JP6232789B2 - Imaging unit and imaging apparatus - Google Patents

Description

  The present invention relates to an imaging unit and an imaging apparatus.

An imaging unit having a package structure in which an imaging chip is mounted in a ceramic package is known.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-019423

  Due to magnetism, noise may be mixed in the pixel signal generated by the image sensor.

  In the first aspect, the imaging unit includes an imaging unit having a plurality of light receiving elements formed thereon, an imaging chip having a circuit positioned around the imaging unit, a mounting substrate on which the imaging chip is mounted, and the mounting An encircling member that is provided on the substrate and surrounds the imaging chip, and covers at least a part of the circuit with respect to a direction in which light enters the imaging unit at a position closer to the imaging chip than the encircling member And a magnetic shielding part for magnetically shielding at least a part of the circuit.

  In the second aspect, an imaging device includes the imaging unit.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a schematic cross section of the camera 10 which is an example of an imaging device. 2 is a perspective view schematically showing an imaging module 40. FIG. 2 is a cross-sectional view schematically showing an imaging module 40. FIG. It is another sectional view showing image pick-up module 40 typically. 2 is a top view schematically showing a configuration of a circuit block formed on the imaging chip 100. FIG. FIG. 6 is a cross-sectional view schematically showing a first modification and a second modification of the imaging unit. It is sectional drawing which shows typically the 3rd modification of the imaging unit 42, and a 4th modification. It is sectional drawing which shows typically the imaging unit 425 as a 5th modification of the imaging unit 42. FIG. FIG. 25 is a cross-sectional view schematically showing an imaging unit 426 as a sixth modification of the imaging unit 42. It is sectional drawing which shows typically the imaging unit 427 as a 7th modification of the imaging unit. It is sectional drawing which shows typically the imaging unit 428 as an 8th modification of the imaging unit 42. FIG. It is sectional drawing which shows typically the imaging unit 429 as a 9th modification of the imaging unit 42. FIG.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a schematic cross-sectional view of a camera 10 that is an example of an imaging apparatus. The camera 10 is a single-lens reflex camera. The camera 10 includes a lens unit 20 and a camera body 30. The lens unit 20 is an interchangeable lens. The lens unit 20 is attached to the camera body 30. The lens unit 20 includes an optical system arranged along the optical axis 22 in the lens barrel, and guides an incident subject light flux to the imaging module 40 of the camera body 30.

  In the present embodiment, the direction along the optical axis 22 is defined as the z-axis direction. That is, the direction in which the subject light beam enters the imaging chip 100 included in the imaging module 40 is defined as the z-axis direction. Specifically, the direction in which the subject luminous flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction. The short direction of the imaging chip 100 is defined as the y-axis direction. Specifically, the x-axis direction and the y-axis direction are determined in the directions illustrated in FIG. The x-axis, y-axis, and z-axis are right-handed orthogonal coordinate systems. For convenience of explanation, the z-axis plus direction may be regarded as up and the z-axis minus direction may be regarded as down. For example, the z-axis plus direction may be referred to as front, front, upper, upper, etc. Also, the z-axis minus direction may be referred to as rear, rear, lower, lower, etc. The z-axis negative direction side may be referred to as the back side.

  The camera body 30 has a mirror unit 31 at a position in the negative z-axis direction from the body mount 26 coupled to the lens mount 24. The mirror unit 31 includes a main mirror 32 and a sub mirror 33. The main mirror 32 is rotatably supported between an entry position where it enters the optical path of the subject light beam emitted from the lens unit 20 and a retreat position where it is retracted from the optical path of the subject light flux. The sub mirror 33 is rotatably supported with respect to the main mirror 32. The sub mirror 33 enters the entry position together with the main mirror 32 and retracts to the retract position together with the main mirror 32. As described above, the mirror unit 31 takes the approach state in which the subject light flux enters the optical path and the retreat state in which the subject light flux is retracted.

  When the mirror unit 31 is in the entering state, a part of the subject light beam incident on the main mirror 32 is reflected by the main mirror 32 and guided to the focus plate 80. The focus plate 80 is disposed at a position conjugate with the imaging surface of the imaging chip 100 included in the imaging module 40 to visualize the subject image formed by the optical system of the lens unit 20. The subject image formed on the focus plate 80 is observed from the finder window 86 through the pentaprism 82 and the finder optical system 84.

  When the mirror unit 31 is in the entering state, light beams other than the subject light beam reflected by the main mirror 32 out of the subject light beam incident on the main mirror 32 enter the sub mirror 33. Specifically, the main mirror 32 has a half mirror area, and the subject light flux that has passed through the half mirror area of the main mirror 32 enters the sub mirror 33. The sub mirror 33 reflects the light beam incident from the half mirror region toward the imaging optical system 70. The imaging optical system 70 guides the incident light beam to a focus detection sensor 72 for detecting the focus position. The focus detection sensor 72 outputs the focus position detection result to the MPU 51.

  The focus plate 80, the pentaprism 82, the main mirror 32, the sub mirror 33, and the finder optical system 84 are supported by a mirror box 60 as a support member. When the mirror unit 31 is in the retracted state and the front curtain and the rear curtain of the shutter unit 38 are in the open state, the subject luminous flux that passes through the lens unit 20 reaches the imaging surface of the imaging chip 100.

  A substrate 62 and a display unit 88 are sequentially arranged at a position in the negative z-axis direction of the imaging module 40. As the display unit 88, for example, a liquid crystal panel or the like can be applied. The display surface of the display unit 88 appears on the back surface of the camera body 30. The display unit 88 displays an image generated from the output signal from the imaging chip 100.

  Electronic circuits such as MPU 51 and ASIC 52 are mounted on the substrate 62. The MPU 51 is responsible for overall control of the camera 10. An output signal from the imaging chip 100 is output to the ASIC 52 via a flexible printed circuit board or the like. The ASIC 52 processes the output signal output from the imaging chip 100.

  The ASIC 52 generates image data for display based on the output signal from the imaging chip 100. The display unit 88 displays an image based on the display image data generated by the ASIC 52. The ASIC 52 generates image data for recording based on the output signal from the imaging chip 100. The ASIC 52 generates image data for recording by performing, for example, image processing or compression processing on the output signal of the imaging chip 100. The recording image data generated by the ASIC 52 is recorded on a recording medium attached to the camera body 30. The recording medium is configured to be detachable from the camera body 30.

  FIG. 2 is a perspective view schematically showing the imaging module 40 including the imaging unit 42, the optical unit 45, and the bracket 150. FIG. 3 is an AA cross-sectional view schematically showing the imaging unit 42, the optical unit 45, and the bracket 150. FIG. 4 is a BB cross-sectional view schematically showing the imaging unit 42, the optical unit 45, and the bracket 150. FIG. 5 is a diagram schematically illustrating a configuration of a circuit block formed on the imaging chip 100.

  The imaging unit 42 includes an imaging chip 100, a mounting substrate 120, a frame 140, and a cover glass 160.

  The imaging chip 100 is an imaging element such as a CMOS image sensor or a CCD image sensor. The imaging chip 100 includes an imaging area 101 and a peripheral area 102 located around the imaging area 101. The imaging region 101 is formed in the center portion of the imaging chip 100 in the xy plane.

  As shown in FIG. 5, a pixel unit 500 is formed in the imaging region 101 of the imaging chip 100. A peripheral circuit portion 570 is formed in the peripheral region 102. The peripheral circuit unit 570 includes a processing circuit unit 540, a drive circuit unit 580, and an output circuit unit 590.

  The pixel unit 500 includes N × M unit cells 501. The unit cells 501 are two-dimensionally arranged in the xy plane. For example, the unit cells 501 are arranged in a matrix in the xy plane. Each of the unit cells 501 is provided at a position corresponding to one corresponding column from one column to M columns in one corresponding row from one row to N rows. Each of the unit cells 501 includes a photoelectric conversion element and a circuit such as a transistor that performs a reset operation or a read operation of accumulated charge accumulated in the photoelectric conversion element. An imaging surface is formed by a photoelectric conversion region formed by N × M unit cells 501.

  The drive circuit unit 580 drives the pixel unit 500. The drive circuit unit 580 includes a shift register, a timing generator, and the like. The drive circuit unit 580 drives the unit cell 501 and outputs a signal obtained by the photoelectric conversion element included in the unit cell 501 performing photoelectric conversion. The unit cell 501 outputs an analog pixel signal indicating the amount of light received by the unit cell 501. The processing circuit unit 540 performs signal processing on the signal output from the unit cell 501. The processing circuit unit 540 includes a CDS circuit 550 and an AD conversion circuit 560. The CDS circuit 550 performs a CDS (correlated double sampling) process. The CDS circuit 550 removes noise included in the pixel signal output from the unit cell 501. The AD conversion circuit 560 converts a pixel signal which is an analog signal into a digital pixel signal. The output circuit unit 590 outputs a digital pixel signal to the mounting substrate 120. Details of functions and operations of the imaging chip 100 will be described later.

