JP6443494B2 - Imaging unit and imaging apparatus - Google Patents

Description

  The present invention relates to an imaging unit and an imaging apparatus.

A camera module is known in which a solid-state imaging device is die-bonded to the bottom surface of a ceramic package, and the upper end surface of the ceramic package is bonded to a printed circuit board.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2007-019423

  There has been a problem that heat generated in the imaging chip cannot be efficiently radiated from the imaging chip to the outside.

  In the first aspect of the present invention, the imaging unit includes an imaging chip, a first surface on which the imaging chip is mounted, a second surface opposite to the first surface, an end of the first surface, and a second surface. An imaging unit having a mounting substrate including a third surface formed along an end of the surface; an attachment member having an opening and for mounting the imaging unit; and a third surface of the mounting substrate and the attachment member And a heat conductive member provided in contact with an inner wall forming the opening.

  In the second aspect of the present invention, an imaging apparatus includes the imaging unit described above.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a schematic cross section of the camera 10 which is an example of an imaging device. 2 is a cross-sectional view schematically showing an optical unit 50 together with an imaging unit 40. FIG. 2 is a perspective view schematically showing an optical unit 50 together with an imaging unit 40. FIG. 3 is a top view schematically showing a bracket 150 together with an imaging unit 40. FIG. 2 is a top view schematically showing a bracket 150 together with an imaging chip 100 and a mounting substrate 120. FIG. FIG. 10 is a cross-sectional view schematically showing an imaging unit 1000 as a modification of the imaging unit 40. FIG. 11 is a cross-sectional view schematically showing an imaging unit 800 as a modification of the imaging unit 40. FIG. 10 is a cross-sectional view schematically showing an imaging unit 900 as a modification of the imaging unit 40. FIG. 11 is a cross-sectional view schematically showing an imaging unit 1300 as a modification of the imaging unit 40. 2 is a cross-sectional view schematically showing a mounting substrate 120 together with an imaging chip 100, a frame 140, a bracket 150, and a heat conductive resin 180. FIG. The top view which shows typically the mounting board | substrate 120 with the imaging chip 100 is shown. It is sectional drawing which shows typically the imaging unit 2000 in another form. 4 is a top view schematically showing a chip mounting substrate 2110 together with the imaging chip 100 in the imaging unit 2000. FIG. Sectional drawing which shows typically the mounting board | substrate 1800 as a modification of the mounting board | substrate 2110 is shown. 5 is a plan sectional view schematically showing a wiring layer in a mounting substrate 1800. FIG.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a schematic cross-sectional view of a camera 10 that is an example of an imaging apparatus. The camera 10 includes a lens unit 20 and a camera body 30. The lens unit 20 is attached to the camera body 30. The lens unit 20 includes an optical system arranged along the optical axis 22 in the lens barrel, and guides an incident subject light flux to the imaging unit 40 of the camera body 30.

  The direction in which the subject luminous flux enters the imaging chip 100 included in the imaging unit 40 is defined as the z-axis direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction, and the lateral direction is defined as the y-axis direction. The direction in which the subject light flux travels toward the imaging chip 100 is defined as the z-axis plus direction. In FIG. 1, the direction toward the front of the paper is the x-axis plus direction, the direction toward the back of the paper is the x-axis minus direction, the direction below the paper is the y-axis plus direction, the direction above the paper is the y-axis minus direction, The direction toward the right is defined as the z-axis plus direction, and the direction toward the left in the drawing is defined as the z-axis minus direction.

  The camera body 30 includes a main mirror 32 and a sub mirror 33 behind a body mount 26 coupled to the lens mount 24. Unless otherwise specified, the rear represents the z-axis plus direction. The main mirror 32 is rotatably supported between an entry position where it enters the optical path of the subject light beam emitted from the lens unit 20 and a retreat position where it is retracted from the optical path of the subject light flux. The sub mirror 33 is rotatably supported with respect to the main mirror 32. The sub mirror 33 enters the entry position together with the main mirror 32 and retracts to the retract position together with the main mirror 32.

  When the main mirror 32 is in the approach position, a part of the subject light beam incident on the main mirror 32 is reflected by the main mirror 32 and guided to the focus plate 80. The focus plate 80 is disposed at a position conjugate with the imaging surface of the imaging chip 100 included in the imaging unit 40, and visualizes the subject image formed by the optical system of the lens unit 20. The subject image formed on the focus plate 80 is observed from the viewfinder 86 through the pentaprism 82 and the viewfinder optical system 84.

  When the main mirror 32 is at the entry position, light beams other than the subject light beam reflected by the main mirror 32 out of the subject light beam incident on the main mirror 32 enter the sub mirror 33. Specifically, the main mirror 32 has a half mirror area, and the subject light flux that has passed through the half mirror area of the main mirror 32 enters the sub mirror 33. The sub mirror 33 reflects the light beam incident from the half mirror region toward the imaging optical system 70. The imaging optical system 70 guides the incident light beam to the focus detection sensor 72. The focus detection sensor 72 outputs the detection result to the CPU 51.

  The focus plate 80, the pentaprism 82, the main mirror 32, and the sub mirror 33 are supported by a mirror box 60 as a support member. When the main mirror 32 and the sub mirror 33 are retracted to the retracted position and the front curtain and the rear curtain of the shutter unit 38 are in the open state, the subject luminous flux that passes through the lens unit 20 is an optical unit disposed behind the shutter unit 38. 50, and reaches the imaging surface of the imaging chip 100.

