JP6547874B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device.

An operation button provided on the back cover, a switch board on which a contact group opposed to the operation button is disposed, and a switch board pressing plate for pressing the switch board, and fixing the switch board pressing plate to the back cover with screws There is known a camera which waterproofs a main substrate portion in the rear cover by pressing the switch substrate against the rear cover (see, for example, Patent Document 1).
[Prior art document]
[Patent Document]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2003-132758

  In the case where a frame ground is provided in the case of the electronic device, if a dedicated conductor for the frame ground is provided, the number of parts constituting the electronic device is increased. In addition, the conductor used for the frame ground occupies a large amount of the internal space of the electronic device.

  In the first aspect, the electronic device includes a first exterior portion providing at least a part of an appearance, and a display portion having a first surface which is a display surface and a second surface opposite to the first surface. A conductive pressing plate for pressing the display unit to the first exterior unit from the second surface of the display unit and fixing the display unit to the first exterior unit; And a substrate having ground conductors connected together.

  Note that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a subcombination of these feature groups can also be an invention.

FIG. 16 is a schematic cross-sectional view of an imaging device 2000. A state in which the mirror unit 2042 has entered into the light path of the subject light flux is shown. FIG. 19 is an exploded perspective view of a rear unit 1910. FIG. 16 is an exploded perspective view of a power supply unit 2500 and a pressing plate 1700. It is a perspective view which shows the state in which the power supply unit 2500 and the pressing plate 1700 were assembled. A state in which the power supply substrate 2520, the processing unit substrate 2420, and the pressing plate 1700 are connected is shown. FIG. 16 is a perspective view showing an imaging unit 2100, a mounting member 2150, a power supply substrate 2520, and an imaging unit side ground conductor 1800. A cross-sectional view of the imaging unit 2100, the attachment member 2150, the processing unit substrate 2420, the pressing plate 1700 and the display unit 2024 is shown. It is sectional drawing which expands and shows the B section of FIG. FIG. 18 is a perspective view mainly showing the positional relationship between the imaging unit side ground conductor 1800, the pressure plate 1700 and the power supply substrate 2520.

  Hereinafter, the present invention will be described through the embodiments of the invention, but the following embodiments do not limit the invention according to the claims. Moreover, not all combinations of features described in the embodiments are essential to the solution of the invention.

  FIG. 1 is a schematic cross-sectional view of an imaging device 2000. The imaging device 2000 is a single-lens reflex camera. The imaging device 2000 includes a lens unit 2010 and a camera body 2020. The lens unit 2010 is an interchangeable lens. The lens unit 2010 is detachable from the camera body 2020. FIG. 1 shows a state in which a lens unit 2010 is mounted on a camera body 2020 as an imaging device 2000.

  The camera body 2020 includes a body side mount 2022, a cover portion 2030, a body portion 2040, a mirror unit 2042, a shutter unit 2023, an imaging unit 2100, a processing unit substrate 2420, a display unit 2024 and a display unit cover. 1610, a finder unit 2060, a finder window 2064, a lens drive unit 2025, and a focus detection unit 2026. The lens unit 2010 is mounted on the body side mount 2022.

  The cover unit 2030 provides the appearance of the imaging device 2000. The cover 2030 has a front cover 2031, an upper cover 2032, and a rear cover 2033. A front cover 2031, an upper cover, a body unit 2040, a mirror unit 2042, a shutter unit 2023, an imaging unit 2100, a processing unit substrate 2420, a finder unit 2060, a lens drive unit 2025, and a focus detection unit 2026. It is substantially covered by 2032 and back cover 2033.

  When the configuration according to the imaging device 2000 is described, the direction along the optical axis X of the lens unit 2010 is defined as the z-axis direction. That is, the direction in which the subject light flux is incident is defined as the z-axis direction. The direction in which the subject light flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. Further, the x-axis direction and the y-axis direction are determined in the directions shown in FIG. The x-axis, y-axis, and z-axis are right-handed orthogonal coordinate systems. Also, the z-axis plus direction may be referred to as the front, the front, or the like. Also, the z-axis minus direction may be referred to as rear, rear side or the like. Also, the y-axis plus direction may be referred to as upper, upper, upper, etc. The y-axis plus direction may be called the lower side, the lower side, the lower side or the like.

  The lens unit 2010 has a lens side mount 2012 and an optical system 2014. The optical system 2014 includes a lens group 2015 and a lens group 2016. The lens unit 2015 and the lens unit 2016 are provided along the optical axis X in the order of the lens unit 2015 and the lens unit 2016 along the negative z-axis direction. The lens side mount 2012 is provided on the rear side of the optical system 2014. The lens unit 2010 is attached to the camera body 2020 by fitting the lens side mount 2012 to the body side mount 2022 disposed on the front surface of the camera body 2020.

  The lens group 2016 is provided movably along the optical axis X. As the lens group 2016 moves along the optical axis X, the focal length and the in-focus position of the optical system 2014 change. The lens group 2016 moves along the optical axis X by the control of the lens drive unit 2025. The lens unit 2010 emits the subject light flux that has passed through the lens group 2015 and the lens group 2016.

  In the camera body 2020, a finder unit 2060 is fixed above the body portion 2040. The finder unit 2060 includes a focusing screen 2061, a pentaprism 2062, a finder lens system 2063, and a photometric unit 2067. The photometric unit 2067 includes a photometric optical system 2068 and a photometric sensor 2069.

  A mirror unit 2042 is provided in the body portion 2040. The mirror unit 2042 includes a main mirror 2043 and a sub mirror 2044.

