in FIG. 1. It is the schematic diagram and sectional drawing of the area | region where a gasket is arrange | positioned at a back cover unit. It is a perspective view showing the state where a back cover unit is built in a main part. It is a schematic diagram and a sectional view of an area where a gasket is arranged in the imaging device. It is the top view and side view which show a display unit. It is sectional drawing of the imaging device which concerns on the modification of a main chassis.

  Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings and the like. The present invention is applicable to an imaging apparatus such as a digital single-lens reflex camera, a digital still camera, and a digital video camera, but is not limited to this, and accommodates a circuit board on which an electronic circuit is mounted in a housing. The present invention can be widely applied to electronic devices.

(1st Embodiment)
Hereinafter, an electronic device according to the present embodiment will be described with reference to FIGS. FIG. 1 is an external perspective view of an imaging device 100 according to the present embodiment. The imaging apparatus 100 includes an apparatus main body 1 (hereinafter, referred to as “main body 1”), a lens barrel unit 2 provided at a front central portion of the main body 1, and a back cover unit 50 provided on a back surface of the main body 1. It is configured. The display unit 3 (third component) is one of the components constituting the back cover unit 50.

  The lens barrel unit 2 has a structure in which a plurality of lens groups (not shown) contained therein can be moved in the optical axis direction, and a shooting position protruding from the main body 1 and a plurality of lens groups are housed inside the main body 1. The main body 1 is configured to be capable of transitioning to a retracted storage position in the main body 1. The display unit 3 has a display device such as a liquid crystal display. The display device displays information such as a live view image, a captured image, and shooting conditions based on an imaging signal output from an imaging element (not shown) built in the main body 1.

  FIG. 2 is an exploded perspective view of the back cover unit 50 in the imaging device 100 of FIG. The display unit 3 is configured to be assembled to the main body 1 after being assembled as a back cover unit 50 together with other mechanical components. The display unit 3 is fixed to the back cover 4 with a double-sided tape (not shown) processed into a frame shape. The inside of the main body of the display unit 3 is covered with a conductive metal cover 3c. The display unit 3 has flexible printed boards 3a and 3b. The flexible printed boards 3a and 3b are flexible, and the front ends of the flexible printed boards 3a and 3b extend from the opening formed in the back cover 4 toward the inside of the main body 1, and a control board (not shown) It is configured to be connected to.

  The radiator plate (second component) 5 is configured to be assembled to the back cover 4 from the inside of the main body. In the present embodiment, the material of the heat radiating plate 5 is a conductive metal heat radiating member, and is processed into a desired shape by press working or the like. After the heat radiating plate 5 and the sub-chassis 7 are aligned with the rear cover 4, the screws 8a, 8b and 8c are fastened to the rear cover 4, whereby the heat radiating plate 5 and the sub-chassis 7 are fixed to the rear cover 4. You.

  When the back cover unit 50 is completely assembled, a certain gap is secured between the inner surface of the display unit 3 and the outer surface of the heat sink 5. A gasket (conductive elastic body) 6 is attached to the heat sink 5 in advance. The gasket 6 is a composite member formed by winding a material having conductivity, such as a conductive cloth, on a material such as polyurethane having elasticity. In the present embodiment, the gasket 6 is attached to the heat sink 5 with a conductive double-sided tape. The gasket 6 has a thickness greater than a gap formed between the plane inside the main body of the display unit 3 and the plane outside the main body of the heat sink 5. When fixed to the back cover 4, the gasket 6 is pressed between the metal cover 3 c and the radiator plate 5 to electrically connect the metal cover 3 c and the radiator plate 5.

  FIG. 3 is a schematic view and a cross-sectional view of a region in the back cover unit 50 where the gasket 6 is arranged. FIG. 3B is a cross-sectional view taken along the line AA in FIG. The opening (second opening) 5 a is an opening formed in the heat sink 5. A step 5b is formed in a part of the peripheral portion of the opening 5a. The step portion 5b has a step shape protruding in a direction away from the display unit 3, and is formed by subjecting the heat sink 5 to drawing or half blanking. The heat radiating plate 5 forms the gap 5c between the step 5b and the display unit 3 by forming the step 5b. A part of the gasket 6 is disposed in the gap 5c, and is attached and held on a flat surface of the step 5b on the display unit 3 side.