  A substrate 62 and a rear display unit 88 are sequentially arranged behind the imaging unit 40. As the rear display unit 88, a liquid crystal panel or the like can be applied. The display surface of the rear display unit 88 appears on the rear surface of the camera body 30. The rear display unit 88 displays an image generated from the output signal from the imaging chip 100.

  Electronic circuits such as a CPU 51 and an ASIC 52 are mounted on the substrate 62. The CPU 51 is responsible for overall control of the camera 10. An output signal from the imaging chip 100 is output to the ASIC 52 via a flexible printed circuit board or the like. The ASIC 52 processes the output signal output from the imaging chip 100.

  The ASIC 52 generates image data for display based on the output signal from the imaging chip 100. The rear display unit 88 displays an image based on the display image data generated by the ASIC 52. The ASIC 52 generates image data for recording based on the output signal from the imaging chip 100. The recording image data generated by the ASIC 52 is recorded on a recording medium attached to the camera body 30. The recording medium is configured to be detachable from the camera body 30.

  FIG. 2 is a cross-sectional view schematically showing the optical unit 50 together with the imaging unit 40. FIG. 3 is a perspective view schematically showing the optical unit 50 together with the imaging unit 40. FIG. 2 shows an AA cross section in FIG. The imaging unit 40 includes an imaging chip 100, a mounting board 120, an electronic component mounting board 130, a frame 140, and a cover glass 160.

  The imaging chip 100 is mounted on the mounting substrate 120 by COB (Chip On Board). Specifically, the imaging chip 100 is mounted on the mounting substrate 120 with an LGA (Land Grid Array), BGA (Ball Grid Array), an adhesive, or the like. The imaging chip 100 is electrically connected to the mounting substrate 120 by, for example, wire bonding or bumps. Thereby, the imaging chip 100 can output the generated pixel signal to the mounting substrate 120, and the mounting substrate 120 can output a drive signal for driving the imaging chip 100 to the imaging chip 100. The mounting substrate 120 includes a first surface 121 that is a mounting surface on which the imaging chip 100 is mounted, a second surface 122 that is a surface opposite to the first surface 121, an end of the first surface 121, and a second surface 122. Side surface 124 a formed along the edge of the first surface 121, side surface 124 b formed along the edge of the first surface 121 and the edge of the second surface 122, and the edge of the first surface 121 and the edge of the second surface 122. And a side surface 124 d formed along the end of the first surface 121 and the end of the second surface 122.

  The mounting substrate 120 is a multilayer substrate including a plurality of wiring layers and an insulating layer that insulates the wiring layers. The mounting substrate 120 may be a single-layer substrate including one wiring layer and an insulating layer that insulates the wiring layer. The mounting board 120 is mounted on the electronic component mounting board 130. The mounting substrate 120 has the second surface 122 mounted on the electronic component mounting substrate 130. The mounting substrate 120 and the electronic component mounting substrate 130 are mounted by LGA (Land Grid Array), BGA (Ball Grid Array), or the like.

  In the electronic component mounting board 130, an electronic component is mounted on a surface 132 opposite to the surface 131 on which the mounting substrate 120 is mounted. Examples of the electronic component include a capacitor, a resistor, and a resistor. The electronic components constitute a power supply circuit that supplies power to the imaging chip 100 and the like. The wiring pattern of the wiring layer on which the electronic component is mounted and the electronic component are electrically connected via solder or the like.

  A connector may be mounted on the surface 132 of the electronic component mounting board 130. For example, a flexible printed circuit board is connected to the connector. In this case, the pixel signal output from the imaging chip 100 is output to the connector via vias and the like provided in the mounting substrate 120 and the electronic component mounting substrate 130. The pixel signal output to the connector is output to the ASIC 52 as an example of a processing circuit via the flexible printed board.

  The frame 140 surrounds the imaging chip 100. The frame 140 is fixed to the first surface 121 of the mounting substrate 120 with an adhesive, for example. The frame 140 is fixed to the frame 140 at the periphery of the first surface 121 of the mounting substrate 120. The imaging chip 100 is surrounded by a frame 140 fixed to the mounting substrate 120. A metal such as aluminum, brass, iron, or nickel alloy can be used as the material of the frame 140. Resin can also be used as the material of the frame 140. As the material of the frame 140, a material in which a metal and a resin are insert-molded can be used.

  The frame 140 is fixed to the bracket 150. The bracket 150 is an example of an attachment member for attaching the imaging unit 40. The frame 140 is fastened to the bracket 150 by screws 142. The frame 140 is screwed by screws 142 at two points in the vicinity of the end away from the center of the imaging surface in the minus direction of the x axis.

  The cover glass 160 seals the imaging chip 100. As a material for the cover glass 160, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass, or the like can be used. The cover glass 160 is fixed to the frame 140 with an adhesive, for example. A sealed space is formed by the mounting substrate 120, the frame 140, and the cover glass 160. The imaging chip 100 is disposed in the sealed space. The heat generated in the imaging chip 100 can be radiated to the outside of the imaging unit 40 via the frame 140. By using a metal or a material in which a metal and a resin are insert-molded as the material of the frame 140, heat can be radiated more efficiently through the frame as compared with the case of using a resin as the material of the frame 140.

