JP6777118B2 - Imaging unit and imaging device - Google Patents

Description

The present invention relates to an imaging unit and an imaging device.

An imaging unit having a package structure in which an imaging chip is mounted in a ceramic package is known.
[Prior art literature]
[Patent Document]
[Patent Document 1] Japanese Unexamined Patent Publication No. 2007-019423

In the manufacturing process of an imaging unit provided with an imaging chip and a mounting substrate provided with an imaging chip surrounding member, the surrounding member may be warped. If the surrounding member is warped, the mounting substrate may also be warped.

In the first aspect, the image pickup unit includes a mounting substrate, an imaging chip mounted on the mounting surface of the mounting substrate, a first surrounding portion provided on the mounting substrate and surrounding the imaging chip, and a first ring. It is provided in the surrounding portion and includes a second surrounding portion that surrounds the imaging chip, and the first surrounding portion extends in a direction along the mounting surface to the second surface opposite to the first surface in contact with the mounting substrate. A protrusion is formed, and the second ring is provided on the first ring at least in contact with the upper surface of the protrusion.

In the second aspect, the imaging unit is provided on the mounting substrate, the imaging chip mounted on the mounting substrate, the first surrounding portion provided on the mounting substrate and surrounding the imaging chip, and the first surrounding portion. It is provided and includes a second surrounding portion that surrounds the imaging chip, and the width of the first surrounding portion from the inner edge portion that surrounds the imaging chip to the outer edge portion that is outside the inner edge portion is the first width. It has a first portion and a second portion in which the width from the inner edge portion to the outer edge portion is a second width larger than the first width, and the second surrounding portion is the first portion and the second portion. The length of the second ring portion in contact with the first portion in the direction from the inner edge portion to the outer edge portion is provided on the second surface opposite to the first surface in contact with the mounting substrate. Is smaller than the length at which the second enclosure is in contact with the second portion.

In the third aspect, the imaging device includes the imaging unit.

The outline of the above invention does not list all the necessary features of the present invention. Sub-combinations of these feature groups can also be inventions.

It is a schematic cross-sectional view of the camera 10 which is an example of an image pickup apparatus. It is a top view which shows typically the image pickup unit 40 which has the frame 140 which concerns on 1st Example. It is a figure which shows the frame 140 schematically. It is sectional drawing which shows typically the AA cross section of FIG. It is sectional drawing which shows the C part of FIG. 4 enlarged. It is sectional drawing which shows typically the BB cross section of FIG. It is a rear view which shows typically the frame 740 which concerns on 2nd Example. It is sectional drawing which shows typically the image pickup unit 890 including the frame 840 which concerns on 3rd Example. It is sectional drawing which shows typically the image pickup unit 990 including the frame 940 which concerns on 4th Embodiment.

Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the inventions claimed in the claims. Also, not all combinations of features described in the embodiments are essential to the means of solving the invention.

FIG. 1 is a schematic cross-sectional view of a camera 10 which is an example of an imaging device. The camera 10 includes a lens unit 20 and a camera body 30. A lens unit 20 is attached to the camera body 30. The lens unit 20 includes an optical system arranged along the optical axis 22 in the lens barrel, and guides the incident subject luminous flux to the image pickup unit 40 of the camera body 30.

In the present embodiment, the direction along the optical axis 22 is defined as the z-axis direction. That is, the direction in which the subject luminous flux is incident on the image pickup chip 100 included in the image pickup unit 40 is defined as the z-axis direction. Specifically, the direction in which the subject luminous flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction. The lateral direction of the imaging chip 100 is defined as the y-axis direction. Specifically, the x-axis direction and the y-axis direction are defined in the directions shown in FIG. The x-axis, y-axis, and z-axis are right-handed Cartesian coordinate systems. For convenience of explanation, the z-axis plus direction may be referred to as front, front, upward, or the like. Further, the z-axis minus direction may be referred to as rear, rear, downward, or the like. Further, a view when viewed in the z-axis minus direction from a position in the z-axis plus direction may be referred to as a top view or the like. Further, a view when viewed in the z-axis plus direction from a position in the z-axis minus direction may be referred to as a rear view or the like.

The camera body 30 has a mirror unit 31 at a position in the minus direction of the z-axis with respect to the body mount 26 coupled to the lens mount 24. The mirror unit 31 includes a main mirror 32 and a sub mirror 33. The main mirror 32 is rotatably supported between an approach position in which the lens unit 20 has entered the optical path of the subject luminous flux emitted by the lens unit 20 and a retracted position retracted from the optical path of the subject luminous flux. The sub mirror 33 is rotatably supported by the main mirror 32. The sub mirror 33 enters the approach position together with the main mirror 32, and retracts to the retracted position together with the main mirror 32. In this way, the mirror unit 31 takes an approach state in which the subject light flux enters the optical path and a retracted state in which the subject light flux is retracted from the subject light beam.

When the mirror unit 31 is in the approaching state, a part of the subject luminous flux incident on the main mirror 32 is reflected by the main mirror 32 and guided to the focus plate 80. The focus plate 80 is arranged at a position conjugate with the image pickup surface of the image pickup chip 100 included in the image pickup unit 40, and visualizes the subject image formed by the optical system of the lens unit 20. The subject image formed on the focus plate 80 is observed from the finder window 86 through the pentaprism 82 and the finder optical system 84.

When the mirror unit 31 is in the approaching state, among the subject luminous flux incident on the main mirror 32, the luminous flux other than the subject luminous flux reflected by the main mirror 32 is incident on the sub mirror 33. Specifically, the main mirror 32 has a half mirror region, and the subject luminous flux transmitted through the half mirror region of the main mirror 32 is incident on the sub mirror 33. The sub-mirror 33 reflects the light flux incident from the half mirror region toward the imaging optical system 70. The imaging optical system 70 guides the incident light flux to the focus detection sensor 72 for detecting the focal position. The focus detection sensor 72 outputs the detection result of the focus position to the MPU 51.

The focus plate 80, the pentaprism 82, the main mirror 32, the sub mirror 33, and the finder optical system 84 are supported by the mirror box 60 as a support member. When the mirror unit 31 is in the retracted state and the front curtain and the rear curtain of the shutter unit 38 are in the open state, the subject luminous flux transmitted through the lens unit 20 reaches the imaging surface of the imaging chip 100.