  Further, a part of the gasket 6 extends from the step 5b to the opening 5a side (the second opening side). The gasket 6 has a thickness T larger than a distance D between a plane of the step portion 5b on the display unit 3 side and a plane of the display unit 3 on the heat radiating plate 5 side. When the heat radiating plate 5 to which the gasket 6 is attached is attached to the back cover, the gasket 6 in the gap 5c is pressed and held by the difference between the thickness T and the distance D. The gasket 6 is pressed (pressed) between the metal cover 3c of the display unit 3 and the heat radiating plate 5 and held, so that the electrical connection can be stably maintained.

  FIG. 4 is a perspective view illustrating a state in which the back cover unit 50 is incorporated into the main body 1. The main body 1 has a main chassis (first component) 9 and a control board 10. The main chassis 9 is made of a conductive metal, and holds each unit (not shown) constituting the main body 1. In FIG. 4, for convenience, components other than the main chassis 9 and the control board 10 are omitted from the components constituting the main body 1, and the outer shape of the main body 1 is schematically indicated by a two-dot chain line. The main chassis 9 has a plurality of fastening portions.

  The control board 10 is mounted on the main chassis 9 together with other mechanical components. A part of the ground wiring pattern of the control board 10 has a conductor exposed, and is configured to come into contact with the fastening portion of the main chassis 9. The ground wiring pattern of the control board 10 is electrically connected to the main chassis 9 by being assembled to the main chassis 9. The fastening part 9a is one of a plurality of fastening parts, and the fastening part 9a has a hole formed by burring or the like. The inner side surface of the hole is tapped so that a screw can be fastened.

  On the other hand, the back cover unit 50 has a plurality of fastening portions. The fastening portion 50a is one of a plurality of fastening portions, and a through hole is formed in the fastening portion 50a. When the back cover unit 50 is incorporated into the main body 1, the fastening portion 50a is coaxial with the center of the hole of the fastening portion 9a and the center of the hole of the fastening portion 50a. At this time, the fastening portion 50a is located outside the main body with respect to the fastening portion 9a.

  When the rear cover unit 50 is completely assembled, the rear cover unit 50 is fixed to the main chassis 9 together with an external cover (not shown) by screws. Next, an opening (first opening) 9 b is formed in the main chassis 9. The opening 9b is an opening larger than the step 5b formed in the heat sink 5. When the back cover unit 50 is incorporated into the main body 1, the position of the opening 9b is set so that the step 5b enters (is inserted into) the inside of the opening 9b. Note that the opening 9b formed in the main chassis 9 may be formed in a conductive region.

  FIG. 5 is a schematic diagram and a cross-sectional view of a region where the gasket 6 in the imaging device 100 is arranged. FIG. 5B is a sectional view taken along line BB in FIG. 5A. When the rear cover unit 50 is incorporated into the main body 1, the heat radiating plate 5 is disposed such that the plane of the step portion 5b on the display unit 3 side and the plane of the main chassis 9 on the display unit 3 side are substantially coplanar. Therefore, the distance D ′ between the display unit 3 side plane of the main chassis 9 and the heat sink 5 side plane of the display unit 3 in the area covering the opening 5 a is equal to the display unit 3 side plane of the step portion 5 b and the heat radiation of the display unit 3. The distance is almost the same as the distance D from the plane on the plate 5 side. When the back cover unit 50 is incorporated into the main body 1, a part of the gasket 6 extending from the step 5b toward the opening 5a is pressed and held by the difference between the thickness T and the distance D '.

  The gasket 6 is pressed between the metal cover 3c and the main chassis 9 to electrically connect the metal cover 3c to the main chassis 9. Further, as described above, since the gasket 6 electrically connects the metal cover 3c and the heat radiating plate 5, the gasket 6 simultaneously applies three parts to the metal cover 3c, the heat radiating plate 5, and the main chassis 9. An electrical connection can be made. The plane of the step portion 5b on the display unit 3 side is arranged to be substantially flush with the plane of the main chassis 9 on the display unit 3 side. Therefore, the gasket 6 can be uniformly pressed without bias.

  Therefore, it is possible to stably secure electrical connection to a plurality of conductive parts. The thickness of the heat radiating plate 5 is set to be equal to or smaller than the thickness of the main chassis 9. Since the plane of the step 5b on the side of the display unit 3 and the plane of the main chassis 9 on the side of the display unit 3 are arranged substantially on the same plane, the plane of the step 5b on the side of the main chassis 9 is equal to the thickness of the main chassis 9. Is configured to fall within the range. Therefore, it is possible to electrically connect a plurality of conductive parts without increasing the thickness of the imaging device 100 in the thickness direction of the main chassis 9.