  The mirror unit 2042 takes a state in which it enters into the optical path of the subject light flux emitted by the lens unit 2010, and a state in which it retracts from the optical path of the subject light flux. FIG. 2 shows a state in which the mirror unit 2042 has entered into the light path of the subject light flux. Specifically, the main mirror 2043 is rotatably supported between an approach position where the subject light flux emitted by the lens unit 2010 enters into the light path and a retraction position where the subject light flux retreats from the light path. The sub mirror 2044 is rotatably supported with respect to the main mirror 2043. The sub mirror 2044 enters the subject light flux together with the main mirror 2043, and withdraws from the subject light flux together with the main mirror 2043.

  When the main mirror 2043 is in the entry position, part of the subject light flux incident on the main mirror 2043 is reflected by the main mirror 2043 and guided to the focusing screen 2061. The focusing screen 2061 is disposed at a position conjugate with the imaging surface of the imaging device 2130 of the imaging unit 2100, and visualizes the subject image formed by the optical system 2014 of the lens unit 2010. The luminous flux of the subject image formed on the focusing screen 2061 is guided to a pentaprism 2062. A part of the light flux of the light flux guided to the pentaprism 2062 can exit from the finder window 2064 through the pentaprism 2062 and the finder lens system 2063 and can be observed as an object. The finder window 2064 is fixed to the rear cover 2033.

  When the main mirror 2043 is at the entry position, among the subject light fluxes incident on the main mirror 2043, the light fluxes other than the subject light flux reflected by the main mirror 2043 are incident on the sub mirror 2044. Specifically, the main mirror 2043 has a half mirror area, and the subject light flux transmitted through the half mirror area of the main mirror 2043 enters the sub mirror 2044. The subject light flux transmitted through the half mirror area and reflected by the sub mirror 2044 is incident on the focus detection unit 2026.

  The focus detection unit 2026 includes a focus detection sensor unit 2027 that detects an incident light flux and outputs information indicating a focus state with respect to a subject. The focus detection sensor unit 2027 outputs the detection result of the focus state to the processing unit substrate 2420. An output signal from the focus detection sensor unit 2027 is output to the processing unit substrate 2420 via the flexible printed circuit. The processing circuit provided on the processing unit substrate 2420 performs focusing based on the detection result of the focus state indicated by h from the output signal from the focus detection sensor unit 2027. For example, the processing circuit provided on the processing unit substrate 2420 controls the lens driving unit 2025 based on the detection result of the focus state to move the lens group 2016.

  A part of the light flux of the light flux guided to the pentaprism 2062 enters the photometric sensor 2069 through the photometric optical system 2068. The photometric sensor 2069 receives the incident light flux and detects the light quantity of the subject. The photometric sensor 2069 outputs the detection result of the light amount of the subject to the processing unit substrate 2420. An output signal from the photometric sensor 2069 is output to the processing unit substrate 2420 via the flexible printed circuit. The processing circuit provided on the processing unit substrate 2420 performs exposure adjustment based on the detection result of the light quantity of the subject indicated by the output signal from the photometric sensor 2069. For example, the processing circuit provided on the processing unit substrate 2420 controls at least one of the aperture of the lens unit 2010, the exposure time, and the sensitivity of the image sensor 2130 based on the detection result of the light amount of the subject.

  When the mirror unit 2042 retracts from the subject light flux and the front and rear curtains of the shutter unit 2023 are opened, the subject light flux transmitted through the lens unit 2010 enters the imaging unit 2100 disposed behind the shutter unit 2023. To reach the imaging surface of the imaging element 2130.

  A processing unit substrate 2420, a pressing plate 1700, a display unit 2024, and a display unit cover 1610 are sequentially disposed behind the imaging unit 2100. The pressing plate 1700 presses the display unit 2024 against the rear cover 2033 to fix the display unit 2024 to the rear cover 2033.

  The display unit 2024 displays an image generated from an output signal from the imaging element 2130. The image on the display surface of the display unit 2024 is displayed from the back of the camera body 2020 through the opening 2039 of the cover unit 2030 and the display unit cover 1610. A liquid crystal panel can be applied to the display unit 2024. The display unit 2024 may include a liquid crystal panel and a back light panel positioned in the z-axis plus direction from the liquid crystal panel. The display unit 2024 may include a touch panel located in the negative z-axis direction from the liquid crystal panel.

  On the processing unit substrate 2420, electronic circuits including processing circuits such as MPU and ASIC are mounted. The MPU is responsible for overall control of the imaging device 2000. An output signal from the imaging element 2130 is output to the ASIC via a flexible printed circuit that connects the imaging unit 2100 and the processing unit substrate 2420. The ASIC processes an output signal output from the imaging element 2130.

  The ASIC generates image data for display based on the output signal from the imaging device 2130. The display unit 2024 displays an image based on the display image data generated by the ASIC. The ASIC generates image data for recording based on an output signal from the imaging device 2130. In the camera body 2020, a recording medium 1680 described later is detachably provided. The image data for recording generated by the ASIC is recorded on the recording medium 1680 mounted on the camera body 2020.

  The front cover 2031, the upper cover 2032 and the rear cover 2033 are formed of resin. The front cover 2031, the upper cover 2032 and the rear cover 2033 are formed of a conductive resin. The front cover 2031, the upper cover 2032 and the rear cover 2033 are formed by resin molding. The body side mount 2022 is formed of metal. The body side mount 2022 is a mount ring having an annular shape. The body portion 2040 is formed of resin. The body side mount 2022 has a rigidity higher than that of the body portion 2040.

