JP2005065014A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus for an electronic camera, etc., at low cost, which is strong to noise from a digital signal system circuit, a power circuit or the like and can maintain the quality of a photographed image satisfactorily by optimally arranging a circuit board in the imaging apparatus and shielding the circuit board. <P>SOLUTION: This imaging apparatus with an imaging device for converting an object image into an electrical signal and a recording means for recording image data outputted from the imaging device on a recording medium is provided with a holding member for holding the imaging device, a first shielding member supported by the holding member, a printed circuit board mounted with an imaging circuit for processing the electrical signal outputted from the imaging device, a second shielding member for covering at least a portion of an imaging circuit block on the printed circuit board, and a flexible wiring board for connecting the imaging device and the printed circuit board, wherein the flexible wiring board is covered with the first shielding member and the first shielding member is connected conductively to the second shielding member. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an imaging device such as a digital camera provided with an imaging device for converting a subject image into an electrical signal and recording means for recording image data output from the imaging device on a recording medium. The present invention relates to an arrangement of an electric circuit board including a signal processing circuit board, an arrangement of each shield member, and a connection structure.

  The subject image incident from the photographic lens is photoelectrically converted by a solid-state imaging device such as a CCD, the photoelectrically converted image signal is A / D converted and recorded on a recording medium, and further, the image is displayed on a built-in liquid crystal monitor. Possible digital cameras are generally known. The following patent document 1 is known as an example applied to an endoscope.

  Especially for digital single-lens reflex cameras with interchangeable lens barrels, they have good operability and high-speed continuous shooting performance, as with silver-salt film cameras. Is required to be wide. For this reason, it is necessary to employ an image sensor having a large number of pixels and high sensitivity. Accordingly, an image pickup device having a large image pickup area is used, and the area of the substrate to which the image pickup device is connected is inevitably large. In addition, compared with the silver halide film camera, a large-scale electric circuit using many electric parts such as an image pickup circuit, an image processing circuit, and an image display circuit is added. It is required to properly arrange the substrate.

  6 and 7 show an example of a digital single-lens reflex camera as a conventional example. 6 shows a horizontal sectional view, and FIG. 7 shows a vertical sectional view.

6 and 7, reference numeral 101 denotes a camera casing, in which a battery 102 is disposed inside a grip portion 101a protruding forward. Reference numeral 103 denotes a replaceable lens barrel that holds the photographing lens 104. Reference numeral 105 denotes a mirror box, which is connected to the lens barrel 103 by a mount portion 105a. In addition, the mirror box 105 includes a quick return mirror 106 that is held at an angle of 45 ° with respect to the optical axis L _{0 in} order to guide the light passing through the photographing lens 104 to the viewfinder eyepiece. A focal plane shutter 107 is provided. Reference numeral 108 denotes a pentaprism, and 109 denotes a finder eyepiece group for observing a subject image.

  A main chassis 110 holds the mirror box 105 and secures the strength of the entire camera.

Reference numeral 111 denotes an image pickup device package that houses a sensor chip having an image pickup surface behind the focal plane shutter 107 and perpendicular to the optical axis L ₀ , and has a plurality of lead terminals 111 a that are bent and extended backward from the top and bottom. doing. An optical low-pass filter 112 is provided on the lens side of the image sensor package 111. An image pickup circuit board 113 is arranged in parallel with the image pickup surface of the image pickup device package 111 as shown in the figure. The lead terminal 111a is inserted into a hole provided in the image pickup circuit board 113 and soldered, thereby picking up an image. The element 112 and the imaging circuit board 113 are directly connected.

A shield case 114 that covers most of the board is provided behind the imaging circuit board 113. A first circuit board 115 and a second circuit board 116 are disposed on the side of the imaging circuit board 113, and a third circuit board 117 is disposed in front of the imaging circuit board 113. For example, a mechanism drive control circuit, an image processing circuit, and an image display circuit are mounted on the first circuit board 115 and the second circuit board 116. On the third circuit board 117, a strobe circuit or a power supply circuit to which a main capacitor 118 is connected is mounted. Reference numeral 119 denotes a connection flexible cable that connects the two boards by a connector 113a mounted on the imaging circuit board 113 and a connector 115a mounted on the first circuit board 115. An illumination light source 120 and a liquid crystal display unit 121 are disposed further rearward of the imaging circuit board 113. A card slot 122 into which a memory card 123 as an external recording medium is mounted is provided between the battery 102 along the first circuit board 115.
Japanese Patent Laid-Open No. 3-64177

  In the case of a digital single-lens reflex camera using a large image sensor, the relative positional relationship between the image sensor and the optical viewfinder and positioning in the photographing focus direction are necessary. Therefore, it is necessary to adjust the position in the focus direction, to adjust the vertical and horizontal tilts to prevent one-sided blurring, and to adjust the position and rotation in the horizontal and vertical directions to adjust the angle of view. As a result, the six axes need to be adjusted.

