JP2017122756A - Electronic equipment and imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic equipment that enables electric connections with a plurality of components having conductivity without any hindrance to down-sizing of an electronic equipment body.SOLUTION: Electronic equipment according to the present invention comprises: a first component (main chassis 9) which includes a conductive region and has a first opening part 9b in the conductive region; a second component (heat radiation plate 5) which includes the conductive region, and has a second opening part 5a in the conductive region and a step part partially in contact with the second opening part 5a; a third component (display unit 3) which includes the conductive region; and a conductive elastic body (gasket 6) which has elasticity and includes the conductive region. The second component is arranged between the first component and third component such that the step part is inserted into the first opening part. The conductive elastic body partially extends from the second opening part to a side of the second opening part, and is pressed among the first component, step part, and third component to be retained.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic device and an imaging device, and more particularly to an electronic device that houses a circuit board on which an electronic circuit is mounted in a housing.

  In recent years, electronic devices represented by digital cameras and the like have been improved in performance along with downsizing. With the miniaturization, the component mounting density of the printed circuit board tends to be higher. And with the performance improvement, the calorific value of the semiconductor element tends to increase. Such an increase in the amount of heat generation may cause malfunction of the electronic device or damage to the semiconductor element itself, so it is necessary to effectively diffuse local heat generation of the semiconductor element. As a method of diffusing local heat generation over a wide area in the housing, a configuration in which a part of a member having high thermal conductivity is brought into direct or indirect contact with a heat generation source is known (see Patent Document 1).

  Usually, an electronic device has a board on which a plurality of electronic components are mounted, and the chassis member is electrically connected to the ground wiring of the board. In addition, there are many conductive members inside the electronic device. When one electrical connection is made to all the conductive members including the heat sink one by one, there is a possibility that the number of adhesive parts such as screw fastening points between parts and conductive double-sided tape will increase. is there. In view of this, there has already been disclosed a method for electrically connecting parts having conductivity while suppressing an increase in the number of parts (see Patent Document 2).

JP 2007-174526 A International Publication No. 2009-063734

  In Patent Document 1, a solid-state imaging device and a heat radiating plate are connected via a heat radiating plate, and heat generated by the solid-state imaging device is conducted to the heat radiating plate. As a material applied to the heat sink, a metal having a relatively high thermal conductivity is often used. When the conductive heat sink is not electrically connected to the metal chassis that constitutes the electronic device, it becomes a floating metal member and becomes an antenna for unnecessary electromagnetic waves, and transmits unnecessary electromagnetic waves to various parts of the electronic devices. There is a possibility of becoming a transmission path. Therefore, it is desirable to connect the heat sink directly or indirectly to the metal chassis constituting the electronic device.

  Further, Patent Document 2 discloses a method of simultaneously making electrical connection to a printed circuit board and two housings with one connection member. The connection member is fixed to the printed circuit board by screw fastening and has a connection portion whose tip is branched into two. Each of the connecting portions is electrically connected to separate housings, so that the printed circuit board and the two housings are electrically connected simultaneously. In this case, since the connecting member is disposed between the screw fastening portion of the printed circuit board and the housing, there is a possibility that downsizing of the device is hindered.

  In view of the above problems, an object of the present invention is to provide an electronic device that can be electrically connected to a plurality of conductive parts without hindering downsizing of the electronic device main body.

  In order to solve the above-described problem, an electronic device according to the present invention includes a first component including a conductive region, the first component having a first opening in the conductive region, and the conductive region. A second part having a second opening in the region having conductivity, a second part having a step part in contact with the second opening, and a third part having a region having conductivity A conductive elastic body including a region having elasticity and conductivity, and the second component includes the first part so that the stepped portion is inserted into the first opening. The conductive elastic body is disposed between a part and the third part, and a part of the conductive elastic body extends from the second opening to the second opening, and the first part and The step portion and the third component are held in pressure contact with each other.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device which can be electrically connected with respect to several components which have electroconductivity, without inhibiting the miniaturization of an electronic device main body can be provided.

1 is an external perspective view of an imaging apparatus according to an embodiment of the present invention. It is a disassembled perspective view of the back cover unit in the imaging device of FIG. It is the schematic and sectional drawing of the area | region where a gasket is arrange | positioned at a back cover unit. It is a perspective view which shows the state which incorporates a back cover unit in a main body. It is the schematic and sectional drawing of the area | region where the gasket in an imaging device is arrange | positioned. It is the top view and side view which show a display unit. It is sectional drawing of the imaging device which concerns on the modification of a main chassis.