  In the cover portion 2030, the front cover 2031 is fixed to the body portion 2040 in the vicinity of the body side mount 2022. The front cover 2031 is fastened to at least one of a portion of the body portion 2040 to which the body side mount 2022 is fastened and the body side mount 2022. For example, the front cover 2031 may be fastened to the body side mount 2022. More specifically, the front cover 2031 is fastened together with the body side mount 2022 and the body portion 2040. The front cover 2031 may have a portion sandwiched between the body side mount 2022 and the body portion 2040, and the portion may be fastened together with the body side mount 2022 and the body portion 2040. The front cover 2031 may be fastened together with the body side mount 2022 and the body portion 2040 by screws for fastening the body side mount 2022 to the body portion 2040.

  The cover 2030 has a monocoque structure. The upper cover 2032 is fastened to the front cover 2031 and the rear cover 2033. The rear cover 2033 is fastened to the front cover 2031 and the upper cover 2032. The front cover 2031, the upper cover 2032 and the rear cover 2033 are respectively fastened with other covers so that the cover portion 2030 formed by the front cover 2031, the upper cover 2032 and the rear cover 2033 has a monocoque structure.

  The cover portion 2030 is fastened to the body portion 2040 in the vicinity of the body side mount 2022. The body portion 2040 is not fastened to any of the front cover 2031, the upper cover 2032 and the rear cover 2033 at other portions. For example, the front cover 2031 is not fastened to the body portion 2040 at a portion other than the vicinity of the body side mount 2022. Further, the front cover 2031 is not fastened to another member fastened to the body portion 2040 except for the body side mount 2022. The upper cover 2032 and the rear cover 2033 are not fastened to the body portion 2040. The upper cover 2032 and the rear cover 2033, except for the front cover 2031, are not fastened to other members fastened to the body portion 2040. Therefore, the cover portion 2030 is fastened to the body portion 2040 only in the vicinity of the body side mount 2022.

  By fastening the body side mount 2022 to the body portion 2040, the rigidity of the portion of the body portion 2040 to which the body side mount 2022 is fastened and the portion in the vicinity thereof are enhanced. Therefore, cover portion 2030 is fastened to a portion of body portion 2040 having high rigidity.

  Further, since the cover portion 2030 has a monocoque structure, stress applied to any of the front cover 2031, the upper cover 2032 and the rear cover 2033 can be received by the whole of the front cover 2031, the upper cover 2032 and the rear cover 2033 At the same time, the stress applied to any of the front cover 2031, the upper cover 2032 and the rear cover 2033 is intensively transmitted to a portion where the rigidity is increased by fixing the body side mount 2022 in the body portion 2040. Therefore, compared with the case where the stress applied to any of the front cover 2031, the upper cover 2032 and the rear cover 2033 is transmitted to the other portion of the body portion 2040, the stress has an influence on the positioning accuracy of the imaging unit 2100. It can be reduced.

  The shutter unit 2023 is connected to the processing unit substrate 2420 via a flexible printed circuit. An output signal of the photometric sensor 2069 is connected to the processing unit substrate 2420 via a flexible printed circuit. The imaging unit 2100 is connected to the processing unit substrate 2420 via a flexible printed circuit. Similarly, the shutter unit 2023 is connected to the processing unit substrate 2420 via a flexible substrate. The operation member provided on the upper cover 2032 is connected to the processing unit substrate 2420 via the flexible substrate. Therefore, for example, stress applied to the rear cover 2033 and the upper cover 2032 is not substantially transmitted to the body portion 2040 through the processing unit substrate 2420 and the flexible printed circuit. Therefore, the portion to which the stress applied to the cover portion 2030 is transmitted is limited to the vicinity of the portion of the body portion 2040 to which the body side mount 2022 is fixed.

  FIG. 2 is an exploded perspective view of the front unit 1900. The front unit 1900 has a front cover 2031, an upper cover 2032 and a body assembly 2050. The body portion set 2050 includes a body portion 2040, a body side mount 2022, an imaging unit 2100, an attachment member 2150, an imaging unit side ground conductor 1800, a shutter unit 2023, and a focus detection unit 2026.

  The body side mount 2022, the imaging unit 2100, the attachment member 2150, the imaging unit side ground conductor 1800, the shutter unit 2023, and the focus detection unit 2026 are fastened directly or indirectly to the body portion 2040. The imaging unit 2100 is attached to the body portion 2040 via an attachment member 2150 fastened to the body portion 2040. The mounting member 2150 is formed of a rigid material. The material forming the mounting member 2150 may be metal. The imaging unit 2100 is indirectly fastened to the body portion 2040 via the mounting member 2150.

  In front unit 1900, front cover 2031 is fastened to body portion 2040. The upper cover 2032 is fastened to the front cover 2031. The upper cover 2032 is fastened to a rear cover 2033 shown in FIG.

  FIG. 3 is an exploded perspective view of the rear unit 1910. The rear unit 1910 includes a display unit cover 1610, a rear cover 2033, a display unit 2024, a pressing plate 1700, a processing unit substrate 2420, and a power supply unit 2500. The processing unit substrate 2420 is provided with electronic circuits such as a device connection connector 1691 and a recording medium connector 1692. Power supply unit 2500 includes a power supply substrate 2520 and a battery box 2510. When the rear unit 1910 is viewed along a line passing through the center of the display unit 2024, the processing unit substrate 2420, the pressing plate 1700, the display unit 2024, and the display unit cover 1610 are arranged in order in the z-axis negative direction.