The substrate 62 and the display unit 88 are sequentially arranged at positions in the negative direction of the z-axis of the image pickup unit 40. As the display unit 88, for example, a liquid crystal panel or the like can be applied. The display surface of the display unit 88 appears on the back surface of the camera body 30. The display unit 88 displays an image generated from the output signal from the image pickup chip 100.

Electronic circuits such as MPU 51 and ASIC 52 are mounted on the substrate 62. The MPU 51 is responsible for overall control of the camera 10. The output signal from the image pickup chip 100 is output to the ASIC 52 via a flexible printed circuit board or the like. The ASIC 52 processes the output signal output from the image pickup chip 100.

The ASIC 52 generates image data for display based on the output signal from the image pickup chip 100. The display unit 88 displays an image based on the image data for display generated by the ASIC 52. The ASIC 52 generates image data for recording based on the output signal from the image pickup chip 100. The ASIC 52 generates image data for recording by, for example, performing image processing or compression processing on the output signal of the imaging chip. The image data for recording generated by the ASIC 52 is recorded on a recording medium mounted on the camera body 30. The recording medium is configured to be removable from the camera body 30.

FIG. 2 is a top view schematically showing an image pickup unit 40 having a frame 140 according to the first embodiment. FIG. 3 is a diagram schematically showing the frame 140. FIG. 3A is a top view schematically showing the frame 140. FIG. 3B is a rear view schematically showing the frame 140. FIG. 4 is a cross-sectional view schematically showing the AA cross section of FIG. FIG. 5 is a cross-sectional view showing an enlarged portion C of FIG.

The image pickup unit 40 includes an image pickup chip 100, a mounting substrate 120, a frame 140, and a cover glass 160. The image pickup chip 100 is a CMOS image sensor or a CCD image sensor. The imaging chip 100 includes an imaging region 101 and a peripheral region 102. The imaging region 101 is formed in the central portion of the imaging chip 100. In the imaging region 101 of the imaging chip 100, an imaging surface is formed by a plurality of photoelectric conversion elements that photoelectrically convert subject light. The peripheral region 102 of the imaging chip 100 is located around the imaging region 101. The peripheral region 102 of the image pickup chip 100 includes a processing circuit that reads out the pixel signal obtained by the photoelectric conversion in the photoelectric conversion element and performs signal processing. The processing circuit includes an AD conversion circuit that converts the output pixel signal into a digital signal.

The imaging chip 100 has a rectangular shape in the xy plane. The imaging chip 100 has a first short side 105a and a second short side 105b, and a first long side 106a and a second long side 106b. The first short side 105a is located in the plus direction on the x-axis from the second short side 105b. The first long side 106a is located in the y-axis plus direction from the second long side 106b.

The image pickup chip 100 is mounted on the mounting board 120. The image pickup chip 100 is mounted on the mounting board 120 by, for example, flip-chip mounting. The image pickup chip 100 is electrically connected to the mounting substrate 120 via the bonding wire 110. The pixel signal converted into a digital signal by the AD conversion circuit of the image pickup chip 100 is output to the mounting board 120 via the bonding wire 110. The image pickup chip 100 is adhered to the mounting substrate 120 with an adhesive. The image pickup chip 100 is housed in the opening 138 of the frame 140. The frame 140 is an example of a ring member that surrounds the image pickup chip 100.

The mounting board 120 mounts the imaging chip 100. The mounting substrate 120 includes a first layer 121, a core layer 207, and a second layer 122. The first layer 121 includes a solder resist layer 201, a wiring layer 202, an insulating layer 203, a wiring layer 204, and an insulating layer 205. The second layer 122 includes an insulating layer 215, a wiring layer 214, an insulating layer 213, a wiring layer 212, and a solder resist layer 211. The mounting substrate 120 is a multilayer core substrate having a core layer 207 as a core layer.

In the mounting substrate 120, along the optical axis 22, the imaging chip 100, the solder resist layer 201, the wiring layer 202, the insulating layer 203, the wiring layer 204, the insulating layer 205, the core layer 207, the insulating layer 215, the wiring layer 214, and the insulation The layer 213, the wiring layer 212, and the solder resist layer 211 are arranged in this order.

The insulating layer 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213 are, for example, resin layers. The thickness of each of the insulating layer 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213 is 20 μm to 50 μm. The thickness is the length in the z-axis direction.

The wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212 include a wiring pattern. As a material for the wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212, nickel-iron alloys (for example, 42alloy and 56alloy), copper, aluminum, and the like can be used. The thickness of each of the wiring patterns of the wiring layer 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212 is about 10 μm to 50 μm.

The core layer 207 is made of metal. When the core layer 207 is formed of metal, for example, an alloy of nickel and iron (for example, 42 allo, 56 allo), copper, aluminum or the like may be used as the material of the core layer 207. The thickness of the core layer 207 is thicker than the thickness of any of the wiring layers 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212. The thickness of the core layer 207 is thicker than the thickness of any of the insulating layers 203, the insulating layer 205, the insulating layer 215, and the insulating layer 213. Specifically, the thickness of the core layer 207 is about 0.1 mm to 0.8 mm. The rigidity of the core layer 207 is higher than the rigidity of any of the wiring layers 202, the wiring layer 204, the wiring layer 214, and the wiring layer 212. The rigidity of the core layer 207 may be higher than the rigidity of the first layer 121. The rigidity of the core layer 207 may be higher than the rigidity of the second layer 122.

The core layer 207 may be made of resin. When the core layer 207 is formed of resin, the core layer 207 may be formed using, for example, FR4 or a material having a higher elastic modulus than FR4. When the core layer 207 is made of resin, the core layer 207 is sandwiched between the wiring layers in the z-axis direction. For example, when the core layer 207 is formed of resin, the imaging chip 100, the solder resist layer 201, the wiring layer 202, the insulating layer 203, the wiring layer 204, the core layer 207, the wiring layer 214, and the insulating layer are formed along the optical axis 22. 213, the wiring layer 212, and the solder resist layer 211 may be arranged in this order. When two additional wiring layers are arranged, an additional insulating layer in contact with the wiring layer 204 and an additional wiring layer in contact with the core layer 207 are optical axes between the wiring layer 204 and the core layer 207. An additional wiring layer in contact with the core layer 207 and an additional insulating layer in contact with the wiring layer 214 are arranged along the optical axis 22 between the core layer 207 and the wiring layer 214, which are arranged in order along 22. Are arranged in order.