  The best mode for carrying out the present invention will be described below with reference to the drawings. The present invention can be applied to an imaging apparatus such as a digital single-lens reflex camera, a digital still camera, or a digital video camera. However, the present invention is not limited to this, and a circuit board on which an electronic circuit is mounted is accommodated in the housing. It can be widely applied to electronic equipment.

(First embodiment)
Hereinafter, the electronic apparatus according to the present embodiment will be described with reference to FIGS. FIG. 1 is an external perspective view of an imaging apparatus 100 according to the present embodiment. The imaging apparatus 100 includes an apparatus main body 1 (hereinafter referred to as “main body 1”), a lens barrel unit 2 provided in the front center of the main body 1, and a back cover unit 50 provided on the back of the main body 1. It is configured. The display unit 3 (third component) is one of components that constitute the back cover unit 50.

  The lens barrel unit 2 has a structure capable of moving a plurality of lens groups (not shown) included in the lens barrel unit 2 in the optical axis direction, and houses a photographing position protruding from the main body 1 and a plurality of lens groups inside the main body 1. The main body 1 is configured so as to be capable of transitioning between the retracted housing position. The display unit 3 has a display device such as a liquid crystal display. The display device displays information such as a live view image, a captured image, and imaging conditions based on an imaging signal output from an imaging element (not shown) incorporated in the main body 1.

  FIG. 2 is an exploded perspective view of the back cover unit 50 in the imaging apparatus 100 of FIG. The display unit 3 is assembled to the main body 1 after being assembled as a back cover unit 50 together with other mechanical components. The display unit 3 is fixed to the back cover 4 with a double-sided tape (not shown) processed into a frame shape. The inner part of the main body of the display unit 3 is covered with a conductive metal cover 3c. The display unit 3 includes flexible printed boards 3a and 3b. The flexible printed boards 3a and 3b are flexible, and the leading ends of the flexible printed boards 3a and 3b extend from the opening formed in the back cover 4 toward the inside of the main body 1, and a control board (not shown) It is configured to be connected to.

  The heat radiating plate (second component) 5 is assembled to the back cover 4 from the inside of the main body. In the present embodiment, the heat radiating plate 5 is made of a metal heat radiating member having conductivity, and is processed into a desired shape by pressing or the like. After aligning the heat sink 5 and the sub chassis 7 with the back cover 4, the heat sink 5 and the sub chassis 7 are fixed to the back cover 4 by fastening screws 8 a, 8 b and 8 c to the back cover 4. The

  In a state where the assembly of the back cover unit 50 is completed, a certain gap is secured between the main body inner plane of the display unit 3 and the main body outer plane of the heat sink 5. A gasket (conductive elastic body) 6 is attached to the heat radiating plate 5 in advance. The gasket 6 is a composite member in which a material having conductivity, such as a conductive cloth, is wound around a material such as polyurethane having elasticity. In the present embodiment, the gasket 6 is attached to the heat radiating plate 5 with a double-sided tape having conductivity. The gasket 6 has a thickness larger than a gap formed between the main body inner plane of the display unit 3 and the main body outer plane of the heat sink 5. When fixed to the back cover 4, the gasket 6 is pressed between the metal cover 3 c and the heat sink 5 to electrically connect the metal cover 3 c and the heat sink 5.

  FIG. 3 is a schematic view and a cross-sectional view of a region where the gasket 6 is disposed in the back cover unit 50. FIG. 3B is a cross-sectional view taken along the line AA in FIG. The opening (second opening) 5 a is an opening formed in the heat sink 5. A stepped portion 5b is formed at a part of the peripheral edge of the opening 5a. The step portion 5 b has a step shape protruding in a direction away from the display unit 3, and is formed by subjecting the heat sink 5 to drawing processing or half punching processing. The heat radiating plate 5 is formed with a step portion 5 b, thereby forming a gap portion 5 c between the step portion 5 b and the display unit 3. A part of the gasket 6 is disposed in the gap 5c and is attached and held on the flat surface of the display unit 3 in the step 5b.

  Furthermore, a part of the gasket 6 extends from the step portion 5b to the opening 5a side (second opening side). The gasket 6 has a thickness T that is greater than the distance D between the flat surface on the display unit 3 side of the stepped portion 5 b and the flat surface on the heat sink 5 side of the display unit 3. When the heat sink 5 with the gasket 6 attached is assembled to the back cover, the gasket 6 in the gap 5c is pressed and held by the difference between the thickness T and the distance D. The gasket 6 can be stably maintained by being pressed (pressed) between the metal cover 3c of the display unit 3 and the heat radiating plate 5 and held.