  The display unit cover 1610 is attached to the rear cover 2033 from the z-axis negative direction. The display unit 2024 has a second main surface 1622 which is a display surface, and a first main surface 1621 opposite to the second main surface 1622. The display unit 2024 is pressed and fixed to the rear cover 2033 from the position in the z-axis plus direction by the pressing plate 1700. The pressing plate 1700 presses the display unit 2024 from the first main surface 1621 of the display unit 2024 against the rear cover 2033 and fixes the display unit 2024 to the rear cover 2033. The display unit 2024 is pressed against the pressing plate 1700 while being supported by the display unit support portion 1650 of the rear cover 2033. The image displayed on the second main surface 1622 of the display unit 2024 is presented to the outside through the opening 2039 that the rear cover 2033 has.

  The pressing plate 1700 is fastened to the rear cover 2033 with a screw. The display unit 2024 is pressed against the rear cover 2033 by the force in the negative z-axis direction applied from the pressing plate 1700 fastened to the rear cover 2033, and is fixed to the rear cover 2033.

  The pressing plate 1700 is formed of metal. The material forming the pressure plate 1700 may be copper. The pressing plate 1700 not only functions as a member for pressing the display unit 2024, but also functions as at least a part of a frame ground conductor in the imaging device 2000. The rigidity of the pressing plate 1700 is lower than the rigidity of the rear cover 2033. For example, the flexural modulus of the pressure plate 1700 is lower than the flexural modulus of the rear cover 2033. The flexural modulus of the pressure plate 1700 is lower than the flexural modulus of the front cover 2031. The flexural modulus of the pressure plate 1700 is lower than the flexural modulus of the upper cover 2032.

  FIG. 4 is an exploded perspective view of power supply unit 2500 and pressing plate 1700. FIG. FIG. 4 is an exploded perspective view seen from a direction different from the exploded perspective view shown in FIG. 3. FIG. 5 is a perspective view showing a state in which power supply unit 2500 and pressing plate 1700 are assembled. As shown in FIG. 5, the power supply unit 2500 is attached to the pressing plate 1700. The power supply unit 2500 is attached to an attachment portion 1790 of the pressing plate 1700.

  The power supply substrate 2520 has a hole 2531 for attaching the power supply substrate 2520 to the pressing plate 1700. The pressing plate 1700 has a hole 1731 in the mounting portion 1790 for mounting the power supply substrate 2520. The hole 1731 is a hole penetrating from the first main surface 1791 to the second main surface 1792 in the mounting portion 1790. A screw is inserted into the hole 2531 of the power supply substrate 2520 and the hole 1731 of the attachment portion 1790 of the power supply substrate 2520 and fastened to the holding plate 1700. The power supply substrate 2520 is fastened to the mounting portion 1790 in a state of being in contact with the second main surface 1792 of the mounting portion 1790.

  The power supply substrate 2520 has a first main surface 2521 provided with a plurality of battery connection terminals 2330, and a second main surface 2522 opposite to the first main surface 2521. A battery is attached to the battery box 2510. The second main surface 2522 is provided with a plurality of battery connection terminals 2330 corresponding to the plurality of terminals of the battery mounted on the battery box 2510. When a battery is attached to the battery box 2510, each of the plurality of battery connection terminals 2330 contacts a corresponding terminal of the battery.

  The power supply substrate 2520 is fixed by bringing the second major surface 2522 of the power supply substrate 2520 into contact with the mounting portion 1790. The holding plate 1700 is electrically connected to the battery connection terminal 2330 which is in contact with the negative electrode terminal of the battery attached to the battery box 2510 among the plurality of battery connection terminals 2330. The pressure plate 1700 contacts the ground conductor connected to the battery connection terminal 2330 which contacts the negative electrode terminal of the battery. The ground conductor provides a reference potential of the power supply circuit. The pressure plate 1700 is connected to the ground conductor at a plurality of different positions of the ground conductor. Since the pressure plate 1700 is electrically connected to the ground conductor of the power supply substrate 2520, the potential of the pressure plate 1700 is the ground potential. The pressure plate 1700 provides at least a portion of the frame ground conductor in the imaging device 2000.

  As described above, the cover 2030 has a monocoque structure. The imaging device 2000 does not have a structure for providing the strength of the entire imaging device 2000 in the cover 2030. The imaging device 2000 does not have a metal structure in the cover 2030. In the imaging device 2000, since the pressing plate 1700 is used as a frame ground conductor, the number of parts can be reduced as compared to the case where a conductor dedicated to the frame ground is provided. Further, since the pressing plate 1700 is used as a frame ground conductor, the space occupied by the frame ground conductor can be made smaller compared to the case where a structure providing strength of the entire imaging device 2000 is used as a frame ground conductor.

  In the imaging device 2000, the power supply substrate 2520 is in contact with the mounting portion 1790 of the pressing plate 1700 and fastened. Since the power supply substrate 2520 is provided in contact with the pressing plate 1700, the impedance between the negative electrode terminal of the battery and the pressing plate 1700 can be reduced. As shown in FIG. 2, the attachment portion 1790 is provided with an opening 1795. From the second main surface 2522 of the power supply substrate 2520, a tip end portion 2331 on the z-axis negative direction side of the battery connection terminal 2330 protrudes. When the power supply substrate 2520 is attached to the attachment portion 1790, the tip end portion 2331 is accommodated in the opening 1795. Therefore, the tip end portion 2331 can be prevented from coming into contact with the pressing plate 1700. In addition, the power supply substrate 2520 and the attachment portion 1790 can be closely fastened. Further, the power supply substrate 2520 and the mounting portion 1790 can be connected in a short distance. Therefore, the impedance between the negative electrode terminal of the battery and the pressure plate 1700 can be further reduced.