  In the structure in which the lead terminal is directly soldered to the image pickup circuit board disposed on the back surface of the image pickup device package like the above-described conventional digital single-lens reflex camera, when the position / tilt adjustment of the image pickup device is performed, the lead terminal Similarly, a change in position or inclination also occurs in a substrate directly attached with. In particular, when the vertical / left / right tilt adjustment for suppressing single-sided blurring is performed, if the substrate is large, the amount of displacement at the end of the substrate becomes large, which may cause interference with adjacent structural components. The substrate could not be enlarged. Therefore, the substrate to which the image sensor is connected has to be of an appropriate size, and it has been necessary to provide and arrange a plurality of substrates obtained by dividing other circuit blocks.

  Therefore, in addition to the increase in component cost and assembly cost due to the division of the substrate, a flexible wiring substrate and a connector for connecting a plurality of substrates are required, and the manufacturing cost of the entire camera is increased.

  In addition, since the lead terminal 111a connecting the image pickup device package 111 and the image pickup circuit board 113 is exposed without being shielded, the digital mounted on the adjacent first circuit board 115 or second circuit board 116 is provided. Noise generated from the signal system circuit and noise generated from a strobe circuit provided in the third circuit board 117 or a step-up transformer mounted on the power supply circuit affect the connection lead terminal portion 111a between the image pickup device itself and the image pickup circuit board 113. Was exerting.

  In view of such a situation, the present invention is resistant to noise from a digital signal system circuit, a power supply circuit, and the like by optimally arranging and shielding a circuit board in an imaging apparatus, and maintains a good quality of a photographed image. An object of the present invention is to provide an imaging device such as an electronic camera at a low cost.

  An image pickup apparatus according to the present invention is an image pickup apparatus having an image pickup element that converts a subject image into an electrical signal, and a recording unit that records image data output from the image pickup element on a recording medium, and holds the image pickup element. A holding member, a first shield member supported by the holding member, a printed circuit board on which an imaging circuit for processing an electric signal output from the imaging element is mounted, and an imaging circuit block on the printed circuit board A second shield member that covers at least a portion; and a flexible wiring board that connects the imaging device and the printed circuit board; and the first shield member covers the flexible wiring board, and the first shield member The second shield member is conductively connected.

  In particular, the imaging apparatus according to the present invention is characterized in that the first shield member and the second shield member are soldered and fixed to each other.

  In the imaging device of the present invention, either the first shield member or the second shield member has a spring shape in one of them, and is held in elastic contact with the other. .

  In the imaging device of the present invention, a printed circuit board on which an imaging circuit for processing an electrical signal output from the imaging element is mounted is disposed substantially parallel to an imaging surface behind the imaging element, and the flexible wiring board Has a U-turn shape, and the first shield member covering the flexible wiring board has a shape bent backward with a width equivalent to that of the flexible wiring board.

  In the image pickup apparatus of the present invention, the connection portion of the first shield member and the second shield member is outside the width of the flexible wiring board.

  In the image pickup apparatus of the present invention, the first shield member includes a portion having a surface substantially parallel to the image pickup surface of the image pickup element and a portion extending rearward so as to cover the flexible wiring board. A surface that is substantially parallel to the imaging surface of the element has an opening that determines a light beam incident on the imaging element.

  Furthermore, the image pickup apparatus of the present invention includes means for attaching a holding member for holding the image pickup element to the image pickup apparatus housing side so as to adjust the position and inclination of the image pickup element.