  In this embodiment, the gasket 6 is attached to the heat sink 5 with a conductive double-sided tape. When attaching the gasket 6 to the main chassis 9, when assembling the back cover unit 50 to the main body 1, the gasket 6 is attached while a part of the gasket 6 is inserted into the gap 5c, so that the assembling work becomes very difficult. I will. When assembling the gasket 6 to the metal cover 3c, it is necessary to provide a mark for precisely defining a position where the gasket 6 is to be attached so that the gasket 6 is accommodated in the gap 5c. For example, processing such as providing a marking line or printing a frame line on the metal cover 3c is required, which may increase the manufacturing cost of the display unit 3. On the other hand, when the gasket 6 is attached to the heat radiating plate 5, the gasket 6 may be attached so that a part of the gasket 6 extends toward the opening 5a with respect to the step 5b. The gasket can be easily and accurately attached to a desired position without providing the gasket. Therefore, it is desirable that the gasket 6 be attached to the heat sink 5.

  FIG. 6 is a plan view showing the display unit 3. FIG. 6A is a side view of the display unit 3 shown in FIG. Note that the display unit 3 according to the present embodiment will be described using a unit in which a liquid crystal display module and a touch panel module are combined. However, the electronic apparatus according to the present embodiment is not limited to this. For example, the electronic apparatus is widely applied to a display device that can display an image signal or the like output from a control board (not shown) built in the main body 1. Can be applied.

  The display unit 3 includes a backlight module 30, a liquid crystal display 31, a touch panel 32, and flexible printed boards 3a and 3b. The backlight module 30, the liquid crystal display 31, and the touch panel 32 are united in a state where they are overlapped and bonded, and are integrated. The backlight module 30 includes a metal cover 3c. The flexible printed board 3b is connected to the backlight module 30. The flexible printed board 3a is connected to the liquid crystal display 31 and the touch panel 32. As described above, the flexible printed boards 3a and 3b are configured to be connected to a control board (not shown) when incorporated in the main body 1. The display area 3d is a display area of the display unit 3. The region 3e is a region where the liquid crystal display driving IC is mounted (hereinafter, referred to as an IC mounting unit). The liquid crystal display 31 includes a glass substrate (not shown) inside, and a plurality of electrode terminals are formed on the glass substrate. The IC mounting section 3e is connected to this electrode terminal by a COG (Chip On Glass) method or the like.

  For example, an image display or the like may be performed on the display unit 3 for a long time by operating the imaging apparatus 100. At this time, the load on the IC mounting part 3e increases, and the self-heating of the IC increases. Due to the heat generated by the IC, a temperature difference occurs between the vicinity of the IC mounting portion 3e and its vicinity and a region other than the vicinity of the IC mounting portion 3e of the liquid crystal display 31. Due to this influence, the characteristics of the liquid crystal display 31 are partially changed, and as a result, display quality such as display unevenness is reduced.

  Therefore, the imaging device 100 according to the present embodiment disperses the heat generated by the IC mounting portion 3e over a wide area of the heat sink 5 by disposing the heat sink 5 near the position facing the display unit 3. Thereby, the temperature difference in the liquid crystal display 31 is reduced, and the deterioration of display quality such as display unevenness is reduced. In FIG. 6B, a region P indicated by a two-dot chain line indicates a region where the gasket 6 is arranged in the state of the back cover unit 50. The gasket 6 is set at a position away from the IC mounting part 3e. As a result, the opening 5a and the step 5b of the heat sink 5 are also formed at positions away from the IC mounting portion 3e. If the opening 5a and the step 5b of the heat sink 5 are formed in the vicinity of the IC mounting part 3e, the heat generated in the IC mounting part 3e becomes difficult to transfer to the heat sink 5.

  Therefore, by setting the gasket 6 at a position away from the IC mounting portion 3e, heat generated in the IC mounting portion 3e can be more efficiently transferred to the heat radiating plate 5. As described above, according to the present embodiment, it is possible to provide an electronic device that can be electrically connected to a plurality of conductive parts without hindering the miniaturization of the electronic device body.

(2nd Embodiment)
Hereinafter, a main chassis 90 which is a modification of the main chassis 9 according to the present embodiment will be described with reference to FIG. The components other than the main chassis 90 in the imaging device to which the main chassis 90 is applied are the same as the components other than the main chassis 9 in the imaging device 100 described in the first embodiment. Omitted.