  FIG. 6 shows a state in which the power supply substrate 2520, the processing unit substrate 2420 and the pressing plate 1700 are connected. In FIG. 6, the device connection connector 1691, the recording medium connector 1692 and the recording medium 1680 are not shown. The processing unit substrate 2420 is fastened to the pressing plate 1700.

  The pressing plate 1700 has a flat portion 1710, a first extending portion 1720, a second extending portion 1730, and an attaching portion 1790. The flat plate portion 1710 has a first major surface 1711 and a second major surface 1712 opposite to the first major surface 1711. The first major surface 1711 and the second major surface 1712 are planes substantially parallel to the xy plane. The second major surface 1712 is a surface for pressing the display unit 2024 in the z-axis negative direction. The flat plate portion 1710 has a rectangular shape in the xy plane. In the xy plane, the area of the flat plate portion 1710 is larger than the area of the display unit 2024.

  The processing unit substrate 2420 has holes 2432, holes 2433 and holes 2434 for attaching the processing unit substrate 2420 to the holding plate 1700. The holes 2432, the holes 2433 and the holes 2434 of the processing unit substrate 2420 are holes penetrating from the first major surface 2421 to the second major surface 2422 of the processing unit substrate 2420. The pressing plate 1700 has a hole 1732, a hole 1733 and a hole 1734 in the flat plate portion 1710 for attaching the processing unit substrate 2420.

  A screw is inserted into the hole 2432 of the processing unit substrate 2420 and the hole 1732 of the flat plate portion 1710 of the pressing plate 1700 of the processing unit substrate 2420 and fastened to the pressing plate 1700. Further, a screw is inserted into the hole 2433 of the processing unit substrate 2420 and the hole 1733 of the flat plate portion 1710 of the pressing plate 1700 of the processing unit substrate 2420 and fastened to the pressing plate 1700. Further, screws are inserted into the holes 2434 of the processing unit substrate 2420 and the holes 1734 of the flat plate portion 1710 of the holding plate 1700 and the processing unit substrate 2420 is fastened to the holding plate 1700.

  The first extending portion 1720 extends in the z-axis plus direction from the first major surface 1711. The first extending portion 1720 extends in the z-axis positive direction from the end of the flat plate portion 1710 in the y-axis positive direction. The first extending portion 1720 has a plate shape substantially parallel to the xy plane. The second extending portion 1730 extends in the z-axis plus direction from the first major surface 1711. The second extending portion 1730 extends in the z-axis plus direction from the end of the flat plate portion 1710 in the y-axis minus direction. The second extending portion 1730 has a plate shape substantially parallel to the xy plane.

The attachment portion 1790 extends in the negative y-axis direction from the end of the first extending portion 1720 in the positive z-axis direction. The mounting portion 1790 has a first major surface 1791 substantially perpendicular to the z-axis and a second major surface 1792 substantially perpendicular to the z-axis. The mounting portion 1790 has a plate shape substantially parallel to the xy plane. In the z-axis direction, the processing unit substrate 2420 is provided between the first major surface 1791 of the mounting portion 1790 and the first major surface 1711 of the pressing plate 1700.

  When the processing unit substrate 2420 is fastened to the pressing plate 1700, the pressing plate 1700 comes in contact with the ground conductor provided on the processing unit substrate 2420. The ground conductors provided on the processing unit substrate 2420 are electrically connected to the pressing plate 1700 at a plurality of points. A ground conductor provided on the processing unit substrate 2420 is electrically connected to the holding plate 1700 to provide a signal ground on the processing unit substrate 2420. The ground conductor provided on the processing unit substrate 2420 provides a signal ground in an electronic circuit such as an ASIC and an MPU provided on the processing unit substrate 2420 and a device connection connector 1691 and a recording medium connector 1692 described later.

  The first extending portion 1720 is not provided with a hole. The flat plate portion 1710 has no hole or opening other than the hole for inserting a screw. Therefore, the cross-sectional area of the electrical path between the portion of the pressing plate 1700 in contact with the ground conductor of the power supply substrate 2520 and the portion of the pressing plate 1700 in contact with the ground conductor of the processing unit substrate 2420 should be increased. Can. Therefore, the ground conductor of the power supply substrate 2520 and the ground conductor of the processing unit substrate 2420 can be electrically connected with low impedance. In addition, noise generated in the electrical path between the ground conductor of the power supply substrate 2520 and the ground conductor of the processing unit substrate 2420 can be reduced.

  As mainly shown in FIG. 3, the processing unit substrate 2420 is provided with a device connection connector 1691 to which another device is connected and a recording medium connector 1692. The device connection connector 1691 and the recording medium connector 1692 are provided on the first main surface 2421 of the processing unit substrate 2420. The above-described ASIC, MPU, and the like are provided on the second main surface 2422 of the processing unit substrate 2420.

  The image data for recording generated by the ASIC provided on the processing unit substrate 2420 is recorded on the recording medium 1680 mounted on the recording medium connector 1692. As the recording medium 1680, a semiconductor memory card such as an SD card can be exemplified. The image data for recording generated by the ASIC provided on the processing unit substrate 2420 and the image data read from the memory card mounted on the recording medium connector 1692 are other devices via the device connection connector 1691. Output to As the device connection connector 1691, a USB connector, an HDMI (registered trademark) connector, or the like can be exemplified.