  The imaging chip 100 is mounted on the mounting substrate 120. The imaging chip 100 is mounted on the first main surface 1121 of the mounting substrate 120. The imaging chip 100 is mounted on the mounting substrate 120 by being bonded to the mounting substrate 120 with an adhesive.

  The imaging chip 100 is electrically connected to the mounting substrate 120 via bonding wires 110. The bonding wire 110 is connected to a bonding pad formed around the mounting area where the imaging chip 100 is mounted on the first main surface 1121 of the mounting substrate 120. The pixel signal converted into a digital signal by the AD conversion circuit 560 included in the imaging chip 100 is output to the mounting substrate 120 via the bonding wire 110. Bonding wire 110 is electrically connected to a bonding pad formed in a part of output circuit portion 590.

  The mounting substrate 120 includes a first layer 121, a core layer 207, and a second layer 122. The first layer 121 includes a solder resist layer 201, a wiring layer 202, an insulating layer 203, a wiring layer 204, and an insulating layer 205. The second layer 122 includes an insulating layer 215, a wiring layer 214, an insulating layer 213, a wiring layer 212, and a solder resist layer 211. The mounting substrate 120 is a multilayer core substrate having the core layer 207 as a core layer.

  On the mounting substrate 120, along the optical axis 22, the imaging chip 100, solder resist layer 201, wiring layer 202, insulating layer 203, wiring layer 204, insulating layer 205, core layer 207, insulating layer 215, wiring layer 214, insulating The layer 213, the wiring layer 212, and the solder resist layer 211 are arranged in this order.

  The insulating layer 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213 are, for example, resin layers. The thickness of each of the insulating layer 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213 is 30 μm to 40 μm. The thickness is a length in the z-axis direction.

  The wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212 include a wiring pattern. As a material for the wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212, an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like can be used. Each of the wiring patterns included in the wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212 has a thickness of about 30 μm to 40 μm.

  The core layer 207 is made of metal. When the core layer 207 is formed of a metal, for example, an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like may be used as the material of the core layer 207. The thickness of the core layer 207 is thicker than any of the wiring layers 202, 204, 214, and 212. The thickness of the core layer 207 is thicker than any of the insulating layers 203, 205, 215, and 213. Specifically, the thickness of the core layer 207 is about 0.1 mm to 0.4 mm. The rigidity of the core layer 207 is higher than the rigidity of any of the wiring layers 202, 204, 214, and 212. The rigidity of the core layer 207 may be higher than the rigidity of the first layer 121. The rigidity of the core layer 207 may be higher than the rigidity of the second layer 122.

  The core layer 207 may be made of resin. When the core layer 207 is formed of resin, FR4 may be used as the material of the core layer 207. When the core layer 207 is formed of resin, the core layer 207 is sandwiched between the wiring layers in the z-axis direction. For example, when the core layer 207 is formed of resin, along the optical axis 22, the imaging chip 100, the solder resist layer 201, the wiring layer 202, the insulating layer 203, the wiring layer 204, the core layer 207, the wiring layer 214, and the insulating layer 213, the wiring layer 212, and the solder resist layer 211 may be arranged in this order. When two wiring layers are additionally disposed, an additional insulating layer that contacts the wiring layer 204 and an additional wiring layer that contacts the core layer 207 are between the wiring layer 204 and the core layer 207. 22, and an additional wiring layer that contacts the core layer 207 and an additional insulating layer that contacts the wiring layer 214 are disposed along the optical axis 22 between the core layer 207 and the wiring layer 214. Are arranged in order.

  As described above, the mounting substrate 120 is a multilayer core substrate having a metal core or a resin core. The thickness of the mounting substrate 120 may be about 0.3 mm to 1.0 mm as a whole.

  The wiring pattern included in the wiring layer 204 and the wiring pattern included in the wiring layer 214 can be used for, for example, a ground line and a power supply line described later. At least a part of the wiring layer 202 is used for a wiring pattern that receives a pixel signal output from the imaging chip 100 via the bonding wire 110. Bonding pads connected to the imaging chip 100 with bonding wires 110 are formed in the wiring layer 202.

  The imaging chip 100 is mounted on the solder resist layer 201. The bonding pad and the wiring layer 212 are electrically connected by a via 131 that penetrates the first layer 121 and the core layer 207. The via 131 is covered with an insulator 132. The pixel signal output from the imaging chip 100 to the bonding pad via the bonding wire 110 is transmitted to the wiring layer 212 via the wiring layer 202 and the via 131.

  An electronic component 180 is provided on the solder resist layer 211. The electronic component 180 includes, for example, a connector, a capacitor, a resistor, a regulator, a transistor, and the like. The electronic component 180 constitutes a power supply circuit that supplies power to the circuits in the imaging chip 100. For example, a flexible board is connected to the connector as a part of the electronic component 180. The connector as a part of the electronic component 180 is connected to the wiring layer 212, and the pixel signal transmitted to the wiring layer 212 is transmitted to an external electronic circuit such as the ASIC 52 via the connector and the flexible substrate.

  The lead member of the electronic component 180 is fixed to the wiring layer 212 with solder or the like. Electronic component 180 and wiring layer 212 are electrically connected by a lead member. As described above, the electronic component 180 is provided on the second main surface 1122 opposite to the first main surface 1121 on which the imaging chip 100 is mounted on one mounting substrate 120.

  The imaging chip 100 is mounted on the mounting substrate 120 by COB (Chip On Board). The imaging chip 100 is bonded to the mounting substrate 120 with an adhesive. For example, the imaging chip 100 is bonded to the mounting substrate 120 by thermosetting a thermosetting adhesive. The bonding wire 110 is connected to the imaging chip 100 and the bonding pad by a wire bonding process. The bonding wire 110 is connected to the bonding pad by thermocompression bonding. The bonding wire 110 may be connected to the bonding pad by ultrasonic crimping. The frame 140 is bonded to the mounting substrate 120 with an adhesive. For example, the frame 140 is bonded to the mounting substrate 120 with a thermosetting adhesive that has been thermoset.

  The frame 140 is an example of a surrounding member that surrounds the imaging chip 100. The frame 140 has an opening 245 for surrounding the imaging chip. The opening 245 includes a first opening 244 and a second opening 246. The frame 140 has a first opening 244 and a second opening 246. The frame 140 surrounds the imaging chip accommodated in the opening 245. Specifically, the first opening 244 of the frame 140 mounted on the mounting substrate 120 surrounds the imaging chip 100. Therefore, the imaging chip 100 is accommodated in the first opening 244 of the frame 140.

  The frame 140 includes a first surface 141, a second surface 142, a third surface 143, a fourth surface 144, a fifth surface 145, a sixth surface 146, a seventh surface 147, and an eighth surface 148. And have. The first surface 141, the second surface 142, the third surface 143, the fourth surface 144, and the fifth surface 145 form the outer surface of the frame 140. The sixth surface 146, the seventh surface 147, and the eighth surface 148 form the inner surface of the frame 140. The sixth surface 146 and the eighth surface 148 form the inner wall surface of the frame 140. The eighth surface 148 forms a second opening 246. The second opening 246 is formed, for example, at a central portion in the xy plane. The sixth surface 146 forms a first opening 244. The first opening 244 is formed at, for example, a central portion in the xy plane. The first opening 244 is an opening located on the negative side of the z axis with respect to the second opening 246. The second opening 246 is an opening located on the z-axis plus direction side with respect to the first opening 244. The volume of the second opening 246 is smaller than the volume of the first opening 244. The shortest distance between a plurality of faces of the sixth surface 146 facing each other is longer than the shortest distance between a plurality of faces of the eighth surface 148 facing each other.

  The first surface 141 is a surface that is bonded to the cover glass 160. The first surface 141 is a surface in contact with the end of the eighth surface 148. The first surface 141 is formed along the outer edge of the eighth surface 148. The first surface 141 is a surface substantially parallel to the xy plane.

  The second surface 142 is a surface in contact with the end of the first surface 141. The second surface 142 is a surface formed along the outer edge of the first surface 141. The second surface 142 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The third surface 143 is a surface in contact with the end of the second surface 142. The third surface 143 is a surface substantially parallel to the xy plane and a surface substantially parallel to the first surface 141.

  The fourth surface 144 is a surface in contact with the end of the third surface 143. The fourth surface 144 is a surface formed along the outer edge of the third surface 143. The fourth surface 144 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The fifth surface 145 is a surface in contact with the end of the fourth surface 144. The fifth surface 145 is a surface formed along the outer edge of the fourth surface 144. The fifth surface 145 is a surface substantially parallel to the xy plane. The fifth surface 145 is a surface substantially parallel to the first surface 141 and the third surface 143. The fifth surface 145 is a surface bonded to the mounting substrate 120.

