JP2014123852A - Imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging apparatus which can efficiently insulate an electromagnetic wave that transmits through a photographing optical system from the front of the apparatus, intrudes into a connection terminal of an imaging element unit or a circuit system at a periphery of the terminal as a noise component, affects an imaging circuit and deteriorates image quality.SOLUTION: An imaging apparatus comprises: an imaging element unit including an imaging element chip 41a which has a light receiving face 41ab where a plurality of light receiving elements are arranged and in which a plurality of connection terminals 41md which are electrically connected to the light receiving element are arranged in a region outside the light receiving face, and a transparent plate-like glass 41c placed on an upper side of the light receiving face; and an electromagnetic wave shielding member 50 which is in a thin plate-like frame shape as a whole and is disposed on an outer surface of the plate-like glass for forming the imaging element unit so that the frame shape part is in a position to cover the plurality of connection terminals (connection patterns) installed on the imaging element chip of the imaging element unit as a projection area in an optical axis direction of the imaging optical system.

Description

  The present invention relates to an image pickup apparatus having a configuration that suppresses the influence of an electromagnetic wave that penetrates an image pickup optical system and enters an image pickup element unit.

  Conventionally, an optical image formed by a photographing optical system is received by a photoelectric conversion element such as an imaging element and sequentially converted into an image signal, and the obtained image signal is stored in a recording medium as image data in a predetermined form. An image display device capable of recording and reproducing and displaying image data recorded on the recording medium as an image, for example, an image pickup device configured to include a liquid crystal display (LCD) or the like, such as a digital camera or a video camera, is generally used. It has been put into practical use and widely used.

  This type of image pickup apparatus is generally configured to include various electric components such as an image pickup unit having an image pickup element chip and a drive motor for driving various mechanism units. . Such an electric component (such as a drive motor) normally generates an electromagnetic wave during its operation.

  In addition, electromagnetic waves may enter the electrical terminals arranged around the image sensor unit from the outside of the imaging device via the photographing lens as noise, and may affect the image signal from the image sensor.

  A photoelectric conversion element such as an image pickup element employed in the image pickup apparatus is one of the main electrical components for generating image data, but for image data flowing through signal lines around the image pickup element unit. When electromagnetic waves such as those described above are mixed, there is a possibility that the noise will deteriorate the image quality of the image formed by the generated image data. Therefore, it is not desirable for such electromagnetic waves to penetrate into the signal line around the image sensor unit, and it is desirable to suppress and shield the penetration as much as possible.

  Therefore, for example, arranging a shield member for shielding electromagnetic waves in the vicinity of the image sensor unit is an effective means. However, in a general configuration of the imaging apparatus, a configuration in which, for example, a lens barrel including a drive motor is disposed in front of the position where the imaging element unit is disposed. Here, when the positional relationship between the imaging element unit and the lens barrel is as described above, the electromagnetic waves generated from the drive motor disposed inside the lens barrel are transparent to the imaging optical system of the lens barrel, that is, transparent. The configuration is such that a plurality of optical lenses made of glass or a resin member can pass through and easily reach the imaging surface of the imaging element unit.

  Therefore, for example, in an imaging apparatus disclosed in Japanese Patent Application Laid-Open No. 2005-286420, an electromagnetic wave transmitted through an optical lens for photographing is formed in the vicinity of a peripheral portion of an imaging element chip mounted and arranged on a circuit board. An electromagnetic wave absorber made of a copper material is provided near the periphery of the image sensor unit to shield the intrusion into the bonding wire connecting the first connection terminal on the upper side and the second connection terminal on the circuit board. The end portion of the electromagnetic wave absorber is configured to be grounded to the GND line formed on the circuit board. Here, the electromagnetic wave absorbing member is formed in a three-dimensional shape and disposed so as to cover the bonding wire.

  With such an arrangement, according to the imaging device disclosed in the above publication, it is possible to shield electromagnetic waves that penetrate through an optical lens or the like from the front of the device while suppressing an increase in size of the device itself. Is.

JP 2005-286420 A

  However, according to the means disclosed in the above Japanese Patent Application Laid-Open No. 2005-286420, there is a problem that it is not possible to shield the electromagnetic wave that has entered the immediate region of the light receiving surface of the image sensor unit. Moreover, what was formed with copper is used as said electromagnetic wave absorber. For this reason, there is a restriction that the end of the electromagnetic wave absorbing material must be grounded to the GND wire. Furthermore, in the means disclosed in the above publication, it is necessary to form a three-dimensional shape so as to cover the front side of the bonding wire formed so as to extend in the vertical direction (height direction) from the imaging element chip surface. Therefore, an internal space of the imaging device is required, and there is a limit to downsizing the device.

  The present invention has been made in view of the above-described points, and an object of the present invention is to transmit noise from the front of the apparatus to the connection terminal of the image sensor unit or a peripheral circuit system thereof. An object of the present invention is to provide an imaging apparatus having a configuration capable of efficiently shielding electromagnetic waves that enter as components and affect the imaging circuit to deteriorate the image quality.

  In order to achieve the above object, an imaging device according to one embodiment of the present invention includes a light receiving surface on which a plurality of light receiving elements are arranged, and the light receiving surface side or the back surface opposite to the light receiving surface. An image pickup device having an image pickup device chip in which a plurality of connection terminals electrically connected to the light receiving device are arranged in a region excluding the projection region of the light receiving surface, and a transparent plate-like glass arranged on the light receiving surface. A plurality of connection terminals (connection patterns) provided on the image pickup device chip of the image pickup device unit as a projection area in the optical axis direction of the image pickup optical system. And an electromagnetic wave shielding member disposed on the outer surface of the sheet glass forming the imaging element unit.

  According to the present invention, it is possible to provide an imaging apparatus having a configuration that can efficiently shield electromagnetic waves that cause noise components that pass through the imaging optical system from the front of the apparatus and enter the imaging circuit to deteriorate the image quality. .

