JP5188412B2 - Imaging apparatus and electronic apparatus - Google Patents

Description

  The present invention relates to an image pickup apparatus and an electronic apparatus provided with a board on which electronic components are mounted, and a connection board connected to the board.

  While higher performance and more multifunctional imaging devices are desired, photoelectric conversion elements with higher pixels, faster drive and signal processing, faster image processing, and more functions are being promoted. As a result, the power consumption of the electronic component responsible for the function increases, and as a result, heat generation from the electronic component increases. Therefore, a cooling structure that suppresses the temperature rise of the electronic component is required for the imaging apparatus.

  At the same time, as the image pickup apparatus is desired to be reduced in size and thickness, if the device is reduced in size and thickness, a layout in which the exterior housing and the substrate on which electronic components are mounted is brought closer. As a result, the exterior casing and the heat source approach each other, and the temperature of the exterior casing surface rises due to heat generated from the heat source. In order to prevent this, a cooling structure that suppresses an increase in the surface temperature of the exterior housing is also required.

As a cooling structure that suppresses the temperature rise of electronic components and the local temperature rise of the exterior housing, the heat diffusion sheet is pressed against the heat generating components, and heat is transported to the low temperature surface of the exterior housing using the heat diffusion sheet It has been known. By doing so, the electronic component can be cooled and a local peak of the housing surface temperature can be suppressed. (Patent Document 1)
Japanese Patent Laid-Open No. 10-229287

  However, in the conventional cooling structure, since it is necessary to provide a heat diffusion sheet exclusively for cooling, there is a problem that the cost increases.

  At the same time as countermeasures against heat, it is also necessary to suppress an increase in unnecessary radiation from the drive pulse pattern of the photoelectric conversion element due to an increase in the drive clock of the photoelectric conversion element.

  The present invention has been made to solve the above problems, and without providing a special cooling member, the temperature of an electronic component that performs photoelectric conversion element driving or signal processing, and the proximity of the electronic component This suppresses a local temperature rise in the exterior surface temperature. Further, it is advantageous for suppressing increase in unnecessary radiation from the photoelectric conversion element driving pulse pattern of the connection substrate for connecting the photoelectric conversion element and the substrate on which the electronic component for performing photoelectric conversion element driving or signal processing is mounted. It is a structure.

  In order to solve the above problems, an imaging apparatus according to the present invention includes a photoelectric conversion element, a substrate on which an electronic component is mounted, and a connection substrate that connects the photoelectric conversion element and the substrate. In addition, at least a horizontal transfer pulse pattern of the photoelectric conversion element and a ground pattern disposed adjacent to the horizontal transfer pulse pattern are formed, and a conductor exposed portion that exposes a part of a conductor layer to the ground pattern is formed, The connection board is arranged so that the conductor exposed portion covers the surface of the electronic component.

  In addition, the electronic device of the present invention has a conductor exposed portion that exposes a part of the conductor layer on the connection substrate in an electronic device including a substrate on which an electronic component is mounted and a connection substrate connected to the substrate. A ground pattern is formed, and the connection substrate is arranged so that the conductor exposed portion covers the surface of the electronic component.

  According to the present invention, it is possible to suppress a local temperature rise in the exterior surface temperature close to the electronic component without providing a special cooling member.

  A first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view of an imaging apparatus (digital camera) as an electronic apparatus according to an embodiment of the present invention as seen from the front side. FIG. 2 is a front perspective view showing the configuration of the imaging apparatus as the electronic apparatus according to the embodiment of the present invention. FIG. 3 is a rear side exploded perspective view showing the configuration of the imaging apparatus according to the embodiment of the present invention. FIG. 4 is an exploded perspective view showing the configuration of the imaging unit according to the embodiment of the present invention. FIG. 5 is a view showing a flexible printed board on which the photoelectric conversion element according to the embodiment of the present invention is mounted. FIG. 5A is a diagram showing the photoelectric conversion element mounting surface side, and FIG. 5B is a diagram showing the back surface side. FIG. 6 is an exploded perspective view of the image pickup apparatus according to the embodiment of the present invention before the front cover unit is mounted. FIG. 7 is a rear side exploded perspective view showing a configuration of an imaging apparatus according to another embodiment of the present invention.

  In FIG. 1, reference numeral 101 denotes a digital camera, which is arranged so that the front part of the taking lens barrel is exposed from an opening provided on the front exterior of the digital camera.