  According to the present invention, the image pickup device and the image pickup circuit board are connected by the flexible wiring board so that the rear image pickup circuit board does not tilt even if the position / tilt adjustment of the image pickup device package is adjusted. And an increase in manufacturing cost can be suppressed. At the same time, a strong GND shield is achieved by using a common potential for the shield member that covers the periphery of the image sensor and the flexible wiring board connected to the image sensor circuit board and the shield member that covers the image sensor circuit. The quality of the captured image can be kept good without affecting the imaging signal processing circuit by noise generated from the power supply circuit or the like.

  In addition, one of the first shield member and the second shield member has a spring shape and is elastically pressed and held against the other, thereby facilitating connection work and disassembly work between the shield members. .

  Moreover, since the flexible wiring board is bent along the shield member by forming the shield member covering the flexible wiring board connecting the imaging element and the imaging circuit board to the rear with the same width as the flexible connection board. The workability when connecting the flexible wiring board to the imaging circuit board is improved.

  In addition, the connection portion between the first shield member and the second shield member is located outside the width of the flexible wiring board, thereby preventing the flexible wiring board from being bent along the shield member without obstructing the form of the imaging circuit board. The workability when connecting to can be kept good.

  In addition, since the first shield member around the image sensor has a function of a mask opening that determines a light beam incident on the image sensor, the parts can be shared and an increase in manufacturing cost can be suppressed.

  Furthermore, a holding member that holds the image sensor can be attached to the image pickup apparatus housing so as to adjust the position and inclination of the image sensor.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

  An imaging apparatus to which the present invention is applied will be described with reference to FIGS. 1 to 5 by taking a digital single lens reflex camera as an example in this embodiment.

  1 and 2 are external views of a digital single-lens reflex camera, and FIG. 1 is a perspective view as seen from the front of the camera, showing a state where a lens barrel is removed. FIG. 2 is a perspective view seen from the back side of the camera.

  First, a portion that is externally described will be described with reference to FIGS. 1 and 2. Reference numeral 1 denotes a camera housing, which is provided with a grip portion 1a that protrudes forward so that a user can easily hold the camera stably during photographing. Reference numeral 2 denotes a mount, which is a part where a detachable lens barrel 3 (see FIGS. 4 and 5) is attached to the camera body. Reference numeral 4 denotes a lens lock release button that is pushed in when removing the lens barrel 3. Reference numeral 5 denotes a mirror box arranged in the camera casing, which has a shape surrounding a light beam that has passed through the photographing lens. In addition, a quick return mirror 6 is built in that is held at an angle of 45 ° to guide the light passing through the photographing lens to the viewfinder.

  To the left of the upper part of the camera (as viewed from the front), a shutter button 7 as a start switch for starting shooting, a main operation dial 8 for setting a shutter speed and a lens aperture value according to an operation mode at the time of shooting, and a camera An LCD display panel 9 showing each operation mode and an upper surface operation mode setting button 10 of the photographing system are arranged. The upper surface operation mode setting button 10 is used to set whether the continuous shooting or only one frame shooting is performed when the shutter button 7 is pressed once, the self shooting mode setting, and the like. The setting status is displayed.

  A flash unit 11 that pops up with respect to the camera body, a shoe groove 12 for attaching a flash, and a flash contact 13 are provided at the upper center of the camera, and a shooting mode setting dial 14 is disposed from the upper right of the camera.

  An openable / closable external terminal lid 15 is provided on the right side of the camera, and a video signal output jack 16 and a USB output connector 17 are housed inside the lid 15 as an external interface.

  A finder eyepiece window 18 is provided above the center of the optical axis on the back of the camera, and a color liquid crystal display 19 capable of displaying an image is provided at the center of the back of the camera. The sub operation dial 20 arranged beside the color liquid crystal display unit 19 plays an auxiliary role of the function of the main operation dial 8, and for example, in the AE mode of the camera, the exposure correction amount with respect to the appropriate exposure value calculated by the automatic exposure device. Used to set Alternatively, in the manual mode in which each of the shutter speed and the lens aperture value is set according to the user's will, the shutter speed is set with the main operation dial 8 and the lens aperture value is set with the sub operation dial 20. The sub operation dial 20 is also used as a display selection unit for a captured image displayed on the color liquid crystal display unit 19.