  The bracket 150 has a first surface 151, a second surface 152, a third surface 153, a fourth surface 154, and an opening 155. The first surface 151 is a surface orthogonal to the z-axis direction, for example, and is a surface facing the frame 140. The second surface 152 is a surface orthogonal to the z-axis direction, for example, and is a surface opposite to the first surface 151. The third surface 153 is, for example, a surface orthogonal to the z-axis direction, and is located between the first surface 151 and the second surface 152 in the z-axis direction. The fourth surface 154 is a surface formed between the first surface 151 and the third surface 153. Specifically, the fourth surface 154 is formed along the end of the first surface 151 and the end of the third surface 153. That is, the fourth surface 154 is formed along the outer edge of the first surface 151 and the outer edge of the third surface 153. The bracket 150 is fixed to the camera body 30.

  A heat conductive resin 180 is provided between the mounting substrate 120 and the frame 140. For example, the gap between the mounting substrate 120 and the frame 140 is filled with the heat conductive resin 180. The heat generated in the imaging chip 100 is transmitted to the bracket 150 via the mounting substrate 120 and the heat conductive resin 180. The heat transmitted to the bracket 150 can be dissipated through the structure.

  The thermally conductive resin 180 thermally connects the mounting substrate 120 and the bracket 150. The thermally conductive resin 180 functions as a heat transfer unit. The heat conductive resin 180 is, for example, a heat conductive adhesive. The heat conductive adhesive is, for example, a thermosetting heat conductive adhesive. Examples of the thermally conductive adhesive include resins such as an epoxy resin, an acrylic resin, a silicon resin, and a urethane resin. The thermally conductive resin 180 includes a thermally conductive filler.

  In the state in which the frame 140 and the bracket 150 are assembled, an opening 141a, an opening 141b, an opening 141c, and an opening 141d that communicate with a space in which the heat conductive resin 180 is provided are formed. The heat conductive resin 180 is injected from the opening 141a, the opening 141b, the opening 141c, and the opening 141d in a state where the frame 140 and the bracket 150 are assembled. When a thermosetting adhesive is used as the heat conductive adhesive, the thermosetting adhesive is injected by injecting the thermosetting adhesive from the opening 141a, the opening 141b, the opening 141c, and the opening 141d and then heated to the curing temperature. Is cured.

  The heat conductive resin 180 is preferably a resin having a curing temperature lower than the melting point of the solder used in the imaging unit 40. The heat conductive resin 180 is preferably a resin having a curing temperature lower than the heat resistant temperature of the imaging chip 100. The heat conductive resin 180 is preferably a resin having a curing temperature lower than the heat resistance temperature of the electronic component provided on the electronic component mounting substrate 130. The thermal conductive resin 180 has a curing temperature lower than the lowest temperature among the melting point of the solder used in the imaging unit 40, the heat resistance temperature of the imaging chip 100, and the heat resistance temperature of the electronic component provided on the electronic component mounting board 130. A resin is preferred. The heat conductive resin 180 is preferably a resin having a curing temperature of less than 230 degrees Celsius. The heat conductive resin 180 is more preferably a resin having a curing temperature of less than 120 degrees Celsius. The cured thermosetting adhesive is in contact with the mounting substrate 120, the frame 140, and the bracket 150. When using a photocurable adhesive as the heat conductive adhesive, after photoinjecting the photocurable adhesive from the opening 141a, the opening 141b, the opening 141c, and the opening 141d, the photocurable resin is irradiated with light such as ultraviolet rays. The adhesive is cured.

  Thus, the heat conductive resin 180 is provided in contact with the mounting substrate 120, the frame 140, and the bracket 150. The heat conductive resin 180 may be provided in contact with the mounting substrate 120 and the bracket 150, and may not be in contact with the frame 140.

  The thermal conductive resin 180 thermally connects the mounting substrate 120 and the bracket 150, so that the mounting substrate 120 is compared with the case where the thermal conductive resin 180 does not thermally connect the mounting substrate 120 and the bracket 150. And the thermal resistance between the bracket 150 can be reduced. The thermal conductive resin 180 thermally connects the mounting substrate 120 and the bracket 150, so that the mounting substrate 120 is compared with the case where the thermal conductive resin 180 does not thermally connect the mounting substrate 120 and the bracket 150. The amount of heat transfer per unit time between the bracket 150 and the bracket 150 can be increased. The thermal conductive resin 180 thermally connects the mounting substrate 120 and the bracket 150, so that the mounting substrate 120 is compared with the case where the thermal conductive resin 180 does not thermally connect the mounting substrate 120 and the bracket 150. The amount of heat transfer per unit temperature difference between the bracket 150 and the bracket 150 can be increased, that is, the heat flux per unit temperature difference between the mounting substrate 120 and the bracket 150 can be increased.

  The optical unit 50 includes a mask rubber 272, an optical element 274, and a pressing member 280. The optical element 274 includes an optical low-pass filter 276 and an infrared cut filter 278. The optical low-pass filter 276 and the infrared cut filter 278 are arranged in the order of the optical low-pass filter 276 and the infrared cut filter 278 in the positive z-axis direction. In addition, you may include in the cover glass 160 the function of some optical layers among the some optical layers which comprise the optical low-pass filter 276. FIG. In this case, the optical low-pass filter 276 can be configured by excluding the functions of some optical layers included in the cover glass 160, that is, only the remaining optical layers among the plurality of optical layers.

  The holding member 280 is screwed to the bracket 150 with a screw 282. The pressing member 280 is fixed in a state where the optical element 274 is pressed against the imaging unit 40 via the mask rubber 272. The optical element 274 is pressed against the imaging unit 40 by a z-axis plus direction force applied from the pressing member 280 when the pressing member 280 is screwed to the bracket 150.