As described above, the mounting substrate 120 is a multilayer core substrate having a metal core or a resin core. The thickness of the mounting substrate 120 may be about 0.3 mm to 1.0 mm as a whole.

At least a part of the wiring layer 202 is used for a wiring pattern that receives a pixel signal output from the image pickup chip 100 via the bonding wire 110. The wiring layer 202 includes a bonding pad 240 to which the bonding wire 110 is connected.

The wiring pattern included in the wiring layer 204 and the wiring pattern included in the wiring layer 214 can be used for, for example, a ground line, a power supply line, and the like.

The imaging chip 100 is mounted on the solder resist layer 201. The imaging chip 100 is electrically connected to the bonding pad 240 by the bonding wire 110. The bonding pad 240 and the wiring layer 212 are electrically connected by a via 131 penetrating the first layer 121 and the core layer 207. The via 131 is covered with an insulator 132. The pixel signal output from the image pickup chip 100 is transmitted to the wiring layer 212 via the wiring layer 202 and the via 131.

An electronic component 180 is provided on the solder resist layer 211. That is, the electronic component 180 is mounted on the second main surface 112 on the mounting substrate 120, which is opposite to the first main surface 111 on which the imaging chip 100 is mounted. The electronic component 180 includes, for example, a connector, a capacitor, a resistor, a regulator, a transistor, and the like. Some components of the electronic component 180 constitute a power supply circuit or the like that supplies electric power to the image pickup chip 100.

A flexible substrate is connected to the connector as a part of the electronic component 180, for example. The connector as a part of the electronic component 180 is connected to the wiring layer 212, and the pixel signal transmitted to the wiring layer 212 is transmitted to an external electronic circuit such as the ASIC 52 via the connector and the flexible substrate.

The electronic component 180 and the wiring layer 212 are electrically connected by a lead member. The lead member of the electronic component 180 is fixed to the wiring layer 212 with solder or the like. A part of the wiring layer 212 is exposed to the outside through an opening formed in the solder resist layer 211 to provide an electrode such as a land.

The image pickup chip 100 is mounted on a mounting substrate 120 by COB (Chip On Board). The image pickup chip 100 is mounted on the mounting substrate 120 by being bonded to the mounting substrate 120, for example, by an adhesive portion 551. Specifically, the image pickup chip 100 is adhered to the solder resist layer 201 of the mounting substrate 120 by an adhesive portion 551. The adhesive portion 551 is formed of, for example, an adhesive. Specifically, the adhesive portion 551 is formed by heat-curing a thermosetting adhesive. The image pickup chip 100 is mounted on the mounting board 120 by going through the image pickup chip mounting step. In the imaging chip mounting process, when the imaging chip 100 is mounted on the mounting substrate 120, the mounting substrate 120 is heated. The image pickup chip 100 is mounted on the heated mounting substrate 120 by thermocompression bonding.

The bonding wire 110 is mounted on the imaging chip 100 and the bonding pad 240. The bonding wire 110 electrically connects the imaging chip 100 and the bonding pad 240 through a wire bonding step (bonding wire mounting step). In the wire bonding step, when the bonding wire 110 is mounted on the bonding pad 240, the bonding pad 240 is heated, and the bonding wire 110 is mounted on the heated bonding pad 240 by thermocompression bonding. In the wire bonding step, the bonding wire 110 may be mounted on the bonding pad 240 by thermosonic bonding.

The frame 140 is adhered to the mounting substrate 120 by an adhesive portion 552. Specifically, the frame 140 is adhered to the solder resist layer 201 of the mounting substrate 120 by the adhesive portion 552. The adhesive portion 552 is formed of, for example, an adhesive. Specifically, the adhesive portion 552 is formed by heat-curing a thermosetting adhesive. The adhesive portion 552 is formed by heat-curing a thermosetting adhesive. In the frame mounting process, the frame 140 is mounted on the mounting board 120. In the frame mounting process, when the frame 140 is mounted on the mounting substrate 120, the frame 140 is heated, and the frame 140 is mounted on the heated mounting substrate 120 by thermocompression bonding.

The frame 140 has a first surface 141, a second surface 142, a third surface 143, a fourth surface 144, a fifth surface 145, and a sixth surface 146. The sixth surface 146 forms an opening 138. The sixth surface 146 forms an inner wall surface of the frame 140. The opening 138 is formed, for example, in the central portion in the xy plane.

The first surface 141 is a surface that is adhered to the cover glass 160 by the adhesive portion 553. The first surface 141 is a surface in contact with the end of the sixth surface 146. The first surface 141 is formed along the outer edge of the sixth surface 146. The first surface 141 is a surface substantially parallel to the xy plane.

The second surface 142 is a surface in contact with the end of the first surface 141. The second surface 142 is a surface formed along the outer edge of the first surface 141. The second surface 142 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

The third surface 143 is a surface in contact with the end portion of the second surface 142. The third surface 143 is a surface substantially parallel to the xy plane, and is a surface substantially parallel to the first surface 141.

The fourth surface 144 is a surface in contact with the end of the third surface 143. The fourth surface 144 is a surface formed along the outer edge of the third surface 143. The fourth surface 144 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

The fifth surface 145 is a surface in contact with the end of the fourth surface 144. The fifth surface 145 is a surface formed along the outer edge of the fourth surface 144. The fifth surface 145 is a surface substantially parallel to the xy plane. The fifth surface 145 is a surface substantially parallel to the first surface 141 and the third surface 143. The fifth surface 145 is a surface that is adhered to the solder resist layer 201 of the mounting substrate 120 by the adhesive portion 552. The fifth surface 145 faces the adhesive portion 552. The fifth surface 145 is a surface in contact with the end of the sixth surface 146. The fifth surface 145 is formed along the outer edge of the sixth surface 146.

The frame 140 has a step portion formed by a first surface 141, a second surface 142, and a third surface 143. The frame 140 has a mounting hole 148 as a mounting portion. The frame 140 has, for example, three mounting holes 148. All three mounting holes 148 are holes that penetrate from the third surface 143 to the fifth surface 145. All three mounting holes 148 are used to mount the imaging unit 40 to other structures such as the mirror box 60.