  FIG. 7 is a perspective view showing an imaging unit 2100, a mounting member 2150, a power supply substrate 2520, and an imaging unit side ground conductor 1800. FIG. 8 shows a cross-sectional view of the imaging unit 2100, the mounting member 2150, the processing unit substrate 2420, the pressing plate 1700 and the display unit 2024. FIG. 8 is a cross section of the yz plane, and shows an AA cross section shown in FIG.

  As shown in FIG. 8, the first extending portion 1720 extends from the second major surface 2422 of the processing unit substrate 2420 to a position in the z-axis plus direction. The second extending portion 1730 extends from the second major surface 2422 of the processing unit substrate 2420 to a position in the z-axis plus direction. Therefore, the pressing plate 1700 also functions as a member that shields the processing unit substrate 2420. For example, the pressing plate 1700 functions as a member that electromagnetically shields the processing unit substrate 2420.

  On the second major surface 2422 of the processing unit substrate 2420, electronic circuits such as the aforementioned ASIC and MPU are provided. Therefore, the electronic circuits such as ASIC and MPU are shielded by the pressing plate 1700. In the case of providing the processing unit substrate 2420 with a circuit such as an electronic circuit for processing a high frequency signal or a pattern with high frequency oscillation, it is preferable to provide these circuits on the second major surface 2422 of the processing unit substrate 2420. More preferably, the first major surface 2421 of the processing unit substrate 2420 is not provided with a circuit such as an electronic circuit for processing a high frequency signal or a pattern with high frequency oscillation.

  The first extending portion 1720 and the second extending portion 1730 may extend from the first major surface 2421 of the processing unit substrate 2420 to a position in the z-axis plus direction. Only one of the first extending portion 1720 and the second extending portion 1730 may extend from the first major surface 2421 of the processing unit substrate 2420 to a position in the z-axis plus direction.

  FIG. 9 is a cross-sectional view showing a portion B of FIG. 8 in an enlarged manner. FIG. 10 is a perspective view mainly showing the positional relationship between the imaging unit side ground conductor 1800, the pressing plate 1700 and the power supply substrate 2520. As shown in FIG.

  As mainly shown in FIG. 8, the imaging unit 2100 includes the first substrate 2120, the second substrate 2122, the imaging device 2130, the surrounding member 2140, the cover glass 2142, the optical element 2144, and the mask rubber 2146. , And a pressing plate 2148.

  The imaging element 2130 is mounted on the first substrate 2120. The second substrate 2122 is located in the z-axis negative direction relative to the first substrate 2120. The second substrate 2122 is attached to the first substrate 2120. A signal output from the imaging element 2130 is transmitted to the second substrate 2122 via the first substrate 2120, and transmitted from the second substrate 2122 to the processing unit substrate 2420 via the flexible printed circuit.

  The surrounding member 2140 is provided on the first substrate 2120 and surrounds the imaging device 2130. A cover glass 2142 is provided on the upper surface of the surrounding member 2140 in the z-axis positive direction. The imaging device 2130 is provided in a closed space formed by the first substrate 2120, the surrounding member 2140 and the cover glass 2142.

  The optical element 2144 may include an optical low pass filter and an infrared cut filter. The subject light flux incident on the optical element 2144 passes through the optical element 2144 and the cover glass 2142 and is incident on the imaging element 2130. The pressing plate 2148 is fastened to the mounting member 2150. The pressing plate 2148 presses the optical element 2144 in the negative z-axis direction via the mask rubber 2146 to press the optical element 2144 against the cover glass 2142.

  The imaging unit side ground conductor 1800 is a main portion 1810 provided along the main surface 2128 on the z-axis negative direction side of the second substrate 2122, a first side wall 1821, a second side wall 1822, and a third side wall 1823, fourth side wall portion 1824, fifth side wall portion 1825, sixth side wall portion 1826, seventh side wall portion 1827, eighth side wall portion 1828, ninth side wall portion 1829, first mounting portion 1830 , A second attachment portion 1840, and a ground connection portion 1850.

  The main portion 1810 has a shape along the main surface 2128 on the z-axis negative direction side of the second substrate 2122. In the portion where the electronic circuit is provided on the main surface 2128, the main portion 1810 has a shape along the outer shape of the electronic circuit. Main portion 1810 has an undulating shape along the electronic component provided on main surface 2128 and main surface 2128. The first side wall portion 1821, the second side wall portion 1822, the third side wall portion 1823 and the ninth side wall portion 1829 extend in the z-axis plus direction from the main portion 1810, and have a flat plate shape substantially parallel to the xy plane.

  The first side wall 1821 extends in the z-axis positive direction from the end of the main portion 1810 in the y-axis positive direction. The second side wall 1822, the third side wall 1823 and the ninth side wall 1829 extend in the z-axis positive direction from the end of the main portion 1810 in the negative y-axis direction. The second side wall portion 1822 is located in the x-axis positive direction relative to the third side wall portion 1823. The third side wall 1823 is located in the x-axis positive direction relative to the ninth side wall 1829. The second side wall 1822 is located in the negative y-axis direction relative to the third side wall 1823. The third side wall 1823 is located in the negative y-axis direction from the ninth side wall 1829. The first side wall 1821 and the second side wall 1822 extend in the z-axis positive direction to the vicinity of the mounting member 2150.