  The pressing member 280 has a pair of flat portions 288. The holding member 280 is screwed to the bracket 150 with a screw 282 at the flat portion 288. Thereby, the optical unit 50 is assembled to the imaging unit 40.

  FIG. 4 is a top view schematically showing the bracket 150 together with the imaging unit 40. FIG. 5 is a top view schematically showing the bracket 150 together with the imaging chip 100 and the mounting substrate 120.

  The imaging chip 100 includes a pixel area 101 and a circuit area 102. The pixel region 101 is formed in the central part of the imaging chip 100, for example. The pixel region 101 includes a plurality of photoelectric conversion elements that photoelectrically convert the received subject image, and forms an imaging surface. The circuit region 102 includes a processing circuit that performs signal processing of pixel signals obtained by photoelectric conversion. The processing circuit includes an AD conversion circuit that converts a pixel signal that is an analog signal into a digital signal. The processing circuit includes a circuit that removes noise of the pixel signal, such as a CDS circuit. The processing circuit includes an amplifier circuit that amplifies the pixel signal. The circuit region 102 is formed around the pixel region 101 of the imaging chip 100. The circuit region 102 is formed in the vicinity of one long side 110 among the four sides forming the pixel region 101 in the imaging chip 100.

  The bracket 150 has an opening 155 for accommodating the electronic component mounting board 130. The bracket 150 has a step portion 158 formed by the first surface 151, the fourth surface 154, and the third surface 153.

  The thermally conductive resin 180 is provided in contact with the step portion 158. The thermally conductive resin 180 is provided in contact with the fourth surface 154 and the third surface 153 that form the step portion 158. The heat conductive resin 180 includes a heat conductive resin 180a, a heat conductive resin 180b, a heat conductive resin 180c, and a heat conductive resin 180d. The thermally conductive resin 180a is provided in contact with the side surface 124a of the mounting substrate 120 and the step portion 158a facing the side surface 124a. The thermally conductive resin 180b is provided in contact with the side surface 124b of the mounting substrate 120 and the step portion 158b facing the side surface 124b. The thermally conductive resin 180c is provided in contact with the side surface 124c of the mounting substrate 120 and the step portion 158c facing the side surface 124c. The thermally conductive resin 180d is provided in contact with the side surface 124d of the mounting substrate 120 and the step portion 158d facing the side surface 124d.

  Note that the heat conductive resin 180 may be provided in contact with the side surface near the circuit region 102 among the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124d without contacting the side surface 124a, the side surface 124b, and the side surface 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a of the mounting substrate 120 without contacting the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b of the mounting substrate 120 without contacting the side surface 124a, the side surface 124c, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124d and the side surface 124a of the mounting substrate 120 without contacting the side surface 124b and the side surface 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124d and the side surface 124b of the mounting substrate 120 without contacting the side surface 124a and the side surface 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124 a and the side surface 124 b of the mounting substrate 120 without contacting the side surface 124 c and the side surface 124 d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124b, and the side surface 124d of the mounting substrate 120 without contacting the side surface 124c of the mounting substrate 120.

  The circuit region 102 has been described by taking an example in which the circuit region 102 is formed in the vicinity of one long side of the four sides forming the pixel region 101 in the imaging chip 100. However, the circuit region 102 has four sides forming the pixel region 101 in the imaging chip 100. It may be formed near one short side. When the circuit region 102 is formed in the vicinity of one short side of the four sides forming the pixel region 101 in the imaging chip 100, the thermal conductive resin 180 is formed from the side surface 124a, the side surface 124b, the side surface 124c, and the mounting substrate 120. What is necessary is just to contact and provide the side surface near the circuit area | region 102 among the side surfaces 124d.

  In the case where the circuit region 102 is formed in the vicinity of two long sides of the four sides forming the pixel region 101 in the imaging chip 100, the thermal conductive resin 180 is composed of the side surface 124 a, the side surface 124 b, the side surface 124 c, and the mounting substrate 120. What is necessary is just to contact and provide the side surface near the circuit area | region 102 among the side surfaces 124d. The heat conductive resin 180 may be provided in contact with the side surface 124a of the mounting substrate 120 without contacting the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b of the mounting substrate 120 without contacting the side surface 124a, the side surface 124c, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124 a and the side surface 124 b of the mounting substrate 120 without contacting the side surface 124 c and the side surface 124 d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a and the side surface 124c of the mounting substrate 120 without contacting the side surface 124b and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a and the side surface 124d of the mounting substrate 120 without contacting the side surface 124b and the side surface 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b and the side surface 124c of the mounting substrate 120 without contacting the side surface 124a and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b and the side surface 124d of the mounting substrate 120 without contacting the side surface 124a and the side surface 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124c and the side surface 124d of the mounting substrate 120 without contacting the side surface 124a and the side surface 124b of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124b, and the side surface 124c of the mounting substrate 120 without contacting the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120 without contacting the side surface 124a of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124c, and the side surface 124d of the mounting substrate 120 without contacting the side surface 124b of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120.

  The circuit region 102 has been described by taking an example in which the circuit region 102 is formed in the vicinity of two long sides of the four sides forming the pixel region 101 in the imaging chip 100. However, the circuit region 102 has four sides forming the pixel region 101 in the imaging chip 100. Of these, it may be formed near two short sides. When the circuit region 102 is formed in the vicinity of two short sides of the four sides that form the pixel region 101 in the imaging chip 100, the thermal conductive resin 180 is formed from the side surface 124 a, the side surface 124 b, the side surface 124 c, and the mounting substrate 120. What is necessary is just to contact and provide the side surface near the circuit area | region 102 among the side surfaces 124d.