The frame 140 is fixed to the bracket 150 by being screwed with screws through the three mounting holes 148. The bracket 150 is fixed to the mirror box 60, for example, by being screwed. Therefore, the image pickup unit 40 is fixed to the mirror box 60.

When the frame 140 and the bracket 150 are screwed with, for example, metal screws using the mounting holes 148, the heat generated when the image pickup chip 100 is operating is transferred to the mirror box 60 via the screws. A heat transfer path for escape can be formed.

The frame 140 has a positioning hole 147. The frame 140 has, for example, two positioning holes 147. The two positioning holes 147 are holes that penetrate from the third surface 143 to the fifth surface 145. Each of the positioning holes 147 is used to position the image pickup unit 40 with respect to the image pickup unit 40. Of the two positioning holes 147, one positioning hole is formed by a fitting hole, and the other positioning hole 147 is formed by an elongated hole.

The frame 140 is positioned with respect to the bracket 150 using two positioning holes 147. For example, the frame 140 and the bracket 150 are positioned by inserting the two positioning pins provided in the bracket 150 into the two positioning holes 147. The frame 140 is fixed so as to be positioned with respect to the bracket 150. Therefore, the image pickup unit 40 is fixed in a state of being positioned on the mirror box 60. The frame 140 and the bracket 150 may be fixed to a structure other than the mirror box 60.

The image pickup unit 40 may be fixed to the mirror box 60 without the bracket 150. The image pickup unit 40 may be fixed to the mirror box 60, for example, by being screwed through three mounting holes 148.

The cover glass 160 is used to seal the image pickup chip 100. The cover glass 160 is fixed to the frame 140 so as to cover the opening 138 of the frame 140. The cover glass 160 has an opening 138 as a sealing space together with the frame 140 and the mounting substrate 120.

The cover glass 160 is adhered to the frame 140 by the adhesive portion 553. The adhesive portion 553 is formed by an adhesive. Specifically, the adhesive portion 552 is formed by curing a photocurable adhesive. For example, the adhesive portion 553 is formed by curing an ultraviolet curable adhesive with ultraviolet rays. As the material of the cover glass 160, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass and the like can be used. The cover glass 160 has translucency. The thickness of the cover glass 160 is 0.5 mm to 0.8 mm.

The cover glass 160 is fixed to the frame 140 after the imaging chip 100, the bonding wire 110, and the frame 140 are mounted on the mounting substrate 120. Since the cover glass 160 has translucency, the cover glass 160 and the frame 140 can be adhered to each other by using a photocurable adhesive. The cover glass 160 is an example of a translucent member. As the translucent member, quartz or the like can be applied in addition to glass.

In this way, the mounting substrate 120, the frame 140, and the cover glass 160 form a sealed space. The image pickup chip 100 is arranged in a sealed space formed by the mounting substrate 120, the frame 140, and the cover glass 160. As a result, the imaging chip 100 is less susceptible to the influence of the external environment. For example, the image pickup chip 100 is less susceptible to the influence of moisture existing outside the sealed space. Therefore, deterioration of the image pickup chip 100 can be prevented.

The frame 140 has a first frame portion 210 and a second frame portion 220. The first frame portion 210 has a first main surface 311 and a second main surface 312, an inner side surface 314, and an outer surface 313. The second frame portion 220 has a first main surface 321 and a second main surface 322, an inner side surface 324, and an outer surface 323. The first main surface 311 and the second main surface 312, the first main surface 321 and the second main surface 312 are planes substantially parallel to the xy plane.

A part of the first main surface 311 of the first frame portion 210 is in contact with the second frame portion 220. A part of the second main surface 312 is in contact with the mounting board 120. The inner surface 314 and the outer surface 313 are surfaces between the first main surface 311 and the second main surface 312. The inner side surface 314 forms an inner edge portion of the first frame portion 210 that surrounds the image pickup chip 100. The outer side surface 313 is located outside the inner side surface 314. The outer side surface 313 forms the outer edge portion of the first frame portion 210. The inner side surface 314 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane. The outer side surface 313 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

A part of the first main surface 321 of the second frame portion 220 is in contact with the cover glass 160. A part of the second main surface 322 is in contact with the first frame portion 210. A part of the second main surface 322 is in contact with the first main surface 321 of the first frame portion 210. The inner surface 324 and the outer surface 323 are surfaces between the first main surface 321 and the second main surface 322. The inner side surface 324 forms an inner edge portion of the second frame portion 220 that surrounds the image pickup chip 100. The outer side surface 323 is located outside the inner side surface 324. The outer side surface 323 forms the outer edge portion of the second frame portion 220. The inner side surface 324 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane. The outer side surface 323 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

The first main surface 321 of the second frame portion 220 provides the first surface 141 of the frame 140. The outer surface 323 of the second frame portion 220 provides the second surface 142 of the frame 140. A portion of the first main surface 311 of the first frame portion 210 provides a third surface 143 of the frame 140. The outer surface 313 of the first frame portion 210 provides the fourth surface 144 of the frame 140. The second main surface 312 of the first frame portion 210 provides the fifth surface 145 of the frame 140. The inner surface 314 of the first frame portion 210, a part of the second main surface 322 of the second frame portion 220, and the inner surface 324 of the second frame portion 220 provide the sixth surface 146 of the frame 140.

The material forming the second frame portion 220 is different from the material forming the first frame portion 210. The coefficient of thermal expansion of the material forming the second frame portion 220 is different from the coefficient of thermal expansion of the material forming the first frame portion 210. In the present embodiment, the second frame portion 220 is made of resin. The first frame portion 210 is made of metal. The material forming the first frame portion 210 may be an alloy of nickel and iron (for example, 42 allo, 56 allo), copper, aluminum or the like. The frame 140 is formed by insert molding the material forming the first frame portion 210 and the material forming the second frame portion 220. The frame 140 may be formed by outsert molding. The method of forming the frame 140 is not limited to insert molding and outsert molding, and various construction methods can be applied.

The first frame portion 210 has a protrusion 400a and a protrusion 400b on the first main surface 311. The protrusions 400a and 400b extend in the xy plane. The protrusions 400a and 400b are formed by half-pressing the material forming the first frame portion 210 in the step of manufacturing the first frame portion 210. The second frame portion 220 is provided at least in contact with the upper surface 410a of the protrusion 400a and the upper surface 410b of the protrusion 400b.