  FIG. 4 is a perspective view illustrating a state in which the back cover unit 50 is assembled into the main body 1. The main body 1 includes a main chassis (first component) 9 and a control board 10. The main chassis 9 is made of a conductive metal and holds each unit (not shown) constituting the main body 1. For the sake of convenience, in FIG. 4, components other than the main chassis 9 and the control board 10 among the components constituting the main body 1 are omitted, and the outer shape of the main body 1 is schematically shown by a two-dot chain line. A plurality of fastening portions are formed in the main chassis 9.

  The control board 10 is assembled to the main chassis 9 together with other mechanical components. A part of the ground wiring pattern of the control board 10 has a conductor exposed, and is configured to come into contact with a fastening portion of the main chassis 9. The ground wiring pattern of the control board 10 is electrically connected to the main chassis 9 by being assembled to the main chassis 9. The fastening portion 9a is one of a plurality of fastening portions, and the fastening portion 9a is formed with a hole raised by burring or the like. The inner surface of the hole is tapped so that a screw can be fastened.

  On the other hand, the back cover unit 50 is formed with a plurality of fastening portions. The fastening portion 50a is one of a plurality of fastening portions, and a through hole is formed in the fastening portion 50a. When the back cover unit 50 is incorporated in the main body 1, the fastening portion 50a has the hole portion of the fastening portion 9a and the center of the hole portion of the fastening portion 50a positioned coaxially. At this time, the fastening part 50a is located on the outer side of the main body with respect to the fastening part 9a.

  When the assembly of the back cover unit 50 is completed, the back cover unit 50 is fixed to the main chassis 9 together with an exterior cover (not shown) by screws. Next, an opening (first opening) 9 b is formed in the main chassis 9. The opening 9 b is an opening larger than the stepped portion 5 b formed in the heat radiating plate 5. When the back cover unit 50 is incorporated in the main body 1, the position of the opening 9b is set so that the stepped portion 5b enters (inserts) the inside of the opening 9b. The opening 9b formed in the main chassis 9 only needs to be formed in a conductive region.

  FIG. 5 is a schematic view and a cross-sectional view of a region where the gasket 6 is disposed in the imaging device 100. FIG. 5B is a cross-sectional view taken along the line BB in FIG. When the rear cover unit 50 is incorporated in the main body 1, the heat sink 5 is disposed so that the display unit 3 side plane of the stepped portion 5 b and the display unit 3 side plane of the main chassis 9 are substantially on the same plane. Accordingly, the distance D ′ between the display unit 3 side plane of the main chassis 9 and the heat sink 5 side plane of the display unit 3 in the region covering the opening 5 a is the heat dissipation of the display unit 3 side plane of the step portion 5 b and the display unit 3. The distance is substantially the same as the distance D from the plate 5 side plane. When the back cover unit 50 is incorporated in the main body 1, a part of the gasket 6 extending from the step portion 5b to the opening 5a side is pressed and held by the difference between the thickness T and the distance D '.

  The gasket 6 can be pressed between the metal cover 3 c and the main chassis 9 to electrically connect the metal cover 3 c and the main chassis 9. In addition, since the gasket 6 electrically connects the metal cover 3c and the heat sink 5 as described above, the gasket 6 allows the metal cover 3c, the heat sink 5 and the main chassis 9 to be simultaneously applied to the three components. Electrical connection can be made. The display unit 3 side plane of the stepped portion 5b is arranged to be substantially on the same plane as the display unit 3 side plane of the main chassis 9. Therefore, the gasket 6 can be pressed uniformly without being biased.

  Therefore, it is possible to stably ensure electrical connection to a plurality of conductive parts. The plate thickness of the heat sink 5 is set to be equal to the plate thickness of the main chassis 9 or thinner than the plate thickness of the main chassis 9. Since the display unit 3 side plane of the stepped portion 5b and the display unit 3 side plane of the main chassis 9 are arranged on substantially the same plane, the main chassis 9 side plane of the stepped portion 5b is the plate thickness of the main chassis 9. It is configured to be within the range. Therefore, electrical connection can be made to a plurality of conductive parts without increasing the thickness of the imaging device 100 in the plate thickness direction of the main chassis 9.