  In the case where the circuit region 102 is formed in the vicinity of each of the four sides forming the pixel region 101 in the imaging chip 100, the thermal conductive resin 180 is formed of the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120. It may be provided in contact with the side surface close to the circuit region 102. The heat conductive resin 180 may be provided in contact with the side surface 124a of the mounting substrate 120 without contacting the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b of the mounting substrate 120 without contacting the side surface 124a, the side surface c, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124c of the mounting substrate 120 without contacting the side surface 124a, the side surface 124b, and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124d of the mounting substrate 120 without contacting the side surface 124a, the side surface b, and the side surface 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124 a and the side surface 124 b of the mounting substrate 120 without contacting the side surface 124 c and the side surface 124 d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a and the side surface 124c of the mounting substrate 120 without contacting the side surface 124b and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a and the side surface 124d of the mounting substrate 120 without contacting the side surface 124b and the side surface 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b and the side surface 124c of the mounting substrate 120 without contacting the side surface 124a and the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b and the side surface 124d of the mounting substrate 120 without contacting the side surface 124a and the side surface 124c of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124c and the side surface 124d of the mounting substrate 120 without contacting the side surface 124a and the side surface 124b of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124b, and the side surface 124c of the mounting substrate 120 without contacting the side surface 124d of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120 without contacting the side surface 124a of the mounting substrate 120. The thermally conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124c, and the side surface 124d of the mounting substrate 120 without contacting the side surface 124b of the mounting substrate 120. The heat conductive resin 180 may be provided in contact with the side surface 124a, the side surface 124b, the side surface 124c, and the side surface 124d of the mounting substrate 120.

  In the imaging unit 40, the heat conductive resin 180 is not in contact with the surface 132 of the electronic component mounting board 130, but the heat conductive resin 180 may be in contact with the surface 132 of the electronic component mounting board 130. . The heat conductive resin 180 may cover a part of the surface 132 of the electronic component mounting substrate 130. Therefore, the heat generated in the electronic circuit included in the electronic component mounting board 130 can be transmitted to the bracket 150 with higher efficiency. In particular, in the heat conductive resin 180, at least a part of a region where the heat conductive resin 180 covers the surface 132 of the electronic component mounting substrate 130 overlaps with at least a part of the imaging chip 100 in the xy plane. May be provided. In particular, at least a part of the region in which the heat conductive resin 180 covers the surface 132 of the electronic component mounting substrate 130 may overlap with the peripheral region of the imaging chip 100 in the xy plane. In this case, the heat generated at the periphery of the imaging chip 100 may be efficiently transmitted to the bracket 150. Therefore, the heat flux toward the pixel region 101 of the imaging chip 100 may be able to be reduced.

  FIG. 6 is a cross-sectional view schematically showing an imaging unit 1000 as a modification of the imaging unit 40. In the imaging unit 1000, members having the same configuration as each part of the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  In the imaging unit 1000, the heat conductive resin 180 is in contact with the mounting substrate 120 and is not in contact with the electronic component mounting substrate 130. The position of the third surface 153 of the bracket 150 in the imaging unit 1000 in the z-axis direction is on the minus side of the z-axis from the position of the third surface 153 of the bracket 150 in the imaging unit 40 in the z-axis direction.

  In the imaging unit 1000, the electronic component mounting substrate 130 is connected to the outside of the imaging unit 40 via a heat conductive member such as a graphite sheet or a sheet metal shield material. For example, the electronic component mounting board 130 is connected to the structural material of the imaging unit 40 via a heat conductive member. Heat generated by the electronic component mounted on the electronic component mounting board 130 is released to the outside of the imaging unit 40 via the heat conductive member.

  FIG. 7 is a cross-sectional view schematically showing an imaging unit 800 as a modified example of the imaging unit 40. In the imaging unit 800, members having the same configurations as the respective parts of the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  The bracket 150 is formed with a penetrating portion 810 penetrating from the second surface 152 to the third surface 153. The through portion 810 communicates the outside of the imaging unit 800 and the space where the heat conductive resin 180 is provided. A thermally conductive adhesive is injected from the outside of the imaging unit 800 through the through portion 810 to cure the thermally conductive adhesive.

  The through portion 810 may be a hole that reaches from the second surface 152 to the third surface 153. The cross-sectional shape of the penetrating portion 810 on the second surface 152 and the third surface 153 is not limited to a circular shape and can be an arbitrary shape. Instead of the through portion 810, a groove may be formed in the bracket 150 along the side portion of the mounting substrate 120 from the second surface 152 to the third surface 153. In this case, a thermally conductive adhesive is injected from the outside of the imaging unit 800 through a groove to cure the thermally conductive adhesive.

  FIG. 8 is a cross-sectional view schematically showing an imaging unit 900 as a modification of the imaging unit 40. In the imaging unit 900, members having the same configurations as the respective parts of the imaging unit 40 may be denoted by the same reference numerals, and description thereof may be omitted.

  In the imaging unit 900, a through portion 910 that penetrates from the first surface 941 to the second surface 942 is formed in the frame 140. The through portion 910 communicates the outside of the imaging unit 900 with the space where the heat conductive resin 180 is provided. A thermally conductive adhesive is injected from the outside of the imaging unit 900 from the through portion 910 to cure the thermally conductive adhesive.