  The configuration of the digital camera 101 will be described with reference to FIGS. The digital camera 101 includes a front cover unit 102, an imaging unit 103, a strobe unit 104, a main board 105, a battery box unit 106, a main chassis 107, an LCD unit 108, and a rear cover unit 109. The LCD unit 108 is a display unit that displays an image.

  Here, the configuration of the imaging unit 103 will be described in detail. As shown in FIG. 4, the imaging unit 103 includes a photoelectric conversion element module unit 113 including a photoelectric conversion element package 110, a flexible printed circuit board 111, and a position regulating member 112, and a photographing lens barrel unit 114.

  The photoelectric conversion element package 110 is a package that accommodates photoelectric conversion elements, and is mounted on the flexible printed circuit board 111 as shown in FIG. Further, a connector 115 for connecting to the main board 105 is mounted on the flexible printed board 111.

  First, the photoelectric conversion element package 110 mounted on the flexible printed circuit board 111 is bonded and fixed to the position regulating member 112. The position regulating member 112 is a metal plate, and an opening 116 is formed at the center. The opening 116 is formed larger than the outer shape of the photoelectric conversion element package 110, and the photoelectric conversion element package 110 mounted on the flexible printed circuit board 111 is disposed in the opening 116.

  The photoelectric conversion element package 110 and the position regulating member 112 are fixed in a state where the photoelectric conversion element package 110 is placed in the opening 116 formed in the position regulating member 112. This is done by pouring an adhesive into the gap and curing it.

  In this way, the photoelectric conversion element module unit 113 in which the photoelectric conversion element package 110, the flexible printed circuit board 111, and the position regulating member 112 are integrated is configured. The photoelectric conversion element module unit 113 is attached to the taking lens barrel unit 114 with screws 117a, 117b, and 117c as shown in FIG.

  At this time, the photographing lens barrel unit 114 is provided with positioning protrusions 118a and 118b as shown in FIG. When the positioning protrusions 118a and 118b, the positioning hole 119, and the positioning notch 120 formed on the position regulating member 112 are engaged, the position regulating member 112 has an optical axis with respect to the photographic lens barrel unit 114. The position in the plane direction orthogonal to is regulated. Since the photoelectric conversion element package 110 is fixed to the position regulating member 112, the position of the photoelectric conversion element package 110 in the plane direction perpendicular to the optical axis with respect to the photographing lens barrel unit 114 is also determined.

  At this time, the biasing springs 121a and 121b installed in the recesses provided in the photographing lens barrel unit 114 bias the position regulating member 112 to the screw heads of the screws 117a, 117b, and 117c. As a result, the position regulating member 112 is biased in the optical axis direction. Further, by adjusting the tightening amounts of the screws 117a, 117b, and 117c, the position of the position regulating member 112 with respect to the lens barrel unit 114 in the optical axis direction and the angle with respect to the optical axis can be finely adjusted. It has become. As a result, the light receiving surface of the photoelectric conversion element can be aligned with high accuracy with respect to the imaging surface of the photographing lens optical system of the photographing lens barrel unit 114.

  From here, it demonstrates in the assembly | attachment order of each unit using FIG. 2, FIG.

  First, the battery box unit 106 is fixed to the main chassis 107, and the main board 105 is attached to the battery box unit 106.

  The battery box unit 106 has a substantially square shape with no walls on the front and rear sides of the camera. The main chassis 107 is attached to the camera back side of the battery box unit 106 to form a wall on the camera back side of the battery box unit 106, and the main board 105 is attached to the front side of the camera to attach the wall on the front side of the battery box. Forming.

  Next, the imaging unit 103 that has been adjusted as described above is attached to a unit in which the main chassis 107, the battery box unit 106, and the main board 105 are integrated.

  The imaging unit 103 is attached and fixed to the main chassis 107 by fixing screws 122a to 122d, and the connector 115 mounted on the flexible printed board 111 of the imaging unit 103 is connected to the connector 123 mounted on the main board 105. The connector 115 and the connector 123 are board-to-board connectors and are connected by fitting each other in a direction perpendicular to the board surface.