  The sixth surface 146 is a surface in contact with the end of the fifth surface 145. The sixth surface 146 is a surface formed along the inner edge of the fifth surface 145. The sixth surface 146 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The seventh surface 147 is a surface in contact with the end of the sixth surface 146. The seventh surface 147 is a surface formed along the upper edge of the sixth surface 146. The seventh surface 147 is a surface substantially parallel to the xy plane. The seventh surface 147 is a surface substantially parallel to the first surface 141 and the third surface 143.

  The eighth surface 148 is a surface in contact with the end of the seventh surface 147. The eighth surface 148 is a surface formed along the inner edge of the seventh surface 147. The eighth surface 148 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane. The eighth surface 148 is located inside the sixth surface 146. The eighth surface 148 is located closer to the optical axis 22 than the sixth surface 146. The second opening 246 formed by the eighth surface 148 defines an opening through which light incident on the imaging chip 100 passes.

  The frame 140 has a step portion formed by the first surface 141, the second surface 142, and the third surface 143. The frame 140 has a mounting hole 240 as a mounting portion. The frame 140 has, for example, three attachment holes 240. All of the three attachment holes 240 are holes that penetrate from the third surface 143 to the fifth surface 145. All of the three attachment holes 240 are used for attaching the imaging unit 42 to another structure such as the mirror box 60.

  The frame 140 is fixed to the bracket 150 by, for example, screwing with a screw 242 through three attachment holes 240. The bracket 150 is fixed to the mirror box 60 by, for example, screwing. Therefore, the imaging unit 42 is fixed to the mirror box 60.

  When the frame 140 and the bracket 150 are screwed using, for example, metal screws 242 using the mounting holes 240, the thermal resistance of the heat transfer path from the imaging chip 100 to the mirror box 60 can be reduced. Therefore, heat generated by the operation of the imaging chip 100 can be efficiently radiated to the mirror box 60.

  Note that the imaging unit 42 may be fixed to the mirror box 60 without using the bracket 150. The imaging unit 42 may not have the bracket 150, and the frame 140 may be directly fixed to the mirror box 60. For example, the imaging unit 42 may be fixed to the mirror box 60 by, for example, screwing through the three attachment holes 240 of the frame 140. The structure for fixing the imaging unit 42 is not limited to the mirror box 60. The imaging unit 42 may be fixed to a structure other than the mirror box 60.

  The cover glass 160 is used for sealing the imaging chip 100. The cover glass 160 is bonded to the frame 140 with an adhesive. Cover glass 160 is fixed to frame 140 so as to cover first opening 244 of frame 140. The cover glass 160 defines a sealed space together with the frame 140 and the mounting substrate 120.

  As an adhesive for adhering the cover glass 160 to the frame 140, a photocurable adhesive can be applied. For example, as the adhesive that bonds the cover glass 160 to the frame 140, an ultraviolet curable adhesive can be applied. As a material for the cover glass 160, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass, or the like can be used. The cover glass 160 has translucency. The thickness of the cover glass 160 is 0.4 mm to 1.0 mm.

  The cover glass 160 is fixed to the frame 140 after the imaging chip 100, the bonding wire 110 and the frame 140 are mounted on the mounting substrate 120. Since the cover glass 160 has a light-transmitting property, the cover glass 160 and the frame 140 can be bonded using a photo-curing adhesive. The cover glass 160 is an example of a translucent member. As the translucent member, quartz or the like can be applied in addition to glass.

  Thus, a sealed space is formed by the mounting substrate 120, the frame 140, and the cover glass 160. The imaging chip 100 is disposed in a sealed space formed by the mounting substrate 120, the frame 140, and the cover glass 160. As a result, the imaging chip 100 is less affected by the external environment. For example, the imaging chip 100 is not easily affected by moisture existing outside the sealed space. Therefore, deterioration of the imaging chip 100 can be prevented.

  The optical unit 45 includes a mask rubber 272, an optical element 274, and a pressing member 280. The optical element 274 includes an optical low-pass filter 276 and an infrared cut filter 278. The optical low-pass filter 276 and the infrared cut filter 278 are arranged in the order of the optical low-pass filter 276 and the infrared cut filter 278 in the negative z-axis direction. In addition, you may include in the cover glass 160 the function of some optical layers among the some optical layers which comprise the optical low-pass filter 276. FIG. In this case, the optical low-pass filter 276 can be configured by excluding the functions of some optical layers included in the cover glass 160, that is, only the remaining optical layers among the plurality of optical layers.

  The holding member 280 is screwed to the bracket 150 with a screw 282. The pressing member 280 has a portion located in the z-axis plus direction from the optical element 274. The pressing member 280 fixes the optical element 274 in a state where the optical element 274 is pressed against the imaging unit 42 via the mask rubber 272. The optical element 274 is pressed by a force in the negative z-axis direction applied from the pressing member 280 screwed to the bracket 150.

  The holding member 280 is made of a metal material. The pressing member 280 has a pair of flat portions 288. The holding member 280 is screwed to the bracket 150 by a screw 282 at the flat portion 288. As a result, the optical unit 45 is assembled as the imaging module 40 together with the imaging unit 42 and the bracket 150. Therefore, at least part of the light that has passed through the second opening 246 formed by the eighth surface 148 is incident on the imaging region 101 of the imaging chip 100.

  The frame 140 is a blocking member that blocks a magnetic field. The frame 140 is a magnetic shielding member that magnetically shields peripheral circuits from a magnetic field. Specifically, the frame 140 mounted on the mounting substrate 120 suppresses the influence of the magnetic field on the peripheral circuit unit 570 of the imaging chip 100 mounted on the mounting substrate 120. Therefore, the frame 140 can suppress noise from being mixed into the pixel signal generated by the imaging chip 100. Specifically, the frame 140 can suppress noise from being mixed into the pixel signal output from the pixel unit 500. As described above, the frame 140 is a member that surrounds the imaging chip 100 and is a member that blocks a magnetic field. Therefore, the shielding member that magnetically shields the peripheral circuit portion from the magnetic field need not be provided as a separate member.

  The magnetic shielding characteristics of the frame 140 will be described. The frame 140 is formed of a material having magnetic shielding properties. The material having magnetic shielding properties may be a metal material, a magnetic material, or the like. Metal refers to a substance that exhibits metal-like properties. A metal is a concept including an alloy. The metal may be an alloy containing a nonmetal in part. Examples of the material for forming the frame 140 include iron material, ferrite, permalloy, and the like.

  The frame 140 has a protruding portion 200 that protrudes toward the imaging chip 100 side. The protrusion 200 protrudes from the sixth surface 146. Specifically, the protrusion 200 protrudes toward the imaging chip 100 with respect to the sixth surface 146. The protruding portion 200 is formed by the seventh surface 147 of the frame 140, the eighth surface 148 of the frame 140, and a part of the first surface 141 of the frame 140. The protrusion 200 is formed by the seventh surface 147 of the frame 140, the eighth surface 148 of the frame 140, and the portion of the first surface 141 of the frame 140 that is closer to the imaging chip 100 than the sixth surface 146. The frame 140 has a step portion formed by the fifth surface 145, the sixth surface 146, and the seventh surface 147. A part of the first surface 141 of the protruding portion 200 faces the cover glass 160 and is bonded with an adhesive.

  Since the protruding portion 200 protrudes from the sixth surface 146, the shortest distance between the plurality of surfaces facing each other out of the sixth surface 146 is the shortest distance between the plurality of surfaces facing each other out of the eighth surface 148. Longer. The frame 140 is a single member. The frame 140 is integrally formed including the protruding portion 200.

  The seventh surface 147 of the frame 140 is substantially parallel to the surface on which the peripheral circuit unit 570 disposed in the peripheral region 102 of the imaging chip 100 is formed. The seventh surface 147 of the frame 140 faces the peripheral region 102 of the imaging chip 100. The seventh surface 147 of the frame 140 faces the region where the processing circuit unit 540 disposed in the peripheral region 102 of the imaging chip 100 is formed. When projected onto a plane parallel to the xy plane, the seventh surface 147 has a portion overlapping the processing circuit unit 540. In addition, the seventh surface 147 of the frame 140 faces the region where the output circuit unit 590 disposed in the peripheral region 102 of the imaging chip 100 is formed. The seventh surface 147 of the frame 140 faces a region where the drive circuit unit 580 disposed in the peripheral region 102 of the imaging chip 100 is formed.