  The through portion 910 may be a hole that reaches from the first surface 941 to the second surface 942. The cross-sectional shape of the penetrating portion 910 on the first surface 941 and the second surface 942 is not limited to a circular shape and can be an arbitrary shape. Note that in the imaging unit 900, the frame 140 may have the penetration part 910, and the bracket 150 may have a penetration part similar to the penetration part 810 of the imaging unit 800.

  FIG. 9 is a cross-sectional view schematically showing an imaging unit 1300 as a modification of the imaging unit 40. In the imaging unit 1300, members having the same configurations as those of the respective units of the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  In the imaging unit 1300, the imaging chip 100 is mounted on one mounting substrate 1320. For example, the mounting substrate 1320 is a core substrate on which the imaging chip 100 is mounted. Specifically, the mounting substrate 1320 includes a plurality of wiring layers, an insulating layer that insulates the wiring layers from each other, and a core layer.

  The thickness of the mounting substrate 1320 is, for example, 0.8 mm to 3.0 mm as a whole. As an example, the core layer is sandwiched between the wiring layer and the wiring layer. The core layer may be sandwiched between the insulating layer and the insulating layer. Examples of the mounting substrate 1320 include a metal core substrate using a metal such as an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, or aluminum as a core layer, or a resin core substrate using a resin such as an epoxy resin as a core layer. be able to. Note that the mounting substrate 1320 may not include the core layer. Examples of the mounting substrate 1320 include a substrate made of ceramic or the like.

  The mounting substrate 1320 has a first surface 1321 and a second surface 1322 that is the surface opposite to the first surface 1321. Similar to the electronic component mounting substrate 130, electronic components, connectors, and the like are mounted on the second surface 1322 of the mounting substrate 1320. As described above, the mounting board 1320 has the functions of the mounting board 120 and the electronic component mounting board 130 in the imaging unit 40, the imaging unit 1000, the imaging unit 800, and the imaging unit 900. The thermally conductive resin 180 is in contact with the side portion of the mounting substrate 1320, the bracket 150, and the frame 140. Since these points are the same as those of the mounting board 120 in the imaging unit 40, description thereof will be omitted.

  Note that the mounting substrate 1320 may be a substrate other than the multilayer substrate having the metal core and the resin core described above. The mounting substrate 1320 may be a single layer substrate including one wiring layer and an insulating layer that insulates the wiring layer. The mounting substrate 1320 may be a multilayer substrate without a core.

  In the description of the imaging unit 40, the imaging unit 1000, the imaging unit 800, and the imaging unit 900, the heat conductive resin 180 is formed of a heat conductive adhesive. The heat conductive resin 180 may be formed of a material other than the heat conductive adhesive. The heat conductive resin 180 may be formed of heat conductive rubber instead of the adhesive. By forming the heat conductive resin 180 with heat conductive rubber, a process for forming a heat transfer portion between the mounting substrate 120 and the bracket 150 can be simplified. For example, a thermosetting step required when using a thermosetting heat conductive adhesive can be omitted.

  FIG. 10 is a cross-sectional view schematically showing the imaging chip 100, the mounting substrate 120, the frame 140, the bracket 150, and the heat conductive resin 180 in the imaging unit 40. FIG. 11 is a top view schematically showing the mounting substrate 120 together with the imaging chip 100.

  The mounting substrate 120 includes a solder resist layer 610, a wiring layer 620 including a wiring layer 620a and a wiring layer 620b, and an insulating layer 630 including an insulating layer 630a and an insulating layer 630b. When the imaging unit 40 is assembled to the camera 10, the solder resist layer 610, the wiring layer 620a, the insulating layer 630a, the wiring layer 620b, and the insulating layer 630b are arranged in this order in the z-axis plus direction. The imaging chip 100 is mounted on the solder resist layer 610. The wiring layer 620 is, for example, a copper foil. The wiring layer 620a is a layer closest to the imaging chip 100 in the wiring layer 620. The insulating layer 630 is a layer that insulates the wiring layer 620.

  The mounting substrate 120 has a region where the wiring layer 620 a is exposed on the outer periphery of the first surface 121. That is, the mounting substrate 120 has a region where the solder resist layer 610 is not formed on the outer peripheral portion of the first surface 121. The frame 140 is provided in a region where the wiring layer 620a is exposed, that is, a region where the solder resist layer 610 is not formed. For this reason, compared with the case where the flame | frame 140 is provided in the soldering resist layer 610, the amount of heat discharge | released to the bracket 150 via the flame | frame 140 can be raised. The wiring layer 620a is preferably formed thicker than the wiring layer 620b. The wiring layer 620a is preferably formed to be thicker than any other wiring layer 620 included in the mounting substrate 120. Thereby, the heat generated in the imaging chip 100 can be efficiently transmitted to the frame 140. Therefore, the heat generated in the imaging chip 100 can be efficiently released to the outside.

  The wiring layer 620a and the wiring layer 620b extend to the side surface 124a and the side surface 124b of the mounting substrate 120. The wiring layer 620a and the wiring layer 620b are exposed at the 124a and the side surface 124b of the mounting substrate 120. The thermally conductive resin 180 is in contact with the wiring layer 620a and the wiring layer 620b on the 124a and the side surface 124b of the mounting substrate 120. Therefore, the heat generated in the imaging chip 100 can be efficiently transmitted to the heat conductive resin 180. Therefore, the heat generated in the imaging chip 100 can be efficiently released to the outside.