The lower surface 420a on the opposite side of the upper surface 410a of the protrusion 400a is separated from the second main surface 312 of the first frame portion 210. The lower surface 420b on the opposite side of the upper surface 410b of the protrusion 400b is separated from the second main surface 312 of the first frame portion 210. Specifically, the lower surface 420a and the lower surface 420b are located in the z-axis plus direction from the second main surface 312 of the first frame portion 210. In this way, a convex portion is formed on the first main surface 311 of the first frame portion 210, and the convex portion on the second main surface 312 is located at a position in the negative direction of the z-axis of the convex portion of the first main surface 311. A recess corresponding to is formed.

The inner side surface 314 of the first frame portion 210 provides an inner edge portion 305a, an inner edge portion 305b, an inner edge portion 306a, and an inner edge portion 306b surrounding the image pickup chip 100. The outer surface 313 of the first frame portion 210 provides an outer edge portion 307a, an outer edge portion 307b, an outer edge portion 308a, and an outer edge portion 308b outside the inner edge portion 305b, the inner edge portion 306a, and the inner edge portion 306b.

The first frame portion 210 has a first portion 301a and a first portion 301b, and a second portion 302a and a second portion 302b. The first portion 301a, the first portion 301b, the second portion 302a, and the second portion 302b form a rectangular frame. The first portion 301a is a portion between the inner edge portion 305a and the outer edge portion 307a. The first portion 301b is a portion between the inner edge portion 305b and the outer edge portion 307b. The second portion 302a is a portion between the inner edge portion 306a and the outer edge portion 308a. The second portion 302b is a portion between the inner edge portion 306b and the outer edge portion 308b.

The inner edge portion 305a, the inner edge portion 305b, the inner edge portion 306a, and the inner edge portion 306b form a rectangle in a plane parallel to the xy plane. The inner edge portion 305a is substantially parallel to the inner edge portion 305b and is located in the x-axis plus direction from the inner edge portion 305b. The inner edge portion 306a is substantially parallel to the inner edge portion 306b and is located in the y-axis plus direction from the inner edge portion 306b.

Further, the inner edge portion 305a and the inner edge portion 305b are substantially parallel to the first short side 105a. The inner edge portion 306a and the inner edge portion 306b are substantially parallel to the first long side 106a. The length of the inner edge portion 305a and the length of the inner edge portion 305b are shorter than the length of the inner edge portion 306a. The length of the inner edge portion 305a and the length of the inner edge portion 305b are shorter than the length of the inner edge portion 306b.

The first portion 301a is between the surface parallel to the yz plane on the outer surface 313 on the plus side of the x-axis and the surface parallel to the yz plane on the inner surface 314 on the plus side of the x-axis. It is a part. The first portion 301b is a portion between the surface parallel to the yz plane on the outer surface 313 on the minus side of the x-axis and the surface parallel to the yz plane on the inner surface 314 on the minus side of the x-axis. is there.

Further, the second portion 302a is between the surface parallel to the xz plane on the outer surface 313 on the y-axis plus side and the surface parallel to the xz plane on the inner surface 314 on the y-axis plus side. It is a part. The second portion 302a is a portion between the surface parallel to the xz plane on the outer surface 313 on the minus side of the y-axis and the surface parallel to the xz plane on the inner surface 314 on the minus side of the y-axis. is there.

In the description of the present embodiment, the widths of the first portion 301a, the first portion 301b, the second portion 302a, and the first portion 301b are represented by the lengths in the direction from the inner edge portion to the outer edge portion. In terms of the coordinate axes set in the present embodiment, the width of the first portion 301a and the width of the first portion 301b are represented by lengths in the direction along the x-axis. The width of the second portion 302a and the second portion 302b is represented by the length in the direction along the y-axis.

In this case, the width of the first portion 301a is substantially the same as the width of the first portion 301b. The width of the second portion 302a is substantially the same as the width of the second portion 302b. The width of the first portion 301a and the width of the first portion 301b are smaller than the width of the second portion 302a. The width of the first portion 301a and the width of the first portion 301b are smaller than the width of the second portion 302b.

Here, the protrusion 400a is provided in the first portion 301a. The protrusion 400b is provided on the first portion 301b. The second portion 302a and the second portion 302b are not provided with the same protrusions as the protrusions 400a and 400b. As described above, the first frame portion 210 is provided with protrusions in the first portion 301a and the first portion 301b, which have a small width. That is, a protrusion is provided in a portion of the first frame portion 210 that is easily deformed by an external force.

The protrusions 400a and 400b extend in the direction along the xy plane. Specifically, the protrusion 400a extends along the inner edge 305a. Therefore, the strength against the stress of deforming the first portion 301a into a convex or concave shape in the yz plane is increased. In addition, the strength against bending stress that deforms the first portion 301b into a convex or concave shape in the yz plane is increased. Therefore, the warp in the z-axis direction generated in the first frame portion 210 can be suppressed. Moreover, the warp of the frame 140 can be suppressed. In addition, the warpage of the mounting board 120 can be suppressed.

For example, when the coefficient of thermal expansion of the first frame portion 210 and the coefficient of thermal expansion of the second frame portion 220 are different, in the xy plane caused by the temperature change between the first frame portion 210 and the second frame portion 220. There may be a difference in expansion or contraction rate. If there is a difference in expansion coefficient or contraction coefficient, the first frame portion 210 may be pulled by the second frame portion 220 at the surface in contact with the second frame portion 220, causing the first frame portion 210 to warp. .. As a result, the entire frame 140 may be warped. For example, the frame 140 may be warped due to a temperature change in the manufacturing process of the frame 140, the mounting process of the imaging chip 100, the electronic component 180, the cover glass 160, etc., and the subsequent cooling process. Further, the mounting substrate 120 may be warped according to the warp generated in the frame 140.

However, according to the frame 140 of the present embodiment, since the protrusions 400a and 400b are formed in the first frame portion 210, the strength of the first frame portion 210 can be increased. Therefore, deformation such as warpage that occurs in the first frame portion 210 can be suppressed.

FIG. 6 is a cross-sectional view schematically showing the BB cross section of FIG. As shown in FIGS. 6 and 3B, the first frame portion 210 includes a through hole 610a, a through hole 610b, a through hole 610c, a through hole 610d, a through hole 610e, and a through hole 610f. Have. The second frame portion 220 has a penetrating portion 620a, a penetrating portion 620b, a penetrating portion 620c, a penetrating portion 620d, a penetrating portion 620e, and a penetrating portion 620f.