  When the projection 200 and the processing circuit unit 540 are orthogonally projected on the plane parallel to the xy plane, the region where the projection 200 is orthogonally projected and the processing circuit unit 540 are orthogonally projected. The region is arranged on the mounting substrate 120 so as to at least partially overlap the region. In particular, when the protrusion 200 and the AD conversion circuit 560 are orthogonally projected onto the plane parallel to the xy plane, the area where the protrusion 200 is orthogonally projected and the AD conversion circuit 560 are orthogonally projected. It is preferable that the mounting region 120 be disposed so that at least a part of the region overlaps with the region. Further, when the protrusion 200 and the AD conversion circuit 560 are orthogonally projected onto the plane parallel to the xy plane, the entire area where the AD conversion circuit 560 is orthogonally projected is the protrusion 200. More preferably, it is arranged on the mounting substrate 120 so as to be included in the orthogonally projected region. When the protrusion 200 and the processing circuit unit 540 are orthogonally projected onto the plane parallel to the xy plane, the entire region where the processing circuit unit 540 is orthogonally projected is the orthogonal projection of the protrusion 200. It is arranged on the mounting board 120 so as to be included in the region.

  When the protrusion 200 and the drive circuit unit 580 are orthogonally projected on the surface parallel to the xy plane, the region where the protrusion 200 is orthogonally projected and the drive circuit unit 580 are orthogonally projected. The region is arranged on the mounting substrate 120 so as to at least partially overlap the region. When the projection 200 and the drive circuit unit 580 are orthogonally projected onto the plane parallel to the xy plane, the entire region where the drive circuit unit 580 is orthogonally projected is the projection of the projection 200. It is arranged on the mounting board 120 so as to be included in the region.

  When the projection 200 and the output circuit unit 590 are orthogonally projected on the plane parallel to the xy plane, the region where the projection 200 is orthogonally projected and the output circuit unit 590 are orthogonally projected. The region is arranged on the mounting substrate 120 so as to at least partially overlap the region. When the projection 200 and the output circuit unit 590 are orthogonally projected on the plane parallel to the xy plane, the entire region where the output circuit unit 590 is orthogonally projected is the projection of the projection 200. It is arranged on the mounting board 120 so as to be included in the region.

    As described above, when the projecting portion 200 and the peripheral circuit portion 570 are orthogonally projected on the surface parallel to the xy plane, the region where the projecting portion 200 is orthogonally projected and the peripheral circuit portion 570 are obtained. It is arranged on the mounting substrate 120 so as to at least partially overlap with the orthogonally projected region. However, in the imaging chip 100 and the protruding portion 200, when all the unit cells 501 and the protruding portions 200 are orthogonally projected onto a plane parallel to the xy plane, the region where all the unit cells 501 are orthogonally projected and the protruding portions 200 are normal. It is arranged on the mounting substrate 120 so as not to overlap the projected area.

  As described above, the protruding portion 200 as a part of the frame 140 is formed of a material having magnetic shielding properties such as iron, permalloy, and ferrite. Therefore, the peripheral circuit part 570 of the imaging chip 100 is magnetically shielded by at least the protruding part 200. For example, the peripheral circuit portion 570 formed in the peripheral region 102 is shielded from the magnetism generated outside the imaging chip 100 by the protruding portion 200.

  The peripheral circuit portion 570 is covered with the protrusion 200 when the z-axis minus direction side is viewed from the z-axis plus direction side. Therefore, the peripheral circuit unit 570 is shielded from the magnetism generated by the magnetic source that is located on the z-axis plus direction side of the projecting part 200 by the projecting part 200. The magnetism generation source varies with time, such as a motor provided in the lens unit 20 mounted on the camera body 30 to drive the lens, a motor provided in the camera body 30, a booster circuit for a lighting device such as a flash device, etc. Including a magnetic source for generating magnetism. Examples of the motor provided in the camera body 30 include a motor that is fixed to the mirror box 60 and that drives a shutter curtain of the shutter unit 38.

  As a material for forming the frame 140, it is preferable to use a high magnetic permeability material. As a material for forming the frame 140, it is preferable to use a high conductivity material. When a high-conductivity material is used as a material for forming the frame 140, it is possible to shield at least the time-varying magnetism even if the material has a low magnetic permeability.

  Mainly with reference to FIG. 5, the structure and operation | movement which concern on the imaging operation of the imaging chip 100 are demonstrated. The drive circuit unit 580 is electrically connected to the plurality of unit cells 501 via the row reset line 510-1 to the row reset line 510-N. The drive circuit unit 580 is electrically connected to the plurality of unit cells 501 through the row selection line 520-1 to the row selection line 520-N. The drive circuit unit 580 is electrically connected to the plurality of unit cells 501 via the column signal lines 530-1 to 530-M. The drive circuit unit 580 includes drive circuits such as a timing generation circuit and a shift register. The drive circuit unit 580 includes a current source connected to the column signal line 530-1 to the column signal line 530-M.

  The processing circuit unit 540 includes CDS circuits 550-1 to CDS circuit 550 -M and AD conversion circuits 560-1 to 560 -M. The CDS circuit 550-1 to CDS circuit 550-M acquires the analog signal output from the unit cell 501 through the column signal line 530-1 to the column signal line 530-M.

  Each of the unit cells 501 is connected to the row reset line 510 of the row corresponding to each unit cell 501 among the row reset lines 510-1 to 510-N. Each of the unit cells 501 is connected to the row selection line 520 of the row corresponding to each unit cell 501 among the row selection lines 520-1 to 520-N. Each of the unit cells 501 is connected to the column signal line 530 of the column corresponding to each unit cell 501 among the column signal lines 530-1 to 530-M.

  The row reset line 510-1 to the row reset line 510-N and the row selection line 520-1 to the row selection line 520-N send a signal for controlling reading of the unit cell 501 to the unit cell 501 provided in the corresponding row. Transmit to. The row reset line 510-1 to the row reset line 510-N transmit a reset signal generated by the shift register included in the driver circuit portion 580 to the unit cells 501 provided in the corresponding row. The unit cell 501 resets the accumulated charge of the photoelectric conversion element included in the unit cell 501 in response to the reset signal. The unit cell 501 outputs the output signal of the photoelectric conversion element in a state where the accumulated charge is reset to the row selection line 520. This output signal is an analog signal indicating a reset level.

  The row selection lines 520-1 to 520 -N transmit row selection signals generated by the shift register included in the driver circuit portion 580 to the unit cells 501 provided in the corresponding rows. The unit cell 501 outputs the output signal of the photoelectric conversion element included in the unit cell 501 to the column signal line 530 in accordance with the row selection signal. This output signal is an analog signal indicating a signal level.

  The CDS circuits 550-1 to 550 -M are connected to a corresponding one of the column signal lines 530 among the column signal lines 530-1 to 530 -M. Each of the CDS circuits 550-1 to 550 -M is output to the corresponding column signal line 530 among the analog signals output from the unit cell 501 to the column signal lines 530-1 to 530 -M. An analog signal indicating the reset level and an analog signal indicating the signal level are acquired. Each of the CDS circuits 550-1 to 550 -M generates an analog signal indicating a difference level between the reset level and the signal level as a pixel signal.

  The AD conversion circuits 560-1 to 560-M are connected to one corresponding CDS circuit 550 among the CDS circuits 550-1 to 550-M. Each of the AD conversion circuits 560-1 to 560 -M AD converts the analog signal of the pixel signal output from the corresponding CDS circuit 550 to generate a digital signal of the pixel signal. Digital signals of pixel signals generated by the AD conversion circuits 560-1 to 560 -M are output to the mounting substrate 120 through the bonding wires 110.

  The processing circuit unit 540 that processes the analog signal is magnetically shielded from the outside of the imaging unit 42 by at least the protrusion 200. Therefore, it can suppress that noise is added to the pixel signal of an analog signal by the magnetism which generate | occur | produced with the magnetic generation source mentioned above. Therefore, it is possible to suppress the noise level applied to the image signal by the magnetism generated by the above-described magnetism generation source.

  Further, the output circuit unit 590 that outputs a digital signal is magnetically shielded from the outside of the imaging unit 42 by at least the protrusion 200. Further, as mainly shown in FIGS. 3 and 4, the bonding wire 110 connected to the output circuit unit 590 is also magnetically shielded from the outside of the imaging unit 42 by at least the protrusion 200. Therefore, it can suppress that noise is added to the pixel signal of a digital signal by the magnetism which generate | occur | produced with the magnetic generation source mentioned above. Therefore, it is possible to suppress the noise level applied to the image signal by the magnetism generated by the above-described magnetism generation source.

  Further, as mainly shown in FIGS. 4 and 5, the drive circuit unit 580 is magnetically shielded from the outside of the imaging unit 42 by at least the protrusion 200. Therefore, it is possible to suppress the influence of the magnetism generated by the above-described magnetic generation source on the drive characteristics of the imaging chip 100.