1 is an external perspective view showing an imaging apparatus according to an embodiment of the present invention. 1 is an external perspective view showing the camera body with the lens barrel removed in the imaging apparatus of FIG. Sectional view along line [3]-[3] in FIG. 1 is an enlarged cross-sectional view of a main part of a camera body in the image pickup apparatus of FIG. FIG. 1 is an external perspective view showing an assembled appearance of an image pickup unit in the image pickup apparatus of FIG. FIG. 5 is an external perspective view showing an assembled state in which some components (front and rear yokes of the shake correction unit) of the image pickup unit in FIG. 5 is an exploded perspective view of the imaging unit in FIG. The perspective view which shows the structure (group B) of the latter half part from the front side among the imaging units shown in FIG. The perspective view which shows the structure (group A) of the first half part from the back side among the imaging units shown in FIG. The top view at the time of seeing the imaging substrate which mounted the image sensor chip among the imaging units of FIG. The figure which shows the example of the various shapes about the magnetic material sheet applied to the imaging unit of FIG. The outline of the size of the image sensor unit applied in the image pickup apparatus of the present embodiment and the size of the magnetic sheet applied thereto is shown, and the image pickup substrate on which the image sensor chip is mounted is directly opposed to the light receiving surface of the image sensor chip. Plan view when viewed from the side Sample image representing “level 1” noise among sample images indicating the appearance of noise in the image acquired by the imaging apparatus of the present embodiment Sample image representing “level 2” noise among sample images indicating the appearance of noise in the image acquired by the imaging apparatus of the present embodiment The graph which shows the frequency of noise appearance at the time of using the conventional imaging device (imaging device which has not attached a magnetic material sheet) of general composition The graph which shows the noise appearance frequency at the time of using the imaging device (imaging device which comprises the magnetic material sheet) of this embodiment The top view which shows the appearance when the imaging unit applied to the imaging device of one Embodiment of this invention is seen facing the light-receiving surface of an image pick-up element chip | tip. Sectional drawing which follows the [18]-[18] line of FIG. The figure which shows the deformation | transformation pattern at the time of seeing from the side surface of the flexible printed circuit board extended from the imaging part of the imaging unit of FIG. The front view which shows the positional relationship of the flexible printed circuit board extended from the imaging part of the imaging unit of FIG. 17, and a sound-absorbing member (cushion member). The figure which shows another structural example about the sound absorptive member (cushion member) in the imaging device of this embodiment.

The present invention will be described below with reference to the illustrated embodiments.
In each drawing used for the following description, each component may be shown with a different scale in order to make each component large enough to be recognized on the drawing. Therefore, according to the present invention, the number of constituent elements, the shape of the constituent elements, the ratio of the constituent element sizes, and the relative positional relationship of the constituent elements described in these drawings are limited to the illustrated embodiments. It is not a thing.

  In one embodiment of the present invention, for example, an optical image formed by an optical lens is photoelectrically converted using a solid-state imaging device, and an image signal obtained thereby is converted into digital image data representing a still image or a moving image, An imaging device such as a digital camera configured to record the digital data generated in this way on a recording medium and to reproduce and display a still image or a moving image on a display device based on the digital image data recorded on the recording medium. This is an example when applied to.

First, a schematic configuration of the imaging apparatus 1 according to the present embodiment will be described mainly with reference to FIGS.
The imaging device 1 according to the present embodiment includes a camera body 10 and a lens barrel 11 as shown in an external perspective view of FIG. As shown in FIG. 2 and the like showing a state where the lens barrel is removed, the camera body 10 is formed of a substantially box-shaped casing, and includes an imaging unit 40 (see FIG. 3 and the like; details will be described later), a battery, and a recording unit. It has various constituent units such as a medium (not shown). As shown in FIG. 2, an opening 10 a is formed at a substantially central portion of the front surface of the camera body 10. Inside the camera body 10, the imaging unit 40 is disposed at a portion exposed by the opening 10a, and the light receiving surface 41ab (see FIG. 10) of the imaging element chip 41a is exposed toward the front surface. Yes. Further, a body side mount portion 10b for attaching and detaching the lens barrel 11 is disposed on the front side peripheral portion of the opening 10a. In the vicinity of the body side mount portion 10b, a lens release button 10c, which is an operation member for operating when the lens barrel 11 is attached or detached, is disposed. Further, on the outer surface of the camera body 10, various operation members, for example, a mode switching dial 10d, a shutter release button 10e, etc., as shown in FIGS.

  As shown in FIGS. 1 and 3 (a cross-sectional view taken along line [3]-[3] in FIG. 1), the lens barrel 11 constitutes a photographing optical system composed of a plurality of optical lenses. A plurality of lens groups (first to sixth lens groups 12a, 13a, 14a, 15a, 16a, 17a) and a plurality of holding frames (first to sixth lens group holding frames) for holding the plurality of lens groups, respectively. 12, 13, 14, 15, 16, 17), and a drive mechanism for moving a movable frame (described later) among these holding frames forward and backward in the direction along the optical axis O, and manually focusing. Operation members such as a focus operation ring 21 for performing an adjustment operation, a zoom operation ring 22 for manually performing a zooming operation, a mode switch 23 (see FIG. 1), and a basic (base) of the lens barrel 11 Fixed frame 19 as a member and front Configured with a fixed frame 18 or the like.

  Among the plurality of lens groups, the first and sixth lens groups 12a and 17a are fixed lens groups. Therefore, the first and sixth lens group holding frames 12 and 17 that hold these two lens groups (12 a and 17 a) are fixed frames that are fixed to the fixed frame 19.

  On the other hand, the second to fifth lens groups 13a, 14a, 15a, and 16a among the plurality of lens groups are movable lens groups. Therefore, the second to fifth lens group holding frames 13 to 16 that hold these lens groups (13 a, 14 a, 15 a, and 16 a) are movable frames that are movable with respect to the fixed frame 19.

The driving mechanism includes a focus driving mechanism 25 including a driving source and a driving force transmission mechanism for performing a focus adjustment operation (focusing), a zoom lens driving motor 24a that is a driving source for performing zooming, and driving thereof. The zoom driving mechanism 24 includes a driving force transmission mechanism that transmits force, and the rotation frame 20 that transmits the driving force from the zoom driving mechanism 24 to the zoom lens group holding frame (14, 15, 16). The
At the rear end of the lens barrel 11, a lens side mount portion 11b that is bayonet-coupled to the body side mount portion 10b of the camera body 10 is provided.

  As shown in the enlarged cross-sectional view of the main part of FIG. 4, an imaging unit 41 including an imaging element chip 41a, an imaging unit 40 including a shake correction unit 42, a dustproof unit 43, and the like are disposed inside the camera body 10. Yes. Also, as shown in FIG. 3, various constituent units such as a display unit 44, a finder unit 45, a shutter unit 46, and a flash light emitting device (not shown) are arranged. Further, although not shown, a battery as a power source and a memory card as a recording medium are detachably disposed inside the camera body 10.

  Next, a detailed configuration of the imaging unit 40 will be described below mainly using FIGS.

  FIG. 5 is an assembled external perspective view showing the image pickup unit in the image pickup apparatus of FIG. 1, and FIG. 10 is a view of the image pickup substrate on which the image pickup device chip is mounted in the image pickup unit of FIG. FIG.