  The mounting substrate 120 has a plurality of vias 650. The via 650 functions as a thermal via. The imaging chip 100 is thermally connected to the wiring layer 620a through the via 650. Thereby, the heat generated in the imaging chip 100 can be efficiently transmitted to the frame 140. Therefore, the heat generated in the imaging chip 100 can be efficiently released to the outside. The imaging chip 100 is thermally connected to the wiring layer 620a and the wiring layer 620b through the via 650. Thereby, the heat generated in the imaging chip 100 can be efficiently transmitted to the heat conductive resin 180. Therefore, the heat generated in the imaging chip 100 can be efficiently released to the outside.

  The via 650 is provided at a position corresponding to the circuit region 102 of the imaging chip 100 on the mounting substrate 120. The density of the vias 650 provided at positions corresponding to the circuit region 102 is preferably higher than the density of the vias 650 provided at locations other than the positions corresponding to the circuit region 102 in the mounting substrate 120. Therefore, heat generated in the processing circuit in the circuit region 102 and traveling toward the pixel region 101 can be reduced.

  The side surface 124 a, the side surface 124 b, the side surface 124 c, and the side surface 124 d of the mounting substrate 120 in contact with the heat conductive resin 180 may be shaped to increase the contact area with the heat conductive resin 180, such as a curved surface or an uneven surface. . For example, the outer edge of the wiring layer 620 that contacts the heat conductive resin 180 may be provided so as to protrude from the outer edge of the insulating layer 630.

  10 and 11, the configuration of the imaging chip 100, the mounting substrate 120, the frame 140, the bracket 150, and the thermal conductive resin 180 in the imaging unit 40 has been described. The same configuration can be applied to the imaging unit 1000, the imaging unit 800, and the imaging unit 900. A similar configuration can also be applied to the imaging unit 1300. For example, the multilayer structure described in relation to the mounting substrate 120 can be applied to the multilayer structure of the single mounting substrate 1320 included in the imaging unit 1300.

  FIG. 12 is a cross-sectional view schematically showing an imaging unit 2000 in another form. The imaging unit 2000 includes the imaging chip 100, a mounting substrate 2110, a frame 140, and a cover glass 160. FIG. 13 is a top view schematically showing the mounting substrate 2110 together with the imaging chip 100 in the imaging unit 2000. In the imaging unit 2000, members having the same configuration as each part of the imaging unit 40 may be denoted by the same reference numerals and description thereof may be omitted.

  The mounting substrate 2110 mounts the imaging chip 100. The frame 140 surrounds the imaging chip 100. The cover glass 160 seals the imaging chip 100. Cover glass 160 is fixed to frame 140. A sealed space is formed by the mounting substrate 2110, the frame 140, and the cover glass 160. The imaging chip 100 is disposed in the sealed space.

  As the mounting substrate 2110, a configuration similar to that of the mounting substrate 120 and the electronic component mounting substrate 130 or a configuration similar to that of the mounting substrate 1320 can be applied. Similar to the mounting substrate 120 described with reference to FIG. 10 and the mounting substrate 1320 described with reference to FIG. 9 and the like, the mounting substrate 2110 includes a solder resist layer 2610 on which the imaging chip 100 is mounted and a solder resist layer 2610. Wiring layer 2620 formed at least.

  When the imaging unit 40 is assembled to the camera 10, the solder resist layer 2610 and the wiring layer 2620 are arranged in this order in the z-axis plus direction. The mounting substrate 2110 has a region where the wiring layer 2620 is exposed on the outer periphery of the mounting surface on which the imaging chip 100 is mounted. That is, the mounting substrate 2110 has a region where the solder resist layer 2610 is not formed on the outer peripheral portion of the mounting surface. The frame 140 is provided in a region where the solder resist layer 2610 is not formed.

  Thereby, compared with the case where the frame 140 is provided in the solder resist layer 2610, the thermal resistance between the imaging chip 100 and the frame 140 can be reduced. Therefore, the heat flux from the imaging chip 100 to the frame 140 can be increased.

  FIG. 14 is a cross-sectional view schematically showing a mounting board 1800 as a modified example of the mounting board 2110. FIG. 15 is a plan sectional view schematically showing a wiring layer in the mounting substrate 1800. The mounting substrate 1800 is different from the mounting substrate 2110 in that the wiring layer 2620 is substantially separated into an inner wiring layer 2621 and an outer wiring layer 2622.

  The inner wiring layer 2621 is provided corresponding to the pixel region 101. Specifically, the inner wiring layer 2621 is provided at a position corresponding to the pixel region 101 in the xy plane. The outer wiring layer 2622 is located outside the inner wiring layer 2621. The outer wiring layer 2622 is located around the inner wiring layer 2621. The outer wiring layer 2622 is provided corresponding to a region other than the pixel region 101.

  The outer wiring layer 2622 and the inner wiring layer 2621 are thermally separated. The outer wiring layer 2622 is separated from the inner wiring layer 2621 by a gap 1820. The gap 1820 has an annular shape. Since the outer wiring layer 2622 and the inner wiring layer 2621 are thermally separated, heat generated in the circuit region 102 and transmitted to the outer wiring layer 2622 is difficult to be transmitted to the inner wiring layer 2621. The heat transferred to the outer wiring layer 2622 can be released to the outside through the frame 140.

  The mounting substrate 1800 may have a via similar to the via 650 in the mounting substrate 120. For example, vias that function as thermal vias may be provided corresponding to the circuit region 102 of the imaging chip 100 to thermally connect the circuit region 102 and the outer wiring layer 2622. Accordingly, heat generated in the circuit region 102 can be easily transferred to the outer wiring layer 2622, and heat flux toward the pixel region 101 can be reduced.