  The fourth side wall 1824, the fifth side wall 1825, the sixth side wall 1826, the seventh side wall 1827, the eighth side wall 1828 and the ninth side wall 1829 extend from the main portion 1810 in the z-axis positive direction. The fourth side wall 1824, the fifth side wall 1825, the sixth side wall 1826, the seventh side wall 1827, and the eighth side wall 1828 have a flat plate shape substantially parallel to the yz plane. The first side wall 1821, the second side wall 1822, the third side wall 1823, the fourth side wall 1824, the fifth side wall 1825, the sixth side wall 1826, the seventh side wall 1827 and the eighth side wall 1828 at least The second substrate 2122 is substantially enclosed.

  The first mounting portion 1830 extends in the y-axis positive direction from the end of the first side wall 1821 in the z-axis positive direction. The first attachment portion 1830 has a flat plate shape substantially parallel to the xy plane. The first attachment portion 1830 has a hole 1831 and a hole 1832 for attaching the imaging unit side ground conductor 1800 to the attachment member 2150.

  The second mounting portion 1840 extends from the end of the second side wall 1822 in the positive z-axis direction in the negative y-axis direction. The second attachment portion 1840 has a flat plate shape substantially parallel to the xy plane. The second mounting portion 1840 has a hole 1841 for mounting the imaging unit side ground conductor 1800 to the mounting member 2150.

  The mounting member 2150 has a hole 1951 and a hole 1952 for mounting the imaging unit side ground conductor 1800. A screw is inserted into the hole 1831 of the first mounting portion 1830 and the hole 1951 of the mounting member 2150 of the imaging unit-side ground conductor 1800 and fastened to the mounting member 2150. A screw is inserted into the hole 1832 of the first mounting portion 1830 and the hole 1952 of the mounting member 2150 of the imaging unit-side ground conductor 1800 and fastened to the mounting member 2150. A screw is inserted into the hole 1841 of the second mounting portion 1840 and the hole 1953 of the mounting member 2150 of the imaging unit side ground conductor 1800, and the imaging unit side ground conductor 1800 is fastened to the mounting member 2150.

  The ground connection portion 1850 extends mainly in the z-axis negative direction from the end of the second mounting portion 1840 in the y-axis negative direction. As mainly shown in FIG. 9, the ground connection portion 1850 is formed between the first extension portion 1851 and the second extension portion 1852, and the first extension portion 1851 and the second extension portion 1852 extend substantially in parallel to the xz plane. And a connector portion 1860 in contact with the pressing plate 1700.

  The connector portion 1860 is supported by the pressing plate 1700 in a state in which the edge of the second extending portion 1730 of the pressing plate 1700 in the z-axis plus direction is sandwiched. The imaging unit side ground conductor 1800 is electrically connected to the pressing plate 1700 at the connector portion 1860.

  The bent portion 1853 is an example of a stress absorbing portion. The bent portion 1853 absorbs stress by deforming against stress. The bent portion 1853 absorbs the stress transmitted from the first extending portion 1851 and suppresses the transfer of the stress transmitted from the first extending portion 1851 to the second extending portion 1852. The bent portion 1853 absorbs the stress transmitted from the second extending portion 1852 and suppresses the transfer of the stress transmitted from the second extending portion 1852 to the first extending portion 1851.

  When stress is applied to the rear cover 2033, the stress transmitted from the rear cover 2033 to the connector portion 1860 of the imaging unit side ground conductor 1800 via the pressing plate 1700 is absorbed by the bending portion 1853. Therefore, transmission of the stress applied to the rear cover 2033 to the body portion set 2050 is suppressed.

  The shape of the bent portion 1853 is not limited to the illustrated shape. The bending portion 1853 may have various shapes such as S-shape and U-shape. The bending stress generated at the bending portion 1853 is preferably low. The bending portion 1853 preferably has a flexible bendability to stress.

  In the imaging device 2000 of the present embodiment, the processing unit substrate 2420 is located in the z-axis negative direction relative to the power supply substrate 2520. However, the processing unit substrate 2420 may be disposed at the same position as the power supply substrate 2520 in the z-axis direction. The processing unit substrate 2420 may be arranged side by side with the power supply substrate 2520 in the xy plane.

  The output signal of the photometric sensor 2069 may be connected to the processing unit substrate 2420 via a flexible printed circuit that connects the shutter unit 2023 and the processing unit substrate 2420. Further, the output signal of the focus detection sensor unit 2027 may be connected to the processing unit substrate 2420 via a flexible printed circuit that connects the shutter unit 2023 and the processing unit substrate 2420. As described above, the connections between the photometric sensor 2069 and the focus detection sensor unit 2027 and the processing unit substrate 2420 may be integrated into a flexible printed circuit that connects the shutter unit 2023 and the processing unit substrate 2420.

  Here, the flexible printed circuit board connecting the shutter unit 2023 and the processing unit board 2420 may be connected to the processing unit board 2420 through the position in the y-axis plus direction from the imaging unit 2100. Similarly, the flexible printed circuit board connecting the imaging unit 2100 and the processing unit board 2420 is connected to the processing unit board 2420 from the position in the y-axis plus direction. Similarly, the flexible substrate connecting the operation member provided on the upper cover 2032 and the processing unit substrate 2420 is connected to the processing unit substrate 2420 from the position in the y-axis plus direction. Thus, in the process of assembling the rear unit 1910 to the front unit 1900, the workability of the process of connecting the flexible substrates to the processing unit substrate 2420 is enhanced. The upper cover 2032 and the processing unit substrate 2420 may be connected by a rigid connector such as a substrate-to-substrate connector.