  As shown in FIG. 4, the imaging unit 40 is configured such that an imaging unit 41, an imaging unit holding frame 41g, an imaging element holding plate 41h, a shake correction unit 42, a dustproof unit 43, and the like are integrated. Is a unit.

  The imaging unit 41 includes an imaging element unit including an imaging element chip 41a and an imaging element glass 41c, a plurality of electrical components 41k, an imaging board 41b, a flexible printed board 41d, and a plurality (two) of optical filters 41e. The dust-proof rubber 41f, the magnetic material sheet 50, and the like.

  As shown in FIG. 4, an image pickup device holding base 41m on which an image pickup device chip 41a is arranged is fixed to the image pickup substrate 41b provided in the camera body 10. The imaging element chip 41a is an imaging element such as a photoelectric conversion element having a light receiving surface 41ab (see FIG. 10) in which a plurality of light receiving elements are arranged. On the image sensor holding base 41m, an image sensor glass 41c made of a transparent plate glass having a predetermined space at a position facing the light receiving surface 41ab on the front surface side of the image sensor chip 41a is disposed. The light receiving surface 41ab (see FIG. 10) of the image pickup element chip 41a is disposed toward the front surface of the image pickup apparatus 1 and is parallel to a plane orthogonal to the optical axis O of the photographing optical system of the lens barrel 11. It is arranged. The optical axis O of the photographing optical system is set so as to substantially coincide with the center of the light receiving surface 41ab of the image sensor chip 41a.

  As shown in FIG. 10, an effective image area 41ac in which pixels for generating an image signal are arranged is provided on the light receiving surface 41ab side of the image sensor chip 41a. In the image sensor holding base 41m, a connection pattern 41aa to which a bonding wire 41af connected to the image sensor chip 41a is electrically connected is disposed on the outer peripheral edge of the image sensor chip 41a. Note that the connection patterns 41aa are arranged at predetermined intervals along the shape of the imaging element chip 41a and over the peripheral portion of the substantially frame shape.

  The imaging element holding base 41m is provided with a connection terminal 41md for outputting an output from the bonding wire 41af to the imaging substrate 41b. In the present embodiment, the connection terminal 41 md is not only the back surface (portion indicated by a dotted line) of the image sensor holding base 41 m but also the side surface (portion indicated by a solid line) of the image sensor holding base 41 m. Both are provided, but either one is acceptable.

  In FIG. 10, a rectangular area denoted by reference numeral 41ac in the area of the light receiving surface 41ab of the image sensor chip 41a is a projection area, which is an effective image area for forming an image. This effective image area is an area for generating image data. In addition to the imaging element chip 41a, a plurality of other electrical components 41k are mounted on the imaging substrate 41b.

  The imaging element chip 41a is a solid-state imaging element using a CCD image sensor using a semiconductor element such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). A MOS type image sensor or the like is applied.

  As shown in FIGS. 4 to 7, the image pickup substrate 41b is provided as a signal input / output path for inputting a control signal to the image pickup element chip 41a and outputting an image pickup signal from the chip 41a. A flexible printed circuit board 41d is extended. The flexible printed circuit board 41d is bent in the optical axis direction from the direction perpendicular to the optical axis O, and is further bent in a U shape so as to extend substantially in the optical axis direction, and is provided in the camera body 10. It is fixed to parts such as circuits. This is because the camera body 10 in the image pickup apparatus according to the present embodiment includes an image pickup element shift type shake correction device, and therefore the image pickup element chip 41a is moved by a shake correction unit 42 described later, and flexible. Since the printed circuit board 41d is also moved, it is arranged in consideration of allowing the moving range.

  The flexible printed board 41d is an electrical connection member that ensures electrical connection with another electrical board provided inside the camera body 10. An imaging element holding plate 41h is integrally attached to one surface of the imaging substrate 41b (a surface on the back side of the gamera body 10).

  FIG. 7 shows the assembly up to this point, that is, an assembly in which the imaging element chip 41a, the imaging board 41b, the imaging element glass 41c, the flexible printed board 41d, and the imaging element holding plate 41h are assembled. 8 is a schematic perspective view of the unit indicated by reference numeral 40B in FIG. 7 when viewed from the direction of arrow B in FIG.

  As shown in FIG. 4, the optical filter 41e is composed of a thick first optical filter arranged on the subject side and a second optical filter thinner than the first optical filter arranged on the image sensor side. It is provided at a portion facing the front surface of the element glass 41c with a predetermined interval. The two optical filters 41e are provided on the dust-proof rubber 41fe so as to cover the side edge of the outer periphery of the optical filter 41e and the outer peripheral edge of the rear surface of the optical filter 41e. The dust-proof rubber 41f is formed so as to surround the outer peripheral side surface of the optical filter 41e, covers the filter holding portion 41fa that holds the optical filter 41e, and the outer peripheral edge portion on the rear surface side of the optical filter 41e, and the image sensor glass 41c. An interval defining portion 41fb that defines an interval between the sheet holding portion 41fc, a sheet holding portion 41fc that extends from the interval defining portion 41fb toward the outer peripheral side and that holds a magnetic sheet 50 described later, and the sheet holding portion. It is an elastic member constituted by a fin portion 41fd that extends further outward and obliquely forward from the front end of 41fc to adhere to a part of the imaging unit holding frame 41g and secure a sealed state therebetween.

  Here, the space defining portion 41fb is sandwiched between the optical filter 41e and the image sensor glass 41c, and the space between the rear surface of the optical filter 41e and the front surface of the image sensor glass 41c is the dust-proof rubber 41f. Is in an airtight state. Examples of the optical filter 41e include an optical low-pass filter (OLPF), an ultraviolet light cut filter, and an infrared light cut filter. In addition to these, for example, a simple flat transparent optical glass having no optical filter effect may be used. In the present embodiment, the first optical filter is an optical low-pass filter (OLPF), and the second optical filter is glass for correcting the optical path length. Of course, it goes without saying that the first optical filter may be an infrared light cut filter, and the second optical filter may be glass for correcting the optical path length.

  As shown in FIG. 4, the magnetic sheet 50 penetrates the imaging optical system from the front of the imaging apparatus 1 and enters the camera body 10, and is connected to the connection pattern 41aa provided on the imaging element holding base 41m. And an electromagnetic wave shielding member for shielding electromagnetic waves (noise components) entering the imaging circuit through signal lines such as bonding wires 41af and connection terminals 41md. In the present embodiment, the magnetic sheet 50 is disposed so as to cover the connection pattern 41aa and the connection terminal 41md in the projected area in the optical axis O direction.