  Note that the frame 140 may be formed of a resin having magnetic shielding properties. For example, the frame 140 may be formed of a resin in which metal powder and magnetic powder are blended.

  The potential of the frame 140 may be the ground potential of the mounting substrate 120. The frame 140 may be electrically connected to a ground line included in the mounting substrate 120. However, the potential of the frame 140 may not be the ground potential. The frame 140 may not be electrically connected to the ground line of the mounting substrate 120. The frame 140 may be electrically floated from a conductive member that forms an electric circuit of the camera body 30. The frame 140 may not be in contact with a conductive member that forms an electric circuit included in the camera body 30.

  FIG. 6 is a cross-sectional view schematically showing a first modification and a second modification of the imaging unit 42. FIG. 6A is a cross-sectional view schematically showing an imaging unit 421 as a first modification of the imaging unit 42. Among the constituent elements of the imaging unit 421, constituent elements having the same reference numerals as those of the constituent elements of the imaging unit 42 described with reference to FIGS. 1 to 5 are included in the imaging unit 42. It has the same function and configuration as the corresponding component. Of the components included in the imaging unit 421, the description of the components corresponding to the components included in the imaging unit 42 may be omitted. Of the components included in the imaging unit 421, only the differences between the components corresponding to the components included in the imaging unit 42 may be described. Note that the mounting substrate 120 in each modification of the imaging unit described below is a layer similar to the layer configuration of the wiring layer, the insulating layer, and the core layer included in the mounting substrate 120 described with reference to FIGS. It has a configuration. Therefore, illustration of the layer configuration of the mounting substrate 120 in each modification of the imaging unit described below is omitted.

  The imaging unit 421 includes a frame 741 as a component corresponding to the frame 140 included in the imaging unit 42. The frame 741 is a modification of the frame 140 included in the imaging unit 42. The frame 741 includes a first surface 311, a second surface 312, a third surface 313, a fourth surface 314, a fifth surface 315, a sixth surface 316, a seventh surface 317, and an eighth surface 318. And a ninth surface 319 and a tenth surface 320. The first surface 311 corresponds to the first surface 141. The second surface 312 corresponds to the second surface 142. The third surface 313 corresponds to the third surface 143. The fourth surface 314 corresponds to the fourth surface 144. The fifth surface 315 corresponds to the fifth surface 145.

  The imaging unit 421 has a protruding portion 410 corresponding to the protruding portion 200 included in the imaging unit 42. The protrusion 410 is provided between the first surface 311 and the fifth surface 315 in the z-axis direction. The protruding portion 410 is located in the minus z-axis direction from the first surface 311 in the z-axis direction. The protrusion 410 is located in the z-axis plus direction from the fifth surface 315 in the z-axis direction.

  In the imaging unit 421, the inner surface of the frame 741 is formed by a sixth surface 316, a seventh surface 317, an eighth surface 318, a ninth surface 319, and a tenth surface 320. The sixth surface 316 is a surface in contact with the end of the fifth surface 315. The sixth surface 316 is a surface formed along the inner edge of the fifth surface 315. The sixth surface 316 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The seventh surface 317 is a surface in contact with the end portion of the sixth surface 316. The seventh surface 317 is a surface formed along the upper edge of the sixth surface 316. The seventh surface 317 is a surface substantially parallel to the xy plane. The seventh surface 317 is a surface substantially parallel to the first surface 311, the third surface 313, and the fifth surface 315.

  The eighth surface 318 is a surface in contact with the end of the seventh surface 317. The eighth surface 318 is a surface formed along the inner edge of the seventh surface 317. The eighth surface 318 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane. The eighth surface 318 is located inside the sixth surface 316. The eighth surface 318 is located closer to the optical axis 22 than the sixth surface 316. The second opening 246 formed by the eighth surface 318 defines an opening through which light incident on the imaging chip 100 passes. Of the light transmitted through the cover glass 160, the light that has passed through the second opening 246 enters the imaging chip 100.

  The ninth surface 319 is a surface in contact with the end portion of the eighth surface 318. The ninth surface 319 is a surface formed along the upper edge of the eighth surface 318. The ninth surface 319 is a surface substantially parallel to the xy plane. The ninth surface 319 is a surface opposite to the seventh surface 317. The ninth surface 319 is a surface substantially parallel to the first surface 311, the third surface 313, the seventh surface 317, and the fifth surface 315.

  The protrusion 410 protrudes from the sixth surface 316 to the imaging chip 100 side. The protruding portion 410 protrudes from the tenth surface 320 toward the imaging chip 100 side. The protrusion 410 is formed by the seventh surface 317, the eighth surface 318, and the ninth surface 319. The protruding portion 410 is not in contact with the cover glass 160. The peripheral circuit portion 570 formed in the peripheral region 102 is magnetically shielded by at least the protrusion 410.

  According to the imaging unit 421, the protrusion 420 can be brought close to the peripheral region 102 of the imaging chip 100 while preventing the bonding wire 110 from contacting the seventh surface 327. Further, the protruding portion 410 can protrude to the vicinity of the end portion of the imaging region 101. In addition, the imaging region 101 can be formed up to the vicinity of the protruding portion 410. Therefore, the magnetic shielding effect for the peripheral circuit portion 570 can be enhanced. In addition, a wide area of the imaging region 101 can be ensured.

  FIG. 6B is a cross-sectional view schematically showing an imaging unit 422 as a second modification of the imaging unit 42. Among the components included in the imaging unit 422, the components having the same reference numerals as those provided to the components included in the imaging unit 42 described with reference to FIGS. 1 to 5 are included in the imaging unit 42. It has the same function and configuration as the corresponding component. Of the components included in the imaging unit 422, descriptions of components corresponding to the components included in the imaging unit 42 may be omitted. Of the components included in the imaging unit 422, only the differences between the components corresponding to the components included in the imaging unit 42 may be described.

  The imaging unit 422 includes a frame 742 as a component corresponding to the frame 140 included in the imaging unit 42. The frame 742 is a modification of the frame 140 included in the imaging unit 42. The frame 742 includes a first surface 321, a second surface 322, a third surface 323, a fourth surface 324, a fifth surface 325, a sixth surface 326, a seventh surface 327, and an eighth surface 328. And a ninth surface 329. The first surface 321 corresponds to the first surface 141. The second surface 322 corresponds to the second surface 142. The third surface 323 corresponds to the third surface 143. The fourth surface 324 corresponds to the fourth surface 144. The fifth surface 325 corresponds to the fifth surface 145. The imaging unit 421 has a protrusion 420 corresponding to the protrusion 200 included in the imaging unit 42. The protrusion 420 has a shape different from that of the protrusion 200.

  In the imaging unit 422, the inner surface of the frame 742 is formed by a sixth surface 326, a seventh surface 327, an eighth surface 328, and a ninth surface 329. The sixth surface 326 is a surface in contact with the end of the fifth surface 325. The sixth surface 326 is a surface formed along the inner edge of the fifth surface 325. The sixth surface 326 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The seventh surface 327 is a surface in contact with the end of the sixth surface 326. The seventh surface 327 is a surface formed along the upper edge of the sixth surface 326. The seventh surface 327 is a surface substantially parallel to the xy plane. The seventh surface 327 is a surface substantially parallel to the first surface 321, the third surface 323, and the fifth surface 325. The seventh surface 327 forms part of a surface that protrudes from the sixth surface 326 to the imaging chip 100 side.

  The eighth surface 328 is a surface in contact with the end portion of the seventh surface 327. The eighth surface 328 is a surface between the end portion on the optical axis 22 side of the seventh surface 327 and the end portion on the negative side of the z axis of the ninth surface 329. The eighth surface 328 has an end on the z-axis minus side and an end on the z-axis plus side. The end of the eighth surface 328 on the minus side of the z axis is in contact with the end of the seventh surface 327 on the side of the optical axis 22. The eighth surface 328 is not parallel to the xy plane. The eighth surface 328 is a surface substantially inclined with respect to the xy plane.

  The ninth surface 329 is a surface in contact with the end on the z-axis plus side of the eighth surface 328. The ninth surface 329 is a surface formed along the inner edge of the eighth surface 328. The ninth surface 329 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane. The ninth surface 329 is a surface substantially parallel to the second surface 322 and the sixth surface 326. The ninth surface 329 is located inside the sixth surface 326. The ninth surface 329 is located closer to the optical axis 22 than the sixth surface 326. The second opening 246 formed by the ninth surface 329 defines an opening through which light incident on the imaging chip 100 passes. Of the light transmitted through the cover glass 160, the light that has passed through the second opening 246 enters the imaging chip 100.