  Here, in the vicinity of the connector 123 of the main substrate 105, an IC 124 for driving the photoelectric conversion element and performing signal processing is mounted. If the wiring length from the photoelectric conversion element to the IC 124 becomes long, noise is added to a minute analog output signal from the photoelectric conversion element, or unnecessary radiation from the drive pattern for driving the photoelectric conversion element increases. There is a problem. Therefore, the IC 124 is disposed in the vicinity of the connector 123.

  In the state where the connector 115 and the connector 123 are fitted, the flexible printed circuit board 111 has an outer shape that covers the IC 124 as shown in FIG. At the same time, as shown in FIG. 3, a copper foil exposed portion 125 (one conductor exposed portion) is provided on the surface facing the IC 124 by opening a cover lay on this surface and exposing a part of the conductor layer of the ground pattern. is there. In addition, the copper foil exposure part 125 opens and exposes the coverlay for the solid pattern of the ground pattern. A double-sided adhesive tape 126 having high thermal conductivity is sandwiched between the IC 124 and the copper foil exposed portion 125. When the connector 115 and the connector 123 are fitted, the copper foil exposed portion 125 and the IC 124 of the flexible printed circuit board 111 are brought into close contact with the heat conductive double-sided adhesive tape 126. Since the copper foil exposed portion 125 and the IC 124 are in close contact with the heat conductive double-sided adhesive tape 126, the heat generated in the IC 124 can be efficiently transmitted to the copper foil exposed portion 125 of the flexible printed circuit board 111. It is.

  Further, the flexible printed circuit board 111 is provided with a copper foil exposed portion 127 (the other conductor exposed portion) at an intermediate portion between the photoelectric conversion element package 110 mounting portion and the connector 115 mounting portion. The copper foil exposed portion 127 opens a cover lay on the surface facing the back side of the camera with the imaging unit 103 attached to the main chassis 107 to expose a part of the conductor layer of the ground pattern. . The copper foil exposed portion 127 opens and exposes a coverlay for the solid pattern of the ground pattern. The copper foil exposed portion 127 is affixed with a thermal conductive sheet 128 (pressing member) having high thermal conductivity and high elasticity and having self-adhesiveness. Thereafter, when the LCD unit 108 is attached to the main chassis 107 from the back side, the heat conductive sheet 128 is applied to the metal frame portion (frame member) covering the camera front side of the LCD unit 108 with copper foil. The exposed part 127 is pressed. A metal frame portion covering the front side of the camera of the LCD unit 108 is a metal member disposed inside the digital camera. The thermally conductive sheet 128 is sandwiched between the copper foil exposed portion 127 of the flexible printed circuit board 111 and the frame of the LCD unit 108 in a slightly compressed state, and is in close contact with each other. It has become. Since the copper foil exposed portion 127 and the frame of the LCD unit 108 are in close contact with each other by the heat conductive sheet 128, heat is efficiently transferred from the copper foil exposed portion 127 of the flexible printed circuit board 111 to the frame of the LCD unit 108. It is possible. That is, a plurality of conductor exposed portions are formed on the flexible printed circuit board 111, one conductor exposed portion is in contact with a heat source, and the other conductor exposed portion is in contact with a metallic member having a small specific heat.

  Details of the flexible printed circuit board 111 will be described with reference to FIG.

  As shown in FIGS. 5A and 5B, the flexible printed circuit board 111 is provided with wiring for signal connection from the component land of the photoelectric conversion element package 110 mounting portion to the component land of the back connector 115 mounting portion. It has been. The solid patterns exposed at the copper foil exposed portions 125 and 127 are the same ground pattern, and the width is set so that heat is efficiently transferred from the copper foil exposed portion 125 to the copper foil exposed portion 127. This is a solid pattern for heat dissipation (heat dissipation pattern 129) that is widely used. This also serves as a ground pattern of the circuit, and horizontal transfer pulse patterns 130a and 130b for driving photoelectric conversion elements are wired so as to be adjacent to the heat radiation pattern 129. The horizontal transfer pulse patterns 130a and 130b require caution to suppress crosstalk and unnecessary radiation to the analog output of the photoelectric conversion element. However, the horizontal transfer pulse patterns 130a and 130b are provided with a large area ground pattern adjacent to each other, so that a sufficient return current path is provided. This can be expected to have a positive effect on the reduction of unwanted radiation.

  With the pattern configuration of the flexible printed circuit board 111 as described above, the heat generated in the IC 124 is efficiently transferred from the copper foil exposed part 125 of the flexible printed circuit board 111 to the copper foil exposed part 127 via the heat radiation pattern 129. The A positive effect can be expected for the reduction of unnecessary radiation.