  This magnetic sheet 50 is formed by forming a thin plate-like sheet member including a magnetic body into a rectangular frame shape (frame shape). Specifically, the magnetic sheet 50 is formed of a thin plate-like sheet member formed in a predetermined planar shape, that is, a substantially frame shape, and includes, for example, a permalloy, that is, an iron nickel (Fe—Ni) alloy or the like. The magnetic material is laminated and formed in the traveling direction of electromagnetic waves (that is, the direction along the optical axis). In this embodiment, as shown in FIG. 7, FIG. 11 (A), etc., for example, those formed in a rectangular frame shape are illustrated.

  In addition, the magnetic material sheet 50 should just be the shape of the assembled | attached state in the above-mentioned rectangular frame shape, or a shape similar to this. Therefore, the shape of the magnetic sheet 50 is not necessarily a rectangular frame-shaped sheet member as shown in FIG. 11 (A). For example, FIGS. 11 (B) and 11 (C) ), As shown in FIG. 11 (D), a configuration in which a plurality of thin plate-like sheet members are combined to form a substantially rectangular frame shape may be employed.

  For example, as shown in FIG. 11B, in order to form the magnetic sheet 50A, a form using two sheet-like members having a substantially L-shaped planar shape is conceivable. In this case, two substantially L-shaped sheet-like members 50Aa are combined to form a rectangular frame shape that can cover a predetermined area on the image sensor glass 41c.

As shown in FIG. 11C, in order to form the magnetic sheet 50B, a sheet-like member 50Ba having a substantially U-shaped planar shape (substantially U-shaped) and a substantially I-shaped sheet shape. Each of the members 50Bb is combined one by one to form a rectangular frame shape that can cover a predetermined area on the image sensor glass 41c.
Further, as shown in FIG. 11 (D), the planar shape is substantially U-shaped so that the rectangular shape of FIG. 11 (A) is vertically divided into two in order to form the magnetic sheet 50C. The two sheet-like members 50Ca having a shape (substantially U-shape) are combined to form a rectangular frame shape that can cover a predetermined area on the image sensor glass 41c. In addition, when forming the form which divided the rectangular sheet into two, in the example of FIG. 11D, although the form cut | disconnected by the rectangular short side direction is shown, as a form which cut | disconnected the long side direction Also good.

  Even in this configuration, the same effect as that of the configuration example of the above embodiment can be obtained. When a large number of sheet-like members are cut out from a single sheet-like sheet member as a base, a configuration example as shown in FIG. 11B, FIG. 11C, and FIG. The sheet-like members 50Aa, 50Ba and 50Bb, 50Ca and the like have an effective effect that the plurality of sheets can be cut out without waste and can be cut out efficiently.

  The magnetic sheet 50 is a predetermined region in the vicinity of the outer peripheral edge portion on the front surface side of the imaging element glass 41c, specifically, a peripheral edge mainly on the front surface side of the imaging element glass 41c, and is projected in the optical axis O direction. In terms of area, the connection pattern 41aa and the connection terminal 41md are disposed at positions that cover the connection portions. The rear surface of the sheet holding portion 41fc of the dust-proof rubber 41f is disposed in close contact with the front side of the magnetic sheet 50. Therefore, the magnetic material sheet 50 is disposed in a state of being sandwiched between the front surface of the imaging element glass 41c and the rear surface of the sheet holding portion 41fc of the dust-proof rubber 41f. Here, the sheet holding portion 41 fc of the dust-proof rubber 41 f is formed according to the shape of the magnetic material sheet 50. Accordingly, the magnetic sheet 50 is fixed and held in a state of being fitted to the sheet holding portion 41fc of the dustproof rubber 41f. Thereby, the magnetic sheet 50 is positioned and fixed by the dust-proof rubber 41f, and at the same time, the magnetic sheet 50 is not easily dropped from the dust-proof rubber 41f.

  The magnetic sheet 50 may be configured to be fixed to, for example, an adhesive or a double-sided tape with respect to each of the imaging element glass 41c and the dustproof rubber 41f. Thus, if the adhesive fixing means is used in combination, the magnetic sheet 50 is reliably held between the dust-proof rubber 41f and the imaging element glass 41c.

  Here, the size of the magnetic material sheet 50 as the electromagnetic wave shielding member will be described in detail below with reference to FIG. FIG. 12 is a schematic diagram showing the size of the imaging element chip and the size of the magnetic sheet applied thereto, and the imaging substrate on which the imaging element chip is mounted is viewed from the side facing the light receiving surface of the imaging element chip. FIG. FIG. 12 shows a state in which a magnetic sheet is arranged on the front surface of the image sensor unit in FIG. Therefore, in FIG. 12, with respect to the part on the front side of the image sensor unit, the part covered with the magnetic sheet is omitted in order to avoid complication of the drawing. For example, in FIG. 12, the part shown with a dashed-two dotted line has shown arrangement | positioning of the connection terminal 41md. Further, the dotted line indicated by reference numeral 41aa is shown by omitting the arrangement of the connection pattern 41aa provided on the front face of reference numeral 41aa in FIG. 10, that is, the imaging element chip 41a.

  In the imaging device or the like, the region most susceptible to electromagnetic waves is the peripheral region of the connection pattern 41aa to which the bonding wire 41af connected to the imaging element chip 41a is connected, and the output from the bonding wire 41af is transmitted to the imaging substrate 41b. This is a peripheral region of the connection terminal 41 md provided on the image sensor holding base 41 m. In particular, the peripheral area of the connection pattern 41aa is greatly affected because a part of the area is exposed in the direction of the optical axis O of the photographing optical system. Therefore, it is desirable to cover as much of the periphery of the connection pattern 41aa and the connection terminal 41md as possible as the region covered with the magnetic sheet 50. On the other hand, it is necessary to cover the image forming area so that effective incident light into the image forming area is not blocked.

    In this case, it is assumed that the planar size of the light receiving surface 41ab of the imaging element chip 41a in the present embodiment is, for example, a rectangular shape of 17.3 mm × 13.0 mm, and the planar size of the imaging element chip 41a itself is, for example, about It is assumed that it is about 28 × 23 mm. And let the intersection of the X-axis and the Y-axis shown in FIG. 12 be the approximate center point O of the light receiving surface 41ab. That is, the center point O is a point that substantially coincides with the optical axis O of the imaging optical system of the imaging apparatus 1 to which the imaging unit 40 including the imaging element chip 41a is applied.