  A rear operation mode setting button 21 can set AE lock settings and the like, and the setting status is displayed on the LCD display panel 9 in the same manner as the upper operation mode setting button 10. Reference numeral 22 denotes a main power switch for turning on the camera, and the switch is turned on and off by rotating it by a predetermined angle. The push button switch 23 arranged on the left side when viewed from the back of the color liquid crystal display unit 19 can perform menu display for changing various settings of the camera with the color liquid crystal operation switch, change the display method of the captured image, and the like.

  Reference numeral 24 denotes an erasing button for erasing image data once recorded on the recording medium, and is arranged away from the LCD operation switch 24 so as not to be pushed in by mistake.

  An openable / closable card cover 25 covers an insertion slot of a memory card, which is an external recording medium, and is supported so that it can be rotated in addition to a small amount of sliding movement. A battery cover 26 is rotatably supported so that the battery can be inserted and removed from the bottom surface of the camera. Reference numeral 27 denotes a tripod mounting screw provided on the bottom of the camera.

  Next, with reference to FIG. 3 to FIG. 5, the arrangement and operation of each component member such as an optical member inside the camera, a battery storage chamber, a circuit board, and a memory card mounting portion will be described.

  3 is a rear view showing the inside of the camera by cutting the housing on the back of the camera, FIG. 4 is a horizontal sectional view taken along the line AA in FIG. 3, and FIG. 5 is along the line BB in FIG. It is a vertical sectional view including the cut lens optical axis, and shows a state where the built-in strobe is popped up.

  In these drawings, reference numeral 3 denotes a lens barrel that is detachable from the camera body, and holds the taking lens 30. A battery 31 serving as a power source is disposed inside the grip portion 1 a protruding forward of the camera housing 1.

  A focal plane shutter 32 is disposed behind the quick return mirror 6 and is held by the mirror box 5.

  Reference numeral 33 denotes a pentaprism, and 34 denotes a finder eyepiece group for observing a subject image.

  Reference numeral 35 denotes a sensor chip having a surface perpendicular to the optical axis L as an imaging surface, and is a semiconductor that converts a subject image into an electrical imaging signal. A sensor package 36 includes a front package 36a and a rear package 36b. The sensor package 36 contains a sensor chip 35, and the side on which a subject image incident from a photographing lens is captured is sealed with a cover glass 37. Reference numerals 38 a and 38 b denote lead frames, which are metal plates that are wire-bonded to the sensor chip 35, and function as a plurality of lead terminals that are each extended from the sensor package 36 to the signal line and the power line from the sensor chip 35.

  The structure composed of the above-mentioned members 35 to 38 is generally called “imaging sensor”.

  Reference numeral 39 denotes a sensor plate, which is a metal plate for holding the image sensor, and has an opening 39a having a sufficient margin for the photographic light flux.

  Reference numeral 40 denotes an upper flexible substrate, which is connected to a plurality of upper lead terminals 38a by solder or the like in the vicinity of one end. Similarly, reference numeral 41 denotes a lower flexible substrate which is connected to a plurality of lower lead terminals 38b by solder or the like. The other end of each of the upper flexible substrate 40 and the lower flexible substrate 41 is connected to an imaging circuit substrate described later.

  Reference numeral 42 denotes a shield plate having extension portions 42a and 42b for shielding the upper flexible substrate 40 and the lower flexible substrate 41, and a contact portion 42c with a shield case, which will be described later, at the rear end of the upper extension portion 42a. doing.

  Reference numeral 43 denotes a low-pass filter mask, which is disposed behind the focal plane shutter 32 and restricts the photographing light flux to prevent the occurrence of ghosts and the like.

  An optical low-pass filter 44 is held by a low-pass filter holder 45 and prevents the occurrence of moiré and false colors in the captured image.

Reference numeral 46 denotes an adhesive tape, which constitutes a unit sealed so that dust and the like do not enter between the cover glass 37 and the optical low-pass filter 44, so that the back surface of the low-pass filter holder 45 and the front surface of the cover glass 37 are It is pasted in between.
The structure including the above-described imaging sensor and including members 39 to 46 will be collectively referred to as an “imaging sensor unit” hereinafter.

  Reference numeral 47 denotes a mounting washer, which is sandwiched between the sensor plate 39 holding the image sensor and the mirror box 5 after the thickness is selected by an adjustment process to be described later. It is fixed with.