  After the imaging unit 103 is attached to the main chassis 107 in this way, the strobe unit 104 and the LCD unit 108 are attached to the main chassis 107 as shown in FIGS.

  At the time when the LCD unit 108 is attached to the main chassis 107, the heat conductive sheet 128 is sandwiched between the copper foil exposed portion 127 of the flexible printed circuit board 111 and the frame of the LCD unit 108 and is in close contact therewith. Therefore, a heat transfer path from the heat radiation pattern 129 of the flexible printed circuit board 111 to the LCD unit 108 is formed. Accordingly, the heat generated by the IC 124 can be transmitted to the LCD unit 108 disposed inside the imaging device via the heat radiation pattern 129 of the flexible printed circuit board without providing a special heat transfer member. become able to do.

  Here, the copper foil exposed portion 127 is provided at an intermediate portion of the connector 115 mounting portion between the photoelectric conversion element package 110 mounting portion of the flexible printed circuit board 111 and the main substrate 105. Further, the copper foil exposed portion 127 is provided on the surface facing the back side with the imaging unit 103 attached to the main chassis 107 and at a position away from the mounting portion of the photoelectric conversion element package 110. In the photoelectric conversion element, dark current noise generally increases due to temperature rise, and the quality of the output signal deteriorates. However, by adopting this configuration, the heat generated in the IC 124 is released to the LCD unit 108 before being transmitted to the photoelectric conversion element package 110. For this reason, the heat generated in the IC 124 is not transmitted to the photoelectric conversion element, and the heat generated in the IC 124 is not adversely affected. In addition, with the recent increase in the number of pixels and the increase in the speed of the photoelectric conversion element itself, the generated heat is increasing, and it is necessary to suppress the temperature rise of the photoelectric conversion element itself in order to improve the image quality of the captured image. According to this configuration, the heat radiation pattern 129 of the flexible printed circuit board 111 is arranged up to the mounting portion of the photoelectric conversion element package 110 and is connected to the ground terminal of the photoelectric conversion element package 110. Therefore, the heat generated by the photoelectric conversion element is also radiated from the copper foil exposed portion 127 to the LCD unit 108 via the heat radiation pattern 129.

  Furthermore, since the flexible printed circuit board 111 sandwiches the heat conductive sheet 128 with the LCD unit 108 at the copper foil exposed portion 127, the compressive force of the heat conductive sheet 128 is applied to this portion. . However, since the copper foil exposed portion 127 is provided at a position away from the mounting portion of the photoelectric conversion element package 110, the position of the photoelectric conversion element in the direction of the optical axis and the angle with respect to the optical axis is determined by the flexibility of the flexible printed circuit board 111. Does not affect the adjustment status.

  Finally, the front cover unit 102 and the rear cover unit 109 shown in FIGS. 2 and 3 are attached and fixed with screws 131a to 131e, whereby the digital camera 101 is completed.

  Here, since the heat generated in the IC 124 is released to the LCD unit 108 via the flexible printed circuit board 111, it is possible to suppress a temperature rise in a portion close to the IC 124 of the front cover unit 102 touched by the user.

  In the above embodiment, the copper foil exposed portion 125 of the flexible printed board 111 and the IC 124 are brought into close contact with each other via the heat conductive double-sided adhesive tape 126, but the present invention is not limited to this. That is, as shown in FIG. 7, it is also possible to arrange the elastic cushion member 132 so as to compress between the front cover unit 102 and the overlapping portion of the copper foil exposed portion 125 and the IC 124 of the flexible printed circuit board 111. is there. With this configuration, the copper foil exposed portion 125 and the IC 124 can be brought into close contact with each other without using the heat conductive double-sided adhesive tape 126. Furthermore, in this case, if the cushion member 132 has a shape enlarged to the back surface of the connector 115 mounting portion, the fitting with the connector 123 mounted on the main board 105 is prevented from being detached due to a drop impact of the camera or the like. Effect can be obtained at the same time. Even in this case, the contact between the copper foil exposed portion 125 and the IC 124 via the heat conductive double-sided adhesive tape 126 is more efficient than the case where the cushion member 132 is simply pressed. Heat can be transferred between the two. This is because air does not exist between the surfaces due to the influence of the roughness of each other, and heat conduction is not hindered.