  The protruding portion 420 protrudes from the sixth surface 326 to the imaging chip 100 side. The protrusion 420 is formed by a portion of the seventh surface 327, the eighth surface 328, the ninth surface 329, and the first surface 321 that is closer to the imaging chip 100 than the sixth surface 146. The surface on the z-axis plus side of the protrusion 420 is in contact with the cover glass 160. The peripheral circuit portion 570 formed in the peripheral region 102 is magnetically shielded by at least the protrusion 420.

  According to the imaging unit 422, the protrusion 420 can be brought close to the peripheral region 102 of the imaging chip 100 while preventing the bonding wire 110 from contacting the eighth surface 328. In addition, the protrusion 420 can protrude to the vicinity of the end of the imaging region 101. In addition, the imaging region 101 can be formed up to the vicinity of the protruding portion 420. Therefore, the magnetic shielding effect for the peripheral circuit portion 570 can be enhanced. In addition, a wide area of the imaging region 101 can be ensured. Further, the width of the frame 742 in the z-axis direction can be reduced. In addition, the height of the imaging unit 42 can be reduced. Moreover, the imaging unit 42 can be reduced in size.

  FIG. 7 is a cross-sectional view schematically showing a third modification and a fourth modification of the imaging unit 42. FIG. 7A is a cross-sectional view schematically showing an imaging unit 423 as a third modification of the imaging unit 42. Among the constituent elements of the imaging unit 423, constituent elements having the same reference numerals as those of the constituent elements of the imaging unit 42 described with reference to FIGS. 1 to 5 are included in the imaging unit 42. It has the same function and configuration as the corresponding component. Of the components included in the imaging unit 423, the description of the components corresponding to the components included in the imaging unit 42 may be omitted. Of the components included in the imaging unit 423, only the differences between the components corresponding to the components included in the imaging unit 42 may be described.

  The imaging unit 423 includes a frame 743 as a component corresponding to the frame 140 included in the imaging unit 42. The frame 743 is a modification of the frame 140 included in the imaging unit 42. The frame 743 is different from the frame 140 included in the imaging unit 42 in that the frame 743 is formed by the protruding member 430 and the frame member 432. The protruding member 430 is a flat member. In the z-axis direction, the principal surface of the projecting member 430 in the z-axis plus direction coincides with the surface of the frame member 432 in the z-axis plus direction. The first surface 141 of the frame 743 is formed by the main surface of the protruding member 430 in the positive z-axis direction and the surface of the frame member 432 in the positive z-axis direction. The protruding member 430 provides a part of the seventh surface 147, the eighth surface 148, and the first surface 141.

  The protruding member 430 is made of a material having magnetic shielding properties. As described above, the material having magnetic shielding properties may be a metal material, a magnetic material, or the like. Examples of the material for forming the protruding member 430 include iron material, ferrite, and permalloy.

  The frame member 432 is made of resin. The frame 743 is formed by outsert-molding the protruding member 430 into the frame member 432. The frame member 432 may not have magnetic shielding properties. The frame member 432 may have a magnetic shielding property. The frame member 432 may be formed of a resin material having magnetic shielding properties. For example, the frame member 432 may be formed of a resin in which metal powder and magnetic powder are blended.

  Note that the frame member 432 may be formed of another material having magnetic shielding properties. The frame member 432 may be formed of a metal material, a magnetic material, or the like. Examples of the material for forming the frame member 432 include iron material, ferrite, and permalloy.

  FIG. 7B is a cross-sectional view schematically showing an imaging unit 424 as a fourth modification of the imaging unit 42. The imaging unit 424 is a modification of the imaging unit 421. Among the constituent elements of the imaging unit 424, constituent elements having the same reference numerals as the constituent elements of the imaging unit 421 have the same functions and configurations as the corresponding constituent elements of the imaging unit 421. Have. Of the components included in the imaging unit 424, description of components corresponding to the components included in the imaging unit 421 may be omitted. Of the components included in the imaging unit 424, only the differences between the components corresponding to the components included in the imaging unit 421 may be described.

  The imaging unit 424 includes a frame 744 as a component corresponding to the frame 741 included in the imaging unit 421. A frame 744 is a modified example of the frame 741 included in the imaging unit 421. The frame 744 is different from the frame 741 included in the imaging unit 421 in that the frame 744 is formed by the protruding member 440 and the frame member 442. The protruding member 440 is a flat member. The protruding member 440 provides a seventh surface 317, an eighth surface 318, and a ninth surface 319.

  The protruding member 440 is made of a material having magnetic shielding properties. As described above, the material having magnetic shielding properties may be a metal material, a magnetic material, or the like. Examples of the material for forming the protruding member 440 include iron, ferrite, permalloy, and the like.

  The frame member 442 is formed of resin. The frame 744 is formed by insert-molding the protruding member 440 into the frame member 442. The frame member 442 may not have magnetic shielding properties. The frame member 442 may have a magnetic shielding property. The frame member 442 may be formed of a resin material having magnetic shielding properties. For example, the frame member 442 may be formed of a resin in which metal powder and magnetic powder are blended.

  Note that the frame member 442 may be formed of another material having magnetic shielding properties. The frame member 442 may be formed of a metal material, a magnetic material, or the like. Examples of the material for forming the frame member 442 include iron, ferrite, permalloy, and the like.

  FIG. 8 is a cross-sectional view schematically showing an imaging unit 425 as a fifth modification of the imaging unit 42. Among the components included in the imaging unit 425, components having the same reference numerals as the components attached to the imaging unit 42 have the same functions and configurations as the corresponding components included in the imaging unit 42. Have. Of the components included in the imaging unit 425, the description of the components corresponding to the components included in the imaging unit 42 may be omitted. Of the components included in the imaging unit 425, only the differences between the components corresponding to the components included in the imaging unit 42 may be described.

  The imaging unit 425 has a magnetic shielding member 450. The imaging unit 425 includes a frame 745 as a component corresponding to the frame 140 included in the imaging unit 42. A frame 745 is a modification of the frame 140 included in the imaging unit 42. The frame 745 does not have the protruding portion 200 that the frame 140 of the imaging unit 42 has.

  The magnetic shielding member 450 is provided on the first surface 161 that is the surface on the z-axis plus side of the cover glass 160. The magnetic shielding member 450 is provided on the first surface 161 as a part of the imaging unit 425. The magnetic shielding member 450 is bonded to the first surface 161 of the cover glass 160 with, for example, an adhesive.

  When the magnetic shielding member 450 is assembled as the imaging unit 42, the magnetic shielding member 450 is positioned between the optical element 274 and the first surface 161 of the cover glass 160. The magnetic shielding member 450 is located in the z-axis minus direction with respect to the optical low-pass filter 276. The magnetic shielding member 450 is located in the minus z-axis direction with respect to the infrared cut filter 278.

  The magnetic shielding member 450 is provided at a position that covers the peripheral region 102 when viewed from a position in the z-axis plus direction. The magnetic shielding member 450 is formed of a material having magnetic shielding properties. As described above, the material having magnetic shielding properties may be a metal material, a magnetic material, or the like. Examples of the material for forming the magnetic shielding member 450 include iron, ferrite, permalloy, and the like. The magnetic shielding member 450 may be a plate-like member. The magnetic shielding member 450 may be a sheet-like member.

  The magnetic shielding member 450 has a second opening 246. The light that has passed through the second opening 246 of the magnetic shielding member 450 passes through the cover glass 160 and enters the imaging chip 100.

  The magnetic shielding member 450 may be in contact with the frame 745. The magnetic shielding member 450 may not be in contact with the frame 745. The magnetic shielding member 450 may be provided on the second surface 162.

  FIG. 9 is a cross-sectional view schematically showing an imaging unit 426 as a sixth modification of the imaging unit 42. The imaging unit 426 is a modification of the imaging unit 421. Among the constituent elements of the imaging unit 426, constituent elements having the same reference numerals as the constituent elements of the imaging unit 421 have the same functions and configurations as the corresponding constituent elements of the imaging unit 421. Have. Of the components included in the imaging unit 426, the description of the components corresponding to the components included in the imaging unit 421 may be omitted. Of the components included in the imaging unit 426, only the differences between the components corresponding to the components included in the imaging unit 421 may be described.

  The imaging chip 100 does not have a bonding wire. The imaging chip 100 is electrically connected to the mounting substrate 120 without using a bonding wire. The imaging chip 100 is mounted on the mounting substrate 120 by, for example, flip chip mounting. The imaging chip 100 is electrically connected to the mounting substrate 120 via a bump part 111 as a connection member. The bump part 111 connects the imaging chip 100 and the mounting substrate 120 at a position in the z minus direction of the peripheral region 102. The pixel signal generated by the imaging chip 100 is transmitted to the mounting substrate 120 via the bump part 111. A signal for controlling the driving of the imaging chip 100 is transmitted to the imaging chip 100 via the bump portion 111.