  In the present embodiment, the gasket 6 is attached to the heat radiating plate 5 with a double-sided tape having conductivity. When the gasket 6 is affixed to the main chassis 9, when the back cover unit 50 is assembled to the main body 1, the gasket 6 is assembled while being inserted into the gap 5c, so that the assembling work becomes very difficult. End up. In addition, when the gasket 6 is assembled to the metal cover 3c, a mark that accurately defines the position where the gasket 6 is attached so that the gasket 6 is accommodated in the gap 5c is required. For example, it is necessary to process the metal cover 3c such as providing a marking line or performing frame printing, which may increase the manufacturing cost of the display unit 3. On the other hand, when the gasket 6 is attached to the heat sink 5, the gasket 6 may be attached so that a part of the gasket 6 extends to the opening 5a side with respect to the stepped portion 5b. The gasket can be attached to a desired position easily and accurately without the need to provide a mask. Accordingly, the gasket 6 is desirably attached to the heat sink 5.

  FIG. 6 is a plan view showing the display unit 3. FIG. 6A is a side view of the display unit 3 shown in FIG. The display unit 3 according to the present embodiment will be described using a unit in which a liquid crystal display module and a touch panel module are combined. However, the electronic apparatus according to the present embodiment is not limited to this, and is widely used for display devices that can display, for example, an image signal output from a control board (not shown) built in the main body 1. Can be applied.

  The display unit 3 includes a backlight module 30, a liquid crystal display 31, a touch panel 32, and flexible printed boards 3a and 3b. The backlight module 30, the liquid crystal display 31, and the touch panel 32 are overlapped and joined, and are unitized. The backlight module 30 includes a metal cover 3c. The flexible printed circuit board 3 b is connected to the backlight module 30. The flexible printed circuit board 3 a is connected to the liquid crystal display 31 and the touch panel 32. As described above, the flexible printed boards 3a and 3b are connected to a control board (not shown) when incorporated in the main body 1. The display area 3 d is a display area of the display unit 3. The region 3e is a region where the liquid crystal display driving IC is mounted (hereinafter referred to as an IC mounting unit). The liquid crystal display 31 includes a glass substrate (not shown) inside, and a plurality of electrode terminals are formed on the glass substrate. The IC mounting portion 3e is connected to this electrode terminal by a COG (Chip On Glass) method or the like.

  For example, an image display or the like may be performed on the display unit 3 for a long time by the operation of the imaging apparatus 100. At this time, the load on the IC mounting portion 3e increases, and the self-heat generation amount of the IC increases. Due to the heat generated by the IC, a temperature difference occurs between the IC mounting portion 3e and the vicinity thereof and a region other than the vicinity of the IC mounting portion 3e of the liquid crystal display 31. Due to this influence, the characteristics of the liquid crystal display 31 are partially changed, resulting in deterioration of display quality such as display unevenness.

  Therefore, the imaging apparatus 100 according to the present embodiment disperses the heat generated by the IC mounting portion 3e over a wide area by disposing the heat sink 5 close to the position facing the display unit 3. Thereby, the temperature difference in the liquid crystal display 31 is reduced, and the deterioration of display quality such as display unevenness is reduced. In FIG. 6B, a region P indicated by a two-dot chain line indicates a region where the gasket 6 is disposed in the state of the back cover unit 50. The gasket 6 is set at a position away from the IC mounting portion 3e. Accordingly, the opening 5a and the step 5b of the heat sink 5 are also formed at positions away from the IC mounting portion 3e. If the opening 5a and the step 5b of the heat sink 5 are formed in the vicinity of the IC mounting portion 3e, the heat generated in the IC mounting portion 3e is difficult to transfer to the heat sink 5.

  Therefore, by setting the gasket 6 at a position away from the IC mounting portion 3e, the heat generated in the IC mounting portion 3e can be more efficiently transferred to the heat radiating plate 5. As described above, according to this embodiment, it is possible to provide an electronic device that can be electrically connected to a plurality of conductive parts without hindering downsizing of the electronic device main body.

(Second Embodiment)
Hereinafter, a main chassis 90 which is a modification of the main chassis 9 according to the present embodiment will be described with reference to FIG. Since components other than the main chassis 90 in the imaging apparatus to which the main chassis 90 is applied are the same as the components other than the main chassis 9 in the imaging apparatus 100 described in the first embodiment, the description in the present embodiment will be omitted. Omitted.