In this embodiment, as a specific example, the magnetic sheet 50 sufficiently covers the connection area such as the connection pattern 41aa and the connection terminal 41md so as to sufficiently cover the projected area in the optical axis direction and shields electromagnetic waves reliably. Each dimension in the rectangular frame shape of the magnetic material sheet 50 is illustrated as shown in FIG. That is, in FIG. 12, the dimension of each side seen from the optical axis direction is
Long side width dimension = 2.45 mm,
Short side width dimension = 2.2 mm,
Long side dimension on the inner edge side = 11.7 mm × 2 = 23.4 mm,
Inner edge side short side dimension = 9.2 mm × 2 = 18.4 mm,
Thus, the long side dimension on the outer edge side in the rectangular frame shape = (11.7 + 2.2) mm × 2 = 27.8 mm,
Short side dimension on the outer edge side = (9.2 + 2.45) mm × 2 = 23.3 mm,
Designed to cover the peripheral area of the connection pattern 41aa and the peripheral area of the connection terminal 41md.

  As shown in FIGS. 4 and 7, the imaging unit 41 is held so as to be sandwiched between the imaging unit holding frame 41g and the imaging element holding plate 41h. In this case, a rectangular opening 41ga that can expose at least the entire light receiving surface of the imaging unit 41 toward the front surface is formed at a substantially central portion of the imaging unit holding frame 41g. The imaging unit 41 is fitted and disposed to the opening 41ga from the back side of the imaging unit holding frame 41g. The imaging element holding plate 41h is fixed to the imaging unit holding frame 41g holding the imaging unit 41 in this manner from the back side with screws. Therefore, the imaging unit holding frame 41g and the imaging element holding plate 41h are base members that hold the imaging unit 41.

  A dustproof unit 43 is disposed on the front side of the opening 41ga of the image sensor holding frame 41g. The dustproof unit 43 includes a dustproof filter support rubber 43a, a dustproof filter 43b, a dustproof filter driving member 43c, a dustproof filter holding member 43d, and the like.

  The dustproof filter 43b is a plate-like optical member formed in a transparent thin plate shape, and is disposed at a position facing the front surface of the optical filter 41e with a predetermined interval. The back side of the dust filter 43b is supported by a dust filter support rubber 43a provided between the image sensor holding frame 41g in the vicinity of the outer peripheral edge thereof. The front side of the dustproof filter 43b is pressed and supported toward the rear along the optical axis O by a dustproof filter holding member 43d disposed in the vicinity of the outer peripheral edge thereof.

  A dust filter driving member 43c is fixed to one end of the outer peripheral edge of the dust filter 43b on the back side. The dustproof filter driving member 43c is constituted by a member such as a piezoelectric element that can generate a unique vibration when energized.

  On the other hand, a member constituting a part of the shake correction unit 42 is disposed in the image sensor holding frame 41g. Here, the shake correction unit 42 includes a VCM (Voice Coil Motor) including a VCM coil 42a, VCM magnets 42b and 42c, VCM yokes 42d and 42e, and the like. The shake correction unit 42 is a movable configuration unit for moving the imaging unit 41 by an arbitrary movement amount at an arbitrary timing in a direction (X direction and Y direction) parallel to the light receiving surface.

  As shown in FIG. 6 and the like, the plate-shaped portion in the vicinity of the outer peripheral edge that extends toward the outside of the opening 41ga of the image sensor holding frame 41g is a member that constitutes a part of the shake correction unit 42. Among them, the VCM coils 42a (three pieces) are arranged at predetermined portions.

  Further, as shown in FIG. 5 and the like, the front VCM yoke 42d of the members constituting a part of the shake correction unit 42 is opposed to the plate-shaped portion in the vicinity of the outer peripheral edge of the image sensor holding frame 41g. . The front VCM yoke 42d is formed in a substantially L shape when viewed from the front of the imaging unit 40. A rear VCM yoke 42e among members constituting a part of the shake correction unit 42 is disposed opposite to the back side of the image sensor holding frame 41g. As shown in FIG. 5, the front VCM yoke 42d and the rear VCM yoke 42e are screwed by two screws 51 with an imaging element holding frame 41g holding an assembly such as the imaging unit 41 interposed therebetween. It is fixed.

  Here, on the back side of the image sensor holding frame 41g, as shown in FIG. 9, three ball storage portions 41gb formed in a concave shape are formed. Then, with the steel balls 49 (see FIG. 9) being accommodated and disposed in the respective ball accommodating portions 41gb, the rear VCM yoke 42e is opposed to the back side of the image sensor holding frame 41g. At this time, a flat ball receiving portion 42ea is formed in each portion (three locations) of the rear VCM yoke 42e facing each ball storage portion 41gb. In this case, the depth of the concave shape of the ball storage portion 41gb is set to be slightly smaller than the diameter of the steel ball 49. Further, the planar ball receiving portion 42ea is a surface parallel to the plane orthogonal to the optical axis O (a surface parallel to the light receiving surface) and has a very smooth surface. Therefore, with such a configuration, when the rear VCM yoke 42e is opposed to the back side of the image sensor holding frame 41g in a state where the steel balls 49 are stored in the respective ball storage portions 41gb, the steel balls 49 are moved to the balls. The imaging element holding frame 41g can move smoothly in a plane parallel to the plane orthogonal to the optical axis O (a plane parallel to the light receiving surface) as it moves in the storage portion 41gb. . The steel ball 49 described above is made of steel, but is not limited to this example, and may be made of other materials, such as ceramic balls.

  Three front VCM magnets 42b are fixedly provided on the back side of the front VCM yoke 42d so as to face each of the three VCM coils 42a. Note that a predetermined distance is maintained between each VCM coil 42a and each front VCM magnet 42b, and the two are in a non-contact state.

Further, three rear VCM magnets 42c are fixedly provided on the front side of the rear VCM yoke 42e so as to face each of the three VCM coils 42a. The VCM coils 42a and the rear VCM magnets 42c are in a non-contact state with a predetermined distance maintained.
Therefore, with this configuration, when energization to the shake correction unit 42 is started, the image sensor holding frame 41g that holds the assembly such as the imaging unit 41 is located between the front VCM yoke 42d and the rear VCM yoke 42e. In other words, it is arranged in a floating state.

More specifically, this state is such that the VCM coil 42a and the front VCM magnet 42b of the image sensor holding frame 41g are not in contact with each other.
Further, the VCM coil 42a and the rear VCM magnet 42c of the image sensor holding frame 41g are not in contact with each other.
The image sensor holding frame 41g and the rear VCM yoke 42e can smoothly move in a plane parallel to a plane orthogonal to the optical axis O (a plane parallel to the light receiving surface) via the three steel balls 49. Is in a state.

  The assembly in which the dustproof unit 43, the image sensor holding frame 41g, the optical filter 41e, the dustproof rubber 41f, and the magnetic sheet 50 in the image pickup unit 41 are assembled is a unit denoted by reference numeral 40A in FIGS. Yes, this unit is a constituent unit (group A) in the first half of the imaging unit. FIG. 9 shows a state when viewed from the direction of arrow A in FIG.