Reference numeral 48 denotes a main chassis obtained by processing a metal plate, which is arranged in parallel with the imaging surface.
The main chassis 48 is firmly fastened to the mirror box 5 with screws or the like, and forms a framework that secures the overall strength of the camera body together with the mirror box 5. Further, the bottom surface of the camera has a portion 48a where a part of the main chassis 48 is bent forward, and a tripod mounting screw 27 is fixed.

  A motor 49 is a driving source for charging the focal plane shutter 32, up / down operation of the quick return mirror, and strobe pop-up operation, and is held in the mirror box 5.

  Reference numeral 50 denotes a main circuit board, which is arranged in parallel with the imaging surface and fixed to the main chassis 48. The main circuit board 50 includes an imaging signal processing circuit that samples and amplifies the output signal of the imaging sensor, performs A / D conversion, an imaging signal processing circuit that performs predetermined processing on an image signal such as white balance, exposure adjustment, and gamma correction, And a memory control circuit for controlling the operation of storing or reading the digital image signal in the internal memory, a control circuit for controlling the entire system such as driving of the mechanical system, and an image display circuit such as a driver circuit for the color liquid crystal monitor 55 described later Is built in and a large area is secured.

  The main circuit board 50 has a connector 51 mounted on the upper part on the back side and a connector 52 mounted on the lower part on the entire surface. The upper flexible board 40 and the lower flexible board connected to the above-described imaging sensor are connected to each connector. 41 is connected.

  Further, a front shield case 53 that covers the imaging circuit block is attached to the front side of the main circuit board 50, and a rear shield case 54 that similarly covers the imaging circuit block is attached to the back side. The rear shield case 54 has an arm portion 54a that comes into pressure contact with the contact portion 42C of the shield plate 42 described above.

  A color liquid crystal display unit 19 is disposed further rearward of the main circuit board 50. The color liquid crystal display unit 19 includes a color liquid crystal monitor 55, an illumination light source 56, and an opening window of the housing 1. The color liquid crystal monitor 55 and the illumination light source 56 are housed in a sheet metal case 57.

  A strobe circuit board 58 is disposed on the left side of the mirror box 5 and is connected to a main capacitor 59 for charging. The main capacitor 59 is charged and the light emitting unit 60 in the strobe unit 11 is controlled. Built in circuit to do.

  Reference numeral 61 denotes a memory card which is an external recording medium, and a card connector to which the 62 memory card 61 is connected, and is provided between the main chassis 48 along the main circuit board 50. The memory card 61 can be inserted / removed from the side surface of the grip side of the camera by pulling the card cover 25 rearward along the optical axis and then rotating the hinge 25a counterclockwise (see FIG. 4). It is like that.

  Next, the position / tilt adjustment of the image sensor in the digital single-lens reflex camera according to the present embodiment configured as described above will be described.

  Since the image pickup surface of the sensor chip 35 has a variation in manufacturing position and inclination with respect to the arrangement surface of the rear package 36b, the correlation position between the photographing lens and the image pickup surface of the sensor chip is determined in manufacturing the camera. Adjustments are required to match. Therefore, the position and inclination of the sensor chip are measured in advance in the state of the imaging sensor unit, and the position of the mounting washer 47 is measured in consideration of the position and inclination measurement values of each of the plurality of mounting surfaces of the mirror box 5 to which the imaging sensor unit is mounted. Determine the thickness. Then, the mounting washer 47 having a thickness determined for each of the plurality of mounting surfaces of the mirror box 5 is squeezed, and the sensor plate 39 is fixed with screws, whereby the fixing of the imaging sensor unit is completed.

  Therefore, although the sensor chip 35 is perpendicular to the optical axis L by the adjustment, the package 36 and the sensor plate 39 are not perpendicular to the optical axis L and are in an inclined state.

  On the other hand, since the main circuit board 50 having a large area is fixed to the main chassis 48, the connection between the image sensor having a different tilt amount for each camera body and the main circuit board 50 is as shown in FIG. Variations can be absorbed using the turned flexible substrates 40 and 41.

  Next, the shield member in the digital single-lens reflex camera in this embodiment will be described in detail.

  The shield plate 42 is held between the sensor plate 39 and the low-pass filter holder 45. The extension 42a has a width substantially the same as that of the upper flexible substrate 40 and extends rearward. Similarly, the extension 42b has a width substantially the same as that of the lower flexible substrate 41 and extends rearward. If the width of each extension is equal to or greater than the width of each flexible cable, it is possible to prevent the influence of noise from adjacent digital signal circuits, strobe circuits, power supply circuits, etc. from reaching the wiring pattern on the flexible cable. it can.