  When viewed from the z-axis plus direction, the peripheral region 102 is covered with the protrusion 411. The projecting portion 411 magnetically shields the bump portion 111. The bump part 111 has an imaging chip side electrode provided on the second main surface 1102 of the imaging chip 100 and a mounting substrate side electrode provided on the first main surface 1121 of the mounting substrate 120. The protruding portion 411 magnetically shields the imaging chip side electrode and the mounting substrate side electrode of the bump portion 111.

  The imaging unit 426 includes a frame 746 as a component corresponding to the frame 741 included in the imaging unit 421. A frame 746 is a modification of the frame 741 included in the imaging unit 421. The protrusion 411 included in the frame 746 is positioned in the z-axis minus direction from the protrusion 410 included in the frame 741 of the imaging unit 421. According to the imaging unit 426, the protruding portion 411 can be brought close to the peripheral region 102 of the imaging chip 100. In addition, the protruding portion 411 can protrude to the vicinity of the end of the imaging region 101. In addition, the imaging region 101 can be formed up to the vicinity of the protruding portion 411. Therefore, the magnetic shielding effect for the peripheral circuit portion 570 can be enhanced. In addition, a wide area of the imaging region 101 can be ensured.

  Note that the protruding portion 411 may be formed by insert molding as in the imaging unit 424 described with reference to FIG.

  FIG. 10 is a cross-sectional view schematically showing an imaging unit 427 as a seventh modification of the imaging unit 42. Among the constituent elements of the imaging unit 427, the constituent elements having the same reference numerals as those of the constituent elements of the imaging unit 42 have the same functions and configurations as the corresponding constituent elements of the imaging unit 42. Have. Of the components included in the imaging unit 427, the description of the components corresponding to the components included in the imaging unit 42 may be omitted. Of the components included in the imaging unit 427, only the differences between the components corresponding to the components included in the imaging unit 42 may be described.

  The imaging chip 100 does not have a bonding wire. The imaging chip 100 is electrically connected to the mounting substrate 120 without using a bonding wire. The imaging chip 100 is mounted on the mounting substrate 120 by, for example, flip chip mounting. The imaging chip 100 is electrically connected to the mounting substrate 120 via a bump part 111 as a connection member. The configuration and application of the bump unit 111 are the same as the configuration and application of the bump unit 111 described with reference to FIG.

  The imaging unit 427 includes a magnetic shielding member 470. The imaging unit 427 includes a frame 747 as a component corresponding to the frame 140 included in the imaging unit 42. A frame 747 is a modification of the frame 140 included in the imaging unit 42. The frame 747 does not have the protrusion 200 that the frame 140 of the imaging unit 42 has. The magnetic shielding member 470 is provided on the imaging chip 100. The magnetic shielding member 470 is provided on the first main surface 1101 of the imaging chip 100.

  FIG. 11 is a cross-sectional view schematically showing an imaging unit 428 as an eighth modification of the imaging unit 42. Among the constituent elements of the imaging unit 428, constituent elements having the same reference numerals as the constituent elements of the imaging unit 42 have the same functions and configurations as the corresponding constituent elements of the imaging unit 42. Have. Of the components included in the imaging unit 428, the description of the components corresponding to the components included in the imaging unit 42 may be omitted. Of the components included in the imaging unit 428, only the differences between the components corresponding to the components included in the imaging unit 42 may be described.

  The imaging unit 428 includes a frame 748 as a component corresponding to the frame 140 included in the imaging unit 42. The frame 748 is a modification of the frame 140 included in the imaging unit 42. The frame 748 includes a first surface 381, a second surface 382, a third surface 383, a fourth surface 384, a fifth surface 385, a sixth surface 386, a seventh surface 387, and an eighth surface 388. And a ninth surface 389. The first surface 381 corresponds to the first surface 141. The second surface 382 corresponds to the second surface 142. The third surface 383 corresponds to the third surface 143. The fourth surface 384 corresponds to the fourth surface 144. The fifth surface 385 corresponds to the fifth surface 145. The sixth surface 386 corresponds to the sixth surface 146. The seventh surface 387 corresponds to the seventh surface 147. The imaging unit 421 includes a protrusion 480 corresponding to the protrusion 200 included in the imaging unit 42. The protrusion 480 has a shape different from that of the protrusion 200.

  In the imaging unit 428, the inner surface of the frame 748 is formed by a sixth surface 386, a seventh surface 387, an eighth surface 388, and a ninth surface 389.

  The eighth surface 388 is a surface in contact with the end of the seventh surface 387. The eighth surface 388 is a surface formed along the inner edge of the seventh surface 387. The eighth surface 388 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane. The eighth surface 388 is located inside the sixth surface 386. The eighth surface 388 is located closer to the optical axis 22 than the sixth surface 386. The second opening 246 formed by the eighth surface 388 defines an opening through which light incident on the imaging chip 100 passes. The eighth surface 388 has an end on the z-axis plus side and an end on the z-axis minus side.

  The ninth surface 389 is a surface between the end on the z-axis plus side of the eighth surface 388 and the end on the optical axis 22 side of the first surface 381. The ninth surface 389 has an end on the z-axis minus side and an end on the z-axis plus side. The end of the ninth surface 389 on the negative side of the z axis is in contact with the end of the eighth surface 388 on the positive side of the z axis. The end on the z-axis plus side of the ninth surface 389 is in contact with the end of the first surface 381 on the optical axis 22 side. The ninth surface 389 is not parallel to the xy plane. The eighth surface 388 is a surface inclined with respect to the xy plane. For this reason, irregular reflection of light occurring in the space surrounded by the mounting substrate 120, the frame 748, and the cover glass 160 can be reduced.

  The protruding portion 480 protrudes from the sixth surface 386 toward the imaging chip 100 side. The protrusion 480 is formed by a seventh surface 387, an eighth surface 388, and a ninth surface 389. Of the light transmitted through the cover glass 160, light that has passed through the second opening 246 formed by the eighth surface 388 enters the imaging chip 100. The peripheral circuit portion 570 formed in the peripheral region 102 is magnetically shielded by at least the protrusion 480.

  According to the imaging unit 428, the protruding portion 480 can be brought close to the peripheral region 102 of the imaging chip 100. Further, the protruding portion 480 can protrude to the vicinity of the end of the imaging region 101. In addition, the imaging region 101 can be formed up to the vicinity of the protruding portion 480. Therefore, the magnetic shielding effect for the peripheral circuit portion 570 can be enhanced. In addition, a wide area of the imaging region 101 can be ensured. Further, the width of the frame 748 in the z-axis direction can be reduced. In addition, the height of the imaging unit 42 can be reduced. Moreover, the imaging unit 42 can be reduced in size.

  FIG. 12 is a cross-sectional view schematically showing an imaging unit 429 as a ninth modification of the imaging unit 42. Among the constituent elements of the imaging unit 429, constituent elements having the same reference numerals as the constituent elements of the imaging unit 42 have the same functions and configurations as the corresponding constituent elements of the imaging unit 42. Have. Of the components included in the imaging unit 429, the description of the components corresponding to the components included in the imaging unit 42 may be omitted. Of the components included in the imaging unit 429, only the differences between the components corresponding to the components included in the imaging unit 42 may be described.

  The imaging unit 429 includes a frame 749 as a component corresponding to the frame 140 included in the imaging unit 42. A frame 749 is a modification of the frame 140 included in the imaging unit 42. The frame 749 does not have the protruding portion 200 that the frame 140 of the imaging unit 42 has.

  The imaging unit 429 includes a magnetic flux concentration member 490. The frame 140 in the imaging unit 429 does not have the protrusion 200 that the frame 140 of the imaging unit 42 has. The frame 140 may be formed of a material that does not have magnetic shielding properties. The frame 140 may be formed of resin.

  The magnetic flux concentration member 490 is formed of, for example, a magnetic material. The magnetic flux concentrating member 490 is preferably formed of a high magnetic permeability material. In the space including the magnetic flux concentrating member 490 and the periphery of the magnetic flux concentrating member 490, the magnetic resistance in the magnetic flux concentrating member 490 is lower than the magnetic resistance outside the magnetic flux concentrating member 490. Therefore, the magnetic flux generated by the magnetism generation source outside the imaging unit 42 is concentrated in the magnetic flux concentration member 490 from the outside of the magnetic flux concentration member 490. As a result, the magnetic flux density in the peripheral region 102 decreases. Thus, the magnetic flux concentration member 490 magnetically shields the peripheral circuit portion 570 by concentrating the magnetic flux.