  FIG. 7 is a cross-sectional view of the imaging device 100 including the main chassis 90 according to the present embodiment. When the back cover unit 50 is incorporated in the main body 1, the plane of the step portion 5 b on the main body 1 side is arranged so as to secure a gap of the distance X in the direction toward the display unit 3 with respect to the main body 1 side plane. ing. By securing the gap of the distance X, after the rear cover unit 50 is assembled, the flat surface of the step portion 5b on the main body 1 side is configured not to protrude more than the flat surface of the main chassis 90 on the main body 1 side. I have. The distance X is determined in consideration of a processing tolerance, an assembly error, and the like of each part.

  In this way, the gap 5c is formed between the step 5b and the display unit 3, and the gasket 6 is disposed in the gap 5c. The thickness of the heat radiating plate 5 is set to be equal to or greater than the thickness of the main chassis 90. The main chassis 90 has a protruding portion 90c formed in a range in contact with the gasket 6. The protruding portion 90c has a protruding shape protruding in a direction toward the display unit 3, and is formed by subjecting the main chassis 90 to a drawing process, a half blanking process, or the like.

  The distance E 'between the plane of the projection 90c on the display unit 3 side and the plane of the display unit 3 on the heat sink 5 is equal to the distance E between the plane of the step unit 5b on the display unit 3 side and the plane of the display unit 3 on the heat sink 5 side. The protrusion amount of the protrusion 90c is set so as to be substantially the same distance. As described above, the gasket 6 electrically connects the metal cover 3c and the heat radiating plate 5 to the metal cover 3c, the heat radiating plate 5, and the main chassis 90 at the same time. An electrical connection can be made. In addition, the gasket 6 can be uniformly pressed without bias, and the electrical connection can be stably secured to a plurality of conductive parts. Then, it is possible to electrically connect a plurality of conductive parts without increasing the thickness of the imaging device 100 in the thickness direction of the main chassis 90.

  As described above, according to the present embodiment, it is possible to provide an electronic device that can be electrically connected to a plurality of conductive parts without hindering the miniaturization of the electronic device body. In the present embodiment, a configuration has been described in which three components can be simultaneously electrically connected. However, the number of components that make electrical connections at the same time is not limited to three, and a configuration that enables electrical connections to four or more components at the same time may be used. In addition, a gasket is taken up as an example of a component that enables electrical connection to a plurality of components at the same time, but is not limited to this. For example, a coil spring or a leaf spring obtained by the above method may be used.

  Although the preferred embodiments of the present invention have been described, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist.

3 Display unit (third part)
5 Heat sink (second component)
5a Opening (second opening)
5b Step 6 Gasket (conductive elastic body)
9 Main chassis (first part)
9b Opening (first opening)

Claims (8)

A first component including a region having conductivity and having a first opening in the region having conductivity;
A second component including a region having conductivity, a second opening in the region having conductivity, and a second part having a step portion partially contacting the second opening;
A third component including a conductive region;
Having elasticity, a conductive elastic body including a region having conductivity,
With
The second component is disposed between the first component and the third component such that the step portion is inserted into the first opening,
A part of the conductive elastic body extends from the step portion to the second opening side, and is pressed into contact with the first component, the step portion, and the third component. An electronic device characterized by being held. The electronic device according to claim 1, wherein the conductive elastic body is attached and fixed to the second component with a conductive double-sided tape. In the state where the conductive elastic body is pressed, the distance between the region where the step portion contacts the conductive elastic body and the third component is such that the first component is the same as the conductive elastic body. 3. The electronic device according to claim 1, wherein the step of the step portion is set so as to be equal to a distance between a contact area and the third component. 4. The said 1st component has a projection part which protrudes in the direction toward the said 3rd component with respect to the range containing the area | region which contacts the said conductive elastic body, or a part thereof, The said 1st component is characterized by the above-mentioned. 4. The electronic device according to any one of 3. In the state where the conductive elastic body is pressed, the projecting portion and the third component are so arranged that the distance between the projecting portion and the third component is the same as the distance between the step portion and the third component. The electronic device according to claim 4, wherein an amount of protrusion of the portion is set. At least one of the first component, the second component, and the third component has an area serving as a heat source therein,
The electronic device according to claim 1, wherein the conductive elastic body is disposed at a position away from an area overlapping the heat source. It further includes a control board on which electronic components are mounted,
The first component is a main chassis to which the control board is fixed, the second component is a heat dissipation member disposed inside the electronic device, and the third component is the control chassis. The electronic device according to claim 1, wherein the electronic device is a display device that displays information output from a substrate. An imaging device comprising the electronic device according to claim 1.

Images