  In the present embodiment, the camera body which is the lens unit is picked up, and the configuration of the imaging apparatus 2000 has been described. However, the imaging device is a concept including a camera body that does not have a lens unit. Further, the imaging apparatus is a concept including cameras of various modes such as a non-interchangeable camera as well as a single-lens reflex camera which is an example of the interchangeable-lens camera.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It is apparent to those skilled in the art that various changes or modifications can be added to the above embodiment. It is also apparent from the scope of the claims that the embodiments added with such alterations or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operations, procedures, steps, and steps in the apparatuses, systems, programs, and methods shown in the claims, the specification, and the drawings is particularly “before”, “preceding” It is to be noted that “it is not explicitly stated as“ etc. ”and can be realized in any order as long as the output of the previous process is not used in the later process. With regard to the operation flow in the claims, the specification, and the drawings, even if it is described using “first,” “next,” etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

1610 display unit cover, 1621 first main surface, 1622 second main surface, 1650 display unit support portion, 1680 recording medium, 1691 device connection connector, 1692 recording medium connector 1700 pressing plate, 1710 flat plate portion, 1711 first main Surface, 1712 second main surface, 1720 first extending portion, 1730 second extending portion, 1731, 1732, 1733, 1734 hole, 1790 mounting portion, 1791 first main surface, 1792 second main surface, 1795 opening 1800 imaging unit Side ground conductor, 1810 main portion, 1821 first side wall portion, 1822 second side wall portion, 1823 third side wall portion, 1824 fourth side wall portion, 1825 fifth side wall portion, 1826 sixth side wall portion, 1827 seventh side wall portion, 1828 eighth side wall portion, 1829 ninth side wall portion, 1830 first mounting portion, 1831 1832, 841 hole 1840 second attachment portion 1850 ground connection portion 1851 first extension portion 1852 second extension portion 1853 bend portion 1860 connector portion 1900 front unit 1910 rear unit 1951, 1952, 1953 hole 2000 imaging device , 2010 lens unit, 2012 lens side mount, 2014 optical system, 2015 lens group, 2016 lens group, 2020 camera body, 2022 body side mount, 2023 shutter unit, 2024 display unit, 2025 lens drive unit, 2026 focus detection unit, 2027 Focus detection sensor unit, 2030 cover unit, 2031 front cover, 2032 upper cover, 2033 rear cover, 2039 opening, 2040 body unit, 2042 mirror unit, 2043 main mirror, 20 4 sub mirror 2050 body assembly 2060 finder unit 2061 focusing screen 2062 penta prism 2063 finder lens system 2064 finder window 2067 photometric unit 2068 photometric optical system 2069 photometric sensor 2100 image pickup unit 2148 pressure plate 2120 1 substrate, 2122 second substrate, 2128 main surface, 2130 imaging device, 2140 surrounding member, 2142 cover glass, 2144 optical element, 2146 mask rubber, 2150 mounting member 2330 battery connection terminal, 2331 tip portion 2420 processing unit substrate, 2421 1 main surface, 2422 second main surface, 2432, 2433, 2434, 2531 hole 2500 power supply unit, 2510 battery box, 2520 power supply substrate, 2521 first main , 2522 the second major surface

Claims (9)

A first exterior that provides at least a portion of the appearance;
A display unit having a first surface which is a display surface and a second surface opposite to the first surface;
A substrate having a ground conductor,
A conductive pressing plate that is electrically connected to a conductor serving as a reference potential of a power supply circuit and presses the display unit from the second surface of the display unit to the first exterior unit;
And a conductor electrically connecting the ground conductor of the substrate and the pressing plate,
The electronic device having a stress absorbing portion that absorbs the stress applied to the connecting conductor. The electronic device according to claim 1, wherein the pressing plate functions as a frame ground conductor of the electronic device with respect to a plurality of the substrates. The power supply circuit generates power for driving the electronic device from power supplied from a battery,
The electronic device according to claim 1, wherein the pressing plate is electrically connected to a negative electrode terminal of the battery. A second exterior part providing part of the appearance and fastened with the first exterior part;
It further comprises a body part fastened to the second exterior part,
The pressing plate is fastened to the first exterior portion,
The electronic device according to any one of claims 1 to 3, wherein the substrate is attached to the body portion. The conductor to be connected is
A first mounting portion attached to the body portion;
And a second attachment portion attached to the pressing plate,
The stress absorbing portion is provided between the first mounting portion and the second mounting portion, and has a bending portion which is bent in response to a stress applied from the pressing plate via the second mounting portion. 5. The electronic device according to item 4. The conductor to be connected is
The electronic device according to any one of claims 1 to 5, further comprising: a shield part which covers at least a part of the circuits provided on the substrate to shield the at least part of the circuits. It further comprises an imaging device provided on the substrate,
The electronic apparatus according to any one of claims 1 to 6, wherein the display unit displays an image based on a signal generated by the imaging device. The electronic device according to any one of claims 1 to 7, wherein the pressing plate covers at least a part of circuits included in the substrate to shield the at least part of the circuits. The pressing plate is
A flat plate portion for holding the display portion;
And an extending portion extending from the flat plate portion to a position where the substrate is provided,
The flat plate portion has a main surface substantially parallel to a surface of the substrate on which the at least one circuit is provided, and covers the at least one circuit to shield the at least one circuit. Electronic device described in.