  FIG. 7 is a cross-sectional view of the imaging apparatus 100 including the main chassis 90 according to the present embodiment. When the back cover unit 50 is incorporated in the main body 1, the main body 1 side plane of the stepped portion 5 b is arranged so as to secure a gap of a distance X in the direction toward the display unit 3 with respect to the main body 1 side plane of the main chassis 90. ing. By securing the gap of the distance X, the main body 1 side plane of the stepped portion 5b is configured not to protrude toward the main body 1 side from the main body 1 side plane of the main chassis 90 after the back cover unit 50 is assembled. Yes. This distance X is determined in consideration of machining tolerances, assembly errors, and the like of each part.

  In this way, the gap 5c is formed between the step 5b and the display unit 3, and the gasket 6 is disposed in the gap 5c. The thickness of the heat radiating plate 5 is set to be equal to the thickness of the main chassis 90 or thicker than the thickness of the main chassis 90. The main chassis 90 forms a protruding portion 90 c with respect to a range in contact with the gasket 6. The projecting portion 90 c has a projecting shape projecting in the direction toward the display unit 3, and is formed by subjecting the main chassis 90 to drawing or half-punching.

  The distance E ′ between the display unit 3 side plane of the protrusion 90 c and the heat sink 5 side plane of the display unit 3 is the distance E between the display unit 3 side plane of the stepped portion 5 b and the heat sink 5 side plane of the display unit 3. The projecting amount of the projecting portion 90c is set so as to be approximately the same distance. Since the gasket 6 electrically connects the metal cover 3c and the heat sink 5 as described above, the gasket 6 allows the metal cover 3c, the heat sink 5 and the main chassis 90 to be simultaneously applied to the three components. Electrical connection can be made. Further, the gasket 6 can be uniformly pressed without unevenness, and electrical connection can be stably secured to a plurality of parts having conductivity. In addition, electrical connection can be made to a plurality of conductive parts without increasing the thickness of the imaging device 100 in the plate thickness direction of the main chassis 90.

  As described above, according to this embodiment, it is possible to provide an electronic device that can be electrically connected to a plurality of conductive parts without hindering downsizing of the electronic device main body. In the present embodiment, the configuration that enables electrical connection to three components simultaneously has been described. However, the number of parts that can be electrically connected at the same time is not limited to three, and it may be a configuration that enables simultaneous electrical connection to four or more parts. In addition, a gasket is taken up as an example of a component that enables electrical connection to a plurality of components at the same time. However, the present invention is not limited to this. For example, a material having conductivity is processed as an elastic component. A coil spring, a leaf spring, or the like obtained in this way may be employed.

  Moreover, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

3 Display unit (third part)
5 Heat sink (second part)
5a Opening (second opening)
5b Step 6 Gasket (conductive elastic body)
9 Main chassis (first part)
9b opening (first opening)

Claims (8)

A first component including a region having conductivity, and having a first opening in the region having conductivity;
A second part including a region having conductivity, a second opening in the region having conductivity, and a step part partially in contact with the second opening;
A third part including a region having conductivity;
A conductive elastic body having elasticity and including a conductive region;
With
The second component is disposed between the first component and the third component such that the stepped portion is inserted into the first opening.
A part of the conductive elastic body extends from the stepped portion toward the second opening, and is pressed between the first component, the stepped portion, and the third component. An electronic device characterized by being held. The electronic apparatus according to claim 1, wherein the conductive elastic body is fixed to the second component by being attached with a double-sided tape having conductivity. In the direction in which the conductive elastic body is in pressure contact, the distance between the region where the stepped portion is in contact with the conductive elastic body and the third component is such that the first component is connected to the conductive elastic body. 3. The electronic device according to claim 1, wherein the step of the step portion is set to be the same as a distance between a contact area and the third component. The first part has a protruding part that protrudes in a direction toward the third part with respect to a range including a region in contact with the conductive elastic body or a part thereof. 4. The electronic device according to any one of items 3. In the direction in which the conductive elastic body is pressure-contacted, the distance between the protrusion and the third part is the same as the distance between the step and the third part. The electronic device according to claim 4, wherein an amount of protrusion is set. At least one of the first component, the second component, and the third component has a region serving as a heat source inside,
The electronic apparatus according to claim 1, wherein the conductive elastic body is disposed at a position away from a region overlapping with the heat generation source. It further includes a control board on which electronic components are mounted,
The first component is a main chassis to which the control board is fixed, the second component is a heat dissipating member disposed inside the electronic device, and the third component is the control The electronic apparatus according to claim 1, wherein the electronic apparatus is a display device that displays information output from a substrate.   The imaging device provided with the electronic device of any one of Claims 1-7.

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