  Note that a magnetic flux concentrating member similar to the magnetic flux concentrating member 490 may be further applied to the imaging unit 42. A magnetic flux concentrating member similar to the magnetic flux concentrating member 490 may be applied to each imaging unit described in the first to eighth modifications of the imaging unit 42 described above.

  In the first to ninth modifications of the imaging unit 42 and the imaging unit 42 described above, the surface of the frame 140 may be subjected to reflection suppression processing that suppresses reflection of light. At least the inner surface of the frame 140 may be subjected to reflection suppression processing. For example, fine irregularities may be formed on the surface of the frame 140. By applying antireflection processing to the surface of the frame 140, irregular reflection of light can be suppressed.

  In the first to ninth modifications of the imaging unit 42 and the imaging unit 42 described above, the imaging chip 100 includes the AD conversion circuit 560. However, the AD conversion circuit may be provided on the mounting substrate 120. In this case, the bonding wire 110 and the bump part 111 described above transmit analog signals.

  In the first to eighth modifications of the imaging unit 42 and the imaging unit 42 described above, the protruding portion 200, the protruding portion 410, the protruding portion 411, the protruding portion 420, the protruding portion 480, the magnetic shielding member 450, and the magnetic shielding The member 470 covers the peripheral region 102 of the imaging chip 100 when viewed from a position in the positive z-axis direction. However, the protrusion 200, the protrusion 410, the protrusion 411, the protrusion 420, the protrusion 480, the magnetic shielding member 450, and the magnetic shielding member 470 may cover at least a part of the peripheral region 102. For example, the protruding portion 200, the protruding portion 410, the protruding portion 411, the protruding portion 420, the protruding portion 480, the magnetic shielding member 450, and the magnetic shielding member 470 cover the processing circuit portion 540, and the drive circuit portion 580 and the output circuit portion 590. It is not necessary to cover at least one of them.

  In the above description, the imaging module 40 has been described as including the imaging unit 42 such as the imaging unit 42 and the optical unit 45. However, the imaging module 40 does not have to include the optical unit 45. The camera body 30 may not have the optical low pass filter 276.

  In the imaging unit 42 described above, the frame 140 has one mounting hole 240 at a position in the x-axis plus direction from the x-axis plus direction of the two sides of the mounting substrate 120 along the short side of the imaging chip 100. Have. The frame 140 has two mounting holes 240 at positions in the x-axis minus direction from the x-axis minus direction side of the two sides of the mounting substrate 120 along the short side of the imaging chip 100. As a modified example of the position of the mounting hole, the frame 140 has two mounting holes at a position in the y-axis plus direction from the side in the y-axis plus direction among the two sides of the mounting substrate 120 along the long side of the imaging chip 100. Then, one mounting hole may be provided at a position in the y-axis minus direction from the y-axis minus direction side of the two sides of the mounting substrate 120 along the long side of the imaging chip 100. In this case, the frame 140 does not have the attachment hole 240 at a position in the x-axis plus direction from the side in the x-axis plus direction among the two sides of the mounting substrate 120 along the short side of the imaging chip 100. Of the two sides of the mounting substrate 120 along the short side, there is no mounting hole at a position in the x-axis minus direction from the x-axis minus direction side. The frame 140 preferably has mounting holes between two sides of the mounting substrate 120 along the short side of the imaging chip 100.

  Thus, the mounting substrate 120 along the short side of the imaging chip 100 is configured such that the frame 140 does not form the attachment holes 240 at positions outside the two sides of the mounting substrate 120 along the short side of the imaging chip 100. A substrate 62 can be provided in the vicinity of this side. Therefore, for example, the length of the signal transmission path between the imaging chip 100 and the ASIC 52 can be shortened. For example, since the electronic component 180 such as a connector can be mounted in the vicinity of the substrate 62, the length of the flexible substrate connecting the substrate 62 and the mounting substrate 120 can be shortened. The above-described modification of the position of the mounting hole may be applied to each imaging unit according to the first to ninth modifications described above.

  The camera 10 including the lens unit 20 and the camera body 30 has been described as an example of an imaging apparatus. However, the imaging device may not include the lens unit 20. For example, the camera body 30 is an example of an imaging device. The imaging device is a concept that includes a lens non-exchangeable imaging device in addition to a lens-exchangeable imaging device such as a single-lens reflex camera.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

10 Camera, 20 Lens unit, 22 Optical axis, 24 Lens mount, 26 Body mount, 30 Camera body, 31 Mirror unit, 32 Main mirror, 33 Sub mirror, 38 Shutter unit, 40 Imaging module 42, 421, 422, 423, 424 425, 426, 427, 428, 429 Imaging unit 45 Optical unit, 51 MPU, 52 ASIC, 60 Mirror box, 62 Substrate, 70 Imaging optical system, 72 Focus detection sensor, 80 Focus plate, 82 Penta prism, 84 Viewfinder Optical system, 86 finder window, 88 display unit 100 imaging chip, 101 imaging region, 102 peripheral region 110 bonding wire, 111 bump unit 120 mounting substrate, 121 first layer, 122 second layer, 131 via, 132 insulator 140 frame 141, first surface, 142 second surface, 143 third surface, 144 fourth surface, 145 fifth surface, 146 sixth surface, 147 seventh surface, 148 eighth surface 150 bracket, 160 cover glass 161 first Surface, 162 Second surface 180 Electronic component 200, 410, 411, 420, 480 Projection 201 Solder resist layer, 202 Wiring layer, 203 Insulating layer, 204 Wiring layer, 205 Insulating layer, 207 Core layer, 211 Solder resist layer, 212 wiring layer, 213 insulating layer, 214 wiring layer, 215 insulating layer, 245 opening 240 mounting hole, 242 screw 245 opening, 244 first opening, 246 second opening 272 mask rubber, 274 optical element, 276 optical low pass filter, 278 Infrared cut filter, 280 holding member, 282 screw, 288 flat part 311, 321, 381 1st surface 312, 322, 382 2nd surface 313, 323, 383 3rd surface 314, 324, 384 4th surface 315, 325, 385 5th surface 316, 326, 386 6th surface 317, 327, 387 7th surface 318, 328, 388 Eighth surface 319, 329, 389 Ninth surface 320 Tenth surface 430, 440 Projection member, 432, 442 Frame member, 450, 470 Magnetic shielding member, 490 Magnetic flux concentrating member 500 Pixel unit, 501 Unit cell , 510 row reset line, 520 row selection line, 530 column signal line, 540 processing circuit unit, 550 CDS circuit, 560 AD conversion circuit, 570 peripheral circuit unit, 580 drive circuit unit, 590 output circuit unit 1101 first main surface, 1102 2nd main surface, 1121 1st main surface, 1122 2nd main surface 741, 742, 743, 744, 745, 746 747,748,749 frame

Claims (12)

An imaging chip having an imaging region that includes light from an optical system and includes a plurality of pixels, and a peripheral region that is positioned around the imaging region and includes a processing circuit that processes a signal from the pixels ;
An electronic component constituting at least a part of a power supply circuit for supplying power to the imaging chip;
A substrate on which the imaging chip and the electronic component are disposed;
A shielding part that is disposed in front of the imaging chip in the optical axis direction of the optical system and shields the processing circuit magnetically;
An imaging unit in which the electronic component is disposed on the substrate at a position farther from the shielding unit in the optical axis direction than the imaging chip.   The imaging unit according to claim 1, further comprising a member that is disposed outside the imaging chip on the substrate and forms a space for accommodating the imaging chip together with the substrate.   The imaging unit according to claim 2, further comprising an optical element that receives light from the optical system and forms a space for accommodating the imaging chip together with the substrate and the member.   The imaging unit according to claim 3, wherein the shielding unit is disposed in a space formed by the substrate, the member, and the optical element and accommodating the imaging chip. The shielding unit, the imaging unit according to any one of the preceding claims 2 to the front SL member having a protrusion protruding on the imaging chip side. Before SL member and the shielding unit, the imaging unit according to claim 5, which is a metallic member formed integrally. Before SL member is formed of a resin,
The shielding unit, the imaging unit according to claim 5 which is a metal member fixed to the front SL member. The shielding unit, the imaging unit according to claim 7 before Symbol member is a metal member formed by insert molding. The imaging unit according to claim 3 or 4 , wherein the shielding portion is fixed to the optical element.   The processing circuit includes an analog circuit for processing the signal,
  The imaging unit according to any one of claims 1 to 9, wherein the shielding unit magnetically shields at least a part of the analog circuit.   The processing circuit includes a conversion circuit that converts the signal into a digital signal,
  The imaging unit according to claim 1, wherein the shielding unit magnetically shields at least a part of the conversion circuit. A connection member for outputting the signal from the imaging chip to the substrate;
The imaging unit according to claim 1 , wherein the shielding part magnetically shields at least a part of the connection member .

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