  Further, a support plate 47 provided with three pairs of position detection magnets 46 is fixed to the back side of the VCM yoke 42e with screws. The position detection magnet 46 is configured to be paired with a position detection member disposed on the imaging substrate 41b, for example, on the back side of the imaging unit 41 disposed at a portion facing the VCM yoke 42e. Is a component of the position detecting means. The position detection magnet 46 detects a position in a plane parallel to a plane orthogonal to the optical axis O of the imaging unit 41 (a plane parallel to the light receiving surface).

  As described above, the imaging apparatus 1 of the present embodiment in which the magnetic sheet 50 is provided in a predetermined part of the imaging unit 40 and the imaging apparatus having a conventional general configuration (the magnetic part sheet is not provided in the same part of the imaging unit). Using the imaging device, a comparison was made between imaging results obtained by imaging a plurality of substantially identical subjects under substantially identical conditions, and the following results could be obtained.

  Here, FIG. 13 and FIG. 14 are examples of sample images showing the appearance of noise. Of these, FIG. 13 is a sample image representing “level 1” noise. FIG. 14 is a sample image representing “level 2” noise.

  As shown in FIGS. 13 and 14, the deterioration of image quality caused by the influence of electromagnetic waves occupies a relatively large area with respect to the entire display area of the image, and is a part where the contrast is uniform. For example, appears in a background or the like of the main subject in a striped or grid pattern. Here, the noise that appears as a striped pattern shown in FIG. 13 is defined as “level 1”. Further, the noise that appears as a grid pattern shown in FIG. 14 is defined as “level 2”. Note that the degree of both indicates that the larger the value, the more severe (strong) the deterioration (level 1 <level 2).

  15 and 16 are graphs showing the noise appearance frequency for a captured image obtained by repeating the imaging operation a plurality of times. Among these, FIG. 15 shows the frequency of noise appearance in the case of using an imaging device having a conventional general configuration (an imaging device to which the magnetic sheet is not attached). FIG. 16 shows the frequency of noise appearance when the imaging apparatus of the present embodiment (imaging apparatus provided with a magnetic sheet) is used. In FIGS. 15 and 16, the horizontal axis indicates the number of times of photographing (number of images), and the vertical axis indicates the presence / absence of noise and the noise level in the case of noise appearance.

  As is apparent from FIGS. 15 and 16, the noise occurrence frequency is higher in the imaging apparatus according to the embodiment, that is, in the imaging apparatus including the magnetic sheet than in the conventional imaging apparatus that does not include the magnetic sheet. Is much more, and the noise level that appears is lower in the imaging apparatus of the present embodiment. That is, in the imaging apparatus of the present embodiment, “level 2” noise does not appear at all.

  As described above, according to the configuration of the above-described embodiment, the magnetic material sheet 50 is disposed so as to cover the front side of the signal line such as the connection pattern 41aa of the image sensor chip 41a. For example, electromagnetic waves generated from the zoom lens drive motor 24a of the lens barrel 11 and the like can be shielded (shielded) extremely efficiently and reliably.

  Further, the magnetic material sheet 50 is disposed so as to be sandwiched between predetermined portions (predetermined portions between the dust-proof rubber 41f and the image sensor glass 41c). According to such a configuration, although the number of members increases by one point, it can be assembled by an extremely simple assembling procedure, so that the manufacturing cost is not extremely increased. In this case, for example, without using means such as adhesion, the magnetic sheet 50 can be securely fixed and held by being sandwiched between the two members (the dust-proof rubber 41f and the imaging element glass 41c) as described above.

  Furthermore, since the magnetic material sheet 50 is arranged on the front surface side of the image pickup device chip 41a at a position closest to the signal line such as the connection pattern 41aa, an area required for shielding electromagnetic waves from the front side. Therefore, it is possible to obtain an efficient electromagnetic wave shielding effect while suppressing the occupied space.

The magnetic sheet 50 provided to shield electromagnetic waves is formed of a thin sheet member. In this configuration, the magnetic material included in the sheet-like member is laminated in the traveling direction of the electromagnetic wave entering from the front (the direction along the optical axis). Therefore, the electromagnetic wave that has entered repeats attenuation and reflection, and a higher shielding effect can be obtained in a narrow space.
Furthermore, by applying a thin sheet-shaped magnetic sheet 50 as an electromagnetic wave shielding member for shielding electromagnetic waves, it is possible to contribute to downsizing of the apparatus.

  Incidentally, as described above, in the image pickup apparatus 1 according to the embodiment, electromagnetic waves generated from components in front of the apparatus, for example, the zoom lens drive motor 24a of the lens barrel 11 and the like pass through the photographing optical system and An image sensor chip including a signal line such as the connection pattern 41aa as a means for preventing the signal line such as the connection pattern 41aa of the image sensor chip 41a from entering the internal electric circuit. A magnetic sheet 50 is disposed so as to cover a predetermined area on the front side of 41a. The magnetic sheet 50 is configured to be reliably held and fixed between the dust-proof rubber 41f and the image sensor glass 41c as described above.

  In this state, as shown in FIG. 4 and the like, the dust-proof rubber 41f covers the front side of the magnetic sheet 50 disposed so as to cover the signal lines such as the connection pattern 41aa of the image sensor chip 41a. It will also be arranged.

  Therefore, the following configuration can be considered as a modification of the above-described embodiment. That is, instead of providing the magnetic sheet 50, a configuration in which the dust-proof rubber 41f is made of a magnetically shielded material to obtain substantially the same effect as the above-described one embodiment is also conceivable. That is, in this configuration, for example, a dust-proof rubber (41f) formed by using a rubber material mixed with an electromagnetic wave absorbing material such as permalloy or carbon, that is, a magnetic-proof member, or applied to the surface is applied. This dust-proof rubber is disposed so as to cover signal lines such as the connection pattern 41aa of the image sensor chip 41a, and is disposed at a position that does not hinder an area effective for forming an image on the light receiving surface of the image sensor chip 41a. It is natural to be done. Other configurations are the same as those of the above-described embodiment.

  Even with such a configuration, the same effect as that of the above-described embodiment can be obtained. Further, since only the material of the constituent member (dust-proof rubber) that should originally exist is changed, the number of members is not increased. Therefore, there is no change in the assembly procedure in the manufacturing process, and the manufacturing cost does not increase.

  Furthermore, in addition to the above configuration, the dustproof filter support rubber 43a may also be formed of the same material as that of the above-described modification, that is, a rubber material including a magnetic-proof member by kneading or coating. According to this configuration, the electromagnetic wave shielding (shielding) performance can be further improved.