  As a modified example of the mounting substrate 1800, a configuration in which the outer wiring layer 2622 is provided and the inner wiring layer 2621 is not provided can be employed. Also with this configuration, the heat flux toward the pixel region 101 can be reduced.

  Note that although the mounting substrate 1800 has been described as a modification of the mounting substrate 2110, the same configuration as the mounting substrate 1800 can be applied to the mounting substrate 120 and the mounting substrate 1320. For example, the same structure as that of the inner wiring layer 2621 and the outer wiring layer 2622 can be applied to the wiring layer 620 and the like in the mounting substrate 120. A structure similar to that of the inner wiring layer 2621 and the outer wiring layer 2622 can be applied to the mounting substrate 1320.

  The embodiment described above can be modified as follows. The imaging chip 100 is disposed in a sealed space formed by a mounting substrate such as the mounting substrate 120, the mounting substrate 1320, and the mounting substrate 2110, the frame 140, and the cover glass 160. You may arrange | position in the sealed space formed with the shape | molded mounting substrate and cover glass.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and stage in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the specification, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 10 Camera 20 Lens unit 22 Optical axis 24 Lens mount 26 Body mount 30 Camera body 32 Main mirror 33 Sub mirror 38 Shutter unit 40 Imaging unit 50 Optical unit 51 CPU
52 ASIC
60 Mirror box 62 Substrate 70 Imaging optical system 72 Focus detection sensor 80 Focus plate 82 Penta prism 84 Finder optical system 86 Finder 88 Rear display unit 100 Imaging chip 101 Pixel region 102 Circuit region 110 Long side 120 Mounting substrate 121 First surface 122 Second surface 124 Side surface 130 Electronic component mounting board 131 Surface 132 Surface 140 Frame 142 Screw 150 Bracket 151 First surface 152 Second surface 153 Third surface 154 Fourth surface 155 Opening 158 Step portion 160 Cover glass 180 Thermal conductive resin 272 Mask rubber 274 Optical element 132 Surface 141 Opening 180 Thermal conductive resin 276 Optical low-pass filter 278 Infrared cut filter 280 Member 282 Screw 288 Flat portion 610 Solder resist layer 620 Wiring layer 630 Insulating layer 650 Via 800 Imaging unit Knit 810 Penetration unit 900 Imaging unit 910 Penetration unit 941 First surface 942 Second surface 1000 Imaging unit 1300 Imaging unit 1320 Mounting substrate 1321 First surface 1322 Second surface 1800 Mounting substrate 1820 Gap 2000 Imaging unit 2110 Mounting substrate 2610 Solder resist layer 2620 Wiring layer 2621 Inner wiring layer 2622 Outer wiring layer

Claims (19)

An imaging chip for imaging a subject;
A first surface on which the imaging chip is disposed; a second surface opposite to the first surface; a third surface formed along an end of the first surface and an end of the second surface; A substrate having,
A first member disposed outside the imaging chip on the first surface and having a first region facing the first surface and a second region different from the first region;
A second member having thermal conductivity disposed to contact the third surface of the substrate and the second region of the first member;
A third member attached to the first member and in contact with the second member;
An imaging apparatus comprising: The imaging device according to claim 1 , wherein the second member is made of resin. The third member has a third region facing the third surface,
It said second member, the imaging apparatus according to claim 1 or 2 is placed in contact with the third region. The third member, the imaging apparatus according to any one of claims 1 to 3, wherein the first member in said second region is mounted. The substrate may imaging apparatus according to any one of claims 1 to 4, electronic components for driving the imaging chip is disposed. The imaging apparatus according to claim 5 , wherein the electronic component is disposed on the second surface of the substrate. The electronic components, an imaging apparatus according to claim 5 or claim 6 including an active element. The imaging chip includes a pixel unit in which a plurality of pixels that generate a signal by photoelectrically converted charges are arranged, and a processing circuit unit that is arranged outside the pixel unit and has a processing circuit that processes the signal. The imaging device according to any one of claims 1 to 7 . The imaging apparatus according to claim 8 , wherein the substrate has a wiring for outputting the signal. An imaging chip for imaging a subject;
A first surface on which the imaging chip is disposed; a second surface opposite to the first surface; a third surface formed along an end of the first surface and an end of the second surface; A substrate having,
A first member disposed outside the imaging chip on the first surface and having a first region facing the first surface and a second region different from the first region;
A second member having thermal conductivity arranged to contact the third surface of the substrate;
Wherein the first member is attached, and a third member to be contacted with said second member,
An imaging apparatus comprising: The imaging device according to claim 10 , wherein the second member is in contact with the second region. The imaging according to claim 10 or 11 , wherein the third member has a third region facing the third surface, and the second member is disposed so as to contact the third region. apparatus. The third member, the imaging apparatus according to any one of claims 12 to claim 10, wherein the first member is attached in the second region. The substrate may imaging device according to any one of claims 13 claim 10, electronic components for driving the imaging chip is disposed. The imaging device according to claim 14 , wherein the electronic component is disposed on the second surface of the substrate. The electronic components, an imaging apparatus according to claim 14 or claim 15 including active elements. The imaging chip includes a pixel unit in which a plurality of pixels that generate a signal by photoelectrically converted charges are arranged, and a processing circuit unit that is arranged outside the pixel unit and has a processing circuit that processes the signal. The imaging device according to any one of claims 10 to 16 . The imaging device according to claim 17 , wherein the substrate has a wiring for outputting the signal. Said second member, the imaging apparatus according to any one of claims 18 claim 10 which is made of a resin.

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