The through hole 610a, the through hole 610c and the through hole 610e are provided in the second portion 302a. The through hole 610b, the through hole 610d and the through hole 610f are provided in the second portion 302b. The through hole 610a, the through hole 610c, and the through hole 610e are formed along the inner edge portion 306a. The through hole 610b, the through hole 610d, and the through hole 610f are formed along the inner edge portion 306b.

The through hole 610a and the through hole 610b reach from the first main surface 311 to the second main surface 312 of the first frame portion 210, respectively. Similarly, the through hole 610c, the through hole 610d, the through hole 610e, and the through hole 610f reach from the first main surface 311 to the second main surface 312 of the first frame portion 210, respectively.

The through portion 620a is formed so as to fill the through hole 610a. The through portion 620b is formed so as to fill the through hole 610b. The through portion 620c is formed so as to fill the through hole 610c. The through portion 620d is formed so as to fill the through hole 610d. The through portion 620e is formed so as to fill the through hole 610e. The through portion 620f is formed so as to fill the through hole 610f. The penetrating portion 620a, the penetrating portion 620b, the penetrating portion 620c, the penetrating portion 620d, the penetrating portion 620e, and the penetrating portion 620f reach the first layer 121 of the mounting substrate 120. In this way, the penetrating portion 620a, the penetrating portion 620c, and the penetrating portion 620e are provided so as to penetrate from the first main surface 311 to the second main surface 312 in the second portion 302a. The penetrating portion 620b, the penetrating portion 620d, and the penetrating portion 620f are provided so as to penetrate from the first main surface 311 to the second main surface 312 in the second portion 302b.

As described above, the first frame portion 210 has a through hole 610a, a through hole 610b, a through hole 610c, a through hole 610d, a through hole 610e, and a through hole 610f outside the inner edge portion, and the second frame portion 220 has. A penetrating portion 620a, a penetrating portion 620b, a penetrating portion 620c, a penetrating portion 620d, a penetrating portion 620e, and a penetrating portion 620f are provided outside the inner edge portion of the first frame portion 210. Therefore, the second frame portion 220 and the first frame portion 210 can be strongly adhered to each other. Further, the second frame portion 220 is less likely to be peeled off from the first frame portion 210. In addition, the contact area between the second frame portion 220 and the mounting substrate 120 increases. Therefore, the adhesiveness between the frame 140 and the mounting substrate 120 is also enhanced. Further, the deformation of the first frame portion 210 can be reduced, and the warp of the first frame portion 210 may be reduced.

FIG. 7 is a rear view schematically showing the frame 740 according to the second embodiment. The frame 740 has a first frame portion 710 as a modification of the first frame portion 210. The first frame portion 710 further includes a protrusion 400c and a protrusion 400d in addition to the components included in the frame 140. Except for this point, the frame 740 has substantially the same configuration as that of the frame 140.

The protrusion 400c is provided along the inner edge portion 306a. The protrusion 400d is provided along the inner edge portion 306b. In this way, the protrusion is provided along the rectangular inner edge of the first frame portion 210. That is, protrusions are provided so as to surround the image pickup chip 100 along the four inner edge portions in which the first frame portion 210 forms a rectangular inner shape that surrounds the image pickup chip 100. As a result, the warp that occurs in the frame 140 can be further suppressed.

In the frame 140 according to the first embodiment and the frame 740 according to the second embodiment, a mode in which the second frame portion 220 has six penetrating portions has been described. However, the number of penetrating portions included in the second frame portion 220 is not limited to six. The second frame portion 220 may have one or more arbitrary number of penetration portions. When the second frame portion 220 is provided with the penetrating portion, it is preferable to provide one or more penetrating portions in the second portion 302a and the second portion 302b of the first frame portion 210, respectively. Further, the position where the penetrating portion is provided is not limited to the position shown in FIG. 3 and the like. However, the position of the penetrating portion in the xy plane is preferably point-symmetrical with respect to the optical axis 22. A configuration may be applied in which the penetrating portion 620a, the penetrating portion 620b, the penetrating portion 620c, the penetrating portion 620d, the penetrating portion 620e, and the penetrating portion 620f are not provided.

FIG. 8 is a cross-sectional view schematically showing an image pickup unit 890 including the frame 840 according to the third embodiment. The frame 840 has a second frame portion 820 as a modification of the second frame portion 220. FIG. 8 is a cross-sectional view of the imaging unit 890 when the imaging unit 890 is cut along a cross section corresponding to the cross section taken along the line AA of FIG. Here, the differences between the image pickup unit 890 and the image pickup unit 40 will be mainly described. Among the components included in the image pickup unit 890, the components having the same structure as that of the image pickup unit 40 may be designated by the same reference numerals and the description thereof may be omitted.

The width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301a of the first frame portion 210 is wider than the width in the x-axis direction in which the second frame portion 220 is in contact with the first portion 301a in the frame 140. small. Further, the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301b of the first frame portion 210 is the width in the x-axis direction in which the second frame portion 220 is in contact with the first portion 301b in the frame 140. Smaller than width.

The width of the second frame portion 820 in the x-axis direction is about the same as the width of the cover glass 160 in the x-axis direction. The width of the second frame portion 820 in the x-axis direction may be substantially the same as the width of the cover glass 160 in the x-axis direction. Considering the assembly of the second frame portion 820 and the cover glass 160, the width of the second frame portion 820 in the x-axis direction has some play, and the width of the second frame portion 820 in the x-axis direction is the cover glass. It may be slightly longer than the width of 160 in the x-axis direction. The area of the portion where the cover glass 160 and the second frame portion 820 are in contact with each other must be at least a predetermined value so that the cover glass 160 can be adhered to the second frame portion 820. Therefore, it is preferable that the width in the x-axis direction in which the cover glass 160 and the second frame portion 820 are in contact with each other is equal to or more than a predetermined lower limit value required for adhering the cover glass 160 to the second frame portion 820. The width of the second frame portion 820 in the x-axis direction may be reduced until the width of the cover glass 160 and the second frame portion 820 in the x-axis direction reaches the lower limit value.