  Incidentally, as described above, in the imaging apparatus 1, the imaging element holding frame 41 g that holds the assembly such as the imaging unit 41 is a plane parallel to a plane orthogonal to the optical axis O (by the action of the shake correction unit 42). It is configured to be movable within a plane parallel to the light receiving surface. In consideration of this, the flexible printed circuit board 41d or the like extended from the imaging unit 41 or the like is formed with a margin (deflection) according to the movement amount. Therefore, for example, when the imaging unit 41 moves in the plane for the shake correction operation, the flexible printed board 41d that moves together with the imaging unit 41 also moves. As described above, since the flexible printed circuit board 41d and the like have a predetermined margin (bending), a so-called rampage phenomenon occurs. Therefore, a space allowing the movement is required around the flexible printed circuit board 41d and the like.

  Therefore, in order to suppress the fluctuation phenomenon of the flexible printed circuit board 41d and the like, in the imaging apparatus 1 of the above-described embodiment, when the imaging unit 40 is assembled, the vicinity of the portion where the flexible printed circuit board 41d and the like are disposed. A plate 48 is disposed on the surface. The leather plate 48 is a component that serves to suppress the ramp of the flexible printed circuit board 41d and keep it within a predetermined area.

In the present embodiment, as shown in FIGS. 17, 18, etc., the plate 48 is fixed to a part of the VCM yoke 42e.
FIG. 17 is a plan view of an image pickup unit applied to the image pickup apparatus according to the embodiment of the present invention, and is a diagram showing the appearance when viewed from the light receiving surface of the image pickup element chip. 18 is a cross-sectional view taken along line [18]-[18] in FIG.

  FIG. 19 is a diagram illustrating a deformation pattern when viewed from the side surface of the flexible printed circuit board extended from the imaging unit of the imaging unit of FIG. 17. Among these, FIG. 19 (A) is a diagram showing the front portion of the bent portion of the flexible printed circuit board touching the leather plate. FIG. 19 (B) is a diagram showing that the substantially central portion of the bent portion of the flexible printed circuit board touches the leather plate. FIG. 19 (C) is a diagram showing the rear part of the bent portion of the flexible printed circuit board touching the leather plate.

  FIG. 20 is a front view showing the positional relationship between the flexible printed circuit board extending from the imaging unit of the imaging unit in FIG. 17 and the sound absorbing member (cushion member). Among these, FIG. 20A is a diagram showing a state where the imaging unit 41 of the shake correction unit is in a neutral position or a non-operating state. FIG. 20B is a diagram illustrating a state in which the shake correction unit has been operated and the imaging unit 41 has moved in the arrow L direction. FIG. 20C is a diagram illustrating a state in which the shake correction unit has been operated and the imaging unit 41 has moved in the arrow R direction.

  As described above, when the shake correction unit 42 operates, the imaging unit 41 that is a movable component unit moves in a plane parallel to the light receiving surface. For example, when the imaging unit 40 is viewed from the front, the flexible printed board 41d extends from the imaging unit 41 with a predetermined deflection. The flexible printed circuit board 41d is folded at a predetermined position, and then wraps around the surface of the component on the back side and extends downward.

  When the shake correction unit 42 operates and the imaging unit 41 starts a predetermined movement, the base end portion (on the imaging unit 41 side) of the flexible printed board 41d also moves accordingly. Since the flexible printed circuit board 41d is provided with bending as described above, the flexible printed circuit board 41d swings in various forms according to the movement of the imaging unit 41. For example, when viewed from the side of the imaging unit 40, a pattern movement as shown in FIG. 19 is observed. Further, when viewed from the front side of the imaging unit 40, the movement of the pattern shown in FIG. 20 is seen. At this time, the flexible printed circuit board 41d may move while being in contact with the pressing plate 48 which is a fixing member. As a result, the flexible printed circuit board 41d may be rubbed against the presser plate 48 to generate scratching noise or the like. If such a rubbing sound or the like occurs during moving image shooting, it is recorded as noise, which causes a problem.

  Therefore, in order to avoid that the flexible printed circuit board on the movable component unit that operates when the shake correction unit 42 is operated, the flexible printed circuit board is sufficiently movable to avoid contact with the fixed plate on the fixed member side. Means such as securing an area can be considered. However, in order to secure such a space, in addition to the problem that the device itself becomes large, it also causes a decrease in the output of the movable component unit due to neglecting the rampage phenomenon of the flexible printed circuit board. There is a problem of becoming.

  Therefore, imaging that can eliminate such problems, suppress the generation of scratching noise by the flexible printed circuit board on the movable component unit side, and at the same time suppress the enlargement of the component unit and prevent the output of the movable component unit from being reduced. For the purpose of realizing the apparatus, the imaging apparatus 1 of the present embodiment further includes a configuration as shown below.

  In other words, in the imaging apparatus 1 of the present embodiment, the contact surface on the fixed member side (the press plate 48) with which a part of the flexible printed circuit board 41d extending from the movable component unit (imaging unit 41) comes into contact has sound absorption. The cushion member 53 is stuck. The cushion member 53 is formed using a material having a sound absorbing effect that can reduce a desired audible sound range, for example, a material such as urethane foam, synthetic rubber, or non-woven fabric.

  Further, the length dimension of the cushion member 53 in the optical axis direction is set in consideration of the contact range and contact state (see FIG. 19) of the flexible printed circuit board 41d. That is, the example shown in FIG. 19 includes the part of reference A that contacts in the state shown in FIG. 19B from the part of reference A that contacts in the state shown in FIG. 19A. It is desirable to arrange in a region that covers up to the portion of reference C that contacts in the state shown.

  Further, the thickness dimension of the cushion member 53 itself is set so that the flexible printed circuit board 41d does not come into contact when the shake correction unit 42 operates normally, and at the same time, the margin (deflection) of the flexible printed circuit board 41d is violent. It is desirable to set it so that it can be touched lightly in a situation where the phenomenon occurs.

  The dimension of the cushion member 53 in the width direction (left-right direction when viewed from the front) is such that the edge portion of the flexible printed circuit board 41d is deformed even when the imaging unit 41 moves left and right and the flexible printed circuit board 41d is twisted and deformed. (See reference numerals D1, D2, E1, and E2 in FIG. 20). If the edge portion of the flexible printed circuit board 41d is rubbed in contact with the cushion member 53, there is a possibility that the cushion member 53 may be scraped. Therefore, in order to avoid this, it is desirable to set the cushion member 53 and the edge portion of the flexible printed circuit board 41d so as not to contact each other.