  In addition, since the extension portions 42a and 42b extend rearward with a width equivalent to the width of the flexible substrate, the flexible substrates 40 and 41 are bent rearward along the extension portion in the state of the imaging sensor unit. In this state, the insertion operation to the connectors 51 and 52 on the main circuit board 50 works well.

  Further, the contact portion 42c with the shield case 54 at the rear end of the upper extension portion 42a is located outside the width of the upper flexible substrate 40, so that the upper flexible substrate 40 extends along the shield plate extension portion 42a. Therefore, it is possible to maintain good workability when connecting to the imaging circuit board without obstructing the bent form.

  The arm portion 54a of the shield case 54 has a leaf spring shape and is in pressure contact with the shield plate contact portion 42c even if the positional relationship between the image sensor units is adjusted and the mutual positional relationship varies. This is because it can be absorbed.

  Note that the connecting work and the disassembling work are easier when the arm part 54a of the shield case 54 is connected to the shield plate contact part 42c only by pressure contact. However, on the other hand, since the connection reliability is low, it goes without saying that the connection by soldering has a lower conduction resistance and higher connection reliability.

  In the above-described embodiment, the low-pass filter mask 43 is set as a single component. However, the low-pass filter mask 43 may function as a mask that restricts the photographing light flux by the lens side opening of the shield plate 42.

1 is an external perspective view of a digital single lens reflex camera according to an embodiment of the present invention as seen from the front. Similarly perspective view from the back side The rear view which cut | disconnects the housing | casing of the back surface of the camera in embodiment of this invention, and shows an inside Horizontal sectional view cut along line AA in FIG. FIG. 3 is a vertical sectional view taken along line BB in FIG. Horizontal cross-sectional view of a conventional digital SLR camera Same vertical section

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Camera housing 2 Mount part 3 Lens barrel 5 Mirror box 6 Quick return mirror 30 Shooting lens 31 Battery 32 Focal plane shutter 35 Sensor chip 36 Sensor package 38 Lead frame 39 Sensor plate 40 Upper flexible board 41 Lower flexible board 42 Shield Plate 44 Optical low-pass filter 48 Main chassis 49 Motor 50 Main circuit board 54 Rear shield case 55 Color LCD monitor 56 Illumination light source 58 Strobe circuit board 61 Memory card

Claims (7)

An imaging device having an imaging device that converts a subject image into an electrical signal, and a recording unit that records image data output from the imaging device on a recording medium,
A holding member for holding the image pickup device; a first shield member supported by the holding member; a printed circuit board on which an image pickup circuit for processing an electric signal output from the image pickup device is mounted; and the printed circuit board. A second shield member that covers at least a part of the imaging circuit block, and a flexible wiring board that connects the imaging element and the printed circuit board, and covers the flexible wiring board with the first shield member, An imaging apparatus, wherein the first shield member and the second shield member are conductively connected.   The imaging apparatus according to claim 1, wherein the first shield member and the second shield member are soldered and fixed to each other.   The imaging apparatus according to claim 1, wherein one of the first shield member and the second shield member has a spring shape, and is elastically pressed against the other and held.   A printed circuit board on which an imaging circuit for processing an electrical signal output from the imaging element is mounted is disposed substantially parallel to the imaging surface behind the imaging element, and the flexible wiring board has a U-turn shape, The imaging apparatus according to claim 1, wherein the first shield member covering the flexible wiring board has a shape bent backward with a width equal to that of the flexible wiring board.   The imaging apparatus according to claim 1, wherein a connection portion between the first shield member and the second shield member is outside the width of the flexible wiring board.   The first shield member includes a portion having a surface substantially parallel to the imaging surface of the imaging element and a portion extending rearward so as to cover the flexible wiring board, and is substantially parallel to the imaging surface of the imaging element. The imaging apparatus according to claim 1, wherein the surface has an opening that determines a light beam incident on the imaging element.   The image pickup apparatus according to claim 1, further comprising means for attaching a holding member for holding the image pickup element to the image pickup apparatus housing side so as to adjust a position and an inclination of the image pickup element.

Images