  As described above, according to the configuration of the present embodiment, the temperature rise of the electronic component that performs photoelectric conversion element driving or signal processing and the exterior surface temperature in the vicinity of the electronic component are not locally provided without providing a cooling member. Temperature rise can be suppressed. It is also effective in suppressing an increase in unnecessary radiation from the photoelectric conversion element driving pulse pattern of the connection substrate for connecting the photoelectric conversion element and the substrate on which the electronic component that performs photoelectric conversion element driving or signal processing is mounted. is there.

  Although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

1 is an external view of an imaging apparatus (digital camera) according to an embodiment of the present invention as viewed from the front side. 1 is a front perspective view illustrating a configuration of an imaging apparatus according to an embodiment of the present invention. FIG. 3 is an exploded perspective view of the rear side showing the configuration of the imaging apparatus according to the embodiment of the present invention. 1 is an exploded perspective view showing a configuration of an imaging unit according to an embodiment of the present invention. The figure which shows the flexible printed circuit board carrying the photoelectric conversion element concerning embodiment of this invention. The disassembled perspective view before mounting | wearing with the front cover unit of the imaging device concerning embodiment of this invention. The back side disassembled perspective view which shows the structure of the imaging device concerning another embodiment of this invention.

DESCRIPTION OF SYMBOLS 101 Digital camera 102 Front cover unit 103 Imaging unit 104 Strobe unit 105 Main board 106 Battery box unit 107 Main chassis 108 LCD unit 109 Rear cover unit 110 Photoelectric conversion element package 111 Flexible printed circuit board 112 Position regulating member 113 Photoelectric conversion element module unit 114 Photographic lens barrel unit 115 connector 116 opening 117a, 117b, 117c screw 118a, 118b positioning projection 119 positioning hole 120 positioning notch 121a, 121b biasing spring 122a, 122b, 122c, 122d screw 123 connector 124 IC
125 Copper foil exposed portion 126 Thermal conductive double-sided adhesive tape 127 Copper foil exposed portion 128 Thermal conductive sheet 129 Heat radiation solid pattern 130a, 130b Horizontal transfer pulse pattern 131a, 131b, 131c, 131d, 131e Screw 132 Cushion member

Claims (7)

In an imaging device including a photoelectric conversion element, a substrate on which electronic components are mounted, and a connection substrate for connecting the photoelectric conversion element and the substrate,
Forming at least a horizontal transfer pulse pattern of the photoelectric conversion element and a ground pattern arranged adjacent to the horizontal transfer pulse pattern on the connection substrate;
Forming a conductor exposed portion for exposing a part of the conductor layer to the ground pattern;
The imaging apparatus, wherein the connection substrate is arranged so that the conductor exposed portion covers a surface of the electronic component. A metal member disposed inside the imaging device;
A plurality of the conductor exposed portions are formed in the ground pattern, and the connection substrate is arranged so that one conductor exposed portion covers the surface of the electronic component and the other conductor exposed portion contacts the metal member. The imaging apparatus according to claim 1. The imaging device includes a display unit for displaying an image,
The imaging apparatus according to claim 2, wherein the connection board is arranged so that the other conductor exposed portion contacts a metal frame member covering the display unit. The connection board has a connector connected to the board,
A pressing member that presses the conductor exposed portion against the surface of the electronic component;
The imaging apparatus according to claim 1, wherein the pressing member applies a force in a direction to connect the connector to the substrate by pressing the connection substrate. In an electronic device provided with a substrate on which electronic components are mounted and a connection substrate connected to the substrate
On the connection substrate, a ground pattern having a conductor exposed portion exposing a part of the conductor layer is formed,
The electronic device is characterized in that the connection substrate is arranged so that the conductor exposed portion covers a surface of the electronic component. A metal member disposed inside the electronic device;
A plurality of the conductor exposed portions are formed in the ground pattern, and the connection substrate is arranged so that one conductor exposed portion covers the surface of the electronic component and the other conductor exposed portion contacts the metal member. The electronic device according to claim 5, wherein: The connection board has a connector connected to the board,
A pressing member that presses the conductor exposed portion against the surface of the electronic component;
The electronic device according to claim 5, wherein the pressing member applies a force in a direction to connect the connector to the substrate by pressing the connection substrate.