According to the frame 840, the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301a and the first portion 301b is small, so that the stress applied to the first frame portion 210 by the second frame portion 820 is reduced. can do. Therefore, the warp of the first frame portion 210 can be further suppressed.

In the third embodiment, the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301a is larger than the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302a. small. Further, the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301a is smaller than the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302b. Similarly, the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301b is smaller than the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302a. Further, the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301b is smaller than the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302b. In this way, since the width in the y direction in which the second portion 302a and the second portion 302b of the first frame portion 210 and the second frame portion 820 are in contact with each other is increased, the second frame portion 820 and the first frame Adhesion with the portion 210 can be ensured. Since the width of the second portion 302a and the second portion 302b in the y direction is longer than the width of the first portion 301a and the first portion 301b in the x direction, the strength of the second portion 302a and the second portion 302b against warpage is high. , The strength of the first portion 301a and the first portion 301b against warpage is higher. Therefore, even if the width in the y direction in which the second portion 302a and the second portion 302b are in contact with the second frame portion 820 is increased, it is possible to suppress the occurrence of a large warp in the yz plane.

As a modification of the second frame portion 820, the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302a is the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301a. It may be reduced to a width substantially the same as the width of. Further, the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302b is reduced to substantially the same width as the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301a. You may. Similarly, the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302a is reduced to substantially the same width as the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301b. You may. Further, the width in the y-axis direction in which the second frame portion 820 is in contact with the second portion 302b is reduced to substantially the same width as the width in the x-axis direction in which the second frame portion 820 is in contact with the first portion 301b. You may.

The frame 840 described above may adopt a configuration that does not have the protrusions 400a and 400b.

FIG. 9 is a cross-sectional view schematically showing an image pickup unit 990 including the frame 940 according to the fourth embodiment. The frame 940 has a first frame portion 910 as a modification of the first frame portion 210 and a second frame portion 920 as a modification of the second frame portion 220. FIG. 9 is a cross-sectional view of the imaging unit 990 when the imaging unit 990 is cut along a cross section corresponding to the cross section taken along the line AA of FIG. Here, the differences between the image pickup unit 990 and the image pickup unit 40 will be mainly described. Among the components included in the image pickup unit 990, the components having the same structure as that of the image pickup unit 40 may be designated by the same reference numerals and the description thereof may be omitted.

The first frame portion 910 has a first portion 901a corresponding to the first portion 301a and a first portion 901b corresponding to the first portion 301b. The first frame portion 910 generally has a shape in which the first frame portion 210 does not have a portion on the inner edge side of the protrusion 400a and a portion on the inner edge side of the protrusion 400b. The first frame portion 910 has a shape having a protrusion 900a and a protrusion 900b on the inner edge portion. Like the protrusions 400a and 400b, the protrusions 900a and 900b are formed by half-cutting.

The protrusion 900a has an upper surface 911a, a lower surface 912a opposite the upper surface 911a, and a side surface 913a between the upper surface 911a and the lower surface 912a. The lower surface 912a is separated from the mounting board 120. Similarly, the protrusion 900b has an upper surface 911b, a lower surface 912b opposite the upper surface 911b, and a side surface 913b between the upper surface 911b and the lower surface 912b. The lower surface 912b is separated from the mounting board 120.

The second frame portion 920 is provided in contact with the upper surface 911a of the protrusion 900a and the lower surface 912a of the protrusion 900a. The second frame portion 920 is also provided in contact with the side surface 913a of the protrusion 900a. The second frame portion 920 is provided so as to surround the three surfaces of the protrusion 900a. Further, the second frame portion 920 is provided so as to be in contact with the mounting substrate 120. As described above, the inner edge portion of the first portion 901a of the first frame portion 910 is covered with the second frame portion 920.

Similarly, the second frame portion 920 is provided in contact with the upper surface 911b of the protrusion 900b and the lower surface 912b of the protrusion 900b. The second frame portion 920 is also provided in contact with the side surface 913b of the protrusion 900b. The second frame portion 920 is provided so as to surround the three surfaces of the protrusion 900b. Further, the second frame portion 920 is provided so as to be in contact with the mounting substrate 120. As described above, the inner edge portion of the first portion 901b of the first frame portion 910 is covered with the second frame portion 920.

According to the frame 940, the second frame portion 920 is provided in contact with the upper surface 911a of the protrusion 900a, the lower surface 912a of the protrusion 900b, the upper surface 911b of the protrusion 900b, and the lower surface 912b of the protrusion 900b. Since the second frame portion 920 is provided in contact with both the upper surface and the lower surface of the protrusion portion in this way, for example, the stress caused by the difference in expansion coefficient between the first frame portion 910 and the second frame portion 920 is reduced. it can. Further, the first frame portion 910 and the second frame portion 920 can be fixed more strongly. In addition, the warp of the first frame portion 210 can be further suppressed. Further, since the second frame portion 920 is in contact with the mounting board 120, the adhesiveness between the frame 940 and the mounting board 120 is enhanced.

Further, similarly to the frame 840 according to the third embodiment, the width in the x-axis direction in which the second frame portion 920 is in contact with the first portion 901a of the first frame portion 910 is such that the second frame portion 220 is the first in the frame 140. It is smaller than the width in the x-axis direction in contact with one portion 301a. Further, the width in the x-axis direction in which the second frame portion 920 is in contact with the first portion 901b of the first frame portion 910 is the width in the x-axis direction in which the second frame portion 220 is in contact with the first portion 301b in the frame 140. Smaller than width. Therefore, since the width in the x-axis direction in which the second frame portion 920 is in contact with the first portion 901a and the first portion 901b is small, the stress applied to the first frame portion 910 by the second frame portion 920 can be reduced. it can. Therefore, the warp of the first frame portion 210 can be further suppressed.

It should be noted that the same protrusions as the protrusions 900a and 900b may be provided along the other inner edges of the other first frame portion 910. That is, a protrusion may be provided along the rectangular inner edge of the first frame portion 910. As described above, the frame 940 is formed by providing the protrusions so as to surround the image pickup chip 100 along the four inner edge portions in which the first frame portion 910 forms the rectangular inner shape surrounding the image pickup chip 100. Warpage can be suppressed more.

Further, in relation to the frame 940 according to the fourth embodiment, an example in which the protrusions such as the protrusion 900a and the protrusion 900b are formed by half-cutting has been described. However, similarly to the protrusions 900a and 900b, the protrusions may be formed by drawing on the surface where the second frame portion 920 and the first frame portion 910 are in contact with each other.