  Specifically, as shown in FIGS. 20B and 20C, when the imaging unit 41 is shaken in the left-right direction when viewed from the front and the flexible printed board 41d is twisted and deformed, the flexible printed board 41d is used. It is desirable that the surface other than the edge portion of the flexible printed circuit board 41d is lightly in contact with the surface of the cushion member 53, and at this time the edge portion of the flexible printed circuit board 41d is not in contact with the fixing member (the press plate 48).

  As shown in the above-described embodiment, in the case where the flexible printed circuit board of the imaging unit extends upward as viewed from the front, the larger the size in the width direction of the flexible printed circuit board itself, the more the imaging unit is When viewed from the side, the twist tends to increase when it swings in the left-right direction. Thus, as means for suppressing the amount of twisting during movement of the flexible printed board, there is means for forming a slit-like portion along the extending direction of the flexible printed board, for example. This slit-shaped part is means for forming the flexible printed circuit board in a partially divided form by forming it on a part of the flexible printed circuit board.

  As described above, when a predetermined slit-like portion is provided in a part of the flexible printed board to be partially divided, twisting occurs in each divided area, so that the amount of twisting is reduced. In the case of such a configuration, the cushion member 53 is disposed for each divided area. In the example shown in FIG. 20, the flexible printed circuit board 41d is partially divided into two parts by forming one slit portion 41dx in the flexible printed circuit board 41d.

  In the above-described configuration example, the cushion member 53, which is a sound-absorbing member, is configured to be fixed to the pressing plate 48 on the fixed member side, but the configuration is not limited thereto. For example, as shown in FIG. 21, a sound-absorbing member (cushion member 53 </ b> A) may be disposed on a flexible printed board 41 d extending from the imaging unit 41. The cushion member 53A having this configuration can be configured in exactly the same manner by setting the dimensions similar to those in the above configuration example. In this configuration, the flexible printed circuit board 41d and the cushion member 53A move integrally, so that the flexible printed circuit board 41d and the cushion member 53A do not slide. However, there is a possibility that the cushion member 53A that moves integrally with the movement of the flexible printed board 41d and the pressing plate 48 come into sliding contact. Therefore, when the imaging unit 41 moves and the cushion member 53A in the shape of the flexible printed circuit board 41d moves, the size of the cushion member 53A is set so as to avoid contact with the edge portion on the side plate 48 side. desirable.

  Further, as a means different from the above-described configuration example, that is, the configuration in which the cushion member 53 is disposed, there is a means for performing a smooth surface treatment or the like on the surface of the leather plate 48 instead of the cushion member 53 being disposed. Conceivable. In this case, the surface treatment of the surface plate 48 may be performed so that the surface of the flexible printed circuit board 41d has a smooth surface that does not generate noise even when the edge portion of the flexible printed circuit board 41d is in sliding contact with the surface plate 48. Also with this configuration, it is possible to obtain substantially the same effect as in the configuration example in which the above-described cushion members 53 and 53A are disposed.

  The imaging device 1 shown in the above-described embodiment is a so-called photographic lens interchangeable configuration in which the lens barrel 11 is configured to be detachable with respect to the camera body 10, but the configuration of the imaging device is as follows. For example, the present invention can be applied to an imaging apparatus in which a lens barrel is integrally fixed to a camera body.

  The present invention is not limited to the above-described embodiments, and it is needless to say that various modifications and applications can be implemented without departing from the spirit of the invention. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if several constituent requirements are deleted from all the constituent requirements shown in the above-described embodiment, if the problem to be solved by the invention can be solved and the effect of the invention can be obtained, this constituent requirement is deleted. The configured structure can be extracted as an invention.

1 …… Imaging device,
DESCRIPTION OF SYMBOLS 10 ... Camera body, 10a ... Opening, 10b ... Body side mount part, 10c ... Lens release button, 10d ... Mode switching dial, 10e ... Shutter release button,
11: Lens barrel, 11b: Lens side mount,
12, 13, 14, 15, 16, 17 ... lens group holding frame,
12a, 13a, 14a, 15a, 16a, 17a ... lens group,
18 …… Front fixed frame, 19 …… Fixed frame, 20 …… Rotating frame,
21... Focus operation ring, 22... Zoom operation ring, 23... Mode selection switch, 24... Zoom drive mechanism, 24 a.
40... Imaging unit, 41... Imaging unit, 41 a... Imaging element chip, 41 aa .. connection pattern, 41 ab ... light receiving surface, 41 ac... Effective image area, 41 b. , 41d: flexible printed circuit board, 41dx: slit part,
41e... Optical filter, 41f .. dustproof rubber, 41fa... Filter holding part 41fa. ... Opening part, 41gb ... Ball storage part, 41h ... Imaging element holding plate, 41k ... Electrical components, imaging element holding base ... 41m, connection terminal 41md
42 …… Vibration correction unit, 42a …… VCM coil, 42b …… VCM magnet, 42c …… Magnet, 42d, 42e …… VCM yoke, 42ea …… Flat ball receiving portion,
43 ... Dust-proof unit, 43a ... Dust-proof filter support rubber, 43b ... Dust-proof filter, 43c ... Dust-proof filter drive member, 43d ... Dust-proof filter holding member,
44 …… Display unit, 45 …… Finder unit, 46 …… Shutter unit, 46 …… Position detection magnet, 47 …… Support plate, 48 …… Osae plate, 49 …… Steel ball,
50, 50A, 50B ... Magnetic material sheet, 50Aa, 50Ba, 50Bb, 50Ca ... Sheet-like member,
51 ....
53, 53A …… Cushion member

Claims (5)

An imaging element chip having a light receiving surface on which a plurality of light receiving elements are arranged, and a plurality of connection terminals electrically connected to the light receiving element in a region outside the light receiving surface; An image sensor unit having a transparent plate-like glass disposed on the upper side;
Position that covers a plurality of connection terminals (connection patterns) provided on the image pickup device chip of the image pickup device unit as a projection area in the optical axis direction of the image pickup optical system as a whole with a thin frame shape. An electromagnetic wave shielding member disposed on the outer surface of the sheet glass forming the imaging element unit, and
An imaging apparatus comprising: The imaging element unit is electrically connected to and held by the imaging substrate,
The imaging apparatus according to claim 1, wherein the electromagnetic wave shielding member covers a connection terminal that electrically connects the imaging element unit and the imaging substrate in the optical axis direction of the imaging optical system.   2. The imaging apparatus according to claim 1, wherein the electromagnetic wave shielding member is sandwiched and disposed between an elastic holding member that holds an optical filter and the plate glass.   The imaging apparatus according to claim 3, wherein the holding member is formed with a holding portion that holds an optical filter.   The imaging apparatus according to claim 1, wherein the electromagnetic wave shielding member is formed by combining a plurality of L-shaped sheet members.