Further, in the frame 940 described above, a configuration in which the width of the second frame portion 920 in the x-axis direction is larger may be applied. For example, a configuration in which the second frame portion 920 is widened from the protrusions 900a and 900b in the x-axis direction toward the outer edge may be applied.

In the embodiment described above, the material forming the first frame portion 210, the first frame portion 710, and the first frame portion 910 is metal. In another embodiment, the frame portions such as the first frame portion 210 and the first frame portion 910 may be formed of resin.

In the above description, the camera 10 including the lens unit 20 and the camera body 30 has been taken up as an example of the image pickup apparatus. However, the image pickup device does not have to include the lens unit 20. For example, the camera body 30 is an example of an imaging device. Further, the image pickup device is a concept including a lens non-interchangeable image pickup device in addition to a lens interchangeable image pickup device such as a single-lens reflex camera. The imaging chip 100 is an example of an electronic device. The combination of the configurations of the frame, the mounting substrate, and the cover glass described above can be applied not only to the imaging chip 100 but also to various types of sealed electronic devices.

Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various changes or improvements can be made to the above embodiments. It is clear from the description of the claims that such modified or improved forms may also be included in the technical scope of the present invention.

The execution order of each process such as operation, procedure, step, and step in the device, system, program, and method shown in the claims, the specification, and the drawing is particularly "before" and "prior to". It should be noted that it can be realized in any order unless the output of the previous process is used in the subsequent process. Even if the scope of claims, the specification, and the operation flow in the drawings are explained using "first", "next", etc. for convenience, it means that it is essential to carry out in this order. It's not a thing.

10 Camera 20 Lens unit 22 Optical axis 24 Lens mount 26 Body mount 30 Camera body 31 Mirror unit 32 Main mirror 33 Sub mirror 38 Shutter unit 40 Imaging unit 51 MPU
52 ASIC
60 Mirror box 62 Substrate 70 Imaging optical system 72 Focus detection sensor 80 Focus plate 82 Pentaprism 84 Finder optical system 86 Finder window 88 Display unit 100 Imaging chip 101 Imaging region 102 Peripheral region 105 Short side 106 Long side 110 Wire 111 First Main surface 112 2nd main surface 120 Mounting board 121 1st layer 122 2nd layer 131 Via 132 Insulator 138 Opening 140 Frame 141 1st surface 142 2nd surface 143 3rd surface 144 4th surface 145 5th surface 146th 6 sides 147 Positioning holes 148 Mounting holes 150 Bracket 160 Cover glass 180 Electronic components 201, 211 Solder resist layers 202, 204, 212, 214 Wiring layers 203, 205, 213, 215 Insulation layer 207 Core layers 551, 552, 535 Adhesive parts 240 Bonding pad 301 1st part 302 2nd part

Claims (22)

A substrate having a first surface on which an imaging chip for imaging a subject is arranged,
A first member which is arranged outside the imaging chip on the first surface and has a second surface facing the first surface and a third surface opposite to the second surface.
A second member arranged on the third surface and having a fourth surface facing the third surface is provided.
The first member may have a projection projecting in a direction toward the third surface from the second surface in said third surface,
The protrusion is an imaging unit extending in a direction along the third surface . The second member is provided on the fourth surface and has a recess into which the protrusion is inserted.
The imaging unit according to claim 1. The second member has a fifth surface opposite to the fourth surface.
The imaging unit according to claim 1 or 2, wherein the fifth surface has a region in which a translucent member to which light from an optical system is incident is adhered by an adhesive. The imaging unit according to claim 3, wherein an accommodation space in which the imaging chip is accommodated is formed by the substrate, the first member, the second member, and the translucent member. The imaging unit according to claim 4, wherein the accommodation space is sealed by the substrate, the first member, the second member, and the translucent member. The first member has a first region facing the fourth surface on the third surface and a second region outside the first region.
The imaging unit according to any one of claims 1 to 5, wherein the second region has a through hole penetrated in a direction from the second surface to the third surface. The imaging unit according to claim 6 , wherein the second region has a plurality of the through holes. The first member has a first region facing the fourth surface on the third surface and a second region outside the first region.
The imaging unit according to any one of claims 1 to 5, wherein the second region is formed with an attachment portion for attachment to another structure. The imaging unit according to claim 8 , wherein the mounting portion has a through hole penetrated in a direction from the second surface to the third surface. The first member has a first thickness in the direction from the second surface to the third surface.
The imaging according to any one of claims 1 to 9 , wherein the second member has a second thickness thicker than the first thickness in the direction from the second surface to the third surface. unit. The first member has a first opening.
The imaging unit according to any one of claims 1 to 10 , wherein the second member has a second opening having an opening area smaller than that of the first opening. The imaging unit according to any one of claims 1 to 11 , wherein the first member has a coefficient of thermal expansion different from that of the second member. The imaging unit according to any one of claims 1 to 12 , wherein the substrate and the first member are adhered to each other by an adhesive arranged between the first surface and the second surface. The imaging unit according to claim 13 , wherein the substrate and the first member are bonded by a thermosetting adhesive arranged between the first surface and the second surface. Said first member and said second member, said third surface and the imaging unit according to any one of claims 14 to claim 1 which is bonded by an adhesive disposed between the fourth surface .. Said first member and said second member, the imaging unit according to claim 15 which is bonded by a thermosetting adhesive which is disposed between the third surface and the fourth surface. The imaging unit according to any one of claims 1 to 16 , wherein the first member is made of metal. The imaging unit according to any one of claims 1 to 17 , wherein the second member is made of resin. Any of claims 1 to 18 , wherein the substrate has a sixth surface opposite to the first surface, and a power supply circuit unit for supplying power to the imaging chip is arranged on the sixth surface. The imaging unit according to claim 1. The imaging unit according to claim 19 , wherein the substrate is provided with a connector portion for outputting an image signal of a subject imaged by the imaging chip to the outside on the sixth surface. The substrate has a sixth surface opposite to the first surface, and a connector portion for outputting an image signal of a subject imaged by the imaging chip to the outside is arranged according to claim 1. Item 2. The imaging unit according to any one of items 18 . An imaging device including the imaging unit according to any one of claims 1 to 21 .

Images